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Электронный компонент: ADUC7026BSTZ62I-RL

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Precision Analog Microcontroller 12-bit
Analog I/O, ARM7TDMI
MCU
ADuC7019/20/21/22/24/25/26/27
FEATURES
Analog I/O
Multichannel, 12-bit, 1 MSPS ADC
Up to 16 ADC channels
1
Fully differential and single-ended modes
0 to V
REF
analog input range
12-bit voltage output DACs
Up to 4 DAC outputs available
1
On-chip voltage reference
On-chip temperature sensor (3C)
Voltage comparator
Microcontroller
ARM7TDMI core, 16-bit/32-bit RISC architecture
JTAG port supports code download and debug
Clocking options
Trimmed on-chip oscillator (3%)
External watch crystal
External clock source up to 44 MHz
41.78 MHz PLL with programmable divider
Memory
62 kB flash/EE memory, 8 kB SRAM
In-circuit download, JTAG-based debug
Software triggered in-circuit reprogrammability
On-chip peripherals
UART, 2 I
2
C and SPI serial I/O
Up to 40-pin GPIO port
1
4 general-purpose timers
Wake-up and watchdog timers
Power supply monitor
Three-phase, 16-bit PWM generator
1
Programmable logic array (PLA)
External memory interface, up to 512 kB
1
Power
Specified for 3 V operation
Active mode: 11 mA @ 5 MHz; 40 mA @ 41.78 MHz
Packages and temperature range
From 40-lead 6 6 mm LFCSP to 80-pin LQFP
1
Fully specified for 40C to +125C operation
Tools
Low-cost QuickStartTM development system
Full third-party support
APPLICATIONS
Industrial control and automation systems
Smart sensors, precision instrumentation
Base station systems, optical networking
FUNCTIONAL BLOCK DIAGRAM
04
95
5-
00
1
1MSPS
12-BIT ADC
DAC0
12-BIT
DAC
DAC1
12-BIT
DAC
DAC2
12-BIT
DAC
DAC3
12-BIT
DAC
PWM0
H
PWM0
L
PWM1
H
PWM1
L
PWM2
H
PWM2
L
THREE-
PHASE
PWM
EXT. MEMORY
INTERFACE
ADuC7026
ADC0
XCLKI
XCLKO
RST
V
REF
ADC11
MUX
TEMP
SENSOR
BANDGAP
REF
OSC
AND PLL
PSM
POR
CMP0
CMP1
CMP
OUT
PLA
4 GENERAL
PURPOSE TIMERS
2k 32 SRAM
31k 16 FLASH/EEPROM
SERIAL I/O
UART, SPI, I
2
C
GPIO
JTAG
ARM7TDMI-BASED MCU WITH
ADDITIONAL PERIPHERALS
Figure 1.
1
Depending on part model. See Ordering Guide for more information.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice.
No license is granted by implication or otherwise under any patent or patent rights of Analog
Devices. Trademarks and registered trademarks are the property of their respective owners.




