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Электронный компонент: AD5318

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REV. B
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties that
may result from its use. No license is granted by implication or otherwise
under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
www.analog.com
Fax: 781/326-8703
2003 Analog Devices, Inc. All rights reserved.
AD5308/AD5318/AD5328
*
2.5 V to 5.5 V Octal Voltage Output
8-/10-/12-Bit DACs in 16-Lead TSSOP
*Protected by U.S.Patent No. 5,969,657; other patents pending.
FEATURES
AD5308: 8 Buffered 8-Bit DACs in 16-Lead TSSOP
A Version: 1 LSB INL, B Version: 0.75 LSB INL
AD5318: 8 Buffered 10-Bit DACs in 16-Lead TSSOP
A Version: 4 LSB INL, B Version: 3 LSB INL
AD5328: 8 Buffered 12-Bit DACs in 16-Lead TSSOP
A Version: 16 LSB INL, B Version: 12 LSB INL
Low Power Operation: 0.7 mA @ 3 V
Guaranteed Monotonic by Design over All Codes
Power-Down to 120 nA @ 3 V, 400 nA @ 5 V
Double-Buffered Input Logic
Buffered/Unbuffered/V
DD
Reference Input Options
Output Range: 0 V to V
REF
or 0 V to 2 V
REF
Power-On Reset to 0 V
Programmability
Individual Channel Power-Down
Simultaneous Update of Outputs (
LDAC)
Low Power, SPI
, QSPITM, MICROWIRETM, and DSP
Compatible 3-Wire Serial Interface
On-Chip Rail-to-Rail Output Buffer Amplifiers
Temperature Range 40 C to +105 C
APPLICATIONS
Portable Battery-Powered Instruments
Digital Gain and Offset Adjustment
Programmable Voltage and Current Sources
Optical Networking
Automatic Test Equipment
FUNCTIONAL BLOCK DIAGRAM
BUFFER
INPUT
REGISTER
DAC
REGISTER
INTERFACE
LOGIC
DIN
LDAC
GND
V
OUT
B
V
OUT
C
V
OUT
D
V
OUT
E
V
OUT
G
V
OUT
H
V
OUT
F
V
DD
POWER-ON
RESET
GAIN-SELECT
LOGIC
V
OUT
A
V
REF
EFGH
V
REF
ABCD
SYNC
SCLK
POWER-DOWN
LOGIC
GAIN-SELECT
LOGIC
STRING
DAC B
BUFFER
INPUT
REGISTER
DAC
REGISTER
STRING
DAC C
BUFFER
INPUT
REGISTER
DAC
REGISTER
STRING
DAC D
BUFFER
INPUT
REGISTER
DAC
REGISTER
STRING
DAC E
BUFFER
INPUT
REGISTER
DAC
REGISTER
BUFFER
INPUT
REGISTER
DAC
REGISTER
BUFFER
INPUT
REGISTER
DAC
REGISTER
BUFFER
INPUT
REGISTER
DAC
REGISTER
V
DD
V
DD
LDAC
STRING
DAC F
STRING
DAC G
STRING
DAC H
STRING
DAC A
GENERAL DESCRIPTION
The AD5308/AD5318/AD5328 are octal 8-, 10-, and 12-bit
buffered voltage output DACs in a 16-lead TSSOP. They operate
from a single 2.5 V to 5.5 V supply, consuming 0.7 mA typ at 3 V.
Their on-chip output amplifiers allow the outputs to swing
rail-to-rail with a slew rate of 0.7 V/
s. The AD5308/AD5318/
AD5328 use a versatile 3-wire serial interface that operates at
clock rates up to 30 MHz and is compatible with standard
SPI, QSPI, MICROWIRE, and DSP interface standards.
The references for the eight DACs are derived from two reference
pins (one per DAC quad). These reference inputs can be
configured as buffered, unbuffered, or V
DD
inputs. The parts
incorporate a power-on reset circuit, which ensures that the DAC
outputs power up to 0 V and remain there until a valid write to
the device takes place. The outputs of all DACs may be updated
simultaneously using the asynchronous
LDAC input. The parts
contain a power-down feature that reduces the current consump-
tion of the devices to 400 nA at 5 V (120 nA at 3 V). The eight
channels of the DAC may be powered down individually.
All three parts are offered in the same pinout, which allows
users to select the resolution appropriate for their application
without redesigning their circuit board.
Mobile Communications
Programmable Attenuators
Industrial Process Control
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REV. B
2
AD5308/AD5318/AD5328SPECIFICATIONS
(V
DD
= 2.5 V to 5.5 V; V
REF
= 2 V; R
L
= 2 k
to
GND; C
L
= 200 pF to GND; all specifications T
MIN
to T
MAX
, unless otherwise noted.)
