CMOS 0.18um Data Sheet
FSC18_012302
0.18
Standard Cell
Application
Flextronics Semiconductor's 0.18
Standard Cell product suite offer designers the best optimization for
performance, low power, and system cost. Applications benefiting from these features are telecom,
networking, portable datacom, and consumer applications. The product suite is well equipped for design
teams who intend to migrate from advanced FPGA to full system on chip ASIC as well as system architects
who need to prototype with an ASIC. Production is "all about results" utilizing Flextronics manufacturing
supply chain muscle to execute cycle-time and cost performance.
Description
Deep sub-micron CMOS silicon utilizing a 0.15
effective gate length capable of up to 250 MHz
operation and 21M logic gates.
Low power 1.8 volt core operation with 0.06
W/gate/MHz power dissipation.
Dense, fast SRAM, ROM, and Multi-port Register
File compilers and instances.
Low noise 3.3 v and 3.3 v / 5.0 v tolerant I/O library
designed for minimum die size / performance
utilizing staggered, in-line, and flip-chip
configurations. Complete pad sets tested for 4000
volts ESD and 300 ma latchup.
Process
Core Voltage
1.8 V
I/O Voltage
3.3 V operation
5.0 V tolerant
Poly/Metal
Density
1P6M (90K gates/mm2)
Power
Dissipation
0.06
W/gate/MHz
Features
Standard
Cells
Over 500+ cell engineered for optimum synthesis and high routability.
I/O
Functions
350+ CMOS/TTL functions with multiple drive strengths (2 ma to 24 ma) 3.3 v and 5 v
tolerant with built in level shifters. The 5 v tolerant function requires no external bias
pin.
Application
Specific I/O
PCI, SSTL, HSTL, USB, LVDS
Clock driver, crystal oscillator, analog input, power, ground, and spacer cells for SoC
compatibility.
SRAM / 1P
Single port SRAM compiler is a high density, high performance solution for embedded
applications. Six transistor bordered bit cells achieve reduced die area while maintaining
low tooling (mask) cost. The compilier maintains multi-bank architecture with capacity
up to 1 Mbit.
SRAM / DP
High density dual port SRAM compiler offers a high performance solution with the
highest density for embedded memory applications. Eight transistor bordered bit cells
achieve minimum die area while maintaining low tooling (mask) cost. The compiler
maintains multi-bank architecture with capacity up to 1 Mbit.
DATA SHEET
CMOS 0.18um Data Sheet
FSC18_012302
Features (continued)
SRAM / 2P
Register compiled high performance two port memory solution for embedded
applications. Best solution for register files, buffer memories, fall-through FIFO, palette
RAM, and tag RAM. Capacity to compile very wide words up to 144 bits for address
matching and virtual address. Low overhead of decode-logic and sense amplifiers
minimize required die area.
ROM
Read Only Memory compiler is a high density, fully diffused ROM solution targeted for
embedded applications that require program store. The bit cells are optimized to offer
very high density and low power. Configurations up to 1 Mbit are available. Metal
programmable versions are also available on a custom basis.
PLL
Compiler based technology that allows system designers to choose the center frequency,
duty cycle, and create a customized PLL. Fully modular and embedded in the I/O pad
ring with no area overhead to the core eliminates manual wiring of analog power
supply or additional band-gaps / external components.
Frequency
Synthesizer
Sophisticated frequency synthesizer targeted for applications such as pixel (dot clock)
generation for use a s a video master and non-integer clock multiplication for high-speed
networking application. Cascaded PLL architecture for precision and phase jitter
stability. Fully modular and embedded in the I/O pad ring with no area overhead to the
core eliminates manual wiring of analog power supply or additional band-gaps /
external components.
Design Kit Support
EDA
views
Verilog views with best case and worse case timing and power data
VHDL views with best case and worse case timing and power data
Synopsys views with best case and worse case timing and power data
Data
Books
Typical timing & power data sheet for each cell
Logic Data Book (typical case:25degrees C/1.8V)
Inline I/O Cell Data Book (typical case:25degrees C/3.3V)
Staggered I/O Cell Data Book (typical case:25degrees C/3.3V)
Our design kits include a broad selection of embedded semiconductor intellectual property components
including standard cell logic, standard I/O, specialty I/O interfaces, memory, and PLL options. System on
chip options include embedded RISC processors, buss standards, connectivity standards, high speed serial
I/O, cryptology, and applied FEC applications. Please contact us regarding your specific requirements.
CMOS 0.18um Data Sheet
FSC18_012302
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Flextronics Semiconductor Inc. reserves the right to make changes in specifications at any time and without notice. The information
furnished by Flextronics Semiconductor Inc. in this publication is believed to be accurate and reliable. No responsibility, however, is
assumed by Flextronics Semiconductor for its use, nor for any infringements of patents or other rights of third parties resulting from
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