One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
2005 Analog Devices, Inc. All rights reserved.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 2 of 92
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description ......................................................................... 4
Detailed Block Diagram .............................................................. 5
Specifications..................................................................................... 6
Timing Specifications .................................................................. 9
Absolute Maximum Ratings.......................................................... 16
ESD Caution................................................................................ 16
Pin Configurations and Function Descriptions ......................... 17
ADuC7019/ADuC7020/ADuC7021/ADuC7022 .................. 17
ADuC7024/ADuC7025 ............................................................. 20
ADuC7026/ADuC7027 ............................................................. 23
Typical Performance Characteristics ........................................... 27
Terminology .................................................................................... 30
ADC Specifications .................................................................... 30
DAC Specifications..................................................................... 30
Overview of the ARM7TDMI Core............................................. 31
Thumb Mode (T)........................................................................ 31
Long Multiply (M)...................................................................... 31
EmbeddedICE (I) ....................................................................... 31
Exceptions ................................................................................... 31
ARM Registers ............................................................................ 31
Interrupt Latency........................................................................ 32
Memory Organization ................................................................... 33
Memory Access........................................................................... 33
Flash/EE Memory....................................................................... 33
SRAM ........................................................................................... 33
Memory Mapped Registers ....................................................... 33
ADC Circuit Overview.................................................................. 37
Transfer Function....................................................................... 37
Typical Operation....................................................................... 38
MMRs Interface.......................................................................... 38
Converter Operation.................................................................. 40
Driving the Analog Inputs ........................................................ 42
Calibration................................................................................... 42
Temperature Sensor ................................................................... 42
Bandgap Reference..................................................................... 42
Nonvolatile Flash/EE Memory ..................................................... 43
Programming.............................................................................. 43
Security ........................................................................................ 43
Flash/EE Control Interface ....................................................... 44
Execution Time from SRAM and Flash/EE............................ 45
Reset and Remap ........................................................................ 46
Other Analog Peripherals.............................................................. 47
DAC.............................................................................................. 47
Power Supply Monitor ............................................................... 48
Comparator ................................................................................. 49
Oscillator and PLL--Power Control........................................ 50
Digital Peripherals.......................................................................... 52
Three-Phase PWM..................................................................... 52
General-Purpose I/O ................................................................. 59
Serial Port Mux........................................................................... 61
UART Serial Interface................................................................ 61
Serial Peripheral Interface......................................................... 64
I
2
C Compatible Interfaces ......................................................... 66
Programmable Logic Array (PLA)........................................... 70
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 3 of 92
Processor Reference Peripherals ...................................................73
Interrupt System..........................................................................73
Timers...........................................................................................74
External Memory Interfacing ....................................................78
Hardware Design Considerations .................................................82
Power Supplies.............................................................................82
Grounding and Board Layout Recommendations .................83
Clock Oscillator...........................................................................83
Power-on Reset Operation.........................................................84
Typical System Configuration ...................................................84
Development Tools .........................................................................85
PC-Based Tools ...........................................................................85
In-Circuit Serial Downloader ...................................................85
Outline Dimensions........................................................................86
Ordering Guide ...........................................................................88
REVISION HISTORY
10/05--Revision 0: Initial Version
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 4 of 92
GENERAL DESCRIPTION
The ADuC7019/20/21/22/24/25/26/27 are fully integrated,
1 MSPS, 12-bit data acquisition systems incorporating high
performance multichannel ADCs, 16-bit/32-bit MCUs and
Flash/EE memory on a single chip.
The ADC consists of up to 12 single-ended inputs. An
additional four inputs are available but are multiplexed
with the four DAC output pins. The four DAC outputs are
only available on certain models (ADuC7019, ADuC7020,
ADuC7021, ADuC7024, and ADuC7026). However, in many
cases where the DAC is not present, this pin can still be used
as an additional ADC input, giving a maximum of 16 ADC
input channels. The ADC can operate in single-ended or
differential input modes. The ADC input voltage is 0 to V
REF
.
Low-drift bandgap reference, temperature sensor, and voltage
comparator complete the ADC peripheral set.
The ADuC7019/20/21/22/24/25/26/27 also integrate four
buffered voltage output DACs on-chip. The DAC output range
is programmable to one of three voltage ranges.
The devices operate from an on-chip oscillator and a PLL
generating an internal high frequency clock of 41.78 MHz. This
clock is routed through a programmable clock divider from
which the MCU core clock operating frequency is generated.
The microcontroller core is an ARM7TDMI, 16-bit/32-bit RISC
machine, which offers up to 41 MIPS peak performance. Eight
kilobytes of SRAM and 62 kilobytes of nonvolatile Flash/EE
memory are provided on-chip. The ARM7TDMI core views all
memory and registers as a single linear array.
On-chip factory firmware supports in-circuit serial download
via the UART or I
2
C serial interface ports, while nonintrusive
emulation is also supported via the JTAG interface. These
features are incorporated into a low-cost QuickStartTM
Development System supporting this MicroConverter family.
The parts operate from 2.7 V to 3.6 V and are specified over
an industrial temperature range of -40C to +125C. When
operating at 41.78 MHz, the power dissipation is typically
120 mW. The ADuC7019/20/21/22/24/25/26/27 are available in
a variety of memory models and packages.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 5 of 92
DETAILED BLOCK DIAGRAM
04
95
5-
0
02
77
ADC0
78
ADC1
79
ADC2/CMP0
80
ADC3/CMP1
1
ADC4
2
ADC5
3
ADC6
4
ADC7
5
ADC8
6
ADC9
7
ADC10
76
ADC11
9
ADCNEG
20
BM/P0.0/CMP
OUT
/PLAI[7]/MS2
68
V
REF
V
REF
18
P4.6/AD14/PLAO[14]
19
P4.7/AD15/PLAO[15]
*SEE SELECTION TABLE FOR
FEATURE AVAILABILITY ON
DIFFERENT MODELS.
55
P
4
.0
/A
D
8
/P
LA
O[
8
]
56
P
4
.1
/A
D
9
/P
LA
O[
9
]
63
P4
.
2
/
A
D
1
0
/
PL
A
O
[
1
0
]
64
P4
.
3
/
A
D
1
1
/
PL
A
O
[
1
1
]
65
P4
.
4
/
A
D
1
2
/
PL
A
O
[
1
2
]
66
P4
.
5
/
A
D
1
3
/
PL
A
O
[
1
3
]
62
P1
.
0
/
T
1
/
SP
M0
/
P
L
AI
[
0
]
61
P
1
.1
/S
P
M
1
/
P
L
A
I[
1
]
60
P
1
.2
/S
P
M
2
/
P
L
A
I[
2
]
59
P
1
.3
/S
P
M
3
/
P
L
A
I[
3
]
58
P
1
.4
/S
P
M
4
/
P
L
A
I[
4
]
/IR
Q2
57
P
1
.5
/S
P
M
5
/
P
L
A
I[
5
]
/IR
Q3
52
P
1
.6
/S
P
M
6
/
P
L
A
I[
6
]
14
TM
S
15
TD
I
23
TD
O
22
TC
K
21
P
0
.6
/T
1
/
M
R
S
T
/P
LA
O
[
3
]
/
A
E
49
P2
.
1
/
W
S/
PW
M
0
H
/P
LA
O[
6
]
50
P2
.
2
/
R
S/
PW
M
0
L
/P
LA
O[
7
]
17
P
2
.3
/A
E
33
P
2
.4
/P
WM
0
H
/M
S
0
35
P
2
.5
/P
WM
0
L
/M
S
1
36
P
2
.6
/P
WM
1
H
/M
S
2
48
P
2
.7
/P
WM
1
L
/M
S
3
24
P
0
.2
/P
W
M
2
L
/
BHE
16
P0
.
1
/
PW
M
2
H
/B
L
E
34
P
0
.
3
/
T
RS
T
/
A16
/
ADC
BU
S
Y
42
P2
.
0
/
SPM
9
/
P
L
A
O
[5
]
/
C
O
NV
STA
R
T
51
P
1
.
7
/
SPM
7
/
PL
A
O
[
0
]
MUX
12-BIT
VOLTAGE
OUTPUTDAC
BUF
10
DAC0*/ADC12
12-BIT
VOLTAGE
OUTPUTDAC
BUF
11
DAC1*/ADC13
12-BIT
VOLTAGE
OUTPUTDAC
BUF
12
DAC2*/ADC14
12-BIT
VOLTAGE
OUTPUTDAC
BUF
13
DAC3*/ADC15
29
P3.0/AD0/PWM0
H
/PLAI[8]
30
P3.1/AD1/PWM0
L
/PLAI[9]
31
P3.2/AD2/PWM1
H
/PLAI[10]
32
P3.3/AD3/PWM1
L
/PLAI[11]
38
P3.4/AD4/PWM2
H
/PLAI[12]
39
P3.5/AD5/PWM2
L
/PLAI[13]
46
P3.6/AD6/PWM
TRIP
/PLAI[14]
47
P3.7/AD7/PWM
SYNC
/PLAI[15]
44
XCLKO
45
XCLKI
40
IRQ0/P0.4/PWM
TRIP
/PLAO[1]/MS1
41
IRQ1/P0.5/ADC
BUSY
/PLAO[2]/MS0
43
P0.7/ECLK/XCLK/SPM8/PLAO[4]
ADuC7026*
69
DA
C
REF
70
DA
CG
N
D
75
DA
CV
DD
37
RS
T
27
LV
DD
28
DG
ND
54
IOV
DD
25
IOGN
D
26
IOV
DD
53
IOGN
D
74
AV
DD
73
AV
DD
67
RE
F
G
ND
71
AG
ND
72
AG
ND
8
GN
D
RE
F
THREE-
PHASE
PWM
DAC
CONTROL
ARM7TDMI
MCU
CORE
62KBYTES FLASH/EE
(31k 16 BITS)
8192 BYTES USER RAM
(2k 32 BITS)
WAKEUP/
RTC TIMER
POWER SUPPLY
MONITOR
PROG. CLOCK
DIVIDER
JT
AG
EMUL
A
T
O
R
DOWNLOADER
PROG. LOGIC
ARRAY
SPI/I
2
C SERIAL
INTERFACE
SERIAL PORT MULTIPLEXER
UART
SERIAL PORT
POR
INTERRUPT
CONTROLLER
12-BIT SAR
ADC 1MSPS
ADC
CONTROL
PLL
OSC
BAND GAP
REFERENCE
CMP
OUT
/IRQ
MUX
DAC
TEMP
SENSOR
Figure 2.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 6 of 92
SPECIFICATIONS
AVDD = IOV
DD
= 2.7 V to 3.6 V, V
REF
= 2.5 V internal reference, f
CORE
= 41.78 MHz, T
A
= 40C to 125C, unless otherwise noted.
Table 1.
Parameter Min
Typ
Max
Unit
Test
Conditions/Comments
ADC CHANNEL SPECIFICATIONS
8 acquisition clocks and fADC/2
ADC Power-Up Time
5
s
DC Accuracy
1, 2
Resolution 12
Bits
Integral Nonlinearity
0.6
1.0
1.5 LSB
LSB
2.5 V internal reference
1.0 V external reference
Differential Nonlinearity
3, 4
0.5
+0.7/-0.6
+1/-0.9 LSB
LSB
2.5 V internal reference
1.0 V external reference
DC Code Distribution
1
LSB
ADC input is a dc voltage
ENDPOINT ERRORS
5
Offset Error
1
2
LSB
Offset Error Match
1
LSB
Gain Error
2
5
LSB
Gain Error Match
1
LSB
DYNAMIC PERFORMANCE
F
IN
= 10 kHz sine wave, f
SAMPLE
= 1 MSPS
Signal-to-Noise Ratio (SNR)
69
dB
Includes distortion and noise components
Total Harmonic Distortion (THD)
-78
dB
Peak Harmonic or Spurious Noise
-75
dB
Channel-to-Channel Crosstalk
-80
dB
Measured on adjacent channels
ANALOG INPUT
Input Voltage Ranges
Differential Mode
V
CM
6
V
REF
/2
V
Single-Ended Mode
0 to V
REF
V
Leakage Current
1
6
A
Input Capacitance
20
pF
During ADC acquisition
ON-CHIP VOLTAGE REFERENCE
0.47 F from V
REF
to AGND
Output Voltage
2.5
V
Accuracy
5
mV
T
A
= 25C
Reference Temperature Coefficient
40
ppm/C
Power Supply Rejection Ratio
75
dB
Output Impedance
70
T
A
= 25C
Internal V
REF
Power-On Time
1
ms
EXTERNAL REFERENCE INPUT
7
Input Voltage Range
0.625
AV
DD
V
Input Impedance
65
k
DAC CHANNEL SPECIFICATIONS
R
L
= 5 k
, C
L
= 100 pF
DC ACCURACY
8
Resolution
12
Bits
Relative Accuracy
2
LSB
Differential Nonlinearity
1
LSB
Guaranteed monotonic
Offset Error
15
mV
2.5 V internal reference
Gain Error
9
1
%
Gain Error Mismatch
0.1
%
% of full scale on DAC0
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 7 of 92
Parameter Min
Typ
Max
Unit
Test
Conditions/Comments
ANALOG OUTPUTS
Output Voltage Range_0
0 to
DAC
REF
V DAC
REF
range: DACGND to DACV
DD
Output Voltage Range_1
0 to 2.5
V
Output Voltage Range_2
0 to
DACV
DD
V
Output Impedance
2
DAC AC CHARACTERISTICS
Voltage Output Settling Time
10
s
Digital to Analog Glitch Energy
20
nV-sec
1 LSB change at major carry
COMPARATOR
Input Offset Voltage
15
mV
Input Bias Current
1
A
Input Voltage Range
AGND
AV
DD
- 1.2
V
Input
Capacitance
7 pF
Hysteresis
4, 6
2
15
mV
Hysteresis can be turned on or off via the
CMPHYST bit in the CMPCON register
Response Time
1
s
100 mV overdrive and configured for 0.5 s
response time (CMPRES = 11)
TEMPERATURE SENSOR
Voltage Output at 25C
780
mV
Voltage TC
-1.3
mV/C
Accuracy
3
C
POWER SUPPLY MONITOR (PSM)
IOV
DD
Trip Point Selection
2.79
V
Two selectable trip points
3.07
V
Power Supply Trip Point Accuracy
3.5
%
Of the selected nominal trip point voltage
POWER-ON
RESET
2.36
V
GLITCH IMMUNITY ON RESET PIN
3
50
s
WATCHDOG TIMER (WDT)
Timeout Period
0 512
sec
FLASH/EE MEMORY
Endurance
10
10,000
cycles
Data Retention
11
10
years
T
J
= 55C
DIGITAL INPUTS
All digital inputs excluding XCLKI and XCLKO
Logic 1 Input Current
(Leakage Current)
0.2
1
A
V
IH
= VDD or V
IH
= 5 V
Logic 0 Input Current
-40
-60
A
V
IL
= 0 V
Input Capacitance
10
pF
LOGIC INPUTS
3
All logic inputs excluding XCLKI and XCLKO
V
INL
,
Input
Low
Voltage
0.8
V
V
INH
, Input High Voltage
2.0
V
LOGIC OUTPUTS
All digital outputs excluding XCLKI and XCLKO
V
OH
, Output High Voltage
2.4
V
I
SOURCE
= 1.6 mA
V
OL
, Output Low Voltage
12
0.4
V I
SINK
= 1.6 mA
CRYSTAL INPUTS XCLKI and XCLKO
Logic Inputs, XCLKI Only
V
INL
,
Input
Low
Voltage
1.1
V
V
INH
, Input High Voltage
1.7
V
XCLKI Input Capacitance
20
pF
XCLKO Output Capacitance
20
pF
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 8 of 92
Parameter Min
Typ
Max
Unit
Test
Conditions/Comments
INTERNAL OSCILLATOR
32.768
kHz
3
%
MCU CLOCK RATE
From 32 kHz Internal Oscillator
326
kHz
CD = 7
From 32 kHz External Crystal
41.78
MHz
CD = 0
Using an External Clock
0.05
44 MHz T
A
= 85C
0.05
41.78
MHz
T
A
= 125C
START-UP TIME
Core clock = 41.78 MHz
At Power-On
300
ms
From Pause/Nap Mode
24
ns
CD = 0
3.06
s
CD = 7
From Sleep Mode
1.58
ms
From Stop Mode
1.7
ms
PROGRAMMABLE LOGIC ARRAY (PLA)
Pin Propagation Delay
12
ns
From input pin to output pin
Element Propagation Delay
2.5
ns
POWER REQUIREMENTS
13, 14
Power Supply Voltage Range
AV
DD
AGND and IOV
DD
- IOGND
2.7
3.6
V
Analog Power Supply Currents
AV
DD
Current
200
A
ADC in idle mode
DACV
DD
Current
15
3
25
A
Digital Power Supply Current
IOV
DD
Current in Normal Mode
Code executing from Flash/EE
7
10
mA
CD = 7
11
15
mA
CD = 3
40
45
mA
CD = 0 (41.78 MHz clock)
IOV
DD
Current in Pause Mode
25
30
mA
CD = 0 (41.78 MHz clock)
IOV
DD
Current in Sleep Mode
250
400
A
T
A
= 85C
600
1000
A
T
A
= 125C
Additional Power Supply Currents
ADC
2
mA
@ 1 MSPS
0.7
mA
@ 62.5 kSPS
DAC
700
A
per
DAC
1
All ADC channel specifications are guaranteed during normal MicroConverter core operation.
2
Apply to all ADC input channels.
3
Measured using the factory set default values in ADCOF and ADCGN.
4
Not production tested but supported by design and/or characterization data on production release.
5
Measured using the factory set default values in ADCOF and ADCGN using an external AD845 op amp as an input buffer stage as shown in Figure 47. Based on
external ADC system components, the user may need to execute a system calibration to remove external endpoint errors and achieve these specifications (see the
Calibration section).
6
The input signal can be centered on any dc common-mode voltage (V
CM
) as long as this value is within the ADC voltage input range specified.
7
When using an external reference input pin, the internal reference must be disabled by setting the LSB in the REFCON memory mapped register to 0.
8
DAC linearity is calculated using reduced code range of 100 to 3995.
9
DAC gain error is calculated using reduced code range of 100 to internal 2.5 V V
REF
.
10
Endurance is qualified as per JEDEC Standard 22 method A117 and measured at -40C, +25C, +85C, and +125C.
11
Retention lifetime equivalent at junction temperature (T
J
) = 55C as per JEDEC Standard 22 method A117. Retention lifetime derates with junction temperature.
12
Test carried out with a maximum of eight I/O set to a low output level.
13
Power supply current consumption is measured in normal, pause, and sleep modes under the following conditions: Normal Mode: 3.6 V supply, Pause Mode: 3.6 V
supply, Sleep Mode: 3.6 V supply.
14
IOV
DD
power supply current decreases typically by 2 mA during a flash/EE erase cycle.
15
On the ADuC7020/21/22, this current must be added to AV
DD
current.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 9 of 92
TIMING SPECIFICATIONS
Table 2. External Memory Write Cycle
Parameter Min
Typ
Max
Unit
CLK
UCLK
T
MS_AFTER_CLKH
0
4
ns
T
ADDR_AFTER_CLKH
4
8
ns
T
AE_H_AFTER_MS
CLK
T
AE
(XMxPAR[14:12] + 1) x CLK
T
HOLD_ADDR_AFTER_AE_L
CLK + (!XMxPAR[10]) x CLK
T
HOLD_ADDR_BEFORE_WR_L
(!XMxPAR[8]) x CLK
T
WR_L_AFTER_AE_L
CLK + (!XMxPAR[10] + !XMxPAR[8]) x CLK
T
DATA_AFTER_WR_L
8
12
ns
T
WR
(XMxPAR[7:4] + 1) x CLK
T
WR_H_AFTER_CLKH
0
4
ns
T
HOLD_DATA_AFTER_WR_H
(!XMxPAR[8]) x CLK
ns
T
BEN_AFTER_AE_L
CLK
T
RELEASE_MS_AFTER_WR_H
(!XMxPAR[8] + 1) x CLK
049
55-
05
2
CLK
CLK
T
MS_AFTER_CLKH
T
AE_H_AFTER_MS
T
AE
T
WR_L_AFTER_AE_L
MS
AE
WR
RD
A/D[15:0]
FFFF
9ABC
5678
9ABE
1234
BEN0
BEN1
A16
T
WR
T
WR_H_AFTER_CLKH
T
HOLD_DATA_AFTER_WR_H
T
HOLD_ADDR_AFTER_AE_L
T
HOLD_ADDR_BEFORE_WR_L
T
DATA_AFTER_WR_L
T
BEN_AFTER_AE_L
T
ADDR_AFTER_CLKH
T
RELEASE_MS_AFTER_WR_H
Figure 3. External Memory Write Cycle
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 10 of 92
Table 3. External Memory Read Cycle
Parameter Min
Typ
Max
Unit
CLK
UCLK
T
MS_AFTER_CLKH
4
8
ns
T
ADDR_AFTER_ CLKH
4
16
ns
T
AE_H_AFTER_MS
CLK
T
AE
(XMxPAR[14:12] + 1) x CLK
T
HOLD_ADDR_AFTER_AE_L
CLK + (!XMxPAR[10]) x CLK
T
RD_L_AFTER_AE_L
CLK + (!XMxPAR[10] + !XMxPAR[9]) x CLK
T
DATA_AFTER_RD_L
8
12
ns
T
RD
(XMxPAR[3:0] + 1) x CLK
T
RD_H_AFTER_CLKH
0
4
ns
T
HOLD_DATA_AFTER_RD_H
(!XMxPAR[9]) x CLK
ns
T
RELEASE_MS_AFTER_RD_H
CLK
0
495
5-
053
ECLK
GP0
AE
WR
RD
CLK
T
MS_AFTER_CLKH
T
AE
T
RD_L_AFTER_AE_L
T
RD
T
RD_H_AFTER_CLKH
T
HOLD_DATA_AFTER_RD_H
T
DATA_AFTER_RD_L
T
HOLD_ADDR_AFTER_AE_L
T
ADDR_AFTER_CLKH
T
AE_H_AFTER_MS
T
RELEASE_MS_AFTER_RD_H
A/D[15:0]
FFFF
234B
CDEF
D14A
234A
89AB
BEN0
BEN1
A16
Figure 4. External Memory Read Cycle
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 11 of 92
Table 4. I
2
C Timing in Fast Mode (400 kHz)
Slave
Parameter Description
Min
Max
Master
Typ Unit
t
L
SCLOCK low pulse width
1
200
1360
ns
t
H
SCLOCK high pulse width
1
100
1140
ns
t
SHD
Start condition hold time
300
251350
ns
t
DSU
Data setup time
100
740
ns
t
DHD
Data hold time
50
400
ns
t
RSU
Setup time for repeated start
100
12.51350
ns
t
PSU
Stop condition setup time
100
400
t
BUF
Bus-free time between a stop condition and a start condition
1.3
t
R
Rise time for both CLOCK and SDATA
100
300
200
ns
t
F
Fall time for both CLOCK and SDATA
60
100
20
ns
t
SUP
Pulse width of spike suppressed
50
ns
1
t
HCLK
depends on the clock divider or CD bits in PLLCON MMR. t
HCLK
= t
UCLK
/2
CD
.
0
49
55
-
0
54
SDATA (I/O)
t
BUF
MSB
LSB
ACK
MSB
1
9
8
27
1
SCLK (I)
PS
STOP
CONDITION
START
CONDITION
S(R)
REPEATED
START
t
SUP
t
R
t
F
t
F
t
R
t
H
t
L
t
SUP
t
DSU
t
DHD
t
RSU
t
DHD
t
DSU
t
SHD
t
PSU
Figure 5. I
2
C Compatible Interface Timing
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 12 of 92
Table 5. SPI Master Mode Timing (PHASE Mode = 1)
Parameter
Description Min
Typ
Max
Unit
t
SL
SCLOCK low pulse width
1
(SPIDIV + 1) t
HCLK
ns
t
SH
SCLOCK high pulse width
1
(SPIDIV + 1) t
HCLK
ns
t
DAV
Data output valid after SCLOCK edge
25
ns
t
DSU
Data input setup time before SCLOCK edge
2
1 t
UCLK
ns
t
DHD
Data input hold time after SCLOCK edge
2
2 t
UCLK
ns
t
DF
Data output fall time
5
12.5
ns
t
DR
Data output rise time
5
12.5
ns
t
SR
SCLOCK rise time
5
12.5
ns
t
SF
SCLOCK fall time
5
12.5
ns
1
t
HCLK
depends on the clock divider or CD bits in PLLCON MMR. t
HCLK
= t
UCLK
/2
CD
.
2
t
UCLK
= 23.9 ns. It corresponds to the 41.78 MHz internal clock from the PLL before the clock divider.
0
49
55
-
055
SCLOCK
(POLARITY = 0)
SCLOCK
(POLARITY = 1)
MOSI
MSB
BITS 61
LSB
MISO
MSB IN
BITS 61
LSB IN
t
SH
t
SL
t
SR
t
SF
t
DR
t
DF
t
DAV
t
DSU
t
DHD
Figure 6. SPI Master Mode Timing (PHASE Mode = 1)
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 13 of 92
Table 6. SPI Master Mode Timing (PHASE Mode = 0)
Parameter
Description Min
Typ
Max
Unit
t
SL
SCLOCK low pulse width
1
(SPIDIV + 1) t
HCLK
ns
t
SH
SCLOCK high pulse width
1
(SPIDIV + 1) t
HCLK
ns
t
DAV
Data output valid after SCLOCK edge
25
ns
t
DOSU
Data output setup before SCLOCK edge
75
ns
t
DSU
Data input setup time before SCLOCK edge
2
1 t
UCLK
ns
t
DHD
Data input hold time after SCLOCK edge
2
2 t
UCLK
ns
t
DF
Data output fall time
5
12.5
ns
t
DR
Data output rise time
5
12.5
ns
t
SR
SCLOCK rise time
5
12.5
ns
t
SF
SCLOCK fall time
5
12.5
ns
1
t
HCLK
depends on the clock divider or CD bits in PLLCON MMR. t
HCLK
= t
UCLK
/2
CD
.
2
t
UCLK
= 23.9 ns. It corresponds to the 41.78 MHz internal clock from the PLL before the clock divider.
04
95
5-
0
56
SCLOCK
(POLARITY = 0)
SCLOCK
(POLARITY = 1)
t
SH
t
SL
t
SR
t
SF
MOSI
MSB
BITS 61
LSB
MISO
MSB IN
BITS 61
LSB IN
t
DR
t
DF
t
DAV
t
DOSU
t
DSU
t
DHD
Figure 7. SPI Master Mode Timing (PHASE Mode = 0)
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 14 of 92
Table 7. SPI Slave Mode Timing (PHASE Mode = 1)
Parameter
Description Min
Typ
Max
Unit
t
CS
CS to SCLOCK edge
1
2 t
UCLK
ns
t
SL
SCLOCK low pulse width
2
(SPIDIV + 1) t
HCLK
ns
t
SH
SCLOCK high pulse width
2
(SPIDIV + 1) t
HCLK
ns
t
DAV
Data output valid after SCLOCK edge
25
ns
t
DSU
Data input setup time before SCLOCK edge
1
1 t
UCLK
ns
t
DHD
Data input hold time after SCLOCK edge
1
2 t
UCLK
ns
t
DF
Data output fall time
5
12.5
ns
t
DR
Data output rise time
5
12.5
ns
t
SR
SCLOCK rise time
5
12.5
ns
t
SF
SCLOCK fall time
5
12.5
ns
t
SFS
CS high after SCLOCK edge
0
ns
1
t
UCLK
= 23.9 ns. It corresponds to the 41.78 MHz internal clock from the PLL before the clock divider.
2
t
HCLK
depends on the clock divider or CD bits in PLLCON MMR. t
HCLK
= t
UCLK
/2
CD
.
04
95
5-
05
7
SCLOCK
(POLARITY = 0)
CS
SCLOCK
(POLARITY = 1)
t
SH
t
SL
t
SR
t
SF
t
SFS
MISO
MSB
BITS 61
LSB
MOSI
MSB IN
BITS 61
LSB IN
t
CS
t
DHD
t
DSU
t
DAV
t
DR
t
DF
Figure 8. SPI Slave Mode Timing (PHASE Mode = 1)
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 15 of 92
Table 8. SPI Slave Mode Timing (PHASE Mode = 0)
Parameter Description
Min
Typ
Max
Unit
t
CS
CS to SCLOCK edge
1
2 t
UCLK
ns
t
SL
SCLOCK low pulse width
2
(SPIDIV + 1) t
HCLK
ns
t
SH
SCLOCK high pulse width
2
(SPIDIV + 1) t
HCLK
ns
t
DAV
Data output valid after SCLOCK edge
25
ns
t
DSU
Data input setup time before SCLOCK edge
1
1 t
UCLK
ns
t
DHD
Data input hold time after SCLOCK edge
1
2 t
UCLK
ns
t
DF
Data output fall time
5
12.5
ns
t
DR
Data output rise time
5
12.5
ns
t
SR
SCLOCK rise time
5
12.5
ns
t
SF
SCLOCK fall time
5
12.5
ns
t
DOCS
Data output valid after CS edge
25
ns
t
SFS
CS high after SCLOCK edge
0
ns
1
t
UCLK
= 23.9 ns. It corresponds to the 41.78 MHz internal clock from the PLL before the clock divider.
2
t
HCLK
depends on the clock divider or CD bits in PLLCON MMR. t
HCLK
= t
UCLK
/2
CD
.
04
95
5-
0
58
SCLOCK
(POLARITY = 0)
CS
SCLOCK
(POLARITY = 1)
t
SH
t
SL
t
SR
t
SF
t
SFS
MISO
MOSI
t
CS
MSB IN
BITS 61
LSB IN
t
DHD
t
DSU
MSB
BITS 61
LSB
t
DOCS
t
DAV
t
DR
t
DF
Figure 9. SPI Slave Mode Timing (PHASE Mode = 0)
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 16 of 92
ABSOLUTE MAXIMUM RATINGS
AGND = REFGND = DACGND = GND
REF
;
T
A
= 25C, unless otherwise noted.
Table 9.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any one
time.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Parameter Rating
AV
DD
to IOV
DD
-0.3 V to +0.3 V
AGND to DGND
-0.3 V to +0.3 V
IOV
DD
to IOGND, AV
DD
to AGND
-0.3 V to +6 V
Digital Input Voltage to IOGND
-0.3 V to +5.3 V
Digital Output Voltage to IOGND
-0.3 V to IOV
DD
+ 0.3 V
V
REF
to AGND
-0.3 V to AV
DD
+ 0.3 V
Analog Inputs to AGND
-0.3 V to AV
DD
+ 0.3 V
Analog Output to AGND
-0.3 V to AV
DD
+ 0.3 V
Operating Temperature
Range Industrial
40C to +125C
Storage Temperature Range
65C to +150C
Junction Temperature
125C
JA
Thermal Impedance (40-pin CSP)
26C/W
JA
Thermal Impedance (64-pin CSP)
24C/W
JA
Thermal Impedance (64-pin LQFP)
47C/W
JA
Thermal Impedance (80-pin LQFP)
38C/W
Peak Solder Reflow Temperature
SnPb Assemblies (10 sec to 30 sec)
240C
Pb-Free Assemblies (20 sec to 40 sec)
260C
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 17 of 92
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
ADuC7019/ADuC7020/ADuC7021/ADuC7022
0
49
55
-
0
64
ADuC7019/
ADuC7020
TOP VIEW
(Not to Scale)
PIN 1
INDICATOR
1
2
3
4
5
6
7
8
9
10
ADC3/CMP1
ADC4
GND
REF
DAC0/ADC12
DAC1/ADC13
DAC2/ADC14
DAC3/ADC15
TMS
TDI
BM/P0.0/CMP
OUT
/PLAI[7]
P1.3/SPM3/PLAI[3]
P1.4/SPM4/PLAI[4]/IRQ2
P1.5/SPM5/PLAI[5]/IRQ3
P1.6/SPM6/PLAI[6]
P1.7/SPM7/PLAO[0]
XCLKI
XCLKO
P0.7/ECLK/XCLK/SPM8/PLAO[4]
P2.0/SPM9/PLAO[5]/CONV
START
IRQ1/P0.5/ADC
BUSY
/PLAO[2]
30
29
28
27
26
25
24
23
22
21
11
12
13
14
15
16
17
18
19
20
P
0
.6
/T
1
/
MR
S
T
/
P
L
A
O[3
]
TC
K
TD
O
IOG
N
D
IO
V
DD
LV
DD
DG
ND
P0
.
3
/
T
RST
/
ADC
BU
S
Y
RST
I
R
Q
0/
P
0.
4/
P
W
M
TR
I
P
/P
L
A
O
[
1
]
ADC2
/
CM
P
0
ADC1
ADC0
AV
DD
AG
ND
V
REF
P
4
.2
/P
L
A
O
[
1
0
]
P1
.
0
/
T
1
/
SPM
0
/
PLA
I
[
0
]
P1
.
1
/
SPM
1/
PL
AI
[
1
]
P1
.
2
/
SPM
2/
PL
AI
[
2
]
40
39
38
37
36
35
34
33
32
31
Figure 10. ADuC7019/ADuC7020 Pin Configuration
0
49
55
-
0
65
ADuC7021
TOP VIEW
(Not to Scale)
PIN 1
INDICATOR
1
2
3
4
5
6
7
8
9
10
ADC4
ADC5
ADC6
ADC7
GND
REF
DAC0/ADC12
DAC1/ADC13
TMS
TDI
BM/P0.0/CMP
OUT
/PLAI[7]
P1.3/SPM3/PLAI[3]
P1.4/SPM4/PLAI[4]/IRQ2
P1.5/SPM5/PLAI[5]/IRQ3
P1.6/SPM6/PLAI[6]
P1.7/SPM7/PLAO[0]
XCLKI
XCLKO
P0.7/ECLK/XCLK/SPM8/PLAO[4]
P2.0/SPM9/PLAO[5]/CONV
START
IRQ1/P0.5/ADC
BUSY
/PLAO[2]
30
29
28
27
26
25
24
23
22
21
11
12
13
14
15
16
17
18
19
20
P
0
.6
/T
1
/
MR
S
T
/
P
L
A
O[3
]
TC
K
TD
O
IOG
N
D
IO
V
DD
LV
DD
DG
ND
P0
.
3
/
T
RST
/
ADC
BU
S
Y
RST
I
R
Q
0/
P
0.
4/
P
W
M
TR
I
P
/P
L
A
O
[
1
]
ADC3
/
CM
P
1
ADC2
/
CM
P
0
ADC1
ADC0
AV
DD
AG
ND
V
REF
P1
.
0
/
T
1
/
SPM
0
/
PLA
I
[
0
]
P1
.
1
/
SPM
1/
PL
AI
[
1
]
P1
.
2
/
SPM
2/
PL
AI
[
2
]
40
39
38
37
36
35
34
33
32
31
Figure 11. ADuC7021 Pin Configuration
04
95
5-
0
66
ADuC7022
TOP VIEW
(Not to Scale)
PIN 1
INDICATOR
1
2
3
4
5
6
7
8
9
10
ADC5
ADC6
ADC7
ADC8
ADC9
GND
REF
TMS
TDI
BM/P0.0/CMP
OUT
/PLAI[7]
P0.6/T1/MRST/PLAO[3]
P1.2/SPM2/PLAI[2]
P1.3/SPM3/PLAI[3]
P1.4/SPM4/PLAI[4]/IRQ2
P1.5/SPM5/PLAI[5]/IRQ3
P1.6/SPM6/PLAI[6]
P1.7/SPM7/PLAO[0]
XCLKI
XCLKO
P0.7/ECLK/XCLK/SPM8/PLAO[4]
P2.0/SPM9/PLAO[5]/CONV
START
30
29
28
27
26
25
24
23
22
21
11
12
13
14
15
16
17
18
19
20
TC
K
TDO
IOGN
D
IOV
DD
LV
DD
DG
ND
P
0
.
3
/
T
RS
T
/
ADC
BUSY
RS
T
IR
Q
0
/P
0
.4
/P
W
M
TR
I
P
/P
L
A
O[
1
]
IR
Q1
/P
0
.
5
/
A
D
C
BUSY
/P
L
A
O[
2
]
A
DC4
A
DC3
/
CM
P
1
A
DC2
/
CM
P
0
A
DC1
A
DC0
AV
DD
AG
ND
V
REF
P
1
.
0
/
T
1
/
SPM
0
/
PL
A
I
[
0
]
P
1
.
1
/
SPM
1
/
PL
AI
[
1
]
40
39
38
37
36
35
34
33
32
31
Figure 12. ADuC7022 Pin Configuration
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 18 of 92
Table 10. Pin Function Descriptions (ADuC7019/ADuC7020/ADuC7021/ADuC7022)
Pin No.
7019/20 7021 7022 Mnemonic
Description
38
37
36
ADC0
Single-Ended or Differential Analog Input 0.
39
38
37
ADC1
Single-Ended or Differential Analog Input 1.
40
39
38
ADC2/CMP0
Single-Ended or Differential Analog Input 2 / Comparator Positive Input.
1 40
39
ADC3/CMP1
Single-Ended or Differential Analog Input 3 (Buffered Input on ADuC7019) /
Comparator Negative Input.
2
1
40
ADC4
Single-Ended or Differential Analog Input 4.
2
1
ADC5
Single-Ended or Differential Analog Input 5.
3
2
ADC6
Single-Ended or Differential Analog Input 6.
4
3
ADC7
Single-Ended or Differential Analog Input 7.
4
ADC8
Single-Ended or Differential Analog Input 8.
5
ADC9
Single-Ended or Differential Analog Input 9.
3 5
6
GND
REF
Ground Voltage Reference for the ADC. For optimal performance, the analog
power supply should be separated from IOGND and DGND.
4 6
DAC0/ADC12
DAC0 Voltage Output / Single-Ended or Differential Analog Input 12.
5 7
DAC1/ADC13
DAC1 Voltage Output / Single-Ended or Differential Analog Input 13.
6
DAC2/ADC14
DAC2 Voltage Output / Single-Ended or Differential Analog Input 14.
7
DAC3/ADC15
DAC3 Voltage Output on ADuC7020. On the ADuC7019, a 10 nF capacitor
needs to be connected between this pin and AGND/Single-Ended or
Differential Analog Input 15.
8
8
7
TMS
Test Mode Select, JTAG Test Port Input. Debug and download access.
9
9
8
TDI
Test Data In, JTAG Test Port Input. Debug and download access.
10 10
9
BM/P0.0/CMP
OUT
/PLAI[7]
Multifunction I/O Pin:
Boot Mode. The ADuC7019/20/21/22 enter serial download mode if BM is
low at reset and execute code if BM is pulled high at reset through a 1 k
resistor / General-Purpose Input-Output Port 0.0 / Voltage Comparator
Output / Programmable Logic Array Input Element 7.
11 11
10
P0.6/T1/MRST/PLAO[3] Multifunction Pin, Driven Low After Reset:
General-Purpose Output Port 0.6 / Timer1 Input / Power-On Reset Output /
Programmable Logic Array Output Element 3.
12
12
11
TCK
Test Clock, JTAG Test Port Input. Debug and download access.
13
13
12
TDO
Test Data Out, JTAG Test Port Output. Debug and download access.
14
14
13
IOGND
Ground for GPIO. Typically connected to DGND.
15 15
14
IOV
DD
3.3 V Supply for GPIO and Input of the On-Chip Voltage Regulator.
16 16
15
LV
DD
2.6 V Output of the On-Chip Voltage Regulator. Must be connected to a 0.47
f capacitor to DGND.
17
17
16
DGND
Ground for Core Logic.
18 18
17
P0.3/TRST/ADC
BUSY
General-Purpose Input-Output Port 0.3 / Test Reset, JTAG Test Port Input.
Debug and download access / ADC
BUSY
Signal Output.
19 19
18
RST
Reset Input, Active Low.
20 20
19
IRQ0/P0.4/PWM
TRIP
/PLAO[1]
Multifunction I/O Pin:
External Interrupt Request 0, Active High / General-Purpose Input-Output
Port 0.4 / PWM Trip External Input / Programmable Logic Array Output
Element 1.
21 21
20
IRQ1/P0.5/ADC
BUSY
/PLAO[2]
Multifunction I/O Pin:
External Interrupt Request 1, Active High / General-Purpose Input-Output
Port 0.5 / ADC
BUSY
Signa l Output / Programmable Logic Array Output Element 2.
22 22
21
P2.0/SPM9/PLAO[5]/CONV
START
Serial Port Multiplexed:
General-Purpose Input-Output Port 2.0 / UART / Programmable Logic Array
Output Element 5 / Start Conversion Input Signal for ADC.
23 23
22
P0.7/ECLK/XCLK/SPM8/PLAO[4]
Serial Port Multiplexed:
General-Purpose Input-Output Port 0.7 / Output for External Clock Signal /
Input to the Internal Clock Generator Circuits / UART / Programmable Logic
Array Output Element 4.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 19 of 92
Pin No.
7019/20 7021 7022 Mnemonic
Description
24
24
23
XCLKO
Output from the Crystal Oscillator Inverter.
25 25
24
XCLKI
Input to the Crystal Oscillator Inverter and Input to the Internal Clock
Generator Circuits.
26 26
25
P1.7/SPM7/PLAO[0]
Serial Port Multiplexed:
General-Purpose Input-Output Port 1.7 / UART, SPI / Programmable Logic
Array Output Element 0.
27 27
26
P1.6/SPM6/PLAI[6]
Serial Port Multiplexed:
General-Purpose Input-Output Port 1.6 / UART, SPI / Programmable Logic
Array Input Element 6.
28 28
27
P1.5/SPM5/PLAI[5]/IRQ3 Serial Port Multiplexed:
General-Purpose Input-Output Port 1.5 / UART, SPI / Programmable Logic
Array Input Element 5 / External Interrupt Request 3, Active High.
29 29
28
P1.4/SPM4/PLAI[4]/IRQ2 Serial Port Multiplexed:
General-Purpose Input-Output Port 1.4 / UART, SPI / Programmable Logic
Array Input Element 4 / External Interrupt Request 2, Active High.
30 30
29
P1.3/SPM3/PLAI[3]
Serial Port Multiplexed:
General-Purpose Input-Output Port 1.3 / UART, I
2
C1 / Programmable Logic
Array Input Element 3.
31 31
30
P1.2/SPM2/PLAI[2]
Serial Port Multiplexed:
General-Purpose Input-Output Port 1.2 / UART, I
2
C1 / Programmable Logic
Array Input Element 2.
32 32
31
P1.1/SPM1/PLAI[1]
Serial Port Multiplexed:
General-Purpose Input-Output Port 1.1 / UART, I
2
C0 / Programmable Logic
Array Input Element 1.
33 33
32
P1.0/T1/SPM0/PLAI[0]
Serial Port Multiplexed:
General-Purpose Input-Output Port 1.0 / Timer1 Input / UART, I
2
C0 /
Programmable Logic Array Input Element 0.
34
P4.2/PLAO[10]
General-Purpose Input-Output Port 4.2 / Programmable Logic Array Output
Element 10.
35 34
33
V
REF
2.5 V Internal Voltage Reference. Must be connected to a 0.47 f capacitor
when using the internal reference.
36
35
34
AGND
Analog Ground. Ground reference point for the analog circuitry.
37 36
35
AV
DD
3.3 V Analog Power.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 20 of 92
ADuC7024/ADuC7025
04
95
5-
0
67
1
ADC4
2
ADC5
3
ADC6
4
ADC7
5
ADC8
6
ADC9
7
GND
REF
8
ADCNEG
9
DAC0/ADC12
10
DAC1/ADC13
11
TMS
12
TDI
13
P4.6/PLAO[14]
14
P4.7/PLAO[15]
15
BM/P0.0/CMP
OUT
/PLAI[7]
16
P0.6/T1/MRST/PLAO[3]
48 P1.2/SPM2/PLAI[2]
47 P1.3/SPM3/PLAI[3]
46 P1.4/SPM4/PLAI[4]/IRQ2
45 P1.5/SPM5/PLAI[5]/IRQ3
44 P4.1/PLAO[9]
43 P4.0/PLAO[8]
42 IOV
DD
41 IOGND
40 P1.6/SPM6/PLAI[6]
39 P1.7/SPM7/PLAO[0]
38 P3.7/PWMSYNC/PLAI[15]
37 P3.6/PWM
TRIP
/PLAI[14]
36 XCLKI
35 XCLKO
34 P0.7/ECLK/XCLK/SPM8/PLAO[4]
33 P2.0/SPM9/PLAO[5]/CONV
START
6
4
ADC
3
/
CM
P
1
6
3
ADC
2
/
CM
P
0
6
2
ADC
1
6
1
ADC
0
6
0
DAC
V
DD
59
A
V
DD
5
8
AG
ND
5
7
DAC
G
N
D
5
6
DAC
REF
55
V
REF
54
P
4.
5/
P
L
A
O
[
13]
53
P
4.
4/
P
L
A
O
[
12]
52
P
4.
3/
P
L
A
O
[
11]
51
P
4.
2/
P
L
A
O
[
10]
5
0
P
1
.0
/T
1
/
S
P
M0
/P
L
A
I[
0
]
4
9
P1
.
1
/
SPM
1
/
PL
A
I
[
1
]
TOP VIEW
(Not to Scale)
ADuC7024/
ADuC7025
PIN 1
INDICATOR
17
TCK
18
TD
O
19
IOGN
D
20
IO
V
DD
21
LV
DD
22
DG
ND
23
P
3
.0
/P
W
M
0
H
/P
L
A
I[
8
]
24
P
3
.1
/P
W
M
0
L
/P
L
A
I[
9
]
25
P
3
.2
/P
W
M
1
H
/P
L
A
I[
1
0
]
26
P
3
.3
/P
W
M
1
L
/P
L
A
I[
1
1
]
27
P
0
.3
/T
R
S
T
/A
D
C
BUSY
28
RS
T
29
P
3
.4
/P
W
M
2
H
/P
L
A
I[
1
2
]
30
P
3
.5
/P
W
M
2
L
/P
L
A
I[
1
3
]
31
IR
Q0
/P
0
.
4
/
P
W
M
TR
I
P
/P
L
A
O
[
1
]
32
IR
Q
1
/P
0
.5
/A
D
C
BUSY
/P
L
A
O
[
2
]
Figure 13.
ADuC7024/ADuC7025 64-Lead CSP
Pin Configuration
04
95
5-
0
68
1
ADC4
2
ADC5
3
ADC6
4
ADC7
5
ADC8
6
ADC9
7
GND
REF
8
ADCNEG
9
DAC0/ADC12
10
DAC1/ADC13
11
TMS
12
TDI
13
P4.6/PLAO[14]
14
P4.7/PLAO[15]
15
BM/P0.0/CMP
OUT
/PLAI[7]
16
P0.6/T1/MRST/PLAO[3]
48 P1.2/SPM2/PLAI[2]
47 P1.3/SPM3/PLAI[3]
46 P1.4/SPM4/PLAI[4]/IRQ2
45 P1.5/SPM5/PLAI[5]/IRQ3
44 P4.1/PLAO[9]
43 P4.0/PLAO[8]
42 IOV
DD
41 IOGND
40 P1.6/SPM6/PLAI[6]
39 P1.7/SPM7/PLAO[0]
38 P3.7/PWMSYNC/PLAI[15]
37 P3.6/PWM
TRIP
/PLAI[14]
36 XCLKI
35 XCLKO
34 P0.7/ECLK/XCLK/SPM8/PLAO[4]
33 P2.0/SPM9/PLAO[5]/CONV
START
17
TCK
18
TD
O
19
IOGN
D
20
IO
V
DD
21
LV
DD
22
DG
ND
23
P
3
.0
/P
W
M
