Advanced Power
N-CHANNEL ENHANCEMENT MODE
Electronics Corp.
POWER MOSFET
Low Gate Charge
BV
DSS
25V
Simple Drive Requirement
R
DS(ON)
33m
Fast Switching
I
D
7A
RoHS Compliant
Description
Absolute Maximum Ratings
Symbol
Units
V
DS
V
V
GS
V
I
D
@T
A
=25
A
I
D
@T
A
=70
A
I
DM
A
P
D
@T
A
=25
W
W/
T
STG
T
J
Symbol
Value
Unit
Rthj-a
Thermal Resistance Junction-ambient
3
Max.
50
/W
Data and specifications subject to change without notice
200415051-1/6
AP4412GM
Pb Free Plating Product
Parameter
Rating
Drain-Source Voltage
25
Gate-Source Voltage
20
Continuous Drain Current
3
7
Continuous Drain Current
3
5.8
Pulsed Drain Current
1
30
Total Power Dissipation
2.5
-55 to 150
Operating Junction Temperature Range
-55 to 150
Linear Derating Factor
0.02
Thermal Data
Parameter
Storage Temperature Range
The Advanced Power MOSFETs from APEC provide the
designer with the best combination of fast switching,
ruggedized device design, ultra low on-resistance and
cost-effectiveness.
S
S
S
G
D
D
D
D
SO-8
G
D
S
Electrical Characteristics@T
j
=25
o
C(unless otherwise specified)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max. Units
BV
DSS
Drain-Source Breakdown Voltage
V
GS
=0V, I
D
=250uA
25
-
-
V
B
V
DSS
/T
j
Breakdown Voltage Temperature Coefficient
Reference to 25
, I
D
=1mA
-
0.03
-
V/
R
DS(ON)
Static Drain-Source On-Resistance
2
V
GS
=10V, I
D
=7A
-
-
33
m
V
GS
=4.5V, I
D
=3.5A
-
-
60
m
V
GS(th)
Gate Threshold Voltage
V
DS
=V
GS
, I
D
=250uA
1
-
3
V
g
fs
Forward Transconductance
V
DS
=10V, I
D
=7A
-
12
-
S
I
DSS
Drain-Source Leakage Current (T
j
=25
o
C)
V
DS
=25V, V
GS
=0V
-
-
1
uA
Drain-Source Leakage Current (T
j
=70
o
C)
V
DS
=20V ,V
GS
=0V
-
-
25
uA
I
GSS
Gate-Source Leakage
V
GS
=20V
-
-
100
nA
Q
g
Total Gate Charge
2
I
D
=7A
-
7
-
nC
Q
gs
Gate-Source Charge
V
DS
=16V
-
1.5
-
nC
Q
gd
Gate-Drain ("Miller") Charge
V
GS
=5V
-
5
-
nC
t
d(on)
Turn-on Delay Time
2
V
DS
=16V
-
7
-
ns
t
r
Rise Time
I
D
=7A
-
22
-
ns
t
d(off)
Turn-off Delay Time
R
G
=3.3
,
V
GS
=10V
-
14.5
-
ns
t
f
Fall Time
R
D
=2.3
-
6
-
ns
C
iss
Input Capacitance
V
GS
=0V
-
218
-
pF
C
oss
Output Capacitance
V
DS
=25V
-
155
-
pF
C
rss
Reverse Transfer Capacitance
f=1.0MHz
-
63
-
pF
Source-Drain Diode
Symbol
Parameter
Test Conditions
Min.
Typ.
Max. Units
I
S
Continuous Source Current ( Body Diode )
V
D
=V
G
=0V , V
S
=1.2V
-
-
2.08
A
V
SD
Forward On Voltage
2
T
j
=25
, I
S
=2.3A, V
GS
=0V
-
-
1.2
V
Notes:
1.Pulse width limited by Max. junction temperature.
2.Pulse width <300us , duty cycle <2%.
3.Surface mounted on 1 in
2
copper pad of
FR4 board ; 125
/W when mounted on Min. copper pad.
2/6
AP4412GM
AP4412GM
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance
v.s. Junction Temperature
3/6
0
5
10
15
20
25
0
1
2
3
4
5
6
V
DS
, Drain-to-Source Voltage (V)
I
D
,
Dra
i
n C
u
rre
nt
(A
)
T
C
=150
o
C
10V
8.0V
6.0V
5.0V
V
GS
=4.0V
0
5
10
15
20
25
30
0
1
2
3
4
5
6
V
DS
, Drain-to-Source Voltage (V)
I
D
,
Dra
i
n C
u
rre
nt
(A
)
T
C
=25
o
C
10V
8.0V
6.0V
5.0V
V
GS
=4.0V
0.6
0.8
1
1.2
1.4
1.6
1.8
-50
0
50
100
150
T
j
, Junction Temperature (
o
C)
No
rma
l
i
z
e
d
R
DS
(
ON)
I
D
=7A
V
GS
=10V
20
25
30
35
40
45
50
55
60
3
4
5
6
7
8
9
10
11
V
GS
(V)
R
DS
(
ON)
(m
)
I
D
=7A
T
C
=25
Fig 5. Maximum Drain Current v.s.
Fig 6. Typical Power Dissipation
Case Temperature
Fig 7. Maximum Safe Operating Area
Fig 8. Effective Transient Thermal Impedance
4/6
AP4412GM
0.01
0.1
1
10
100
0.1
1
10
100
V
DS
(V)
I
D
(A
)
T
C
=25
o
C
Single Pulse
1ms
10ms
100ms
1s
10s
DC
0.001
0.01
0.1
1
0.0001
0.001
0.01
0.1
1
10
100
1000
t , Pulse Width (s)
N
o
r
m
aliz
ed T
h
er
m
a
l Res
pon
s
e
(
R
th
ja
)
P
DM
Duty Factor = t/T
Peak T
j
= P
DM
x R
thja
+ T
a
R
thja
=125
o
C/W
t
T
0.02
0.01
0.05
0.1
0.2
Duty Factor = 0.5
Single Pulse
0
1
2
3
4
5
6
7
8
25
50
75
100
125
150
T
c
, Case Temperature (
o
C)
I
D
,
Dra
i
n C
u
rre
nt
(A
)
0
1
2
3
0
50
100
150
T
c ,
Case Temperature (
o
C)
P
D
(W
)
AP4412GM
Fig 9. Gate Charge Characteristics
Fig 10. Typical Capacitance Characteristics
Fig 11. Forward Characteristic of
Fig 12. Gate Threshold Voltage v.s.
Reverse Diode
Junction Temperature
5/6
0
1
2
3
-50
0
50
100
150
T
j
, Junction Temperature (
o
C )
V
GS
(t
h
)
(V)
0
2
4
6
8
10
12
14
16
0
2
4
6
8
10
12
14
16
Q
G
, Total Gate Charge (nC)
V
GS
, Ga
te
to
So
urc
e
Vo
lta
g
e
(V)
I
D
=7A
V
DS
=16V
10
100
1000
1
5
9
13
17
21
25
29
V
DS
(V)
C (
p
F)
f=1.0MHz
Ciss
Coss
Crss
0.1
1
10
100
0.1
0.3
0.5
0.7
0.9
1.1
1.3
1.5
V
SD
(V)
I
S
(A)
Tj=25
o
C
Tj=150
o
C
PDF 
ZIP