A Version
2
B Version
2
Parameter
1
Min
Typ
Max
Min
Typ
Max
Unit
Conditions/Comments
DC PERFORMANCE
3, 4
AD5308
Resolution
8
8
Bits
Relative Accuracy
0.15
1
0.15
0.75 LSB
Differential Nonlinearity
0.02
0.25
0.02
0.25 LSB
Guaranteed Monotonic by Design over All Codes
AD5318
Resolution
10
10
Bits
Relative Accuracy
0.5
4
0.5
3
LSB
Differential Nonlinearity
0.05
0.50
0.05
0.50 LSB
Guaranteed Monotonic by Design over All Codes
AD5328
Resolution
12
12
Bits
Relative Accuracy
2
16
2
12
LSB
Differential Nonlinearity
0.2
1.0
0.2
1.0
LSB
Guaranteed Monotonic by Design over All Codes
Offset Error
5
60
5
60
mV
V
DD
= 4.5 V, Gain = +2. See Figures 2 and 3.
Gain Error
0.30
1.25
0.30
1.25 % of FSR
V
DD
= 4.5 V, Gain = +2. See Figures 2 and 3.
Lower Deadband
5
10
60
10
60
mV
See Figure 2. Lower deadband exists only if offset
error is negative.
Upper Deadband
5
10
60
10
60
mV
See Figure 3. Upper deadband exists only if V
REF
=
V
DD
and offset plus gain error is positive.
Offset Error Drift
6
12
12
ppm of FSR/
C
Gain Error Drift
6
5
5
ppm of FSR/
C
DC Power Supply Rejection Ratio
6
60
60
dB
V
DD
=
10%
DC Crosstalk
6
200
200
V
R
L
= 2 k
to GND or V
DD
DAC REFERENCE INPUTS
6
V
REF
Input Range
1.0
V
DD
1.0
V
DD
V
Buffered Reference Mode
0.25
V
DD
0.25
V
DD
V
Unbuffered Reference Mode
V
REF
Input Impedance (R
DAC
)
>10.0
>10.0
M
Buffered Reference Mode and Power-Down Mode
37.0
45.0
37.0
45.0
k
Unbuffered Reference Mode. 0 V to V
REF
Output Range.
18.0
22.0
18.0
22.0
k
Unbuffered Reference Mode. 0 V to 2 V
REF
Output Range.
Reference Feedthrough
70.0
70.0
dB
Frequency = 10 kHz
Channel-to-Channel Isolation
75.0
75.0
dB
Frequency = 10 kHz
OUTPUT CHARACTERISTICS
6
Minimum Output Voltage
7
0.001
0.001
V
This is a measure of the minimum and maximum
Maximum Output Voltage
7
V
DD
0.001
V
DD
0.001
V
drive capability of the output amplifier.
DC Output Impedance
0.5
0.5
Short Circuit Current
25.0
25.0
mA
V
DD
= 5 V
16.0
16.0
mA
V
DD
= 3 V
Power-Up Time
2.5
2.5
s
Coming Out of Power-Down Mode. V
DD
= 5 V.
5.0
5.0
s
Coming Out of Power-Down Mode. V
DD
= 3 V.
LOGIC INPUTS
6
Input Current
1
1
A
V
IL
, Input Low Voltage
0.8
0.8
V
V
DD
= 5 V
10%
0.8
0.8
V
V
DD
= 3 V
10%
0.7
0.7
V
V
DD
= 2.5 V
V
IH
, Input High Voltage
1.7
1.7
V
V
DD
= 2.5 V to 5.5 V; TTL and CMOS
Compatible
Pin Capacitance
3.0
3.0
pF
POWER REQUIREMENTS
V
DD
2.5
5.5
2.5
5.5
V
I
DD
(Normal Mode)
8
V
IH
= V
DD
and V
IL
= GND
V
DD
= 4.5 V to 5.5 V
1.0
1.8
1.0
1.8
mA
All DACs in Unbuffered Mode. In Buffered mode,
V
DD
= 2.5 V to 3.6 V
0.7
1.5
0.7
1.5
mA
extra current is typically x
A per DAC; x = (5 A
+ V
REF
/R
DAC
)/4.
I
DD
(Power-Down Mode)
9
V
IH
= V
DD
and V
IL
= GND
V
DD
= 4.5 V to 5.5 V
0.4
1
0.4
1
A
V
DD
= 2.5 V to 3.6 V
0.12
1
0.12
1
A
NOTES
1
See the Terminology section.
2
Temperature range (A, B Version): 40
C to +105C; typical at +25C.
3
DC specifications tested with the outputs unloaded unless stated otherwise.