0
H
/P
L
A
I[
8
]
24
P
3
.1
/P
W
M
0
L
/P
L
A
I[
9
]
25
P
3
.2
/P
W
M
1
H
/P
L
A
I[
1
0
]
26
P
3
.3
/P
W
M
1
L
/P
L
A
I[
1
1
]
27
P
0
.3
/T
R
S
T
/A
D
C
BUSY
28
RS
T
29
P
3
.4
/P
W
M
2
H
/P
L
A
I[
1
2
]
30
P
3
.5
/P
W
M
2
L
/P
L
A
I[
1
3
]
31
IR
Q0
/P
0
.
4
/
P
W
M
TR
I
P
/P
L
A
O
[
1
]
32
IR
Q
1
/P
0
.5
/A
D
C
BUSY
/P
L
A
O
[
2
]
6
4
AD
C3
/
CM
P
1
6
3
AD
C2
/
CM
P
0
6
2
AD
C1
6
1
AD
C0
6
0
DA
CV
DD
59
A
V
DD
5
8
AG
ND
5
7
DA
CG
ND
56
D
A
C
REF
55
V
RE
F
54
P
4.
5/
P
L
A
O
[
13]
53
P
4.
4/
P
L
A
O
[
12]
52
P
4.
3/
P
L
A
O
[
11]
51
P
4.
2/
P
L
A
O
[
10]
5
0
P1
.
0
/
T
1
/
SPM
0
/
PL
A
I
[
0
]
4
9
P1
.
1
/
SPM
1
/
PL
A
I
[
1
]
TOP VIEW
(Not to Scale)
ADuC7024/
ADuC7025
PIN 1
INDICATOR
Figure 14. ADuC7024/ADuC7025 64-Lead LQFP
Pin Configuration
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 21 of 92
Table 11. Pin Function Descriptions (ADuC7024/ADuC7025 64-Lead CSP and ADuC7024/ADuC7025 64-Lead LQFP)
Pin No.
Mnemonic
Description
1
ADC4
Single-Ended or Differential Analog Input 4.
2
ADC5
Single-Ended or Differential Analog Input 5.
3
ADC6
Single-Ended or Differential Analog Input 6.
4
ADC7
Single-Ended or Differential Analog Input 7.
5
ADC8
Single-Ended or Differential Analog Input 8.
6
ADC9
Single-Ended or Differential Analog Input 9.
7 GND
REF
Ground Voltage Reference for the ADC. For optimal performance, the analog power supply
should be separated from IOGND and DGND.
8 ADCNEG
Bias Point or Negative Analog Input of the ADC in Pseudo Differential Mode. Must be connected
to the ground of the signal to convert. This bias point must be between 0 V and 1 V.
9 DAC0/ADC12
DAC0 Voltage Output / Single-Ended or Differential Analog Input 12 (DAC outputs not present
on the ADuC7025).
10 DAC1/ADC13
DAC1 Voltage Output / Single-Ended or Differential Analog Input 13 (DAC outputs not present
on the ADuC7025).
11
TMS
JTAG Test Port Input, Test Mode Select. Debug and download access.
12
TDI
JTAG Test Port Input, Test Data In. Debug and download access
13
P4.6/PLAO[14]
General-Purpose Input-Output Port 4.6 / Programmable Logic Array Output Element 14.
14
P4.7/PLAO[15]
General-Purpose Input-Output Port 4.7 / Programmable Logic Array Output Element 15.
15 BM/P0.0/CMP
OUT
/PLAI[7]
Multifunction I/O Pin:
Boot Mode. The ADuC7024/ADuC7025 enter download mode if BM is low at reset and executes
code if BM is pulled high at reset through a 1 k
resistor / General-Purpose Input-Output Port 0.0 /
Voltage Comparator Output / Programmable Logic Array Input Element 7.
16 P0.6/T1/MRST/PLAO[3]
Multifunction Pin, Driven Low After Reset:
General-Purpose Output Port 0.6 / Timer1 Input / Power-On Reset Output / Programmable Logic
Array Output Element 3.
17
TCK
JTAG Test Port Input, Test Clock. Debug and download access.
18
TDO
JTAG Test Port Output, Test Data Out. Debug and download access.
19
IOGND
Ground for GPIO. Typically connected to DGND.
20 IOV
DD
3.3 V Supply for GPIO and Input of the On-Chip Voltage Regulator.
21 LV
DD
2.6 V Output of the On-Chip Voltage Regulator. Must be connected to a 0.47 F capacitor to DGND.
22
DGND
Ground for Core Logic.
23 P3.0/PWM0
H
/PLAI[8]
General-Purpose Input-Output Port 3.0 / PWM Phase 0 High-Side Output / Programmable Logic
Array Input Element 8.
24 P3.1/PWM0
L
/PLAI[9]
General-Purpose Input-Output Port 3.1 / PWM Phase 0 Low-Side Output / Programmable Logic
Array Input Element 9.
25 P3.2/PWM1
H
/PLAI[10]
General-Purpose Input-Output Port 3.2 / PWM Phase 1 High-Side Output / Programmable Logic
Array Input Element 10.
26 P3.3/PWM1
L
/PLAI[11]
General-Purpose Input-Output Port 3.3 / PWM Phase 1 Low-Side Output / Programmable Logic
Array Input Element 11.
27 P0.3/TRST/ADC
BUSY
General-Purpose Input-Output Port 0.3 / JTAG Test Port Input, Test Reset. Debug and download
access / ADC
BUSY
Signal Output.
28
RST
Reset Input, Active Low.
29 P3.4/PWM2
H
/PLAI[12]
General-Purpose Input-Output Port 3.4 / PWM Phase 2 High-Side Output / Programmable Logic
Array Input 12.
30 P3.5/PWM2
L
/PLAI[13]
General-Purpose Input-Output Port 3.5 / PWM Phase 2 Low-Side Output / Programmable Logic
Array Input Element 13.
31 IRQ0/P0.4/PWM
TRIP
/PLAO[1]
Multifunction I/O Pin:
External Interrupt Request 0, Active High / General-Purpose Input-Output Port 0.4 / PWM Trip
External Input / Programmable Logic Array Output Element 1.
32 IRQ1/P0.5/ADC
BUSY
/PLAO[2]
Multifunction I/O Pin:
External Interrupt Request 1, Active High / General-Purpose Input-Output Port 0.5 / ADC
BUSY
Signal Output / Programmable Logic Array Output Element 2.
33
P2.0/SPM9/PLAO[5]/CONV
START
Serial Port Multiplexed:
General-Purpose Input-Output Port 2.0 / UART / Programmable Logic Array Output Element 5 /
Start Conversion Input Signal for ADC.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 22 of 92
Pin No.
Mnemonic
Description
34 P0.7/ECLK/XCLK/SPM8/PLAO[4]
Serial Port Multiplexed:
General-Purpose Input-Output Port 0.7 / Output for External Clock Signal / Input to the Internal
Clock Generator Circuits / UART / Programmable Logic Array Output Element 4.
35
XCLKO
Output from the Crystal Oscillator Inverter.
36
XCLKI
Input to the Crystal Oscillator Inverter and Input to the Internal Clock Generator Circuits.
37 P3.6/PWM
TRIP
/PLAI[14]
General-Purpose Input-Output Port 3.6 / PWM Safety Cut Off / Programmable Logic Array Input
Element 14.
38 P3.7/PWM
SYNC
/PLAI[15]
General-Purpose Input-Output Port 3.7 / PWM Synchronization Input Output / Programmable
Logic Array Input Element 15.
39 P1.7/SPM7/PLAO[0]
Serial Port Multiplexed:
General-Purpose Input-Output Port 1.7 / UART, SPI / Programmable Logic Array Output Element 0.
40 P1.6/SPM6/PLAI[6]
Serial Port Multiplexed:
General-Purpose Input-Output Port 1.6 / UART, SPI / Programmable Logic Array Input Element 6.
41
IOGND
Ground for GPIO. Typically connected to DGND.
42 IOV
DD
3.3 V Supply for GPIO and Input of the On-Chip Voltage Regulator.
43
P4.0/PLAO[8]
General-Purpose Input-Output Port 4.0 / Programmable Logic Array Output Element 8.
44
P4.1/PLAO[9]
General-Purpose Input-Output Port 4.1 / Programmable Logic Array Output Element 9.
45 P1.5/SPM5/PLAI[5]/IRQ3 Serial Port Multiplexed:
General-Purpose Input-Output Port 1.5 / UART, SPI / Programmable Logic Array Input Element 5 /
External Interrupt Request 3, Active High.
46 P1.4/SPM4/PLAI[4]/IRQ2 Serial Port Multiplexed:
General-Purpose Input-Output Port 1.4 / UART, SPI / Programmable Logic Array Input Element 4 /
External Interrupt Request 2, Active High.
47 P1.3/SPM3/PLAI[3]
Serial Port Multiplexed:
General-Purpose Input-Output Port 1.3 / UART, I
2
C1 / Programmable Logic Array Input Element 3.
48 P1.2/SPM2/PLAI[2]
Serial Port Multiplexed:
General-Purpose Input-Output Port 1.2 / UART, I
2
C1 / Programmable Logic Array Input Element 2.
49 P1.1/SPM1/PLAI[1]
Serial Port Multiplexed:
General-Purpose Input-Output Port 1.1 / UART, I
2
C0 / Programmable Logic Array Input Element 1.
50 P1.0/T1/SPM0/PLAI[0]
Serial Port Multiplexed:
General-Purpose Input-Output Port 1.0 / Timer1 Input / UART, I
2
C0 / Programmable Logic Array
Input Element 0.
51
P4.2/PLAO[10]
General-Purpose Input-Output Port 4.2 / Programmable Logic Array Output Element 10.
52
P4.3/PLAO[11]
General-Purpose Input-Output Port 4.3 / Programmable Logic Array Output Element 11.
53
P4.4/PLAO[12]
General-Purpose Input-Output Port 4.4 / Programmable Logic Array Output Element 12.
54
P4.5/PLAO[13]
General-Purpose Input-Output Port 4.5 / Programmable Logic Array Output Element 13.
55 V
REF
2.5 V Internal Voltage Reference. Must be connected to a 0.47 F capacitor when using the
internal reference.
56 DAC
REF
External Voltage Reference for the DACs. Range: DACGND to DACV
DD
.
57
DACGND
Ground for the DAC. Typically connected to AGND.
58
AGND
Analog Ground. Ground reference point for the analog circuitry.
59 AV
DD
3.3 V Analog Power.
60 DACV
DD
3.3 V Power Supply for the DACs. Typically connected to AV
DD
.
61
ADC0
Single-Ended or Differential Analog Input 0.
62
ADC1
Single-Ended or Differential Analog Input 1.
63
ADC2/CMP0
Single-Ended or Differential Analog Input 2 / Comparator Positive Input.
64
ADC3/CMP1
Single-Ended or Differential Analog Input 3 / Comparator Negative Input.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 23 of 92
ADuC7026/ADuC7027
04
95
5-
0
69
1
ADC4
2
ADC5
3
ADC6
4
ADC7
5
ADC8
6
ADC9
7
ADC10
8
GND
REF
9
ADCNEG
10
DAC0/ADC12
11
DAC1/ADC13
12
DAC2/ADC14
13
DAC3/ADC15
14
TMS
15
TDI
16
P0.1/PWM2
H
/BLE
17
P2.3/AE
18
P4.6/AD14/PLAO[14]
19
P4.7/AD15/PLAO[15]
20
BM/P0.0/CMP
OUT
/PLAI[7]/MS2
60 P1.2/SPM2/PLAI[2]
59 P1.3/SPM3/PLAI[3]
58 P1.4/SPM4/PLAI[4]/IRQ2
57 P1.5/SPM5/PLAI[5]/IRQ3
56 P4.1/AD9/PLAO[9]
55 P4.0/AD8/PLAO[8]
54 IOV
DD
53 IOGND
52 P1.6/SPM6/PLAI[6]
51 P1.7/SPM7/PLAO[0]
50 P2.2/RS/PWM0
L
/PLAO[7]
49 P2.1/WS/PWM0
H
/PLAO[6]
48 P2.7/PWM1
L
/MS3
47 P3.7/AD7/PWM
SYNC
/PLAI[15]
46 P3.6/AD6/PWM
TRIP
/PLAI[14]
45 XCLKI
44 XCLKO
43 P0.7/ECLK/XCLK/SPM8/PLAO[4]
42 P2.0/SPM9/PLAO[5]/CONV
START
41 IRQ1/P0.5/ADC
BUSY
/PLAO[2]/MS0
21
P
0
.
6
/T1
/
M
R
S
T
/P
LA
O[
3
]
/A
E
22
TC
K
23
TD
O
24
P
0
.2
/P
WM
2
L
/
BHE
25
I
OGN
D
26
IOV
DD
27
LV
DD
28
DG
ND
29
P
3
.0
/A
D
0
/P
WM
0
H
/P
LA
I
[
8
]
30
P
3
.
1
/A
D
1
/P
W
M
0
L
/P
LA
I
[
9
]
31
P
3
.2
/A
D
2
/P
WM1
H
/P
LA
I[
1
0
]
32
P
3
.3
/A
D
3
/P
W
M
1
L
/P
LA
I[
1
1
]
33
P2
.
4
/
P
W
M
0
H
/M
S
0
34
P
0
.
3
/
T
RS
T
/
A
1
6
/
AD
C
BUS
Y
35
P2
.
5
/
PW
M
0
L
/M
S
1
36
P2
.
6
/
P
W
M
1
H
/M
S
2
37
RS
T
38
P
3
.4
/A
D
4
/P
WM2
H
/P
LA
I[
1
2
]
39
P
3
.5
/A
D
5
/P
W
M
2
L
/P
LA
I[
1
3
]
40
IR
Q
0
/
P
0
.
4
/
P
W
M
TRI
P
/P
LA
O[
1
]
/MS
1
80
ADC3/
C
M
P
1
79
ADC2/
C
M
P
0
78
ADC1
77
ADC0
76
ADC11
75
DACV
DD
74
AV
DD
73
AV
DD
72
AG
ND
71
AG
ND
70
DACG
ND
69
DAC
RE
F
68
V
RE
F
67
RE
F
G
N
D
6
6
P
4
.5
/A
D
1
3
/P
L
A
O[
1
3
]
6
5
P
4
.4
/A
D
1
2
/P
L
A
O[
1
2
]
6
4
P
4
.3
/A
D
1
1
/P
L
A
O[
1
1
]
6
3
P
4
.2
/A
D
1
0
/P
L
A
O[
1
0
]
6
2
P
1
.0
/T1
/
S
P
M
0
/P
L
A
I
[
0
]
6
1
P
1
.1
/S
P
M
1
/
P
L
A
I[
1
]
TOP VIEW
(Not to Scale)
ADuC7026/
ADuC7027
PIN 1
INDICATOR
Figure 15. ADuC7026/ADuC7027 Pin Configuration
Table 12. Pin Function Descriptions (ADuC7026/ADuC7027)
Pin No.
Mnemonic
Description
1
ADC4
Single-Ended or Differential Analog Input 4.
2
ADC5
Single-Ended or Differential Analog Input 5.
3
ADC6
Single-Ended or Differential Analog Input 6.
4
ADC7
Single-Ended or Differential Analog Input 7.
5
ADC8
Single-Ended or Differential Analog Input 8.
6
ADC9
Single-Ended or Differential Analog Input 9.
7
ADC10
Single-Ended or Differential Analog Input 10.
8 GND
REF
Ground Voltage Reference for the ADC. For optimal performance, the analog power supply
should be separated from IOGND and DGND.
9 ADCNEG
Bias Point or Negative Analog Input of the ADC in Pseudo Differential Mode. Must be connected
to the ground of the signal to convert. This bias point must be between 0 V and 1 V.
10 DAC0/ADC12
DAC0 Voltage Output / Single-Ended or Differential Analog Input 12 (DAC outputs not
present on the ADuC7027).
11 DAC1/ADC13
DAC1 Voltage Output / Single-Ended or Differential Analog Input 13 (DAC outputs not
present on the ADuC7027).
12 DAC2/ADC14
DAC2 Voltage Output / Single-Ended or Differential Analog Input 14 (DAC outputs not
present on the ADuC7027).
13 DAC3/ADC15
DAC3 Voltage Output / Single-Ended or Differential Analog Input 15 (DAC outputs not
present on the ADuC7027).
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 24 of 92
Pin No.
Mnemonic
Description
14
TMS
JTAG Test Port Input, Test Mode Select. Debug and download access.
15
TDI
JTAG Test Port Input, Test Data In. Debug and download access.
16
P0.1/PWM2
H
/BLE
General-Purpose Input-Output Port 0.1 / PWM Phase 2 High-Side Output / External Memory
Byte Low Enable.
17
P2.3/AE
General-Purpose Input-Output Port 2.3 / External Memory Access Enable.
18 P4.6/AD14/PLAO[14]
General-Purpose Input-Output Port 4.6 / External Memory Interface / Programmable Logic
Array Output Element 14.
19 P4.7/AD15/PLAO[15]
General-Purpose Input-Output Port 4.7 / External Memory Interface / Programmable Logic
Array Output Element 15.
20 BM/P0.0/CMP
OUT
/PLAI[7]/MS2
Multifunction I/O Pin:
Boot Mode. The ADuC7026/27 enters UART download mode if BM is low at reset and executes
code if BM is pulled high at reset through a 1 k
resistor / General-Purpose Input-Output
Port 0.0 / Voltage Comparator Output/Programmable Logic Array Input Element 7 / External
Memory Select 2.
21 P0.6/T1/MRST/PLAO[3]/AE Multifunction Pin, Driven Low After Reset:
General-Purpose Output Port 0.6 / Timer1 Input / Power-On Reset Output / Programmable
Logic Array Output Element 3.
22
TCK
JTAG Test Port Input, Test Clock. Debug and download access.
23
TDO
JTAG Test Port Output, Test Data Out. Debug and download access.
24
P0.2/ PWM2
L
/BHE
General-Purpose Input-Output Port 0.2 / PWM Phase 2 Low-Side Output / External Memory
Byte High Enable.
25
IOGND
Ground for GPIO. Typically connected to DGND.
26 IOV
DD
3.3 V Supply for GPIO and Input of the On-Chip Voltage Regulator.
27 LV
DD
2.6 V Output of the On-Chip Voltage Regulator. Must be connected to a 0.47 F capacitor to DGND.
28
DGND
Ground for Core Logic.
29 P3.0/AD0/PWM0
H
/PLAI[8]
General-Purpose Input-Output Port 3.0 / External Memory Interface / PWM Phase 0 High-Side
Output/Programmable Logic Array Input Element 8.
30 P3.1/AD1/PWM0
L
/PLAI[9]
General-Purpose Input-Output Port 3.1 / External Memory Interface / PWM Phase 0 Low-Side
Output / Programmable Logic Array Input Element 9.
31 P3.2/AD2/PWM1
H
/PLAI[10]
General-Purpose Input-Output Port 3.2 / External Memory Interface / PWM Phase 1 High-Side
Output / Programmable Logic Array Input Element 10.
32 P3.3/AD3/PWM1
L
/PLAI[11]
General-Purpose Input-Output Port 3.3 / External Memory Interface / PWM Phase 1 Low-Side
Output / Programmable Logic Array Input Element 11.
33 P2.4/PWM0
H
/MS0
General-Purpose Input-Output Port 2.4 / PWM Phase 0 High-Side Output / External Memory
Select 0.
34 P0.3/TRST/A16/ADC
BUSY
General-Purpose Input-Output Port 0.3 / JTAG Test Port Input, Test Reset. Debug and
download access / ADC
BUSY
Signal Output.
35 P2.5/PWM0
L
/MS1
General-Purpose Input-Output Port 2.5 / PWM Phase 0 Low-Side Output / External Memory
Select 1.
36 P2.6/PWM1
H
/MS2
General-Purpose Input-Output Port 2.6 / PWM Phase 1 High-Side Output / External Memory
Select 2.
37
RST
Reset Input, Active Low.
38 P3.4/AD4/PWM2
H
/PLAI[12]
General-Purpose Input-Output Port 3.4 / External Memory Interface / PWM Phase 2 High-Side
Output / Programmable Logic Array Input 12.
39 P3.5/AD5/PWM2
L
/PLAI[13]
General-Purpose Input-Output Port 3.5 / External Memory Interface / PWM Phase 2 Low-Side
Output / Programmable Logic Array Input Element 13.
40 IRQ0/P0.4/PWM
TRIP
/PLAO[1]/MS1
Multifunction I/O Pin:
External Interrupt Request 0, Active High / General-Purpose Input-Output Port 0.4 / PWM Trip
External Input / Programmable Logic Array Output Element 1 / External Memory Select 1.
41 IRQ1/P0.5/ADC
BUSY
/PLAO[2]/MS0
Multifunction I/O Pin:
External Interrupt Request 1, Active High / General-Purpose Input-Output Port 0.5 / ADC
BUSY
Signal Output / Programmable Logic Array Output Element 2 / External Memory Select 0.
42
P2.0/SPM9/PLAO[5]/CONV
START
Serial Port Multiplexed:
General-Purpose Input-Output Port 2.0 / UART / Programmable Logic Array Output Element 5 /
Start Conversion Input Signal for ADC.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 25 of 92
Pin No.
Mnemonic
Description
43 P0.7/ECLK/XCLK/SPM8/
PLAO[4]
Serial Port Multiplexed:
General-Purpose Input-Output Port 0.7 / Output for External Clock Signal / Input to the
Internal Clock Generator Circuits / UART / Programmable Logic Array Output Element 4.
44
XCLKO
Output from the Crystal Oscillator Inverter.
45
XCLKI
Input to the Crystal Oscillator Inverter and Input to the Internal Clock Generator Circuits.
46 P3.6/AD6/PWM
TRIP
/PLAI[14]
General-Purpose Input-Output Port 3.6 / External Memory Interface / PWM Safety Cut Off /
Programmable Logic Array Input Element 14.
47 P3.7/AD7/PWM
SYNC
/PLAI[15]
General-Purpose Input-Output Port 3.7 / External Memory Interface / PWM Synchronization /
Programmable Logic Array Input Element 15.
48 P2.7/PWM1
L
/MS3
General-Purpose Input-Output Port 2.7 / PWM Phase 1 Low-Side Output / External Memory
Select 3.
49
P2.1/WS/PWM0
H
/PLAO[6]
General-Purpose Input-Output Port 2.1 / External Memory Write Strobe / PWM Phase 0 High-
Side Output / Programmable Logic Array Output Element 6.
50
P2.2/RS/PWM0
L
/PLAO[7]
General-Purpose Input-Output Port 2.2 / External Memory Read Strobe / PWM Phase 0 Low-
Side Output / Programmable Logic Array Output Element 7.
51 P1.7/SPM7/PLAO[0]
Serial Port Multiplexed:
General-Purpose Input-Output Port 1.7 / UART, SPI / Programmable Logic Array Output Element 0.
52 P1.6/SPM6/PLAI[6]
Serial Port Multiplexed:
General-Purpose Input-Output Port 1.6 / UART, SPI / Programmable Logic Array Input Element 6.
53
IOGND
Ground for GPIO. Typically connected to DGND.
54 IOV
DD
3.3 V Supply for GPIO and Input of the On-Chip Voltage Regulator.
55 P4.0/AD8/PLAO[8]
General-Purpose Input-Output Port 4.0 / External Memory Interface / Programmable Logic
Array Output Element 8.
56 P4.1/AD9/PLAO[9]
General-Purpose Input-Output Port 4.1 / External Memory Interface / Programmable Logic
Array Output Element 9.
57 P1.5/SPM5/PLAI[5]/IRQ3
Serial Port Multiplexed:
General-Purpose Input-Output Port 1.5 / UART, SPI / Programmable Logic Array Input Element 5 /
External Interrupt Request 3, Active High.
58 P1.4/SPM4/PLAI[4]/IRQ2
Serial Port Multiplexed:
General-Purpose Input-Output Port 1.4 / UART,SPI / Programmable Logic Array Input Element 4 /
External Interrupt Request 2, Active High.
59 P1.3/SPM3/PLAI[3]
Serial Port Multiplexed:
General-Purpose Input-Output Port 1.3 / UART, I
2
C1 / Programmable Logic Array Input Element 3.
60 P1.2/SPM2/PLAI[2]
Serial Port Multiplexed:
General-Purpose Input-Output Port 1.2 / UART, I
2
C1 / Programmable Logic Array Input Element 2.
61 P1.1/SPM1/PLAI[1]
Serial Port Multiplexed:
General-Purpose Input-Output Port 1.1 / UART, I
2
C0 / Programmable Logic Array Input Element 1.
62 P1.0/T1/SPM0/PLAI[0]
Serial Port Multiplexed:
General-Purpose Input-Output Port 1.0 / Timer1 Input / UART, I
2
C0 / Programmable Logic Array
Input Element 0.
63 P4.2/AD10/PLAO[10]
General-Purpose Input-Output Port 4.2 / External Memory Interface / Programmable Logic
Array Output Element 10.
64 P4.3/AD11/PLAO[11]
General-Purpose Input-Output Port 4.3 / External Memory Interface / Programmable Logic
Array Output Element 11.
65 P4.4/AD12/PLAO[12]
General-Purpose Input-Output Port 4.4 / External Memory Interface / Programmable Logic
Array Output Element 12.
66 P4.5/AD13/PLAO[13]
General-Purpose Input-Output Port 4.5 / External Memory Interface / Programmable Logic
Array Output Element 13.
67
REFGND
Ground for the Reference. Typically connected to AGND.
68 V
REF
2.5 V Internal Voltage Reference. Must be connected to a 0.47 F capacitor when using the
internal reference.
69 DAC
REF
External Voltage Reference for the DACs. Range: DACGND to DACV
DD
.
70
DACGND
Ground for the DAC. Typically connected to AGND.
71, 72
AGND
Analog Ground. Ground reference point for the analog circuitry.
73, 74
AV
DD
3.3 V Analog Power.
75 DACV
DD
3.3 V Power Supply for the DACs. Typically connected to AV
DD
.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 26 of 92
Pin No.
Mnemonic
Description
76
ADC11
Single-Ended or Differential Analog Input 11.
77
ADC0
Single-Ended or Differential Analog Input 0.
78
ADC1
Single-Ended or Differential Analog Input 1.
79
ADC2/CMP0
Single-Ended or Differential Analog Input 2 / Comparator Positive Input.
80
ADC3/CMP1
Single-Ended or Differential Analog Input 3 / Comparator Negative Input.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 27 of 92
TYPICAL PERFORMANCE CHARACTERISTICS
ADC CODES
(L
S
B
)
1.0
1.0
0.8
0.6
0.4
0.2
0
0.2
0.4
0.6
0.8
0
2000
1000
3000
4000
04
95
5-
0
75
f
S
= 774kSPS
Figure 16. Typical INL Error, f
S
= 774 kSPS
ADC CODES
(L
S
B
)
1.0
1.0
0.8
0.6
0.4
0.2
0
0.2
0.4
0.6
0.8
0
2000
1000
3000
4000
04
95
5-
0
77
f
S
= 1MSPS
Figure 17. Typical INL Error, f
S
= 1 MSPS
EXTERNAL REFERENCE (V)
(L
S
B
)
(L
S
B
)
1.0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
0
0.1
0.2
0.3
0.5
0.6
0.7
0.8
0.9
1.0
1.0
1.5
2.0
2.5
3.0
04
95
5-
07
2
WCN
WCP
Figure 18. Typical Worst Case INL Error vs. V
REF
, f
S
= 774 kSPS
ADC CODES
(L
S
B
)
1.0
1.0
0.8
0.6
0.4
0.2
0
0.2
0.4
0.6
0.8
0
2000
1000
3000
4000
04
95
5-
0
74
f
S
= 774kSPS
Figure 19. Typical DNL Error, fs = 774 kSPS
ADC CODES
(L
S
B
)
1.0
1.0
0.8
0.6
0.4
0.2
0
0.2
0.4
0.6
0.8
0
2000
1000
3000
4000
04
95
5-
0
76
f
S
= 1MSPS
Figure 20. Typical DNL Error, f
S
= 1 MSPS
EXTERNAL REFERENCE (V)
(L
S
B
)
(L
S
B
)
0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1.0
1.5
2.0
2.5
3.0
04
95
5-
07
1
WCN
WCP
Figure 21. Typical Worst Case DNL Error vs. V
REF
, f
S
= 774 kSPS
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 28 of 92
BIN
FR
E
Q
U
E
N
C
Y
9000
0
1000
2000
3000
4000
5000
6000
7000
8000
1161
1162
1163
04
95
5-
0
73
Figure 22. Code Histogram Plot
FREQUENCY (kHz)
(d
B
)
0
160
140
120
100
80
60
40
20
0
100
200
04
95
5-
0
78
f
S
= 774kSPS,
SNR = 69.3dB,
THD = 80.8dB,
PHSN = 83.4dB
Figure 23. Dynamic Performance, f
S
= 774 kSPS
FREQUENCY (kHz)
(dB
)
20
0
160
140
120
100
80
60
40
20
0
150
100
50
200
04
95
5-
07
9
f
S
= 1MSPS,
SNR = 70.4dB,
THD = 77.2dB,
PHSN = 78.9dB
Figure 24. Dynamic Performance, f
S
= 1 MSPS
EXTERNAL REFERENCE (V)
SN
R
(d
B
)
TH
D
(
d
B
)
75
40
45
50
55
60
65
70
76
88
86
84
82
80
78
1.0
1.5
2.0
2.5
3.0
04
95
5-
0
70
SNR
THD
Figure 25. Typical Dynamic Performance vs. V
REF
04
95
5-
06
0
TEMPERATURE (
C)
CO
DE
50
0
50
100
1000
1500
1450
1400
1350
1300
1250
1200
1150
1100
1050
150
Figure 26. On-Chip Temperature Sensor Voltage Output vs. Temperature
TEMPERATURE (C)
(m
A
)
39.8
39.7
38.9
39.0
39.1
39.2
39.3
39.4
39.5
39.6
40
25
85
0
125
04
95
5-
08
0
Figure 27. Current Consumption vs. Temperature @ CD = 0
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 29 of 92
TEMPERATURE (C)
(m
A
)
12.05
11.95
12.00
11.55
11.60
11.65
11.70
11.75
11.80
11.85
11.90
40
25
85
0
125
04
95
5-
0
81
Figure 28. Current Consumption vs. Temperature @ CD = 3
TEMPERATURE (C)
(m
A
)
7.85
7.75
7.80
7.40
7.45
7.50
7.55
7.60
7.65
7.70
40
25
85
0
125
04
95
5-
0
82
Figure 29. Current Consumption vs. Temperature @ CD = 7
TEMPERATURE (C)
(m
A
)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
40
25
85
0
125
04
95
5-
0
83
Figure 30. Current Consumption vs. Temperature in Sleep Mode
SAMPLING FREQUENCY (kSPS)
(m
A
)
37.4
37.2
37.0
36.8
36.6
36.4
36.2
62.25
250.00
500.00
125.00
1000.00
04
95
5-
0
84
Figure 31. Current Consumption vs. ADC Speed
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 30 of 92
TERMINOLOGY
ADC SPECIFICATIONS
Integral Nonlinearity
The maximum deviation of any code from a straight line
passing through the endpoints of the ADC transfer function.
The endpoints of the transfer function are zero scale, a point
LSB below the first code transition and full scale, a point
LSB above the last code transition.
Differential Nonlinearity
The difference between the measured and the ideal 1 LSB
change between any two adjacent codes in the ADC.
Offset Error
The deviation of the first code transition (0000 . . . 000) to
(0000 . . . 001) from the ideal, that is, + LSB.
Gain Error
The deviation of the last code transition from the ideal AIN
voltage (full scale 1.5 LSB) after the offset error has been
adjusted out.
Signal to (Noise + Distortion) Ratio
The measured ratio of signal to (noise + distortion) at the
output of the ADC. The signal is the rms amplitude of the
fundamental. Noise is the rms sum of all nonfundamental
signals up to half the sampling frequency (fS/2), excluding dc.
The ratio is dependent upon the number of quantization levels
in the digitization process; the more levels, the smaller the
quantization noise.
The theoretical signal to (noise + distortion) ratio for an ideal
N-bit converter with a sine wave input is given by
Signal to (Noise + Distortion) = (6.02 N + 1.76) dB
Thus, for a 12-bit converter, this is 74 dB.
Total Harmonic Distortion
The ratio of the rms sum of the harmonics to the fundamental.
DAC SPECIFICATIONS
Relative Accuracy
Otherwise known as endpoint linearity, relative accuracy is a
measure of the maximum deviation from a straight line passing
through the endpoints of the DAC transfer function. It is
measured after adjusting for zero error and full-scale error.
Voltage Output Settling Time
The amount of time it takes for the output to settle to within a
1 LSB level for a full-scale input change.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 31 of 92
OVERVIEW OF THE ARM7TDMI CORE
The ARM7 core is a 32-bit reduced instruction set computer
(RISC). It uses a single 32-bit bus for instruction and data. The
length of the data can be 8 bits, 16 bits, or 32 bits. The length of
the instruction word is 32 bits.
The ARM7TDMI is an ARM7 core with four additional
features:
T support for the thumb (16-bit) instruction set.
D support for debug.
M support for long multiplications.
I includes the embeddedICE module to support embedded
system debugging.
THUMB MODE (T)
An ARM instruction is 32-bits long. The ARM7TDMI processor
supports a second instruction set that has been compressed
into 16-bits, called the thumb instruction set. Faster execution
from 16-bit memory and greater code density can usually be
achieved by using the thumb instruction set instead of the ARM
instruction set, which makes the ARM7TDMI core particularly
suitable for embedded applications.
However, the thumb mode has two limitations:
Thumb code usually uses more instructions for the same
job. As a result, ARM code is usually best for maximizing
the performance of the time-critical code.
The thumb instruction set does not include some of the
instructions needed for exception handling, which
automatically switches the core to ARM code for exception
handling.
See the ARM7TDMI user guide for details on the core
architecture, the programming model, and both the ARM and
ARM thumb instruction sets.
LONG MULTIPLY (M)
The ARM7TDMI instruction set includes four extra instruc-
tions that perform 32-bit by 32-bit multiplication with 64-bit
result, and 32-bit by 32-bit multiplication-accumulation (MAC)
with 64-bit result. These results are achieved in fewer cycles
than required on a standard ARM7 core.
EMBEDDEDICE (I)
EmbeddedICE provides integrated on-chip support for the
core. The EmbeddedICE module contains the breakpoint
and watchpoint registers that allow code to be halted for
debugging purposes. These registers are controlled through
the JTAG test port.
When a breakpoint or watchpoint is encountered, the
processor halts and enters debug state. Once in a debug
state, the processor registers can be inspected as well as the
Flash/EE, the SRAM, and the memory mapped registers.
EXCEPTIONS
ARM supports five types of exceptions and a privileged
processing mode for each type. The five types of exceptions are:
Normal interrupt or IRQ. This is provided to service
general-purpose interrupt handling of internal and
external events.
Fast interrupt or FIQ. This is provided to service data
transfer or communication channel with low latency.
FIQ has priority over IRQ.
Memory abort.
Attempted execution of an undefined instruction.
Software interrupt instruction (SWI). This can be used to
make a call to an operating system.
Typically, the programmer defines interrupt as IRQ, but for
higher priority interrupt, that is, faster response time, the
programmer can define interrupt as FIQ.
ARM REGISTERS
ARM7TDMI has a total of 37 registers: 31 general-purpose
registers and six status registers. Each operating mode has
dedicated banked registers.
When writing user-level programs, 15 general-purpose
32-bit registers (R0 to R14), the program counter (R15)
and the current program status register (CPSR) are usable.
The remaining registers are only used for system-level
programming and for exception handling.
When an exception occurs, some of the standard registers are
replaced with registers specific to the exception mode. All
exception modes have replacement banked registers for the
stack pointer (R13) and the link register (R14) as represented in
Figure 32. The fast interrupt mode has more registers (R8 to R12)
for fast interrupt processing. This means the interrupt processing
can begin without the need to save or restore these registers, and
thus save critical time in the interrupt handling process.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 32 of 92
04955-
007
USABLE IN USER MODE
SYSTEM MODES ONLY
SPSR_UND
SPSR_IRQ
SPSR_ABT
SPSR_SVC
R8_FIQ
R9_FIQ
R10_FIQ
R11_FIQ
R12_FIQ
R13_FIQ
R14_FIQ
R13_UND
R14_UND
R0
R1
R2
R3
R4
R5
R6
R7
R8
R9
R10
R11
R12
R13
R14
R15 (PC)
R13_IRQ
R14_IRQ
R13_ABT
R14_ABT
R13_SVC
R14_SVC
SPSR_FIQ
CPSR
USER MODE
FIQ
MODE
SVC
MODE
ABORT
MODE
IRQ
MODE
UNDEFINED
MODE
Figure 32. Register Organization
More information relative to the programmer's model and the
ARM7TDMI core architecture can be found in the following
documents from ARM:
DDI0029G, ARM7TDMI Technical Reference Manual
DDI0100E, ARM Architecture Reference Manual
INTERRUPT LATENCY
The worst case latency for a fast interrupt request (FIQ) consists
of the following:
The longest time the request can take to pass through
the synchronizer
The time for the longest instruction to complete
(the longest instruction is an LDM) that loads all
the registers including the PC,
The time for the data abort entry
The time for FIQ entry.
At the end of this time, the ARM7TDMI executes the instruc-
tion at 0x1C (FIQ interrupt vector address). The maximum
total time is 50 processor cycles, which is just under 1.2 s in a
system using a continuous 41.78 MHz processor clock.
The maximum interrupt request (IRQ) latency calculation is
similar, but must allow for the fact that FIQ has higher priority
and could delay entry into the IRQ handling routine for an
arbitrary length of time. This time can be reduced to 42 cycles
if the LDM command is not used. Some compilers have an
option to compile without using this command. Another
option is to run the part in THUMB mode, where the time
is reduced to 22 cycles.
The minimum latency for FIQ or IRQ interrupts is a total of
five cycles, which consist of the shortest time the request can
take through the synchronizer, plus the time to enter the
exception mode.
Note that the ARM7TDMI always runs in ARM (32-bit) mode
when in privileged modes, for example, when executing
interrupt service routines.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 33 of 92
MEMORY ORGANIZATION
The ADuC7019/20/21/22/24/25/26/27 incorporate two separate
blocks of memory: 8 kB of SRAM and 64 kB of on-chip
Flash/EE memory. Sixty-two kilobytes of on-chip Flash/EE
memory is available to the user, and the remaining 2 kB are
reserved for the factory configured boot page. These two blocks
are mapped as shown in Figure 33.
04
95
5-
00
8
MMRs
0xFFFFFFFF
0xFFFF0000
RESERVED
EXTERNAL MEMORY REGION 3
0x40000FFFF
0x40000000
RESERVED
EXTERNAL MEMORY REGION 2
0x30000FFFF
0x30000000
RESERVED
EXTERNAL MEMORY REGION 1
0x20000FFFF
0x20000000
RESERVED
EXTERNAL MEMORY REGION 0
0x10000FFFF
0x10000000
RESERVED
FLASH/EE
0x0008FFFF
0x00080000
RESERVED
SRAM
0x00011FFF
0x00010000
RE-MAPPABLE MEMORY SPACE
(FLASH/EE OR SRAM)
0x0000FFFF
0x00000000
Figure 33. Physical Memory Map
Note that by default, after a reset, the Flash/EE memory is
mirrored at address 000000000. It is possible to remap the
SRAM at address 000000000 by clearing bit 0 of the REMAP
MMR. This remap function is described in more detail in the
Flash/EE Memory section.
MEMORY ACCESS
The ARM7 core sees memory as a linear array of 2
32
byte
location where the different blocks of memory are mapped as
outlined in Figure 33.
The ADuC7019/20/21/22/24/25/26/27 memory organizations
are configured in little endian format, which means that the
least significant byte is located in the lowest byte address, and
the most significant byte is in the highest byte address.
0
495
5-
0
09
BIT 31
BYTE 2
A
6
2
.
.
.
BYTE 3
B
7
3
.
.
.
BYTE 1
9
5
1
.
.
.
BYTE 0
8
4
0
.
.
.
BIT 0
32 BITS
0xFFFFFFFF
0x00000004
0x00000000
Figure 34. Little Endian Format
FLASH/EE MEMORY
The total 64 kB of Flash/EE memory is organized as 32 k
16 bits (31 k 16 bits is user space and 1 k 16 bits is reserved
for the on-chip kernel). The page size of this Flash/EE memory
is 512 bytes.
Sixty-two kilobytes of Flash/EE memory are available to the
user as code and nonvolatile data memory. There is no
distinction between data and program as ARM code shares the
same space. The real width of the Flash/EE memory is 16 bits,
which means that in ARM mode (32-bit instruction), two
accesses to the Flash/EE are necessary for each instruction
fetch. It is therefore recommended to use thumb mode when
executing from Flash/EE memory for optimum access speed.
The maximum access speed for the Flash/EE memory is 41.78
MHz in thumb mode and 20.89 MHz in full ARM mode. More
details about Flash/EE access time are outlined later in the
Execution Time from SRAM and Flash/EE section of this
datasheet.
SRAM
Eight kilobytes of SRAM are available to the user, organized as
2 k 32 bits, that is, two words. ARM code can run directly
from SRAM at 41.78 MHz, given that the SRAM array is
configured as a 32-bit wide memory array. More details about
SRAM access time are outlined later in the Execution Time
from SRAM and Flash/EE section of this datasheet.
MEMORY MAPPED REGISTERS
The memory mapped register (MMR) space is mapped into the
upper two pages of the memory array, and accessed by indirect
addressing through the ARM7 banked registers.
The MMR space provides an interface between the CPU and
all on-chip peripherals. All registers, except the core registers,
reside in the MMR area. All shaded locations shown in
Figure 35 are unoccupied or reserved locations, and should
not be accessed by user software. Table 13 shows the full MMR
memory map.
The access time for reading from or writing to an MMR
depends on the advanced microcontroller bus architecture
(AMBA) bus used to access the peripheral. The processor has
two AMBA busses: advanced high performance bus (AHB)
used for system modules, and advanced peripheral bus (APB)
used for lower performance peripheral. Access to the AHB is
one cycle, and access to the APB is two cycles. All peripherals
on the ADuC7019/20/21/22/24/25/26/27 are on the APB except
the Flash/EE memory, the GPIOs, and the PWM.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 34 of 92
PWM
FLASH CONTROL
INTERFACE
GPIO
PLA
SPI
I
2
C1
I
2
C0
UART
DAC
ADC
BANDGAP
REFERENCE
POWER SUPPLY
MONITOR
PLL AND
OSCILLATOR CONTROL
WATCHDOG
TIMER
WAKE UP
TIMER
GENERAL PURPOSE
TIMER
TIMER 0
REMAP AND
SYSTEM CONTROL
INTERRUPT
CONTROLLER
0xFFFFFFFF
0xFFFFFC3C
0xFFFFFC00
0xFFFFF820
0xFFFFF800
0xFFFFF46C
0xFFFFF400
0xFFFF0B54
0xFFFF0B00
0xFFFF0A14
0xFFFF0A00
0xFFFF0948
0xFFFF0900
0xFFFF0848
0xFFFF0800
0xFFFF0730
0xFFFF0700
0xFFFF0620
0xFFFF0600
0xFFFF0538
0xFFFF0500
0xFFFF0490
0xFFFF048C
0xFFFF0448
0xFFFF0440
0xFFFF0420
0xFFFF0404
0xFFFF0370
0xFFFF0360
0xFFFF0350
0xFFFF0340
0xFFFF0334
0xFFFF0320
0xFFFF0310
0xFFFF0300
0xFFFF0238
0xFFFF0220
0xFFFF0110
0xFFFF0000
04
95
5-
0
10
Figure 35. Memory Mapped Registers
Table 13. Complete MMR List
Address Name
Byte
Access
Type
Default
Value Page
IRQ address base = 0xFFFF0000
0x0000 IRQSTA 4 R
0x00000000 73
0x0004 IRQSIG
1
4 R
0x00XXX000
73
0x0008 IRQEN
4 RW
0x00000000 73
0x000C IRQCLR 4
W
0x00000000 73
0x0010 SWICFG 4 W
0x00000000 74
0x0100 FIQSTA
4 R
0x00000000 73
0x0104 FIQSIG
1
4 R
0x00XXX000
74
0x0108 FIQEN
4 RW
0x00000000 74
0x010C FIQCLR
4
W
0x00000000 74

System control address base = 0xFFFF0200
0x0220 REMAP
2
1 RW 0x00
46
0x0230 RSTSTA 1 RW
0x01
46
0x0234 RSTCLR 1 W
0x00
46

Timer address base = 0xFFFF0300
0x0300 T0LD
2 RW
0x0000
75
0x0304 T0VAL
2 R
0xFFFF
75
0x0308 T0CON
2 RW
0x0000
75
0x030C T0CLRI
1
W
0xFF
75
0x0320 T1LD
4 RW
0x00000000 75
0x0324 T1VAL
4 R
0xFFFFFFFF 75
0x0328 T1CON
2 RW
0x0000
75
0x032C T1CLRI
1
W
0xFF
76
0x0330 T1CAP
4 RW
0x00000000 76
0x0340 T2LD
4 RW
0x00000000 76
0x0344 T2VAL
4 R
0xFFFFFFFF 76
0x0348 T2CON
2 RW
0x0000
77
0x034C T2CLRI
1
W
0xFF
77
0x0360 T3LD
2 RW
0x0000
77
0x0364 T3VAL
2 R
0xFFFF
77
0x0368 T3CON
2 RW
0x0000
77
0x036C T3CLRI
1
W
0x00
78

PLL base address = 0xFFFF0400
0x0404 POWKEY1 2 W
0x0000
51
0x0408 POWCON 2 RW
0x0003
51
0x040C POWKEY2 2
W
0x0000
51
0x0410 PLLKEY1 2 W
0x0000
51
0x0414 PLLCON 1 RW
0x21
51
0x0418 PLLKEY2 2 W
0x0000
51

PSM address base = 0xFFFF0440
0x0440 PSMCON 2 RW
0x0008
48
0x0444 CMPCON 2 RW
0x0000
49

Reference address base = 0xFFFF0480
0x048C REFCON 1
RW
0x00
42
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 35 of 92
Address Name
Byte
Access
Type
Default
Value Page
ADC address base = 0xFFFF0500
0x0500 ADCCON 2 RW
0x0600
39
0x0504 ADCCP
1 RW
0x00
39
0x0508 ADCCN 1 RW
0x01
40
0x050C ADCSTA 1
R
0x00
40
0x0510 ADCDAT 4 R
0x00000000 40
0x0514 ADCRST 1 RW
0x00
40
0x0530 ADCGN 2 RW
0x0200
40
0x0534 ADCOF 2 RW
0x0200
40

DAC address base = 0xFFFF0600
0x0600 DAC0CON 1 RW
0x00
47
0x0604 DAC0DAT 4 RW
0x00000000 47
0x0608 DAC1CON 1 RW
0x00
47
0x060C DAC1DAT 4
RW
0x00000000 47
0x0610 DAC2CON 1 RW
0x00
47
0x0614 DAC2DAT 4 RW
0x00000000 47
0x0618 DAC3CON 1 RW
0x00
47
0x061C DAC3DAT 4
RW
0x00000000 47

UART base address = 0xFFFF0700
0x0700 COMTX 1 RW
0x00
62
COMRX
1
R
0x00 62
COMDIV0
1
RW
0x00 62
0x0704 COMIEN0 1 RW
0x00
62
COMDIV1
1
R/W
0x00 62
0x0708 COMIID0 1 R
0x01
62
0x070C COMCON0
1
RW
0x00
62
0x0710 COMCON1
1 RW
0x00
63
0x0714 COMSTA0 1 R
0x60
63
0x0718 COMSTA1 1 R
0x00
63
0x071C COMSCR 1
RW
0x00
63
0x0720 COMIEN1
1 RW
0x04
64
0x0724 COMIID1
1 R
0x01
64
0x0728 COMADR 1 RW
0xAA
64
0x072C COMDIV2 2
RW
0x0000
63














Address Name
Byte
Access
Type
Default
Value Page
I2C0 base address = 0xFFFF0800
0x0800 I2C0MSTA
1 R
0x00
67
0x0804 I2C0SSTA 1 R
0x01
67
0x0808 I2C0SRX 1 R
0x00
68
0x080C I2C0STX 1
W
0x00
68
0x0810 I2C0MRX 1 R
0x00
68
0x0814 I2C0MTX 1 W
0x00
68
0x0818 I2C0CNT 1 RW
0x00
68
0x081C I2C0ADR 1
RW
0x00
68
0x0824 I2C0BYTE 1 RW
0x00
68
0x0828 I2C0ALT 1 RW
0x00
68
0x082C I2C0CFG 1
RW
0x00
69
0x0830 I2C0DIV 2 RW
0x1F1F
69
0x0838 I2C0ID0 1 RW
0x00
69
0x083C I2C0ID1 1
RW
0x00
69
0x0840 I2C0ID2 1 RW
0x00
69
0x0844 I2C0ID3 1 RW
0x00
69
0x0848 I2C0CCNT 1 RW
0x01
69
0x084C I2C0FSTA 2
R
0x0000
70

I2C1 base address = 0xFFFF0900
0x0900 I2C1MSTA 1 R
0x00
67
0x0904 I2C1SSTA 1 R
0x01
67
0x0908 I2C1SRX 1 R
0x00
68
0x090C I2C1STX 1
W
0x00
68
0x0910 I2C1MRX 1 R
0x00
68
0x0914 I2C1MTX 1 W
0x00
68
0x0918 I2C1CNT 1 RW
0x00
68
0x091C I2C1ADR 1
RW
0x00
68
0x0924 I2C1BYTE 1 RW
0x00
68
0x0928 I2C1ALT 1 RW
0x00
68
0x092C I2C1CFG 1
RW
0x00
68
0x0930 I2C1DIV 2 RW
0x1F1F
69
0x0938 I2C1ID0 1 RW
0x00
69
0x093C I2C1ID1 1
RW
0x00
69
0x0940 I2C1ID2 1 RW
0x00
69
0x0944 I2C1ID3 1 RW
0x00
69
0x0948 I2C1CCNT 1 RW
0x01
69
0x094C I2C1FSTA 2
R
0x0000
69

SPI base address = 0xFFFF0A00
0x0A00 SPISTA
1
R
0x00
65
0x0A04 SPIRX
1
R
0x00
65
0x0A08 SPITX
1
W
0x00
65
0x0A0C SPIDIV
1
RW
0x1B
65
0x0A10 SPICON 2
RW
0x0000
65




ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 36 of 92
Address Name
Byte
Access
Type
Default
Value Page
PLA base address = 0xFFFF0B00
0x0B00 PLAELM0 2
RW
0x0000
70
0x0B04 PLAELM1 2
RW
0x0000
70
0x0B08 PLAELM2 2
RW
0x0000
70
0x0B0C PLAELM3 2
RW
0x0000
70
0x0B10 PLAELM4 2
RW
0x0000
70
0x0B14 PLAELM5 2
RW
0x0000
70
0x0B18 PLAELM6 2
RW
0x0000
70
0x0B1C PLAELM7 2
RW
0x0000
70
0x0B20 PLAELM8 2
RW
0x0000
70
0x0B24 PLAELM9 2
RW
0x0000
70
0x0B28 PLAELM10
2
RW
0x0000
70
0x0B2C PLAELM11 2
RW
0x0000
70
0x0B30 PLAELM12
2
RW
0x0000
70
0x0B34 PLAELM13
2
RW
0x0000
70
0x0B38 PLAELM14
2
RW
0x0000
70
0x0B3C PLAELM15 2
RW
0x0000
70
0x0B40 PLACLK 1
RW
0x00
71
0x0B44 PLAIRQ 4
RW
0x00000000 72
0x0B48 PLAADC 4
RW
0x00000000 72
0x0B4C PLADIN 4
RW
0x00000000 72
0x0B50 PLADOUT 4
R
0x00000000 72
0x0B54 PLALCK 1
W
0x00
72

External memory base address = 0xFFFFF000
0xF000 XMCFG 1 RW
0x00
79
0xF010 XM0CON 1 RW
0x00
79
0xF014 XM1CON 1 RW
0x00
79
0xF018 XM2CON 1 RW
0x00
79
0xF01C XM3CON 1
RW
0x00
79
0xF020 XM0PAR 2 RW
0x70FF
79
0xF024 XM1PAR 2 RW
0x70FF
79
0xF028 XM2PAR 2 RW
0x70FF
79
0xF02C XM3PAR 2
RW
0x70FF
79















Address Name
Byte
Access
Type
Default
Value Page
GPIO base address = 0xFFFFF400
0xF400 GP0CON 4 RW
0x00000000 59
0xF404 GP1CON 4 RW
0x00000000 59
0xF408 GP2CON 4 RW
0x00000000 59
0xF40C GP3CON 4
RW
0x00000000 59
0xF410 GP4CON 4 RW
0x00000000 59
0xF420 GP0DAT 4 RW
0x000000XX 60
0xF424 GP0SET 4 W
0x000000XX 60
0xF428 GP0CLR 4 W
0x000000XX 60
0xF42C GP0PAR 4
W
0x20000000 60
0xF430 GP1DAT 4 RW
0x000000XX 60
0xF434 GP1SET 4 W
0x000000XX 60
0xF438 GP1CLR 4 W
0x000000XX 60
0xF43C GP1PAR 4
W
0x00000000 60
0xF440 GP2DAT 4 RW
0x000000XX 60
0xF444 GP2SET 4 W
0x000000XX 60
0xF448 GP2CLR 4 W
0x000000XX 60
0xF450 GP3DAT 4 RW
0x000000XX 60
0xF454 GP3SET 4 W
0x000000XX 60
0xF458 GP3CLR 4 W
0x000000XX 60
0xF45C GP3PAR 4
W
0x00222222 60
0xF460 GP4DAT 4 RW
0x000000XX 60
0xF464 GP4SET 4 W
0x000000XX 60
0xF468 GP4CLR 4 W
0x000000XX 60

Flash/EE base address = 0xFFFFF800
0xF800 FEESTA 1 R
0x20
44
0xF804 FEEMOD 2 RW
0x0000
44
0xF808 FEECON 1 RW
0x07
44
0xF80C FEEDAT 2
RW
0xXXXX
45
0xF810 FEEADR 2 RW
0x0000
45
0xF818 FEESIGN 3 R
0xFFFFFF 45
0xF81C FEEPRO 4
RW
0x00000000 45
0xF820
FEEHIDE
4
RW
0xFFFFFFFF
45