4
Linearity is tested using a reduced code range: AD5308 (Code 8 to Code 255), AD5318 (Code 28 to Code 1023), and AD5328 (Code 115 to Code 4095).
5
This corresponds to x codes. x = deadband voltage/LSB size.
6
Guaranteed by design and characterization; not production tested.
7
For the amplifier output to reach its minimum voltage, offset error must be negative; for the amplifier output to reach its maximum voltage, V
REF
= V
DD
and offset plus gain error
must be positive.
8
Interface inactive. All DACs active. DAC outputs unloaded.
9
All eight DACs powered down.
Specifications subject to change without notice.
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REV. B
AD5308/AD5318/AD5328
3
AC CHARACTERISTICS
1
(V
DD
= 2.5 V to 5.5 V; R
L
= 2 k
to GND; C
L
= 200 pF to GND; all specifications T
MIN
to T
MAX
, unless
otherwise noted.)
A, B Version
3
Parameter
2
Min
Typ
Max
Unit
Conditions/Comments
Output Voltage Settling Time
V
REF
= V
DD
= 5 V
AD5308
6
8
s
1/4 Scale to 3/4 Scale Change (0x40 to 0xC0)
AD5318
7
9
s
1/4 Scale to 3/4 Scale Change (0x100 to 0x300)
AD5328
8
10
s
1/4 Scale to 3/4 Scale Change (0x400 to 0xC00)
Slew Rate
0.7
V/
s
Major-Code Change Glitch Energy
12
nV-s
1 LSB Change around Major Carry
Digital Feedthrough
0.5
nV-s
Digital Crosstalk
0.5
nV-s
Analog Crosstalk
1
nV-s
DAC-to-DAC Crosstalk
3
nV-s
Multiplying Bandwidth
200
kHz
V
REF
= 2 V
0.1 V p-p. Unbuffered Mode.
Total Harmonic Distortion
70
dB
V
REF
= 2.5 V
0.1 V p-p. Frequency = 10 kHz.
NOTES
1
Guaranteed by design and characterization; not production tested.
2
See the Terminology section.
3
Temperature range (A, B Version): 40
C to +105C; typical at +25C.
Specifications subject to change without notice.
TIMING CHARACTERISTICS
1, 2, 3
A, B Version
Parameter
Limit at T
MIN
, T
MAX
Unit
Conditions/Comments
t
1
33
ns min
SCLK Cycle Time
t
2
13
ns min
SCLK High Time
t
3
13
ns min
SCLK Low Time
t
4
13
ns min
SYNC to SCLK Falling Edge Setup Time
t
5
5
ns min
Data Setup Time
t
6
4.5
ns min
Data Hold Time
t
7
0
ns min
SCLK Falling Edge to
SYNC Rising Edge
t
8
50
ns min
Minimum
SYNC High Time
t
9
20
ns min
LDAC Pulsewidth
t
10
20
ns min
SCLK Falling Edge to
LDAC Rising Edge
t
11
0
ns min
SCLK Falling Edge to
LDAC Falling Edge
NOTES
1
Guaranteed by design and characterization; not production tested.
2
All input signals are specified with tr = tf = 5 ns (10% to 90% of V
DD
) and timed from a voltage level of (V
IL
+ V
IH
)/2.
3
See Figures 2 and 3.
Specifications subject to change without notice.
SCLK
SYNC
DIN
DB15
DB0
LDAC
1
LDAC
2
NOTES
1
ASYNCHRONOUS LDAC UPDATE MODE
2
SYNCHRONOUS LDAC UPDATE MODE
t
1
t
2
t
8
t
3
t
4
t
5
t
6
t
9
t
11
t
7
t
10
Figure 1. Serial Interface Timing Diagram
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REV. B
4
AD5308/AD5318/AD5328
ABSOLUTE MAXIMUM RATINGS
1, 2
(T
A
= 25
C, unless otherwise noted.)