PWM base address = 0xFFFFFC00
0xFC00 PWMCON 2
RW
0x0000
58
0xFC04 PWMSTA 2
RW
0x0000
58
0xFC08 PWMDAT0 2
RW
0x0000
59
0xFC0C PWMDAT1 2
RW
0x0000
59
0xFC10 PWMCFG 2
RW
0x0000
58
0xFC14 PWMCH0 2
RW
0x0000
59
0xFC18 PWMCH1 2
RW
0x0000
59
0xFC1C PWMCH2 2
RW
0x0000
59
0xFC20 PWMEN 2
RW
0x0000
58
0xFC24 PWMDAT2 2
RW
0x0000
59
1
Depends on the level on the external interrupt pins (P0.4, P0.5, P1.4, and P1.5).
2
Depends on model.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 37 of 92
ADC CIRCUIT OVERVIEW
The analog-to-digital converter (ADC) incorporates a fast,
multi-channel, 12-bit ADC. It can operate from 2.7 V to 3.6 V
supplies and is capable of providing a throughput of up to 1
MSPS when the clock source is 41.78 MHz. This block provides
the user with a multichannel multiplexer, differential track-and-
hold, on-chip reference, and ADC.
The ADC consists of a 12-bit successive approximation
converter based around two capacitor DACs. Depending on the
input signal configuration, the ADC can operate in one of three
different modes:
Fully differential mode, for small and balanced signals
Single-ended mode, for any single-ended signals
Pseudo differential mode, for any single-ended signals,
taking advantage of the common-mode rejection offered
by the pseudo differential input
The converter accepts an analog input range of 0 to V
REF
when
operating in single-ended mode or pseudo differential mode. In
fully differential mode, the input signal must be balanced
around a common-mode voltage V
CM
, in the range 0 V to AV
DD
,
and with a maximum amplitude of 2 V
REF
(see Figure 36).
04
95
5-
01
1
AV
DD
V
CM
V
CM
V
CM
0
2V
REF
2V
REF
2V
REF
Figure 36. Examples of Balanced Signals in Fully Differential Mode
A high precision, low drift, and factory calibrated 2.5 V
reference is provided on-chip. An external reference can also be
connected as described later in the Bandgap Reference section.
Single or continuous conversion modes can be initiated in the
software. An external CONV
START
pin, an output generated from
the on-chip PLA, or a Timer0 or Timer1 overflow, can also be
used to generate a repetitive trigger for ADC conversions.
A voltage output from an on-chip bandgap reference
proportional to absolute temperature can also be routed
through the front-end ADC multiplexer, effectively an
additional ADC channel input. This facilitates an internal
temperature sensor channel, which measures die temperature to
an accuracy of 3C.
TRANSFER FUNCTION
Pseudo Differential and Single-Ended Modes
In pseudo differential or single-ended mode, the input range is
0 V to V
REF
. The output coding is straight binary in pseudo
differential and single-ended modes with
1 LSB = FS/4096, or
2.5 V/4096 = 0.61 mV, or
610 V when V
REF
= 2.5 V
The ideal code transitions occur midway between successive
integer LSB values (that is, 1/2 LSB, 3/2 LSB, 5/2 LSB, ... ,
FS 3/2 LSB). The ideal input/output transfer characteristic
is shown in Figure 37.
04
95
5-
01
2
O
UT
P
UT
CO
DE
VOLTAGE INPUT
1111 1111 1111
1111 1111 1110
1111 1111 1101
1111 1111 1100
0000 0000 0011
1LSB
0V
+FS 1LSB
0000 0000 0010
0000 0000 0001
0000 0000 0000
1LSB =
FS
4096
Figure 37. ADC Transfer Function in Pseudo Differential Mode
or Single-Ended Mode
Fully Differential Mode
The amplitude of the differential signal is the difference
between the signals applied to the V
IN+
and V
IN
pins (that is,
V
IN+
V
IN
). The maximum amplitude of the differential signal
is therefore V
REF
to +V
REF
p-p (that is, 2 V
REF
). This is
regardless of the common mode (CM). The common mode is
the average of the two signals, for example, (V
IN+
+ V
IN
)/2, and
is therefore the voltage that the two inputs are centered on. This
results in the span of each input being CM V
REF
/2. This
voltage has to be set up externally and its range varies with V
REF
(see the Driving the Analog Inputs section).
The output coding is twos complement in fully differential
mode with 1 LSB = 2 V
REF
/4096 or 2 2.5 V/4096 = 1.22 mV
when V
REF
= 2.5 V. The designed code transitions occur midway
between successive integer LSB values (that is, 1/2 LSB, 3/2 LSB,
5/2 LSB, ... , FS 3/2 LSB). The ideal input/output transfer
characteristic is shown in Figure 38.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 38 of 92
04
95
5-
0
13
O
U
T
P
UT
CO
DE
VOLTAGE INPUT (V
IN
+ V
IN
)
0 1111 1111 1110
0 1111 1111 1100
0 1111 1111 1010
0 0000 0000 0010
0 0000 0000 0000
1 1111 1111 1110
1 0000 0000 0100
1 0000 0000 0010
1 0000 0000 0000
V
REF
+ 1LSB
+V
REF
1LSB
0LSB
1LSB =
2 V
REF
4096
SIGN
BIT
Figure 38. ADC Transfer Function in Differential Mode
TYPICAL OPERATION
Once configured via the ADC control and channel selection
registers, the ADC converts the analog input and provides a
12-bit result in the ADC data register.
The top 4 bits are the sign bits. The 12-bit result is placed from
Bit 16 to Bit 27 as shown in Figure 39. Again, it should be noted
that in fully differential mode, the result is represented in twos
complement format, and in pseudo differential and single-
ended mode, the result is represented in straight binary format.
04
95
5-
01
4
SIGN BITS
12-BIT ADC RESULT
31
27
16 15
0
Figure 39. ADC Result Format
The same format is used in DACDAT, simplifying the software.
Current Consumption
The ADC in standby mode, that is, powered up but not convert-
ing, typically consumes 640 A. The internal reference adds 140
A. During conversion, the extra current is 0.3 A multiplied by
the sampling frequency (in kHz). Figure 31 shows the current
consumption versus the sampling frequency of the ADC.
Timing
Figure 40 gives details of the ADC timing. Users have control on
the ADC clock speed and on the number of acquisition clocks
in the ADCCON MMR. By default, the acquisition time is eight
clocks and the clock divider is two. The number of extra clocks
(such as bit trial or write) is set to 19, which gives a sampling
rate of 774 kSPS. For conversion on temperature sensor, the
ADC acquisition time is automatically set to 16 clocks and the
ADC clock divider is to 32.
0
4955
-
0
15
ADC CLOCK
ACQ
BIT TRIAL
DATA
ADCSTA = 0
ADCSTA = 1
ADC INTERRUPT
WRITE
CONV
START
ADC
BUSY
ADCDAT
Figure 40. ADC Timing
ADuC7019
The ADuC7019 is identical to the ADuC7020 except for one
buffered ADC channel, ADC3, and it has only three DACs. The
output buffer of the fourth DAC is internally connected to the
ADC3 channel as shown in Figure 41.
04
95
5-
0
16
1MSPS
12-BIT ADC
12-BIT
DAC
MUX
ADC3
ADC15
DAC3
ADuC7019
Figure 41. ADC3 Buffered Input
Note that the DAC3 output pin must be connected to a 10 nF
capacitor to AGND. This channel should be used to measure
DC voltages only. ADC calibration might be necessary on this
channel.
MMRS INTERFACE
The ADC is controlled and configured via the eight MMRs
described in this section.
ADCCON Register
Name
Address
Default Value
Access
ADCCON 0xFFFF0500 0x0600
RW
ADCCON is an ADC control register that allows the
programmer to enable the ADC peripheral, select the mode
of operation of the ADC (either in single-ended, pseudo
differential or fully differential mode), and the conversion type.
This MMR is described in Table 14.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 39 of 92
Table 14. ADCCON MMR Bit Designations
Bit Value
Description
15 to
13
Reserved.
12 to
10
ADC clock speed.
000
fADC/1. This divider is provided to obtain
1 MSPS ADC with an external clock <41.78 MHz.
001
fADC/2
(default
value).
010
fADC/4.
011
fADC/8.
100
fADC/16.
101
fADC/32.
9, 8
ADC acquisition time.
00
2
clocks.
01
4
clocks.
10
8 clocks (default value).
11
16
clocks.
7
Enable start conversion.
Set by the user to start any type of conversion
command. Cleared by the user to disable a
start conversion (clearing this bit does not
stop the ADC when continuously converting).
6 Enable
ADC
BUSY
.
Set by the user to enable the ADC
BUSY
pin.
Cleared by the user to disable the ADC
BUSY
pin.
5
ADC power control.
Set by the user to place the ADC in normal
mode (the ADC must be powered up for at least
5 s before it converts correctly). Cleared by the
user to place the ADC in power-down mode.
4, 3
Conversion mode.
00
Single-ended
mode.
01
Differential
mode.
10
Pseudo differential mode.
11
Reserved.
2 to 0
Conversion type.
000
Enable CONV
START
pin as a conversion input.
001
Enable Timer1 as a conversion input.
010
Enable Timer0 as a conversion input.
011
Single software conversion; sets to 000 after
conversion (Bit 7 of ADCCON MMR should be
cleared after starting a single software
conversion to avoid further conversions
triggered by the CONV
START
pin).
100
Continuous
software
conversion.
101
PLA
conversion.
Other
Reserved.
ADCCP Register
Name
Address
Default Value
Access
ADCCP 0xFFFF0504
0x00
RW
ADCCP is an ADC positive channel selection register. This
MMR is described in Table 15.
Table 15. ADCCP
1
MMR Bit Designation
Bit Value
Description
7 to 5
Reserved
4 to 0
Positive channel selection bits
00000
ADC0
00001
ADC1
00010
ADC2
00011
ADC3
00100
ADC4
00101
ADC5
00110
ADC6
00111
ADC7
01000
ADC8
01001
ADC9
01010
ADC10
01011
ADC11
01100
DAC0/ADC12
01101
DAC1/ADC13
01110
DAC2/ADC14
01111
DAC3/ADC15
10000
Temperature
sensor
10001
AGND
(self-diagnostic
feature)
10010
Internal reference (self-diagnostic feature)
10011
AVDD/2
Others
Reserved
1
ADC and DAC channel availability depends on part model. See Ordering
Guide for details.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 40 of 92
ADCCN Register
Name
Address
Default Value
Access
ADCCN 0xFFFF0508 0x01
RW
ADCCN is an ADC negative channel selection register. This
MMR is described in Table 16.
Table 16. ADCCN MMR Bit Designation
Bit Value
Description
7 to 5
Reserved
4 to 0
Negative channel selection bits
00000
ADC0
00001
ADC1
00010
ADC2
00011
ADC3
00100
ADC4
00101
ADC5
00110
ADC6
00111
ADC7
01000
ADC8
01001
ADC9
01010
ADC10
01011
ADC11
01100
DAC0/ADC12
01101
DAC1/ADC13
01110
DAC2/ADC14
01111
DAC3/ADC15
10000
Internal reference (self-diagnostic feature)
Others
Reserved
ADCSTA Register
Name
Address
Default Value
Access
ADCSTA 0xFFFF050C 0x00
R
ADCSTA is an ADC status register that indicates when an ADC
conversion result is ready. The ADCSTA register contains only
one bit, ADCReady (Bit 0), representing the status of the ADC.
This bit is set at the end of an ADC conversion, generating an
ADC interrupt. It is cleared automatically by reading the
ADCDAT MMR. When the ADC is performing a conversion,
the status of the ADC can be read externally via the ADC
BUSY
pin. This pin is high during a conversion. When the conversion
is finished, ADC
BUSY
goes back low. This information can be
available on P0.5 (see the General-Purpose I/O section) if
enabled in the ADCCON register.
ADCDAT Register
Name
Address
Default Value
Access
ADCDAT 0xFFFF0510 0x00000000
R
ADCDAT is an ADC data result register. Hold the 12-bit ADC
result as shown in Figure 39.
ADCRST Register
Name
Address
Default Value
Access
ADCRST 0xFFFF0514 0x00
RW
ADCRST resets the digital interface of the ADC. Writing any
value to this register resets all the ADC registers to their default
value.
ADCGN Register
Name
Address
Default Value
Access
ADCGN 0xFFFF0530 0x0200
RW
ADCGN is a 10-bit gain calibration register.
ADCOF Register
Name
Address
Default Value
Access
ADCOF 0xFFFF0534 0x0200
RW
ADCOF is a 10-bit offset calibration register.
CONVERTER OPERATION
The ADC incorporates a successive approximation (SAR)
architecture involving a charge-sampled input stage. This
architecture can operate in three different modes: differential,
pseudo differential, and single-ended.
Differential Mode
The ADuC7019/20/21/22/24/25/26/27 each contain a
successive approximation ADC based on two capacitive DACs.
Figure 42 and Figure 43 show simplified schematics of the ADC
in acquisition and conversion phase, respectively. The ADC is
comprised of control logic, a SAR, and two capacitive DACs. In
Figure 42 (the acquisition phase), SW3 is closed and SW1 and
SW2 are in Position A. The comparator is held in a balanced
condition, and the sampling capacitor arrays acquire the
differential signal on the input.
0495
5-
0
17
CAPACITIVE
DAC
CAPACITIVE
DAC
CONTROL
LOGIC
COMPARATOR
SW3
SW1
A
A
B
B
SW2
C
S
C
S
V
REF
AIN0
AIN11
MUX
CHANNEL+
CHANNEL
Figure 42. ADC Acquisition Phase
When the ADC starts a conversion, as shown in Figure 43, SW3
opens, and then SW1 and SW2 move to Position B. This causes
the comparator to become unbalanced. Both inputs are
disconnected once the conversion begins. The control logic and
the charge redistribution DACs are used to add and subtract
fixed amounts of charge from the sampling capacitor arrays to
bring the comparator back into a balanced condition. When the
comparator is rebalanced, the conversion is complete. The
control logic generates the ADC's output code. The output
impedances of the sources driving the V
IN+
and V
IN
pins must
be matched; otherwise, the two inputs have different settling
times, resulting in errors.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 41 of 92
0495
5-
0
18
CAPACITIVE
DAC
CAPACITIVE
DAC
CONTROL
LOGIC
COMPARATOR
SW3
SW1
A
A
B
B
SW2
C
S
C
S
V
REF
AIN0
AIN11
MUX
CHANNEL+
CHANNEL
Figure 43. ADC Conversion Phase
Pseudo Differential Mode
In pseudo differential mode, Channel- is linked to the V
IN-
pin
of the ADuC7019/20/21/22/24/25/26/27. SW2 switches
between A (Channel-) and B (V
REF
). V
IN-
pin must be
connected to ground or a low voltage. The input signal on V
IN+
can then vary from V
IN-
to V
REF
+ V
IN-
. Note that V
IN-
must be
chosen so that V
REF
+ V
IN-
do not exceed AV
DD
.
0495
5-
0
19
CAPACITIVE
DAC
CAPACITIVE
DAC
CONTROL
LOGIC
COMPARATOR
SW3
SW1
A
A
B
B
SW2
C
S
C
S
V
REF
AIN0
AIN11
VIN
MUX
CHANNEL+
CHANNEL
Figure 44. ADC in Pseudo Differential Mode
Single-Ended Mode
In single-ended mode, SW2 is always connected internally to
ground. The V
IN-
pin can be floating. The input signal range on
V
IN+
is 0 V to V
REF
.
0495
5-
0
20
CAPACITIVE
DAC
CAPACITIVE
DAC
CONTROL
LOGIC
COMPARATOR
SW3
SW1
A
B
C
S
C
S
AIN0
AIN11
MUX
CHANNEL+
CHANNEL
Figure 45. ADC in Single-Ended Mode
Analog Input Structure
Figure 46 shows the equivalent circuit of the analog input structure
of the ADC. The four diodes provide ESD protection for the analog
inputs. Care must be taken to ensure that the analog input
signals never exceed the supply rails by more than 300 mV.
This would cause these diodes to become forward biased and
start conducting into the substrate. These diodes can conduct
up to 10 mA without causing irreversible damage to the part.
The capacitors, C1, in Figure 46 are typically 4 pF and can be
primarily attributed to pin capacitance. The resistors are
lumped components made up of the ON resistance of the
switches. The value of these resistors is typically about 100 .
The capacitors, C2, are the ADC's sampling capacitors and
typically have a capacitance of 16 pF.
AV
DD
C1
D
D
R1 C2
AV
DD
C1
D
D
R1 C2
04
95
5-
0
21
Figure 46. Equivalent Analog Input Circuit Conversion Phase:
Switches Open, Track Phase: Switches Closed
For AC applications, removing high frequency components
from the analog input signal is recommended by using an RC
low-pass filter on the relevant analog input pins. In applications
where harmonic distortion and signal-to-noise ratio are critical,
the analog input should be driven from a low impedance
source. Large source impedances significantly affect the AC
performance of the ADC. This can necessitate the use of an
input buffer amplifier. The choice of the op amp is a function of
the particular application. Figure 47 and Figure 48 give an
example of ADC front end.
0
495
5-
0
61
ADuC702x
ADC0
10
0.01
F
Figure 47. Buffering Single-Ended/Pseudo Differential Input
04
95
5-
06
2
ADuC702x
ADC0
V
REF
ADC1
Figure 48. Buffering Differential Inputs
When no amplifier is used to drive the analog input, the source
impedance should be limited to values lower than 1 k. The
maximum source impedance depends on the amount of total
harmonic distortion (THD) that can be tolerated. The THD
increases as the source impedance increases and the
performance degrades.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 42 of 92
DRIVING THE ANALOG INPUTS
Internal or external reference can be used for the ADC. In
differential mode of operation, there are restrictions on
common-mode input signal (V
CM
), which is dependent on the
reference value and supply voltage used to ensure that the signal
remains within the supply rails. Table 17 gives some calculated
V
CM
min and V
CM
max for some conditions.
Table 17. V
CM
Ranges
AV
DD
V
REF
V
CM
Min
V
CM
Max
Signal Peak-to-Peak
2.5 V
1.25 V
2.05 V
2.5 V
2.048 V
1.024 V
2.276 V
2.048 V
3.3 V
1.25 V
0.75 V
2.55 V
1.25 V
2.5 V
1.25 V
1.75 V
2.5 V
2.048 V
1.024 V
1.976 V
2.048 V
3.0 V
1.25 V
0.75 V
2.25 V
1.25 V
CALIBRATION
By default, the factory set values written to the ADC offset
(ADCOF) and gain coefficient registers (ADCGN) yield
optimum performance in terms of end-point errors and
linearity for standalone operation of the part. (See the
Specifications section.) If system calibration is required, it is
possible to modify the default offset and gain coefficients to
improve end-point errors, but note that any modification to the
factory set ADCOF and ADCGN values can degrade ADC
linearity performance.
For system offset error correction, the ADC channel input stage
must be tied to AGND. A continuous software ADC conversion
loop must be implemented by modifying the value in ADCOF
until the ADC result (ADCDAT) reads code 0 to 1. Offset error
correction is done digitally and has a resolution of 0.25 LSB and
a range of 3.125% of V
REF
.
For system gain error correction, the ADC channel input stage
must be tied to V
REF
. A continuous software ADC conversion
loop must be implemented to modify the value in ADCOF until
the ADC result (ADCDAT) reads code 4094 to 4095. Similar to
the offset calibration, the gain calibration resolution is 0.25 LSB
with a range of 3% of V
REF
.
TEMPERATURE SENSOR
The ADuC7019/20/21/22/24/25/26/27 provide voltage output
from on-chip bandgap references proportional to absolute
temperature. This voltage output can also be routed through the
front-end ADC multiplexer (effectively an additional ADC
channel input) facilitating an internal temperature sensor
channel, measuring die temperature to an accuracy of 3C.
BANDGAP REFERENCE
Each ADuC7019/20/21/22/24/25/26/27 provides an on-chip
bandgap reference of 2.5 V, which can be used for the ADC and
DAC. This internal reference also appears on the V
REF
pin.
When using the internal reference, a 0.47 F capacitor must be
connected from the external V
REF
pin to AGND to ensure
stability and fast response during ADC conversions. This
reference can also be connected to an external pin (V
REF
) and
used as a reference for other circuits in the system. An external
buffer is required because of the low drive capability of the V
REF
output. A programmable option also allows an external
reference input on the V
REF
pin.
REFCON Register
Name
Address
Default Value
Access
REFCON 0xFFFF048C 0x00
RW
The bandgap reference interface consists of an 8-bit MMR
REFCON described in Table 18.
Table 18. REFCON MMR Bit Designations
Bit Description
7 to 2
Reserved.
1
Internal reference power-down enable. Set by user to
place the internal reference in power-down mode and
use as an external reference. Cleared by user to place
the internal reference in normal mode and use it for
ADC conversions.
0
Internal reference output enable. Set by user to
connect the internal 2.5 V reference to the V
REF
pin. The
reference can be used for external component but
needs to be buffered. Cleared by user to disconnect
the reference from the V
REF
pin.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 43 of 92
NONVOLATILE FLASH/EE MEMORY
The ADuC7019/20/21/22/24/25/26/27 incorporate Flash/EE
memory technology on-chip to provide the user with
nonvolatile, in-circuit reprogrammable memory space.
Like EEPROM, flash memory can be programmed in-system at
a byte level, although it must first be erased. The erase is
performed in page blocks. As a result, flash memory is often
and more correctly referred to as Flash/EE memory.
Overall, Flash/EE memory represents a step closer to the ideal
memory device that includes nonvolatility, in-circuit
programmability, high density, and low cost. Incorporated in
the ADuC7019/20/21/22/24/25/26/27, Flash/EE memory
technology allows the user to update program code space in-
circuit, without the need to replace one time programmable
(OTP) devices at remote operating nodes.
Each ADuC7019/20/21/22/24/25/26/27 contains a 64 kB array
of Flash/EE memory. The lower 62 kB is available to the user
and the upper 2 kB contain permanently embedded firmware,
allowing in-circuit serial download. These 2 kB of embedded
firmware also contain a power-on configuration routine that
downloads factory calibrated coefficients to the various
calibrated peripherals (such as ADC, temperature sensor, and
bandgap references). This 2 kB embedded firmware is hidden
from user code.
PROGRAMMING
The 62 kB of Flash/EE memory can be programmed in-circuit,
using the serial download mode or the JTAG mode provided.
Serial Downloading (In-Circuit Programming)
The ADuC7019/20/21/22/24/25/26/27 facilitate code download
via the standard UART serial port or via the I
2
C port. The parts
enter serial download mode after a reset or power cycle if the
BM pin is pulled low through an external 1k resistor. Once in
serial download mode, the user can download code to the full
62 kB of Flash/EE memory while the device is in-circuit in its
target application hardware. An executable PC serial download
is provided as part of the development system for serial
downloading via the UART. An application note is available at
www.analog.com/microconverter describing the protocol for
serial downloading via the UART and I
2
C.
JTAG Access
The JTAG protocol uses the on-chip JTAG interface to
facilitate code download and debug. An application note
is available at www.analog.com/microconverter describing
the protocol via JTAG.
It is possible to write to a single Flash/EE location address
twice. If a single address is written to more than twice, then the
data within the Flash/EE memory can be corrupted. That is, it is
possible to walk zeros only byte wise.
SECURITY
The 62 kB of Flash/EE memory available to the user can be read
and write protected.
Bit 31 of the FEEPRO/FEEHIDE MMR (see Table 22) protects
the 62 kB from being read through JTAG and also in parallel
programming mode. The other 31 bits of this register protect
writing to the flash memory. Each bit protects four pages, that
is, 2 kB. Write protection is activated for all types of access.
Three Levels of Protection
Protection can be set and removed by writing directly into
FEEHIDE MMR. This protection does not remain after reset.
Protection can be set by writing into FEEPRO MMR. It
only takes effect after a save protection command (00C)
and a reset. The FEEPRO MMR is protected by a key to
avoid direct access. The key is saved once and must be
entered again to modify FEEPRO. A mass erase sets the
key back to 0FFFF but also erases all the user code.
Flash can be permanently protected by using the FEEPRO
MMR and a particular value of key: 0DEADDEAD.
Entering the key again to modify the FEEPRO register is
not allowed.
Sequence to Write the Key
1. Write the bit in FEEPRO corresponding to the page to be
protected.
2. Enable key protection by setting Bit 6 of FEEMOD (Bit 5
must be = 0).
3. Write a 32-bit key in FEEADR, FEEDAT.
4. Run the write key command 00C in FEECON; wait for
the read to be successful by monitoring FEESTA.
5. Reset the part.
To remove or modify the protection, the same sequence is
used with a modified value of FEEPRO. If the key chosen is
the value 0DEAD, then the memory protection cannot be
removed. Only a mass erase unprotects the part, but it also
erases all user code.
The sequence to write the key is illustrated in the following
example (this protects writing pages 4 to 7 of the Flash):
FEEPRO=0xFFFFFFFD;
//Protect pages 4 to 7
FEEMOD=0x48;
//Write key enable
FEEADR=0x1234;
//16 bit key value
FEEDAT=0x5678;
//16 bit key value
FEECON= 0x0C;
// Write key command
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 44 of 92
The same sequence should be followed to protect the part
permanently with FEEADR = 0DEAD and FEEDAT =
0DEAD.
FLASH/EE CONTROL INTERFACE
Serial, parallel, and JTAG programming use the Flash/EE control
interface, which includes eight MMRs outlined in this section.
FEESTA Register
Name
Address
Default Value
Access
FEESTA 0xFFFFF800 0x20
R
FEESTA is a read-only register that reflects the status of the
flash control interface as described in Table 19.
Table 19. FEESTA MMR Bit Designations
Bit Description
15 to 6
Reserved.
5
Burst command enable. Set when the command is a
burst command: 0x07, 0x08, or 0x09. Cleared when
other command.
4 Reserved.
3
Flash interrupt status bit. Set automatically when an
interrupt occurs, that is, when a command is complete
and the Flash/EE interrupt enable bit in the FEEMOD
register is set. Cleared when reading FEESTA register.
2
Flash/EE controller busy. Set automatically when the
controller is busy. Cleared automatically when the
controller is not busy.
1
Command fail. Set automatically when a command
completes unsuccessfully. Cleared automatically when
reading FEESTA register.
0
Command pass. Set by MicroConverter when a
command completes successfully. Cleared
automatically when reading FEESTA register.
FEEMOD Register
Name
Address
Default Value
Access
FEEMOD 0xFFFFF804 0x0000
RW
FEEMOD sets the operating mode of the flash control interface.
Table 20 shows FEEMOD MMR bit designations.
Table 20. FEEMOD MMR Bit Designations
Bit Description
15 to 9
Reserved.
8
Reserved. This bit should always be set to 0.
7 to 5
Reserved. These bits should always be set to 0 except
when writing keys. See the Sequence to Write the Key
section.
4
Flash/EE interrupt enable. Set by user to enable the
Flash/EE interrupt. The interrupt occurs when a
command is complete. Cleared by user to disable
the Flash/EE interrupt.
3
Erase/write command protection. Set by user to
enable the erase and write commands. Cleared to
protect the Flash against erase/write command.
2 to 0
Reserved. These bits should always be set to 0.
FEECON Register
Name
Address
Default Value
Access
FEECON 0xFFFFF808 0x07
RW
FEECON is an 8-bit command register. The commands are
described in Table 21.
Table 21. Command Codes in FEECON
Code Command Description
0x00
1
Null
Idle
state.
0x01
1
Single
Read Load FEEDAT with the 16-bit data.
Indexed by FEEADR.
0x02
1
Single
Write Write FEEDAT at the address pointed by
FEEADR. This operation takes 20
s.
0x03
1
Erase-Write Erase the page indexed by FEEADR and
write FEEDAT at the location pointed by
FEEADR. This operation takes 20 ms.
0x04
1
Single
Verify Compare the contents of the location
pointed by FEEADR to the data in
FEEDAT. The result of the comparison is
returned in FEESTA Bit 1.
0x05
1
Single Erase
Erase the page indexed by FEEADR.
0x06
1
Mass
Erase Erase 62 kB of user space. The 2 kB of
kernel are protected. This operation
takes 2.48 seconds. To prevent accidental
execution, a command sequence is
required to execute this instruction. See
the Command Sequence for Executing a
Mass Erase section.
0x07 Burst
Read Default command. No write is allowed.
This operation takes 2 cycles.
0x08
Burst Read-
Write
Write can handle a maximum of 8 data of
16 bits and takes a maximum of 8 x 20
s.
0x09
Erase Burst
Read-Write
Automatically erases the page indexed
by the write; writes pages without
running an erase command. This
command takes 20 ms to erase the page
+ 20
s per data to write.
0x0A Reserved
Reserved.
0x0B Signature
Give a signature of the 64 kB of Flash/EE
in the 24-bit FEESIGN MMR. This
operation takes 32,778 clock cycles.
0x0C Protect
This command can run only once. The
value of FEEPRO is saved and removed
only with a mass erase (0x06) or the key.
0x0D Reserved
Reserved.
0x0E Reserved
Reserved.
0x0F
Ping
No operation; interrupt generated.
1
The FEECON always reads 0x07 immediately after execution of any of these
commands.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 45 of 92
FEEDAT Register
Name
Address
Default Value
Access
FEEDAT 0xFFFFF80C 0xXXXX
RW
FEEDAT is a 16-bit data register.
FEEADR Register
Name
Address
Default Value
Access
FEEADR 0xFFFFF810 0x0000
RW
FEEADR is another 16-bit address register.
FEESIGN Register
Name
Address
Default Value
Access
FEESIGN 0xFFFFF818 0xFFFFFF
R
FEESIGN is a 24-bit code signature.
FEEPRO Register
Name
Address
Default Value
Access
FEEPRO 0xFFFFF81C 0x00000000
RW
FEEPRO MMR provides immediate protection. It does not
require any software keys. See description in Table 22.
FEEHIDE Register
Name
Address
Default Value
Access
FEEHIDE 0xFFFFF820 0xFFFFFFFF
RW
FEEHIDE provides protection following subsequent reset of the
MMR. It requires a software key. See description in Table 22.
Table 22. FEEPRO and FEEHIDE MMR Bit Designations
Bit Description
31
Read protection. Cleared by user to protect all code.
Set by user to allow reading the code.
30 to 0
Write protection for pages 123 to 120, pages 119 to 116,
and pages 0 to 3. Cleared by user to protect the pages in
writing. Set by user to allow writing the pages.
Command Sequence for Executing a Mass Erase
FEEDAT=0x3CFF;
FEEADR = 0xFFC3;
FEEMOD= FEEMOD|0x8; //Erase key enable
FEECON=0x06;
//Mass erase command
EXECUTION TIME FROM SRAM AND FLASH/EE
Execution from SRAM
Fetching instructions from SRAM takes one clock cycle as the
access time of the SRAM is 2 ns and a clock cycle is 22 ns
minimum. However, if the instruction involves reading or
writing data to memory, one extra cycle must be added if the
data is in SRAM (or three cycles if the data is in Flash/EE), one
cycle to execute the instruction, and two cycles to get the 32-bit
data from Flash/EE. A control flow instruction (a branch
instruction, for example) takes one cycle to fetch but also takes
two cycles to fill the pipeline with the new instructions.
Execution from Flash/EE
Because the Flash/EE width is 16 bits and access time for 16-bit
words is 22 ns, execution from Flash/EE cannot be done in
one cycle (as can be done from SRAM when CD Bit = 0). Also,
some dead times are needed before accessing data for any value
of CD bits.
In ARM mode, where instructions are 32 bits, two cycles are
needed to fetch any instruction when CD = 0. In thumb mode,
where instructions are 16 bits, one cycle is needed to fetch any
instruction.
Timing is identical in both modes when executing instructions
that involve using the Flash/EE for data memory. If the
instruction to be executed is a control flow instruction, an extra
cycle is needed to decode the new address of the program
counter and then four cycles are needed to fill the pipeline. A
data-processing instruction involving only the core register
does not require any extra clock cycle. However, if it involves
data in Flash/EE, an extra clock cycle is needed to decode the
address of the data, and two cycles are needed to get the 32-bit
data from Flash/EE. An extra cycle must also be added before
fetching another instruction. Data transfer instructions are
more complex and are summarized in Table 23.
Table 23. Execution Cycles in ARM/Thumb Mode
Instructions
Fetch
Cycles
Dead
Time Data
Access
Dead
Time
LD
2
2/1
1
2
1
LDH 2/1
1
1
1
LDM/PUSH 2/1
N
1
2 x N
1
N
1
STR
2
2/1
1
2 x 20
s
1
STRH 2/1
1
20
s
1
STRM/POP 2/1
N
1
2 x N x 20
s
1
N
1
1
N is the number of data to load or store in the multiple load/store instruction
(1 <N 16).
2
The SWAP instruction combines a LD and STR instruction with only one
fetch, giving a total of 8 cycles plus 40
s.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 46 of 92
RESET AND REMAP
The ARM exception vectors are all situated at the bottom of the
memory array, from address 0x00000000 to address
0x00000020 as shown in Figure 49.
04
955
-
02
2
KERNEL
INTERRUPT
SERVICE ROUTINES
INTERRUPT
SERVICE ROUTINES
ARM EXCEPTION
VECTOR ADDRESSES
0x00000020
0x00011FFF
0x0008FFFF
0xFFFFFFFF
FLASH/EE
SRAM
MIRROR SPACE
0x00000000 0x00000000
0x00010000
0x00080000
Figure 49. Remap for Exception Execution
By default, and after any reset, the Flash/EE is mirrored at the
bottom of the memory array. The remap function allows the
programmer to mirror the SRAM at the bottom of the memory
array, which facilitates execution of exception routines from
SRAM instead of from Flash/EE. This means exceptions are
executed twice as fast, being executed in 32-bit ARM mode, and
the SRAM being 32-bit wide instead of 16-bit wide Flash/EE
memory.
Remap Operation
When a reset occurs on the ADuC7019/20/21/22/24/25/26/27,
execution starts automatically in factory programmed internal
configuration code. This kernel is hidden and cannot be
accessed by user code. If the ADuC7019/20/21/22/24/25/26/27
are in normal mode (BM pin is high), then they execute the
power-on configuration routine of the kernel and then jump to
the reset vector address, 0x00000000, to execute the user's reset
exception routine.
Because the Flash/EE is mirrored at the bottom of the memory
array at reset, the reset interrupt routine must always be written
in Flash/EE.
The remap is done from Flash/EE by setting Bit 0 of the
REMAP register. Precaution must be taken to execute this
command from Flash/EE, above address 0x00080020, and not
from the bottom of the array as this is replaced by the SRAM.
This operation is reversible. The Flash/EE can be remapped at
address 0x00000000 by clearing Bit 0 of the REMAP MMR.
Precaution must again be taken to execute the remap function
from outside the mirrored area. Any kind of reset remaps the
Flash/EE memory at the bottom of the array.
Reset Operation
There are four kinds of reset: external, power-on, watchdog
expiation, and software force. The RSTSTA register indicates
the source of the last reset, and RSTCLR allows clearing the
RSTSTA register. These registers can be used during a reset
exception service routine to identify the source of the reset.
If RSTSTA is null, the reset is external.
REMAP Register
Name
Address
Default Value
Access
REMAP 0xFFFF0220 0xXX
1
RW
1
Depends on model.

Table 24. REMAP MMR Bit Designations
Bit Name Description
4
Read-Only Bit. Indicates the size of the
Flash/EE memory available. If this bit is set,
only 32 kB of Flash/EE memory is available.
3
Read-Only Bit. Indicates the size of the SRAM
memory available. If this bit is set, only 4 kB of
SRAM is available.
2, 1
Reserved.
0 Remap
Remap Bit. Set by the user to remap the SRAM
to address 0x00000000. Cleared automatically
after reset to remap the Flash/EE memory to
address 0x00000000.
RSTSTA Register
Name
Address
Default Value
Access
RSTSTA 0xFFFF0230 0x01
RW

Table 25. RSTSTA MMR Bit Designations
Bit Description
7 to 3
Reserved.
2
Software Reset. Set by user to force a software reset.
Cleared by setting the corresponding bit in RSTCLR.
1
Watchdog Timeout. Set automatically when a
watchdog timeout occurs. Cleared by setting the
corresponding bit in RSTCLR.
0
Power-On Reset. Set automatically when a power-on
reset occurs. Cleared by setting the corresponding bit in
RSTCLR.
RSTCLR Register
Name
Address
Default Value
Access
RSTCLR 0xFFFF0234 0x00
RW
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 47 of 92
OTHER ANALOG PERIPHERALS
DAC
The ADuC7019/20/21/22/24/25/26/27 incorporate two, three,
or four 12-bit voltage output DACs on-chip depending on
model. Each DAC has a rail-to-rail voltage output buffer capable
of driving 5 kF/100 pF.
Each DAC has three selectable ranges: 0 V to V
REF
(internal
bandgap 2.5 V reference), 0 V to DAC
REF,
and 0 V to AV
DD
.
DAC
REF
is equivalent to an external reference for the DAC.
The signal range is 0 V to AV
DD
.
MMRs Interface
Each DAC is configurable independently through a control
register and a data register. These two registers are identical for
the four DACs. Only DAC0CON (see Table 26) and DAC0DAT
(see Table 27) are described in detail in this section.
DACxCON Registers
Name
Address
Default Value
Access
DAC0CON 0xFFFF0600 0x00
RW
DAC1CON 0xFFFF0608 0x00
RW
DAC2CON 0xFFFF0610 0x00
RW
DAC3CON 0xFFFF0618 0x00
RW
Table 26. DAC0CON MMR Bit Designations
Bit Value Name Description
6
Reserved.
5
DACCLK
DAC Update Rate. Set by user to
update the DAC using Timer1.
Cleared by user to update the DAC
using HCLK (core clock).
4
DACCLR
DAC Clear Bit. Set by user to enable
normal DAC operation. Cleared by
user to reset data register of the DAC
to zero.
3
Reserved. This bit should be left at 0.
2
Reserved. This bit should be left at 0.
1, 0
DAC Range Bits.
00
Power-Down Mode. The DAC output
is in tri-state.
01
0 - DAC
REF
Range.
10
0 - V
REF
(2.5 V) Range.
11
0 - AV
DD
Range.
DACxDAT Registers
Name
Address
Default Value
Access
DAC0DAT 0xFFFF0604 0x00000000
RW
DAC1DAT 0xFFFF060C 0x00000000
RW
DAC2DAT 0xFFFF0614 0x00000000
RW
DAC3DAT 0xFFFF061C 0x00000000
RW
Table 27. DAC0DAT MMR Bit Designations
Bit Description
31 to 28
Reserved.
27 to 16
12-bit data for DAC0.
15 to 0
Reserved.
Using the DACs
The on-chip DAC architecture consists of a resistor string DAC
followed by an output buffer amplifier, the functional
equivalent of which is shown in Figure 50.
04
95
5-
0
23
R
R
R
R
R
DAC0
OUTPUT
BUFFER
BYPASSED
FROM MCU
V
REF
AV
DD
DAC
REF
Figure 50. DAC Structure
As illustrated in Figure 50, the reference source for each DAC is
user selectable in software. It can be either AV
DD
, V
REF
, or DAC
REF
.
In 0-to-AV
DD
mode, the DAC output transfer function spans
from 0 V to the voltage at the AV
DD
pin. In 0-to-DAC
REF
mode,
the DAC output transfer function spans from 0 V to the voltage at
the DAC
REF
pin. In 0-to-V
REF
mode, the DAC output transfer
function spans from 0 V to the internal 2.5 V reference, V
REF
.
The DAC output buffer amplifier features a true rail-to-rail
output stage implementation. This means that, unloaded, each
output is capable of swinging to within less than 5 mV of both
AV
DD
and ground. Moreover, the DAC's linearity specification
(when driving a 5 k resistive load to ground) is guaranteed
through the full transfer function except codes 0 to 100, and, in
0-to-AV
DD
mode only, codes 3995 to 4095.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 48 of 92
Linearity degradation near ground and V
DD
is caused by
saturation of the output amplifier, and a general representation
of its effects (neglecting offset and gain error) is illustrated in
Figure 51. The dotted line in Figure 51 indicates the ideal transfer
function, and the solid line represents what the transfer function
might look like with endpoint nonlinearities due to saturation of
the output amplifier. Note that Figure 51 represents a transfer
function in 0-to-AV
DD
mode only. In 0-to-V
REF
or 0-to-DAC
REF
modes (with V
REF
< AV
DD
or DAC
REF
< AV
DD
), the lower non-
linearity is similar. However, the upper portion of the transfer
function follows the "ideal" line right to the end (V
REF
in this case,
not AV
DD
), showing no signs of endpoint linearity errors.
04
95
5-
0
24
AV
DD
AV
DD
100mV
100mV
0x000
0xFFF
Figure 51. Endpoint Nonlinearities Due to Amplifier Saturation
The endpoint nonlinearities conceptually illustrated in
Figure 51 get worse as a function of output loading. Most of
the ADuC7019/20/21/22/24/25/26/27's data sheet specifications
assume a 5 k resistive load to ground at the DAC output.
As the output is forced to source or sink more current,
the nonlinear regions at the top or bottom (respectively) of
Figure 51 become larger. With larger current demands, this
can significantly limit output voltage swing.
POWER SUPPLY MONITOR
The power supply monitor regulates the IOV
DD
supply on the
ADuC7019/20/21/22/24/25/26/27. It indicates when the IOV
DD
supply pin drops below one of two supply trip points. The
monitor function is controlled via the PSMCON register. If
enabled in the IRQEN or FIQEN register, then the monitor
interrupts the core using the PSMI bit in the PSMCON MMR.
This bit is immediately cleared once CMP goes high.
This monitor function allows the user to save working registers
to avoid possible data loss due to the low supply or brown-out
conditions. It also ensures that normal code execution does not
resume until a safe supply level has been established.
PSMCON Register
Name
Address
Default Value
Access
PSMCON 0xFFFF0440 0x0008
RW
Table 28. PSMCON MMR Bit Descriptions
Bit Name Description
3 CMP Comparator Bit. This is a read-only bit and
directly reflects the state of the comparator.
Read 1 indicates that the IOV
DD
supply is above
its selected trip point or the PSM is in power-
down mode. Read 0 indicates the IOV
DD
supply is
below its selected trip point. This bit should be
set before leaving the interrupt service routine.
2
TP
Trip Point Selection Bits. 0 = 2.79 V, 1 = 3.07 V.
1 PSMEN
Power Supply Monitor Enable Bit. Set to 1 to
enable the power supply monitor circuit. Clear to
0 to disable the power supply monitor circuit.
0 PSMI Power Supply Monitor Interrupt Bit. This bit is set
high by the MicroConverter once when CMP
goes low, indicating low I/O supply. The PSMI bit
can be used to interrupt the processor. Once
CMP returns high, the PSMI bit can be cleared by
writing a 1 to this location. A 0 write has no
effect. There is no timeout delay; PSMI can be
immediately cleared once CMP goes high.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 49 of 92
COMPARATOR
The ADuC7019/20/21/22/24/25/26/27 integrate voltage
comparators. The positive input is multiplexed with ADC2 and
the negative input has two options: ADC3 or DAC0. The output
of the comparator can be configured to generate a system
interrupt, can be routed directly to the programmable logic
array, can start an ADC conversion, or can be on an external
pin, CMP
OUT
, as shown in Figure 52.
04
95
5-
0
25
MUX
IRQ
MUX
DAC0
ADC2/CMP0
ADC3/CMP1
P0.0/CMP
OUT
Figure 52. Comparator
Hysteresis
Figure 53 shows how the input offset voltage and hysteresis
terms are defined. Input offset voltage (V
OS
) is the difference
between the center of the hysteresis range and the ground level.
This can either be positive or negative. The hysteresis voltage
(V
H
) is the width of the hysteresis range.
049
55
-
06
3
COMP
OUT
COMP0
V
H
V
H
V
OS
Figure 53. Comparator Hysteresis Transfer Function
Comparator Interface
The comparator interface consists of a 16-bit MMR, CMPCON,
which is described in Table 29.
CMPCON Register
Name
Address
Default Value
Access
CMPCON 0xFFFF0444 0x0000
RW
Table 29. CMPCON MMR Bit Descriptions
Bit Value
Name Description
15 to
11
Reserved.
10 CMPEN
Comparator Enable Bit. Set by user
to enable the comparator. Cleared
by user to disable the comparator.
9, 8
CMPIN
Comparator Negative Input Select
Bits.
00
AVDD/2.
01
ADC3
Input.
10
DAC0
Output.
11
Reserved.
7, 6
CMPOC
Comparator Output Configuration
Bits.
00
Reserved.
01
Reserved.
10
Output on CMPOUT.
11
IRQ.
5 CMPOL
Comparator Output Logic State Bit.
When low, the comparator output is
high if the positive input (CMP0) is
above the negative input (CMP1).
When high, the comparator output
is high if the positive input is below
the negative input.
4, 3
CMPRES
Response Time.
00
10
s.
01
5
s.
10
1
s.
11
0.5
s.
2 CMPHYST
Comparator Hysteresis Bit. Set by
user to have a hysteresis of about
7.5 mV. Cleared by user to have no
hysteresis.
1 CMPORI
Comparator Output Rising Edge
Interrupt. Set automatically when a
rising edge occurs on the moni-
tored voltage (CMP0). Cleared by
user by writing a 1 to this bit.
0 CMPOFI
Comparator Output Falling Edge
Interrupt. Set automatically when a
falling edge occurs on the monitored
voltage (CMP0). Cleared by user.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 50 of 92
OSCILLATOR AND PLL--POWER CONTROL
Clocking System
Each ADuC7019/20/21/22/24/25/26/27 integrates a 32.768 kHz
3% oscillator, a clock divider, and a PLL. The PLL locks onto
a multiple (1275) of the internal oscillator or an external
32.768 kHz crystal to provide a stable 41.78 MHz clock for
the system. To allow power saving, the core can operate at
this frequency, or at binary submultiples of it. The default
core clock is the PLL clock divided by 8 (CD = 3) or 5.22 MHz.
The core clock frequency can also come from an external clock
on the ECLK pin as described in Figure 54. The core clock can
be outputted on the ECLK pin when using an internal oscillator
or external crystal.
04955
-
026
*32.768kHz 3%
AT POWER UP
41.78MHz
OCLK 32.768kHz
WATCHDOG
TIMER
INT. 32kHz*
OSCILLATOR
CRYSTAL
OSCILLATOR
WAKEUP
TIMER
MDCLK
HCLK
PLL
CORE
I
2
C
UCLK
ANALOG
PERIPHERALS
/2
CD
CD
XCLKO
XCLKI
P0.7/XCLK
P0.7/ECLK
Figure 54. Clocking System
The selection of the clock source is in the PLLCON register. By
default, the part uses the internal oscillator feeding the PLL.
External Crystal Selection
To switch to external crystal, clear the OSEL bit in the
PLLCON MMR (see Table 32). In noisy environments, noise
might couple to the external crystal pins and PLL could loose
lock momentarily. A PLL interrupt is provided in the interrupt
controller. The core clock is halted immediately and this
interrupt is only serviced once the lock has been restored.
In case of crystal loss, the watchdog timer should be used.
During initialization, a test on the RSTSTA can determine
if the reset came from the watchdog timer.
External Clock Selection
To switch to an external clock on P0.7, configure P0.7 in
Mode 1 and MDCLK bits to 11. External clock can be up
to 44 MHz providing the tolerance is 1%.
Power Control System
A choice of operating modes is available on the ADuC7019/20/
21/22/24/25/26/27.
Table 30 describes what part is powered on in the different
modes and indicates the power-up time. Table 31 gives some
typical values of the total current consumption (analog + digital
supply currents) in the different modes depending on the clock
divider bits. The ADC is turned off. Note that these values also
include current consumption of the regulator and other parts
on the test board on which these values are measured.
Table 30. Operating Modes
Mode Core Peripherals PLL XTAL/T2/T3 IRQ0 to IRQ3
Start-up/Power-on Time
Active
X
X
X
X
X
300 ms at CD = 0
Pause
X
X
X
X
24 ns at CD = 0; 3 s at CD = 7
Nap
X
X
X
24 ns at CD = 0; 3 s at CD = 7
Sleep
X
X
1.58
ms
Stop
X
1.7
ms
Table 31. Typical Current Consumption at 25C
PC[2-0]
Mode
CD = 0
CD = 1
CD = 2
CD = 3
CD = 4
CD = 5
CD = 6
CD = 7
000
Active
33.1 21.2 13.8 10 8.1
7.2
6.7
6.45
001
Pause
22.7 13.3 8.5
6.1 4.9 4.3 4 3.85
010
Nap
3.8 3.8 3.8 3.8
3.8
3.8
3.8
3.8
011
Sleep 0.4 0.4 0.4 0.4
0.4
0.4
0.4
0.4
100
Stop
0.4 0.4 0.4 0.4
0.4
0.4
0.4
0.4
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 51 of 92
MMRs and Keys
The operating mode, clocking mode, and programmable clock
divider are controlled via two MMRs, PLLCON (see Table 32)
and POWCON (see Table 33). PLLCON controls operating
mode of the clock system, while POWCON controls the core
clock frequency and the power-down mode.
To prevent accidental programming, a certain sequence (see
Table 34) has to be followed to write in the PLLCON and
POWCON registers.
PLLKEYx Registers
Name
Address
Default Value
Access
PLLKEY1 0xFFFF0410 0x0000
W
PLLKEY2 0xFFFF0418 0x0000
W
PLLCON Register
Name
Address
Default Value
Access
PLLCON 0xFFFF0414 0x21
RW
POWKEYx Registers
Name
Address
Default Value
Access
POWKEY1 0xFFFF0404 0x0000
W
POWKEY2 0xFFFF040C 0x0000
W
POWCON Register
Name
Address
Default Value
Access
POWCON 0xFFFF0408 0x0003
RW

Table 32. PLLCON MMR Bit Designations
Bit Value Name Description
7, 6
Reserved.
5
OSEL 32 kHz PLL input selection. Set by
the user to use the internal 32 kHz
oscillator. Set by default. Cleared by
user to use the external 32 kHz crystal.
4,
3, 2
Reserved.
1, 0
MDCLK
Clocking modes.
00
Reserved.
01
PLL. Default configuration.
10
Reserved.
11
External clock on P0.7 pin.
Table 33. POWCON MMR Bit Designations
Bit Value
Name
Description
7
Reserved.
6 to 4
PC
Operating modes.
000
Active
mode.
001
Pause
mode.
010
Nap.
011
Sleep mode. IRQ0 to IRQ3 and
Timer2 can wake-up the
ADuC7019/20/21/22/24/25/26/27.
100
Stop mode. IRQ0 to IRQ3 can wake-
up the ADuC7019/20/21/22/24/25/
26/27.
Others
Reserved.
3
Reserved.
2 to 0
CD
CPU clock divider bits.
000
41.78
MHz.
001
20.89
MHz.
010
10.44
MHz.
011
5.22
MHz.
100
2.61
MHz.
101
1.31
MHz.
110
653
kHz.
111
326
kHz.