V
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to +7 V
Digital Input Voltage to GND . . . . . . . 0.3 V to V
DD
+ 0.3 V
Reference Input Voltage to GND . . . . 0.3 V to V
DD
+ 0.3 V
V
OUT
AV
OUT
D to GND . . . . . . . . . . . 0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
Industrial (A, B Version) . . . . . . . . . . . . . 40
C to +105C
Storage Temperature Range . . . . . . . . . . . . 65
C to +150C
Junction Temperature (T
J MAX
) . . . . . . . . . . . . . . . . . . . 150
C
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
AD5308ARU
40
C to +105C
Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5308ARU-REEL7
40
C to +105C
Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5308BRU
40
C to +105C
Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5308BRU-REEL
40
C to +105C
Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5308BRU-REEL7
40
C to +105C
Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5318ARU
40
C to +105C
Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5318ARU-REEL7
40
C to +105C
Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5318BRU
40
C to +105C
Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5318BRU-REEL
40
C to +105C
Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5318BRU-REEL7
40
C to +105C
Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5318BRUZ
*
40
C to +105C
Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5318BRUZ-REEL
*
40
C to +105C
Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5318BRUZ-REEL7
*
40
C to +105C
Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5328ARU
40
C to +105C
Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5328ARU-REEL7
40
C to +105C
Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5328BRU
40
C to +105C
Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5328BRU-REEL
40
C to +105C
Thin Shrink Small Outline Package (TSSOP)
RU-16
AD5328BRU-REEL7
40
C to +105C
Thin Shrink Small Outline Package (TSSOP)
RU-16
*Z = Pb-free part.
16-Lead TSSOP
Power Dissipation . . . . . . . . . . . . . . . . . . . (T
J MAX
T
A
)/
JA
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . 150.4
C/W
Reflow Soldering
Peak Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
C
Time at Peak Temperature . . . . . . . . . . . . . 10 sec to 40 sec
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability.
2
Transient currents of up to 100 mA will not cause SCR latch-up.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD5308/AD5318/AD5328 feature proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions
are recommended to avoid performance degradation or loss of functionality.
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REV. B
AD5308/AD5318/AD5328
5
PIN CONFIGURATION
TOP VIEW
(Not to Scale)
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
SYNC
LDAC
V
DD
V
OUT
A
V
OUT
B
V
OUT
C
V
OUT
D
V
REF
ABCD
SCLK
DIN
V
OUT
E
AD5308/
AD5318/
AD5328
V
REF
EFGH
V
OUT
F
V
OUT
G
V
OUT
H
GND
PIN FUNCTION DESCRIPTIONS
Pin No.
Mnemonic
Function
1
LDAC
This active low-control input transfers the contents of the input registers to their respective DAC registers.
Pulsing this pin low allows any or all DAC registers to be updated if the input registers have new data.
This allows simultaneous update of all DAC outputs. Alternatively, this pin can be tied permanently low.
2
SYNC
Active Low-Control Input. This is the frame synchronization signal for the input data. When
SYNC goes
low, it powers on the SCLK and DIN buffers and enables the input shift register. Data is transferred in
on the falling edges of the following 16 clocks. If
SYNC is taken high before the 16th falling edge, the
rising edge of
SYNC acts as an interrupt and the write sequence is ignored by the device.
3
V
DD
Power Supply Input. These parts can be operated from 2.5 V to 5.5 V, and the supply should be
decoupled with a 10
F capacitor in parallel with a 0.1 F capacitor to GND.
4
V
OUT
A
Buffered Analog Output Voltage from DAC A. The output amplifier has rail-to-rail operation.
5
V
OUT
B
Buffered Analog Output Voltage from DAC B. The output amplifier has rail-to-rail operation.
6
V
OUT
C
Buffered Analog Output Voltage from DAC C. The output amplifier has rail-to-rail operation.
7
V
OUT
D
Buffered Analog Output Voltage from DAC D. The output amplifier has rail-to-rail operation.
8
V
REF
ABCD
Reference Input Pin for DACs A, B, C, and D. It may be configured as a buffered, unbuffered, or V
DD
input to the four DACs, depending on the state of the BUF and V
DD
control bits. It has an input range
from 0.25 V to V
DD
in unbuffered mode and from 1 V to V
DD
in buffered mode.
9
V
REF
EFGH
Reference Input Pin for DACs E, F, G, and H. It may be configured as a buffered, unbuffered, or V
DD
input to the four DACs, depending on the state of the BUF and V
DD
control bits. It has an input range
from 0.25 V to V
DD
in unbuffered mode and from 1 V to V
DD
in buffered mode.
10
V
OUT
E
Buffered Analog Output Voltage from DAC E. The output amplifier has rail-to-rail operation.
11
V
OUT
F
Buffered Analog Output Voltage from DAC F. The output amplifier has rail-to-rail operation.
12
V
OUT
G
Buffered Analog Output Voltage from DAC G. The output amplifier has rail-to-rail operation.
13
V
OUT
H
Buffered Analog Output Voltage from DAC H. The output amplifier has rail-to-rail operation.
14
GND
Ground Reference Point for All Circuitry on the Part.
15
DIN
Serial Data Input. This device has a 16-bit shift register. Data is clocked into the register on the falling
edge of the serial clock input. The DIN input buffer is powered down after each write cycle.
16
SCLK
Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial clock
input. Data can be transferred at rates up to 30 MHz. The SCLK input buffer is powered down after
each write cycle.

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