Table 34. PLLCON and POWCON Write Sequence
PLLCON POWCON
PLLKEY1 = 0xAA
POWKEY1 = 0x01
PLLCON = 0x01
POWCON = User Value
PLLKEY2 = 0x55
POWKEY2 = 0xF4
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 52 of 92
DIGITAL PERIPHERALS
THREE-PHASE PWM
Each ADuC7019/20/21/22/24/25/26/27 provides a flexible and
programmable, three-phase pulse-width modulation (PWM)
waveform generator. It can be programmed to generate the
required switching patterns to drive a three-phase voltage
source inverter for ac induction motor control (ACIM).
Note that only active high patterns can be produced.
The PWM generator produces three pairs of PWM signals on the
six PWM output pins (PWM0
H
, PWM0
L
, PWM1
H
, PWM1
L
,
PWM2
H
, and PWM2
L
). The six PWM output signals consist of
three high-side drive signals and three low-side drive signals.
The switching frequency and dead time of the generated PWM
patterns are programmable using the PWMDAT0 and
PWMDAT1 MMRs. In addition, three duty-cycle control
registers (PWMCH0, PWMCH1, and PWMCH2) directly
control the duty cycles of the three pairs of PWM signals.
Each of the six PWM output signals can be enabled or disabled by
separate output enable bits of the PWMEN register. In addition,
three control bits of the PWMEN register permit crossover of
the two signals of a PWM pair. In crossover mode, the PWM
signal destined for the high-side switch is diverted to the comple-
mentary low-side output. The signal destined for the low-side
switch is diverted to the corresponding high-side output signal.
In many applications, there is a need to provide an isolation
barrier in the gate-drive circuits that turn on the power devices
of the inverter. In general, there are two common isolation
techniques, optical isolation using opto-couplers, and
transformer isolation using pulse transformers. The PWM
controller permits mixing of the output PWM signals with a
high frequency chopping signal to permit easy interface to such
pulse transformers. The features of this gate-drive chopping
mode can be controlled by the PWMCFG register. An 8-bit
value within the PWMCFG register directly controls the
chopping frequency. High frequency chopping can be
independently enabled for the high-side and low-side outputs
using separate control bits in the PWMCFG register.
The PWM generator can operate in one of two distinct modes,
single update mode or double update mode. In single update
mode, the duty cycle values are programmable only once per
PWM period, so that the resulting PWM patterns are
symmetrical about the midpoint of the PWM period. In the
double update mode, a second updating of the PWM duty cycle
values is implemented at the midpoint of the PWM period.
In double update mode, it is also possible to produce
asymmetrical PWM patterns that produce lower harmonic
distortion in three-phase PWM inverters. This technique
permits closed-loop controllers to change the average voltage
applied to the machine windings at a faster rate. As a result,
faster closed-loop bandwidths are achieved. The operating
mode of the PWM block is selected by a control bit in the
PWMCON register. In single update mode, a PWMSYNC pulse
is produced at the start of each PWM period. In double update
mode, an additional PWMSYNC pulse is produced at the
midpoint of each PWM period.
The PWM block can also provide an internal synchronization
pulse on the PWM
SYNC
pin that is synchronized to the PWM
switching frequency. In single update mode, a pulse is produced
at the start of each PWM period. In double update mode, an
additional pulse is produced at the mid-point of each PWM
period. The width of the pulse is programmable through the
PWMDAT2 register. The PWM block can also accept an external
synchronization pulse on the PWM
SYNC
pin. The selection of
external synchronization or internal synchronization is in the
PWMCON register. The SYNC input timing can be synchronized
to the internal peripheral clock, which is selected in the
PWMCON register. If the external synchronization pulse from
the chip pin is asynchronous to the internal peripheral clock
(typical case), the external PWMSYNC is considered
asynchronous and should be synchronized. The synchronization
logic adds latency and jitter from the external pulse to the actual
PWM outputs. The size of the pulse on the PWM
SYNC
must be
greater than two core clock periods.
The PWM signals produced by the ADuC7019/20/21/22/24/
25/26/27 can be shut off via a dedicated asynchronous PWM
shutdown pin, PWM
TRIP
. When brought low, PWM
TRIP
instantaneously places all six PWM outputs in the off state (high).
This hardware shutdown mechanism is asynchronous so that the
associated PWM disable circuitry does not go through any
clocked logic. This ensures correct PWM shutdown even in the
event of a core clock loss.
Status information about the PWM system is available to the
user in the PWMSTA register. In particular, the state of the
PWM
TRIP
pin is available, as well as a status bit that indicates
whether operation is in the first half or the second half of the
PWM period.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 53 of 92
40-Pin Package Devices
On the 40-pin package devices, the PWM outputs are not
directly accessible, as described in the General-Purpose I/O
section. One channel can be brought out on a GPIO via the
PLA as shown in this example:
PWMCON = 0x1;
// enables PWM o/p
PWMDAT0 = 0x055F;
// PWM switching freq
// Configure Port Pins
GP4CON = 0x300;
// P4.2 as PLA output
GP3CON = 0x1;
// P3.0 configured as
// output of PWM0
//(internally)
// PWM0 onto P4.2
PLAELM8 = 0x0035;
// P3.0 (PWM output)
// input of element 8
PLAELM10 = 0x0059; // PWM from element 8
Description of the PWM Block
A functional block diagram of the PWM controller is shown in
Figure 55. The generation of the six output PWM signals on
pins PWM0
H
to PWM2
L
is controlled by four important blocks:
The Three-Phase PWM Timing Unit. The core of the PWM
controller, it generates three pairs of complemented and dead-
time-adjusted, center-based PWM signals.
The Output Control Unit. This block can redirect the
outputs of the three-phase timing unit for each channel to
either the high-side or low-side output. In addition, the
output control unit allows individual enabling/disabling of
each of the six PWM output signals.
The Gate Drive Unit. This block can generate the high
frequency chopping frequency and its subsequent mixing
with the PWM signals.
The PWM Shutdown Controller. This block takes care of
the PWM shutdown via the PWM
TRIP
pin and generates the
correct reset signal for the timing unit.
The PWMSYNC pulse control unit generates the internal
synchronization pulse and also controls whether the external
PWM
SYNC
pin is used or not.
The PWM controller is driven by the ADuC7019/20/21/22/24/
25/26/27 core clock frequency and is capable of generating two
interrupts to the ARM core. One interrupt is generated on the
occurrence of a PWMSYNC pulse, and the other is generated
on the occurrence of any PWM shutdown action.
04
95
5-
0
27
PWM0
H
PWM0
L
PWM1
H
PWM1
L
PWM2
H
PWM2
L
PWMCON
PWMDAT0
PWMDAT1
PWMDAT2
PWMCH0
PWMCH1
PWMCH2
CONFIGURATION
REGISTERS DUTY CYCLE
REGISTERS
THREE-PHASE
PWM TIMING
UNIT
PWMEN
OUTPUT
CONTROL
UNIT
PWM
SHUTDOWN
CONTROLLER
PWMCFG
GATE
DRIVE
UNIT
PWM
SYNC
PWM
TRIP
TO INTERRUPT
CONTROLLER
SYNC
CORE CLOCK
Figure 55. Overview of the PWM Controller
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 54 of 92
Three-Phase Timing Unit
PWM Switching Frequency (PWMDAT0 MMR)
The PWM switching frequency is controlled by the PWM
period register, PWMDAT0. The fundamental timing unit of
the PWM controller is
t
CORE
= 1/f
CORE
where f
CORE
is the core frequency of the MicroConverter.
Therefore, for a 41.78 MHz f
CORE
, the fundamental time
increment is 24 ns. The value written to the PWMDAT0
register is effectively the number of f
CORE
clock increments in
a PWM period. The required PWMDAT0 value is a function of
the desired PWM switching frequency (f
PWN
) and is given by
PWMDAT0 = f
CORE
/(2 f
PWM
)
Therefore, the PWM switching period, T
S
, can be written as
T
S
= 2 PWMDAT0 t
CORE
The largest value that can be written to the 16-bit PWMDAT0
MMR is 0FFFF = 65535, which corresponds to a minimum
PWM switching frequency of
f
PWM(min)
= 41.78 10
6
/(2 65535) = 318.75 Hz
Note that a PWMDAT0 value of 0 and 1 are not defined and
should not be used.
PWM Switching Dead Time (PWMDAT1 MMR)
The second important parameter that must be set up in the initial
configuration of the PWM block is the switching dead time. This
is a short delay time introduced between turning off one PWM
signal (0
H
, for example) and turning on the complementary signal
(0
L
). This short time delay is introduced to permit the power
switch to be turned off (in this case, 0H) to completely recover its
blocking capability before the complementary switch is turned
on. This time delay prevents a potentially destructive short-circuit
condition from developing across the dc link capacitor of a
typical voltage source inverter.
The dead time is controlled by the 10-bit, read/write PWMDAT1
register. There is only one dead-time register that controls the
dead time inserted into all three pairs of PWM output signals.
The dead time, TD, is related to the value in the PWMDAT1
register by:
TD = PWMDAT1 2 t
CORE
Therefore, a PWMDAT1 value of 0x00A (= 10), introduces
a 426 ns delay between the turn-off on any PWM signal (0H,
for example) and the turn-on of its complementary signal (0L).
The amount of the dead time can therefore be programmed in
increments of 2t
CORE
(or 49 ns for a 41.78 MHz core clock).
The PWMDAT1 register is a 10-bit register with a maximum
value of 0x3FF (= 1023), which corresponds to a maximum
programmed dead time of
TD
(max)
= 1023 2 t
CORE
= 1023 2 24 10
9
= 48.97 s
for a core clock of 41.78 MHz
Obviously, the dead time can be programmed to be zero by
writing 0 to the PWMDAT1 register.
PWM Operating Mode (PWMCON, PWMSTA MMRs)
As previously discussed, the PWM controller of the
ADuC7019/20/21/22/24/25/26/27 can operate in two
distinct modes, single update mode and double update
mode. The operating mode of the PWM controller is
determined by the state of Bit 2 of the PWMCON register.
If this bit is cleared, the PWM operates in the single update
mode. Setting Bit 2 places the PWM in the double update
mode. The default operating mode is single update mode.
In single update mode, a single PWMSYNC pulse is produced
in each PWM period. The rising edge of this signal marks the
start of a new PWM cycle, and is used to latch new values from
the PWM configuration registers (PWMDAT0 and PWMDAT1)
and the PWM duty cycle registers (PWMCH0, PWMCH1, and
PWMCH2) into the three-phase timing unit. In addition, the
PWMEN register is latched into the output control unit on the
rising edge of the PWMSYNC pulse. In effect, this means that
the characteristics and resulting duty cycles of the PWM signals
can be updated only once per PWM period at the start of each
cycle. The result is symmetrical PWM patterns about the
midpoint of the switching period.
In double update mode, there is an additional PWMSYNC
pulse produced at the midpoint of each PWM period. The
rising edge of this new PWMSYNC pulse is again used to latch
new values of the PWM configuration registers, duty cycle
registers, and the PWMEN register. As a result, it is possible to
alter both the characteristics (switching frequency and dead
time) as well as the output duty cycles at the midpoint of each
PWM cycle. Consequently, it is also possible to produce PWM
switching patterns that are no longer symmetrical about the
midpoint of the period (asymmetrical PWM patterns). In
double update mode, it can be necessary to know whether
operation at any point in time is in either the first half or the
second half of the PWM cycle. This information is provided by
Bit 0 of the PWMSTA register, which is cleared during
operation in the first half of each PWM period (between the
rising edge of the original PWMSYNC pulse and the rising edge
of the new PWMSYNC pulse introduced in double update
mode). Bit 0 of the PWMSTA register is set during operation
in the second half of each PWM period. This status bit allows
the user to make a determination of the particular half-cycle
during implementation of the PWMSYNC interrupt service
routine, if required.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 55 of 92
The advantage of double update mode is that lower harmonic
voltages can be produced by the PWM process and faster
control bandwidths are possible. However, for a given PWM
switching frequency, the PWMSYNC pulses occur at twice the
rate in the double update mode. Because new duty cycle values
must be computed in each PWMSYNC interrupt service
routine, there is a larger computational burden on the ARM
core in double update mode.
PWM Duty Cycles (PWMCH0, PWMCH1,
PWMCH2 MMRs)
The duty cycles of the six PWM output signals on Pin PWM0
H
to Pin PWM 2
L
are controlled by the three, 16-bit read/write
duty cycle registers, PWMCH0, PWMCH1, and PWMCH2.
The duty cycle registers are programmed in integer counts of
the fundamental time unit, t
CORE
. They define the desired on-
time of the high-side PWM signal produced by the three-phase
timing unit over half the PWM period. The switching signals
produced by the three-phase timing unit are also adjusted to
incorporate the programmed dead time value in the
PWMDAT1 register. The three-phase timing unit produces
active low signals so that a low level corresponds to a command
to turn on the associated power device.
Figure 56 shows a typical pair of PWM outputs (in this case, 0H
and 0L) from the timing unit in single update mode. All
illustrated time values indicate the integer value in the
associated register and can be converted to time by simply
multiplying by the fundamental time increment, t
CORE
. Note that
the switching patterns are perfectly symmetrical about the
midpoint of the switching period in this mode because the same
values of PWMCH0, PWMDAT0, and PWMDAT1 are used to
define the signals in both half cycles of the period.
Figure 56 also demonstrates how the programmed duty cycles
are adjusted to incorporate the desired dead time into the
resulting pair of PWM signals. Clearly, the dead time is incor-
porated by moving the switching instants of both PWM signals
(0H and 0L) away from the instant set by the PWMCH0 register.
0
49
55
-
02
8
PWMDAT0/2
0H
0L
PWMSYNC
PWMSTA (0)
PWMDAT0
+PWMDAT0/2
PWMDAT0/2
0
0
PWMDAT0
PWMDAT2+1
PWMCH0
2 PWMDAT1
2 PWMDAT1
PWMCH0
Figure 56. Typical PWM Outputs of Three-Phase Timing Unit
in Single Update Mode
Both switching edges are moved by an equal amount
(PWMDAT1 t
CORE
) to preserve the symmetrical output
patterns.
Also shown is the PWMSYNC pulse and Bit 0 of the PWMSTA
register, which indicates whether operation is in the first or
second half cycle of the PWM period.
The resulting on-times of the PWM signals over the full PWM
period (two half periods) produced by the timing unit can be
written as follows:
On the high side
T
0HH
= PWMDAT0 + 2(PWMCH0 - PWMDAT1) t
CORE
T
0HL
= PWMDAT0 - 2(PWMCH0 - PWMDAT1) t
CORE
and the corresponding duty cycles (d)
d
0H
= T
0HH
/T
S
= + (PWMCH0 - PWMDAT1)/PWMDAT0
and on the low side
T
0LH
= PWMDAT0 - 2(PWMCH0 + PWMDAT1)
t
CORE
T
0LL
= PWMDAT0 + 2(PWMCH0 + PWMDAT1)
t
CORE
and the corresponding duty cycles (d)
d
OL
= T
0LH
/T
S
= - (PWMCH0 + PWMDAT1)/PWMDAT0
The minimum permissible T
0H
and T
0L
values are zero,
corresponding to a 0% duty cycle. In a similar fashion, the
maximum value is T
S
, corresponding to a 100% duty cycle.
Figure 57 shows the output signals from the timing unit for
operation in double update mode. It illustrates a general case
where the switching frequency, dead time, and duty cycle are all
changed in the second half of the PWM period. Of course, the
same value for any or all of these quantities can be used in both
halves of the PWM cycle. However, there is no guarantee that
symmetrical PWM signals are produced by the timing unit in
double update mode. Figure 57 also shows that the dead time
inserted into the PWM signals are done so in the same way as
demonstrated in single update mode.
0
4955
-
029
PWMDAT0
1
/2
0H
0L
PWMSYNC
PWMSTA (0)
PWMDAT0
1
+PWMDAT0
1
/2
PWMDAT0
2
/2
+PWMDAT0
2
/2
PWMCH0
2
PWMCH0
1
2 PWMDAT1
2
2 PWMDAT1
1
PWMDAT2
2
+1
PWMDAT2
1
+1
0
0
PWMDAT0
2
Figure 57. Typical PWM Outputs of the Three-Phase Timing Unit
in Double Update Mode
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 56 of 92
In general, the on-times of the PWM signals in double update
mode can be defined as follows:
On the high side
T
0HH
= (PWMDAT0
1
/2
+ PWMDAT0
2
/2
+ PWMCH0
1
+
PWMCH0
2
- PWMDAT1
1
- PWMDAT1
2
) t
CORE
T
0HL
= (PWMDAT0
1
/2
+ PWMDAT0
2
/2
- PWMCH0
1
-
PWMCH0
2
+ PWMDAT1
1
+ PWMDAT1
2
) t
CORE
where the subscript 1 refers to the value of that register during
the first cycle, and the subscript 2 refers to the value during
the second half cycle.
The corresponding duty cycles (d) are
d
0H
= T
0HH
/T
S
= (PWMDAT0
1
/2
+ PWMDAT0
2
/2
+
PWMCH0
1
+ PWMCH0
2
- PWMDAT1
1
- PWMDAT1
2
)/
(PWMDAT0
1
+
PWMDAT0
2
)
On the low side
T
0LH
= (PWMDAT0
1
/2
+ PWMDAT0
2
/2
+ PWMCH0
1
+
PWMCH0
2
+ PWMDAT1
1
+ PWMDAT1
2
) t
CORE
T
0LL
= (PWMDAT0
1
/2
+ PWMDAT0
2
/2
- PWMCH0
1
-
PWMCH0
2
- PWMDAT1
1
- PWMDAT1
2
) t
CORE
where the subscript 1 refers to the value of that register during
the first half cycle, and the subscript 2 refers to the value during
the second half cycle.
The corresponding duty cycles (d) are
d
0L
= T
0LH
/T
S
= (PWMDAT0
1
/2 + PWMDAT0
2
/2 +
PWMCH0
1
+ PWMCH0
2
+ PWMDAT1
1
+
PWMDAT1
2
)/(PWMDAT0
1
+ PWMDAT0
2
)
For the completely general case in double update mode
(see Figure 57), the switching period is given by
T
S
=
(PWMDAT0
1
+ PWMDAT0
2
) t
CORE
Again, the values of T
0H
and T
0L
are constrained to lie between
zero and T
S
.
PWM signals similar to those illustrated in Figure 56 and Figure
57 can be produced on the 1H, 1L, 2H, and 2L outputs by
programming the PWMCH1 and PWMCH2 registers in a manner
identical to that described for PWMCH0. The PWM controller
does not produce any PWM outputs until all of the PWMDAT0,
PWMCH0, PWMCH1, and PWMCH2 registers have been
written to at least once. Once these registers have been written,
internal counting of the timers in the three-phase timing unit is
enabled.
Writing to the PWMDAT0 register starts the internal timing of the
main PWM timer. Provided that the PWMDAT0 register is written
to prior to the PWMCH0, PWMCH1, and PWMCH2 registers in
the initialization, the first PWMSYNC pulse and interrupt (if
enabled) appear 1.5 t
CORE
PWMDAT0 seconds after the initial
write to the PWMDAT0 register in single update mode. In double
update mode, the first PWMSYNC pulse appears after
PWMDAT0 t
CORE
seconds.
Output Control Unit
The operation of the output control unit is controlled by the
9-bit read/write PWMEN register. This register controls two
distinct features of the output control unit that are directly
useful in the control of electronic counter measures (ECM) or
binary decimal counter measures (BDCM). The PWMEN
register contains three crossover bits, one for each pair of PWM
outputs. Setting Bit 8 of the PWMEN register enables the
crossover mode for the 0H/0L pair of PWM signals, setting
Bit 7 enables crossover on the 1H/1L pair of PWM signals, and
setting Bit 6 enables crossover on the 2H/2L pair of PWM
signals. If crossover mode is enabled for any pair of PWM
signals, the high-side PWM signal from the timing unit (0H, for
example) is diverted to the associated low-side output of the
output control unit so that the signal ultimately appears at the
PWM0
L
pin. Of course, the corresponding low-side output of
the timing unit is also diverted to the complementary high-side
output of the output control unit so that the signal appears at
the PWM0
H
pin. Following a reset, the three crossover bits are
cleared and the crossover mode is disabled on all three pairs of
PWM signals. The PWMEN register also contains 6 bits (Bit 0
to Bit 5) that can be used to individually enable or disable each
of the six PWM outputs. If the associated bit of the PWMEN
register is set, the corresponding PWM output is disabled
regardless of corresponding value of the duty cycle register. This
PWM output signal remains in the off state as long as the
corresponding enable/disable bit of the PWMEN register is set.
The implementation of this output enable function is
implemented after the crossover function.
Following a reset, all six enable bits of the PWMEN register are
cleared, and all PWM outputs are enabled by default. In a
manner identical to the duty cycle registers, the PWMEN is
latched on the rising edge of the PWMSYNC signal. As a result,
changes to this register only become effective at the start of each
PWM cycle in single update mode. In double update mode, the
PWMEN register can also be updated at the midpoint of the
PWM cycle.
In the control of an ECM, only two inverter legs are switched at
any time, and often the high-side device in one leg must be
switched on at the same time as the low-side driver in a second
leg. Therefore, by programming identical duty cycle values for
two PWM channels (for example, PWMCH0 = PWMCH1) and
setting Bit 7 of the PWMEN register to cross over the 1H/1L
pair of PWM signals, it is possible to turn on the high-side
switch of Phase A and the low-side switch of Phase B at the
same time. In the control of ECM, it is usual for the third
inverter leg (Phase C in this example) to be disabled for a
number of PWM cycles. This function is implemented by
disabling both the 2H and 2L PWM outputs by setting Bit 0
and Bit 1 of the PWMEN register.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 57 of 92
This situation is illustrated in Figure 58, where it can be seen
that both the 0H and 1L signals are identical, because
PWMCH0 = PWMCH1 and the crossover bit for phase B is set.
04
95
5-
03
0
PWMCH0 =
PWMCH1
0H
0L
1H
1L
2H
2L
PWMCH0 =
PWMCH1
2 PWMDAT1
2 PWMDAT1
PWMDAT0
PWMDAT0
Figure 58. Active LO PWM Signals Suitable for ECM Control,
PWMCH0 = PWMCH1, Crossover 1H/1L Pair and Disable
0L, 1H, 2H, and 2L Outputs in Single Update Mode.
In addition, the other four signals (0L, 1H, 2H, and 2L) have
been disabled by setting the appropriate enable/disable bits of
the PWMEN register. In Figure 58, the appropriate value for
the PWMEN register is 000A7. In normal ECM operation,
each inverter leg is disabled for certain periods of time so that
the PWMEN register is changed based on the position of the
rotor shaft (motor commutation).
Gate Drive Unit
The gate drive unit of the PWM controller adds features that
simplify the design of isolated gate-drive circuits for PWM
inverters. If a transformer-coupled, power device, gate-drive
amplifier is used, then the active PWM signal must be chopped at
a high frequency. The 10-bit read/write PWMCFG register
programs this high frequency chopping mode. The chopped
active PWM signals can be required for the high-side drivers
only, the low-side drivers only, or both the high-side and low-
side switches. Therefore, independent control of this mode for
both high-side and low-side switches is included with two
separate control bits in the PWMCFG register.
Typical PWM output signals with high frequency chopping
enabled on both high-side and low-side signals are shown in
Figure 59. Chopping of the high-side PWM outputs (0H, 1H,
and 2H) is enabled by setting Bit 8 of the PWMCFG register.
Chopping of the low-side PWM outputs (0L, 1L, and 2L) is
enabled by setting Bit 9 of the PWMCFG register. The high
chopping frequency is controlled by the 8-bit word (GDCLK)
placed in Bit 0 to Bit 7 of the PWMCFG register. The period of
this high frequency carrier is
T
CHOP
= (4 (GDCLK + 1)) t
CORE
and the chopping frequency is therefore an integral subdivision
of the MicroConverter core frequency
f
CHOP
= f
CORE
/(4 (GDCLK + 1))
The GDCLK value can range from 0 to 255, corresponding to
a programmable chopping frequency rate from 40.8 kHz to
10.44 MHz for a 41.78 MHz core frequency. The gate drive
features must be programmed before operation of the PWM
controller and are typically not changed during normal
operation of the PWM controller. Following a reset, all bits of
the PWMCFG register are cleared so that high frequency
chopping is disabled, by default.
0
49
55
-
03
1
PWMCH0
PWMCH0
PWMDAT0
PWMDAT0
0L
0H
2 PWMDAT1
4 (GDCLK + 1)
t
CORE
2 PWMDAT1
Figure 59. Typical PWM Signals with High Frequency Gate Chopping Enabled
on Both High-Side and Low-Side Switches
PWM Shut Down
In the event of external fault conditions, it is essential that the
PWM system be instantaneously shut down in a safe fashion. A
low level on the PWM
TRIP
pin provides an instantaneous,
asynchronous (independent of the MicroConverter core clock)
shutdown of the PWM controller. All six PWM outputs are
placed in the off state, that is, high state. In addition, the
PWMSYNC pulse is disabled. The PWM
TRIP
pin has an internal
pull-down resistor to disable the PWM if the pin becomes
disconnected. The state of the PWM
TRIP
pin can be read from
Bit 3 of the PWMSTA register.
If a PWM shutdown command occurs, a PWMTRIP
interrupt is
generated, and internal timing of the three-phase timing unit of
the PWM controller is stopped. Following a PWM shutdown, the
PWM can only be re-enabled (in a PWMTRIP interrupt service
routine, for example) by writing to all of the PWMDAT0,
PWMCH0, PWMCH1, and PWMCH2 registers. Provided that
the external fault is cleared and the PWMTRIP
is returned to a
high level, the internal timing of the three-phase timing unit
resumes, and new duty-cycle values are latched on the next
PWMSYNC boundary.
Note that the PWMTRIP interrupt is available in IRQ only,
and the PWMSYNC interrupt is available in FIQ only. Both
interrupts share the same bit in the interrupt controller.
Therefore, only one of the interrupts can be used at once.
See the Interrupt System section for further details.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 58 of 92
PWM MMRs Interface
The PWM block is controlled via the MMRs described in this
section.
PWMCON Register
Name
Address
Default Value
Access
PWMCON 0xFFFFFC00 0x0000
RW
PWMCON is a control register that enables the PWM and
chooses the update rate.

Table 35. PWMCON MMR Bit Descriptions
Bit Name
Description
7 to
5
Reserved.
4 PWM_SYNCSEL
External Sync Select. Set to use external
sync. Cleared to use internal sync.
3 PWM_EXTSYNC
External Sync Select. Set to select
external synchronous sync signal.
Cleared for asynchronous sync signal.
2 PWMDBL
Double Update Mode. Set to 1 by user
to enable double update mode.
Cleared to 0 by the user to enable
single update mode.
1 PWM_SYNC_EN
PWM Synchronization Enable. Set by
user to enable synchronization. Cleared
by user to disable synchronization.
0 PWMEN
PWM Enable Bit. Set to 1 by the user
to enable the PWM. Cleared to 0 by
the user to disable the PWM. Also
cleared automatically with PWMTRIP.
PWMSTA Register
Name
Address
Default Value
Access
PWMSTA 0xFFFFFC04 0x0000
RW
PWMSTA reflects the status of the PWM.

Table 36. PWMSTA MMR Bit Descriptions
Bit Name
Description
15 to
10
Reserved.
9
PWMSYNCINT
PWM Sync Interrupt Bit.
8
PWMTRIPINT
PWM Trip Interrupt Bit.
3
PWMTRIP
Raw Signal from the PWM
TRIP
Pin.
2, 1
Reserved.
0 PWMPHASE
PWM Phase Bit. Set to 1 by the Micro-
Converter when the timer is counting
down (1
st
half). Cleared to 0 by the
MicroConverter when the timer is
counting up (2
nd
half).
PWMCFG Register
Name
Address
Default Value
Access
PWMCFG 0xFFFFFC10 0x0000
RW
PWMCFG is a gate chopping register.

Table 37. PWMCFG MMR Bit Descriptions
Bit Name
Description
15 to 10
Reserved.
9
CHOPLO
Low-Side Gate Chopping Enable Bit.
8
CHOPHI
High-Side Gate Chopping Enable Bit.
7 to 0
GDCLK
PWM Gate Chopping Period (Unsigned).
PWMEN Register
Name
Address
Default Value
Access
PWMEN 0xFFFFFC20 0x0000
RW
PWMEN allows enabling channel outputs and crossover. See its
bit definitions in Table 38.

Table 38. PWMEN MMR Bit Descriptions
Bit Name
Description
8 0H0L_XOVR
Channel 0 Output Crossover Enable Bit. Set
to 1 by user to enable Channel 0 output
crossover. Cleared to 0 by user to disable
Channel 0 output crossover.
7 1H1L_XOVR
Channel 1 Output Crossover Enable Bit. Set
to 1 by user to enable Channel 1 output
crossover. Cleared to 0 by user to disable
Channel 1 output crossover.
6 2H2L_XOVR
Channel 2 Output Crossover Enable Bit. Set
to 1 by user to enable Channel 2 output
crossover. Cleared to 0 by user to disable
Channel 2 output crossover.
5 0L_EN
0L Output Enable Bit. Set to 1 by user to
disable the 0L output of the PWM. Cleared
to 0 by user to enable the 0L output of the
PWM.
4 0H_EN
0H Output Enable Bit. Set to 1 by user to
disable the 0H output of the PWM. Cleared
to 0 by user to enable the 0H output of the
PWM.
3 1L_EN
1L Output Enable Bit. Set to 1 by user to
disable the 1L output of the PWM. Cleared
to 0 by user to enable the 1L output of the
PWM.
2 1H_EN
1H Output Enable Bit. Set to 1 by user to
disable the 1H output of the PWM. Cleared
to 0 by user to enable the 1H output of the
PWM.
1 2L_EN
2L Output Enable Bit. Set to 1 by user to
disable the 2L output of the PWM. Cleared
to 0 by user to enable the 2L output of the
PWM.
0 2H_EN
2H Output Enable Bit. Set to 1 by user to
disable the 2H output of the PWM. Cleared
to 0 by user to enable the 2H output of the
PWM.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 59 of 92
PWMDAT0 Register
Name
Address
Default Value
Access
PWMDAT0 0xFFFFFC08 0x0000
RW
PWMDAT0 is an unsigned 16-bit register for switching period.
PWMDAT1 Register
Name
Address
Default Value
Access
PWMDAT1 0xFFFFFC0C 0x0000
RW
PWMDAT1 is an unsigned 10-bit register for dead time.
PWMCHx Registers
Name
Address
Default Value
Access
PWMCH0 0xFFFFFC14 0x0000
RW
PWMCH1 0xFFFFFC18 0x0000
RW
PWMCH2 0xFFFFFC1C 0x0000
RW
PWMCH0, PWMCH1, and PWMCH2 are channel duty cycles
for the three phases.
PWMDAT2 Register
Name
Address
Default Value
Access
PWMDAT2 0xFFFFFC24 0x0000
RW
PWMDAT2 is an unsigned 10-bit register for PWM sync pulse
width.
GENERAL-PURPOSE I/O
The ADuC7019/20/21/22/24/25/26/27 provide 40 general-
purpose, bi-directional I/O (GPIO) pins. All I/O pins are 5 V
tolerant, which means that the GPIOs support an input voltage
of 5 V. In general, many of the GPIO pins have multiple
functions (see Table 39 for the pin function definitions). By
default, the GPIO pins are configured in GPIO mode.
All GPIO pins have internal pull-up resistor (of about 100 k)
and their drive capability is 1.6 mA. Note that a maximum of
20 GPIO can drive 1.6 mA at the same time. The following
GPIO have programmable pull up: P0.0, P0.4, P0.5, P0.6, P0.7,
and the 8 GPIOs of P1.
The 40 GPIO are grouped in five ports, Port 0 to Port 4. Each
port is controlled by four or five MMRs, x representing the port
number.
Note that the kernel changes P0.6 from its default configuration
at reset (MRST) to GPIO mode. If MRST is used for external
circuitry, an external pull-up resistor should be used to insure
that the level on P0.6 does not drop when the kernel switches
mode. For example, if MRST is required for power down, it can
be reconfigured in GP0CON MMR.
Table 39. GPIO Pin Function Descriptions
Configuration
Port Pin 00
01
10
11
0 P0.0
GPIO
CMP
MS2
PLAI[7]
P0.1
GPIO
PWM2
H
BLE
P0.2
GPIO
PWM2
L
BHE
P0.3
GPIO
TRST
A16
ADC
BUSY
P0.4
GPIO/IRQ0 PWM
TRIP
MS1
PLAO[1]
P0.5
GPIO/IRQ1 ADC
BUSY
MS0
PLAO[2]
P0.6
GPIO/T1 MRST AE
PLAO[3]
P0.7
GPIO
ECLK/XCLK
1
SIN PLAO[4]
1 P1.0
GPIO/T1
SIN
SCL0
PLAI[0]
P1.1
GPIO
SOUT SDA0
PLAI[1]
P1.2
GPIO
RTS
SCL1
PLAI[2]
P1.3
GPIO
CTS
SDA1
PLAI[3]
P1.4
GPIO/IRQ2 RI
CLK
PLAI[4]
P1.5
GPIO/IRQ3 DCD
MISO
PLAI[5]
P1.6
GPIO
DSR
MOSI
PLAI[6]
P1.7
GPIO
DTR
CSL
PLAO[0]
2 P2.0
GPIO
CONV
START
2
SOUT PLAO[5]
P2.1
GPIO
PWM0
H
WS
PLAO[6]
P2.2
GPIO
PWM0
L
RS
PLAO[7]
P2.3
GPIO
AE
P2.4
GPIO
PWM0
H
MS0
P2.5
GPIO
PWM0
L
MS1
P2.6
GPIO
PWM1
H
MS2
P2.7
GPIO
PWM1
L
MS3
3 P3.0
GPIO
PWM0
H
AD0
PLAI[8]
P3.1
GPIO
PWM0
L
AD1
PLAI[9]
P3.2
GPIO
PWM1
H
AD2
PLAI[10]
P3.3
GPIO
PWM1
L
AD3
PLAI[11]
P3.4
GPIO
PWM2
H
AD4
PLAI[12]
P3.5
GPIO
PWM2
L
AD5
PLAI[13]
P3.6
GPIO
PWM
TRIP
AD6
PLAI[14]
P3.7
GPIO
PWM
SYNC
AD7
PLAI[15]
4 P4.0
GPIO
AD8
PLAO[8]
P4.1
GPIO
AD9
PLAO[9]
P4.2
GPIO
AD10
PLAO[10]
P4.3
GPIO
AD11
PLAO[11]
P4.4
GPIO
AD12
PLAO[12]
P4.5
GPIO
AD13
PLAO[13]
P4.6
GPIO
AD14
PLAO[14]
P4.7
GPIO
AD15
PLAO[15]
1
When configured in Mode 1, PO.7 is ECLK by default, or core clock output.
To configure it as a clock input, MDCLK bits in PLLCON must be set to 11.
2
The CONV
START
signal is active in all modes of P2.0.
GPxCON Registers
Name
Address
Default Value
Access
GP0CON 0xFFFFF400 0x00000000
RW
GP1CON 0xFFFFF404 0x00000000
RW
GP2CON 0xFFFFF408 0x00000000
RW
GP3CON 0xFFFFF40C 0x00000000
RW
GP4CON 0xFFFFF410 0x00000000
RW
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 60 of 92
GPxCON are the port x control registers, which select the
function of each pin of port x. as described in Table 40.
Table 40. GPxCON MMR Bit Descriptions
Bit Description
31, 30
Reserved
29, 28
Select Function of Px.7 Pin
27, 26
Reserved
25, 24
Select Function of Px.6 Pin
23, 22
Reserved
21, 20
Select Function of Px.5 Pin
19, 18
Reserved
17, 16
Select Function of Px.4 Pin
15, 14
Reserved
13, 12
Select Function of Px.3 Pin
11, 10
Reserved
9, 8
Select Function of Px.2 Pin
7, 6
Reserved
5, 4
Select Function of Px.1 Pin
3, 2
Reserved
1, 0
Select Function of Px.0 Pin
GPxPAR Registers
Name
Address
Default Value
Access
GP0PAR 0xFFFFF42C 0x20000000
RW
GP1PAR 0xFFFFF43C 0x00000000
RW
GP3PAR 0xFFFFF45C 0x00222222
RW
GPxPAR program the parameters for Port 0, Port 1, and Port 3.
Note that the GPxDAT MMR must always be written after
changing the GPxPAR MMR.
Table 41. GPxPAR MMR Bit Descriptions
Bit Description
31 to 29
Reserved
28 Pull-Up
Disable
Px.7
27 to 25
Reserved
24 Pull-Up
Disable
Px.6
23 to 21
Reserved
20 Pull-Up
Disable
Px.5
19 to 17
Reserved
16 Pull-Up
Disable
Px.4
15 to 13
Reserved
12 Pull-Up
Disable
Px.3
11 to 9
Reserved
8 Pull-Up
Disable
Px.2
7 to 5
Reserved
4 Pull-Up
Disable
Px.1
3 to 1
Reserved
0 Pull-Up
Disable
Px.0
GPxDAT Registers
Name
Address
Default Value
Access
GP0DAT 0xFFFFF420 0x000000XX
RW
GP1DAT 0xFFFFF430 0x000000XX
RW
GP2DAT 0xFFFFF440 0x000000XX
RW
GP3DAT 0xFFFFF450 0x000000XX
RW
GP4DAT 0xFFFFF460 0x000000XX
RW
GPxDAT are port x configuration and data registers. They
configure the direction of the GPIO pins of port x, set the
output value for the pins configured as output, and store the
input value of the pins configured as input.
Table 42. GPxDAT MMR Bit Descriptions
Bit Description
31 to 24
Direction of the Data. Set to 1 by user to configure
the GPIO pin as an output. Cleared to 0 by user to
configure the GPIO pin as an input.
23 to 16
Port x Data Output.
15 to 8
Reflect the State of Port x Pins at Reset (read only).
7 to 0
Port x Data Input (read only).
GPxSET Registers
Name
Address
Default Value
Access
GP0SET 0xFFFFF424 0x000000XX W
GP1SET 0xFFFFF434 0x000000XX W
GP2SET 0xFFFFF444 0x000000XX W
GP3SET 0xFFFFF454 0x000000XX W
GP4SET 0xFFFFF464 0x000000XX W
GPxSET are data set port x registers.
Table 43. GPxSET MMR Bit Descriptions
Bit Description
31 to 24
Reserved.
23 to 16
Data Port x Set Bit. Set to 1 by user to set bit on port
x; also sets the corresponding bit in the GPxDAT
MMR. Cleared to 0 by user; does not affect the data out.
15 to 0
Reserved.
GPxCLR Registers
Name
Address
Default Value
Access
GP0CLR 0xFFFFF428 0x000000XX W
GP1CLR 0xFFFFF438 0x000000XX W
GP2CLR 0xFFFFF448 0x000000XX W
GP3CLR 0xFFFFF458 0x000000XX W
GP4CLR 0xFFFFF468 0x000000XX W
GPxCLR are data clear port x registers.
Table 44. GPxCLR MMR Bit Descriptions
Bit Description
31 to 24
Reserved.
23 to 16
Data Port x Clear Bit. Set to 1 by user to clear bit on
port x; also clears the corresponding bit in the
GPxDAT MMR. Cleared to 0 by user; does not affect
the data out.
15 to 0
Reserved.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 61 of 92
SERIAL PORT MUX
The serial port mux multiplexes the serial port peripherals
(an SPI, UART, and two I
2
Cs) and the programmable logic array
(PLA) to a set of ten GPIO pins. Each pin must be configured to
one of its specific I/O functions as described in Table 45.
Table 45. SPM Configuration
GPIO
UART UART/I
2
C/SPI PLA
Pin (00) (01)
(10)
(11)
SPM0 P1.0 SIN
I2C0SCL
PLAI[0]
SPM1 P1.1 SOUT
I2C0SDA
PLAI[1]
SPM2 P1.2 RTS
I2C1SCL
PLAI[2]
SPM3 P1.3 CTS
I2C1SDA
PLAI[3]
SPM4 P1.4 RI
SPICLK
PLAI[4]
SPM5 P1.5 DCD
SPIMISO
PLAI[5]
SPM6 P1.6 DSR
SPIMOSI
PLAI[6]
SPM7 P1.7 DTR
SPICSL
PLAO[0]
SPM8 P0.7 ECLK/XCLK SIN
PLAO[4]
SPM9 P2.0 CONV
SOUT
PLAO[5]
Table 45 also details the mode for each of the SPMUX GPIO
pins. This configuration has to be done via the GP0CON,
GP1CON, and GP2CON MMRs. By default these ten pins are
configured as GPIOs.
UART SERIAL INTERFACE
The UART peripheral is a full duplex, universal asynchronous
receiver/transmitter. It is fully compatible with the 16450 serial
port standard. The UART performs serial-to-parallel
conversion on data characters received from a peripheral device
or modem, and parallel-to-serial conversion on data characters
received from the CPU. The UART includes a fractional divider
for baud rate generation and has a network addressable mode.
The UART function is made available on the 10 pins of the
ADuC7019/20/21/22/24/25/26/27 (see Table 46).
Table 46. UART Signal Description
Pin Signal
Description
SPM0 (Mode 1)
SIN
Serial Receive Data
SPM1 (Mode 1)
SOUT
Serial Transmit Data
SPM2 (Mode 1)
RTS
Request to Send
SPM3 (Mode 1)
CTS
Clear to Send
SPM4 (Mode 1)
RI
Ring Indicator
SPM5 (Mode 1)
DCD
Data Carrier Detect
SPM6 (Mode 1)
DSR
Data Set Ready
SPM7 (Mode 1)
DTR
Data Terminal Ready
SPM8 (Mode 2)
SIN
Serial Receive Data
SPM9 (Mode 2)
SOUT
Serial Transmit Data
The serial communication adopts an asynchronous protocol,
which supports various word lengths, stop bits, and parity
generation options selectable in the configuration register.
Baud Rate Generation
There are two ways of generating the UART baud rate.
1.
Normal 450 UART Baud Rate Generation.
The baud rate is a divided version of the core clock using the
value in COMDIV0 and COMDIV1 MMRs (16-bit value, DL).
DL
rate
Baud
CD
=
2
16
2
MHz
78
.
41
Table 47 gives some common baud rate values.
Table 47. Baud Rate Using the Normal Baud Rate Generator
Baud Rate
CD
DL
Actual Baud Rate
% Error
9600 0
88
h
9600
0%
19200 0
44
h
19200
0%
115200 0
0B
h
118691
3%
9600 3
11
h
9600
0%
19200 3
8
h
20400
6.25%
115200 3
1
h
163200
41.67%
2.
Using the Fractional Divider.
The fractional divider combined with the normal baud rate
generator produces a wider range of more accurate baud rates.
04
95
5-
03
2
/16DL
UART
FBEN
CORE
CLOCK
/2
/(M+N/2048)
Figure 60. Baud Rate Generation Options
Calculation of the baud rate using fractional divider is as
follows:
)
2048
(
2
16
2
MHz
78
.
41
N
M
DL
Rate
Baud
CD
+
=
2
16
2
MHz
78
.
41
2048
=
+
DL
Rate
Baud
N
M
CD
For example, generation of 19200 baud with CD bits = 3
(Table 47 gives DL = 8 h),
2
8
16
2
19200
MHz
78
.
41
2048
3
=
+
N
M
06
.
1
2048
=
+
N
M
where:
M = 1
N = 0.06 2048 = 128
=
2048
128
2
8
16
2
MHz
78
.
41
3
Rate
Baud
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 62 of 92
where:
Baud Rate = 19200 bps
Error = 0% compared to 6.25% with the normal baud rate
generator.
UART Registers Definition
The UART interface consists on 12 registers: COMTX,
COMRX, COMDIV0, COMIEN0, COMDIV1, COMIIDO,
COMCON0, COMCON1, COMSTA0, COMSTA1, COMSCR,
and COMDIV2.
COMTX Register
Name
Address
Default Value
Access
COMTX 0xFFFF0700 0x00
RW
COMTX is an 8-bit transmit register.
COMRX Register
Name
Address
Default Value
Access
COMRX 0xFFFF0700 0x00
R
COMRX is an 8-bit receive register.
COMDIV0 Register
Name
Address
Default Value
Access
COMDIV0 0xFFFF0700 0x00
RW
COMDIV0 is a low-byte divisor latch. COMTX, COMRX,
and COMDIV0 share the same address location. COMTX
and COMTX can be accessed when Bit 7 in COMCON0
register is cleared. COMDIV0 can be accessed when Bit 7
of COMCON0 is set.
COMIEN0 Register
Name
Address
Default Value
Access
COMIEN0 0xFFFF0704 0x00
RW
COMIEN0 is the interrupt enable register.
Table 48. COMIEN0 MMR Bit Descriptions
Bit Name
Description
7 to 4
Reserved.
3 EDSSI
Modem Status Interrupt Enable Bit. Set by
user to enable generation of an interrupt if
any of COMSTA1[3:0] are set. Cleared by user.
2 ELSI
RX Status Interrupt Enable Bit. Set by user to
enable generation of an interrupt if any of
COMSTA0[3:0] are set. Cleared by user.
1 ETBEI
Enable Transmit Buffer Empty Interrupt. Set
by user to enable interrupt when buffer is
empty during a transmission. Cleared by user.
0 ERBFI
Enable Receive Buffer Full Interrupt. Set by
user to enable interrupt when buffer is full
during a reception. Cleared by user.
COMDIV1 Register
Name
Address
Default Value
Access
COMDIV1 0xFFFF0704 0x00
RW
COMDIV1 is a divisor latch (high byte) register.
COMIID0 Register
Name
Address
Default Value
Access
COMIID0 0xFFFF0708 0x01
R
COMIID0 is the interrupt identification register.
Table 49. COMIID0 MMR Bit Descriptions
Bit 2:1
Status
Bits
Bit 0
NINT Priority Definition
Clearing
Operation
00 1
No
interrupt.
11 0 1
Receive line
status interrupt.
Read
COMSTA0.
10 0 2
Receive buffer
full interrupt.
Read COMRX.
01 0 3
Transmit buffer
empty
interrupt.
Write data to
COMTX or read
COMIID0.
00 0 4
Modem status
interrupt.
Read COMSTA1
register.
COMCON0 Register
Name
Address
Default Value
Access
COMCON0 0xFFFF070C
0x00
RW
COMCON0 is the line control register.
Table 50. COMCON0 MMR Bit Descriptions
Bit Name Description
7 DLAB
Divisor Latch Access. Set by user to enable
access to COMDIV0 and COMDIV1 registers.
Cleared by user to disable access to COMDIV0
and COMDIV1 and enable access to COMRX
and COMTX.
6 BRK Set Break. Set by user to force SOUT to 0.
Cleared to operate in normal mode.
5 SP Stick Parity. Set by user to force parity to
defined values: 1 if EPS = 1 and PEN = 1,
0 if EPS = 0 and PEN = 1.
4 EPS Even Parity Select Bit. Set for even parity.
Cleared for odd parity.
3 PEN Parity Enable Bit. Set by user to transmit and
check the parity bit. Cleared by user for no
parity transmission or checking.
2 STOP
Stop Bit. Set by user to transmit 1.5 stop bits if the
word length is 5 bits or 2 stop bits if the word
length is 6 bits, 7 bits, or 8 bits. The receiver
checks the first stop bit only, regardless of the
number of stop bits selected. Cleared by user to
generate 1 stop bit in the transmitted data.
1, 0
WLS
Word Length Select:
00 = 5 bits, 01 = 6 bits
10 = 7 bits, 11 = 8 bits
ADuC7019/20/21/22/24/25/26/27
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COMCON1 Register
Name
Address
Default Value
Access
COMCON1 0xFFFF0710
0x00
RW
COMCON1 is the modem control register.
Table 51. COMCON1 MMR Bit Descriptions
Bit Name
Description
7 to
5
Reserved.
4 LOOPBACK Loop Back. Set by user to enable loop
back mode. In loop back mode, the
SOUT is forced high. The modem signals
are also directly connected to the status
inputs (RTS to CTS, DTR to DSR, OUT1 to
RI, and OUT2 to DCD).
Cleared by user to
be in normal mode.
3 PEN
Parity Enable Bit. Set by user to transmit
and check the parity bit. Cleared by user
for no parity transmission or checking.
2 STOP
Stop Bit. Set by user to transmit 1.5 stop
bits if the word length is 5 bits or 2 stop
bits if the word length is 6, 7, or 8 bits.
The receiver checks the first stop bit
only, regardless of the number of stop
bits selected. Cleared by user to generate
1 stop bit in the transmitted data.
1 RTS
Request to Send. Set by user to force the
RTS output to 0. Cleared by user to force
the RTS output to 1.
0 DTR
Data Terminal Ready. Set by user to force
the DTR output to 0. Cleared by user to
force the DTR output to 1.
COMSTA0 Register
Name
Address
Default Value
Access
COMSTA0 0xFFFF0714 0x60
R
COMSTA0 is the line status register.
Table 52. COMSTA0 MMR Bit Descriptions
Bit Name Description
7
Reserved.
6 TEMT COMTX Empty Status Bit. Set automatically if
COMTX is empty. Cleared automatically when
writing to COMTX.
5 THRE COMTX and COMRX Empty. Set automatically if
COMTX and COMRX are empty. Cleared automati-
cally when one of the register receives data.
4 BI
Break Error. Set when SIN is held low for more than
the maximum word length. Cleared automatically.
3 FE Framing Error. Set when invalid stop bit. Cleared
automatically.
2 PE Parity Error. Set when a parity error occurs.
Cleared automatically.
1 OE Overrun Error. Set automatically if data is over-
written before being read. Cleared automatically.
0 DR Data Ready. Set automatically when COMRX is
full. Cleared by reading COMRX.
COMSTA1 Register
Name
Address
Default Value
Access
COMSTA1 0xFFFF0718 0x00
R
COMSTA1 is a modem status register.
Table 53. COMSTA1 MMR Bit Descriptions
Bit Name Description
7
DCD
Data Carrier Detect.
6 RI
Ring
Indicator.
5
DSR
Data Set Ready.
4
CTS
Clear to Send.
3 DDCD
Delta DCD. Set automatically if DCD changed
state since COMSTA1 last read. Cleared automati-
cally by reading COMSTA1.
2 TERI Trailing Edge RI. Set if NRI changed from 0 to 1
since COMSTA1 last read. Cleared automatically
by reading COMSTA1.
1 DDSR
Delta DSR. Set automatically if DSR changed state
since COMSTA1 last read. Cleared automatically
by reading COMSTA1.
0 DCTS Delta CTS. Set automatically if CTS changed state
since COMSTA1 last read. Cleared automatically
by reading COMSTA1.
COMSCR Register
Name
Address
Default Value
Access
COMSCR 0xFFFF071C 0x00
RW
COMSCR is an 8-bit scratch register used for temporary
storage. It is also used in network addressable UART mode.
COMDIV2 Register
Name
Address
Default Value
Access
COMDIV2 0xFFFF072C 0x0000
RW
COMDIV2 is a 16-bit fractional baud divide register.
Table 54. COMDIV2 MMR Bit Descriptions
Bit Name Description
15 FBEN Fractional Baud Rate Generator Enable Bit.
Set by user to enable the fractional baud
rate generator. Cleared by user to generate
baud rate using the standard 450 UART
baud rate generator.
14, 13
Reserved.
12, 11
FBM[1-0]
M if FBM = 0, M = 4
10 to 0
FBN[10-0]
N
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 64 of 92
Network Addressable UART Mode
This mode connects the MicroConverter to a 256-node serial
network, either as a hardware single-master or via software in a
multimaster network. Bit 7 of COMIEN1 (ENAM bit) must be set
to enable UART in network addressable mode. Note that there is
no parity check in this mode; the parity bit is used for address.
Network Addressable UART Register Definitions
Four additional registers, COMSCR, COMIEN1, and COMIID1,
and COMADR, are only used in network addressable UART mode.
COMSCR is an 8-bit scratch register used for temporary
storage. In network address mode, the least significant bit of the
scratch register is the transmitted network address control bit.
If set to 1, the device is transmitting an address. If cleared to 0,
the device is transmitting data.
COMIEN1 Register
Name
Address
Default Value
Access
COMIEN1 0xFFFF0720 0x04
RW
COMIEN1 is an 8-bit network enable register.
Table 55. COMIEN1 MMR Bit Descriptions
Bit Name Description
7 ENAM
Network Address Mode Enable Bit. Set by user
to enable network address mode. Cleared by
user to disable network address mode.
6 E9BT 9-Bit Transmit Enable Bit. Set by user to enable
9-bit transmit. ENAM must be set. Cleared by
user to disable 9-bit transmit.
5 E9BR 9-Bit Receive Enable Bit. Set by user to enable
9-bit receive. ENAM must be set. Cleared by
user to disable 9-bit receive.
4
ENI
Network Interrupt Enable Bit.
3 E9BD
Word Length. Set for 9-bit data. E9BT has to be
cleared. Cleared for 8-bit data.
2 ETD Transmitter Pin Driver Enable Bit. Set by user to
enable SOUT pin as an output in slave mode or
multimaster mode. Cleared by user; SOUT is
three-state.
1
NABP
Network Address Bit. Interrupt polarity bit.
0 NAB Network Address Bit. Set by user to transmit the
slave's address. Cleared by user to transmit data.
COMIID1 Register
Name
Address
Default Value
Access
COMIID1 0xFFFF0724 0x01
R
COMIID1 is an 8-bit network interrupt register. Bit 7 to Bit 4
are reserved (see Table 56).
Table 56. COMIID1 MMR Bit Descriptions
Bit 3:1
Status
Bits
Bit 0
NINT Priority Definition
Clearing
Operation
000 1
No
interrupt
110 0 2
Matching
network address
Read COMRX
101 0 3
Address
transmitted,
buffer empty
Write data to
COMTX or
read COMIID0
011 0 1
Receive line
status interrupt
Read
COMSTA0
010 0 2
Receive buffer
full interrupt
Read COMRX
001 0 3
Transmit buffer
empty interrupt
Write data to
COMTX or
read COMIID0
000 0 4
Modem status
interrupt
Read COMSTA1
register
COMADR Register
Name
Address
Default Value
Access
COMADR 0xFFFF0728 0xAA
RW
COMADR is an 8-bit, read/write network address register, which
holds the address that the network addressable UART checks
for. Upon receiving this address, the device interrupts the
processor and/or sets the appropriate status bit in COMIID1.
SERIAL PERIPHERAL INTERFACE
The ADuC7019/20/21/22/24/25/26/27 integrate a complete
hardware serial peripheral interface (SPI) on-chip. SPI is an
industry standard, synchronous serial interface that allows eight
bits of data to be synchronously transmitted and simultaneously
received, that is, full duplex up to a maximum bit rate of 1.6 Mb.
The SPI interface is only operational with core clock divider bits
POWCON[2:0] = 0, 1, or 2.
The SPI port can be configured for master or slave operation
and typically consists of four pins: MISO, MOSI, SCL, and CS.
MISO (Master In, Slave Out) Pin
The MISO pin is configured as an input line in master mode
and an output line in slave mode. The MISO line on the master
(data in) should be connected to the MISO line in the slave
device (data out). The data is transferred as byte wide (8-bit)
serial data, MSB first.
MOSI (Master Out, Slave In) Pin
The MOSI pin is configured as an output line in master mode
and an input line in slave mode. The MOSI line on the master
(data out) should be connected to the MOSI line in the slave
device (data in). The data is transferred as byte wide (8-bit)
serial data, MSB first.
ADuC7019/20/21/22/24/25/26/27
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SCL (Serial Clock) I/O Pin
The master serial clock (SCL) is used to synchronize the data
being transmitted and received through the MOSI SCL period.
Therefore, a byte is transmitted/received after eight SCL
periods. The SCL pin is configured as an output in master mode
and as an input in slave mode.
In master mode, polarity and phase of the clock are controlled
by the SPICON register, and the bit rate is defined in the
SPIDIV register as follows:
)
1
(
2
SPIDIV
f
f
HCLK
clock
serial
+
=
In slave mode, the SPICON register must be configured with
the phase and polarity of the expected input clock. The slave
accepts data from an external master up to 10 Mb at CD = 0.
In both master and slave modes, data is transmitted on one edge
of the SCL signal and sampled on the other. Therefore, it is
important that the polarity and phase are configured the same
for the master and slave devices.
Chip Select (CS) Input Pin
In SPI slave mode, a transfer is initiated by the assertion of CS ,
which is an active low input signal. The SPI port then transmits
and receives 8-bit data until the transfer is concluded by
deassertion of CS . In slave mode, CS is always an input.
SPI Registers
The following MMR registers are used to control the SPI
interface: SPISTA, SPIRX, SPITX, SPIDIV, and SPICON.
SPISTA Register
Name
Address
Default Value
Access
SPISTA 0xFFFF0A00
0x00
RW
SPISTA is an 8-bit read-only status register.
Table 57. SPISTA MMR Bit Descriptions
Bit Description
7, 6
Reserved.
5
SPIRX Data Register Overflow Status Bit. Set if SPIRX is
overflowing. Cleared by reading SPISRX register.
4
SPIRX Data Register IRQ. Set automatically if Bit 3 or Bit 5
is set. Cleared by reading SPIRX register.
3
SPIRX Data Register Full Status Bit. Set automatically if a
valid data is present in the SPIRX register. Cleared by
reading SPIRX register.
2
SPITX data register underflow status bit. Set auto-
matically if SPITX is under flowing. Cleared by writing in
the SPITX register.
1
SPITX data register IRQ. Set automatically if Bit 0 is clear
or Bit 2 is set. Cleared by writing in the SPITX register or if
finished transmission disabling the SPI.
0
SPITX data register empty status bit. Set by writing to
SPITX to send data. This bit is set during transmission of
data. Cleared when SPITX is empty.
SPIRX Register
Name
Address
Default Value
Access
SPIRX 0xFFFF0A04
0x00
R
SPIRX is an 8-bit read-only receive register.
SPITX Register
Name
Address
Default Value
Access
SPITX 0xFFFF0A08
0x00
W
SPITX is an 8-bit write-only transmit register.
SPIDIV Register
Name
Address
Default Value
Access
SPIDIV 0xFFFF0A0C
0x1B
RW
SPIDIV is an 8-bit serial clock divider register.
SPICON Register
Name
Address
Default Value
Access
SPICON 0xFFFF0A10 0x0000
RW
SPICON is a 16-bit control register.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 66 of 92
Table 58. SPICON MMR Bit Descriptions
Bit Description
15 to 13
Reserved.
12
Continuous Transfer Enable. Set by user to enable continuous transfer. In master mode, the transfer continues until no valid data
is available in the TX register. CS is asserted and remains asserted for the duration of each 8-bit serial transfer until TX is empty.
Cleared by user to disable continuous transfer. Each transfer consists of a single 8-bit serial transfer. If valid data exists in the
SPITX register, then a new transfer is initiated after a stall period.
11
Loop Back Enable. Set by user to connect MISO to MOSI and test software. Cleared by user to be in normal mode.
10
Slave Output Enable. Set by user to enable the slave output. Cleared by user to disable slave output.
9
Slave Select Input Enable. Set by user in master mode to enable the output. Cleared by user to disable master output.
8
SPIRX Overflow Overwrite Enable. Set by user, the valid data in the RX register is overwritten by the new serial byte received.
Cleared by user, the new serial byte received is discarded.
7
SPITX Underflow Mode. Set by user to transmit 0. Cleared by user to transmit the previous data.
6
Transfer and Interrupt Mode (Master Mode). Set by user to initiate transfer with a write to the SPITX register. Interrupt occurs
when TX is empty. Cleared by user to initiate transfer with a read of the SPIRX register. Interrupt occurs when RX is full.
5
LSB First Transfer Enable Bit. Set by user, the LSB is transmitted first. Cleared by user, the MSB is transmitted first.
4 Reserved.
3
Serial Clock Polarity Mode Bit. Set by user, the serial clock idles high. Cleared by user, the serial clock idles low.
2
Serial Clock Phase Mode Bit. Set by user, the serial clock pulses at the beginning of each serial bit transfer. Cleared by user, the
serial clock pulses at the end of each serial bit transfer.
1
Master Mode Enable Bit. Set by user to enable master mode. Cleared by user to enable slave mode.
0
SPI Enable Bit. Set by user to enable the SPI. Cleared to disable the SPI.
I
2
C COMPATIBLE INTERFACES
The ADuC7019/20/21/22/24/25/26/27 support two fully
licensed I
2
C interfaces. The I
2
C interfaces are both implemented
as a full hardware master and slave interface. Because the two
I
2
C interfaces are identical, this data sheet describes only I2C0
in detail. Note that the two masters and one of the slaves have
individual interrupts. See section on the Interrupt System.
The two pins used for data transfer, SDA and SCL, are
configured in a wired-AND format that allows arbitration in a
multimaster system.
The I
2
C bus peripheral's addresses in the I
2
C bus system is
programmed by the user. This ID can be modified any time a
transfer is not in progress. The user can configure the interface
to respond to four slave addresses.
The transfer sequence of an I
2
C system consists of a master
device initiating a transfer by generating a start condition while
the bus is idle. The master transmits the address of the slave
device and the direction of the data transfer in the initial
address transfer. If the master does not lose arbitration and the
slave acknowledges, then the data transfer is initiated. This
continues until the master issues a stop condition and the bus
becomes idle.
The I
2
C peripheral master and slave functionality are
independent and can be simultaneously active. A slave is
activated when a transfer has been initiated on the bus. If it is
not addressed, it remains inactive until another transfer is
initiated. This also allows a master device, which loses
arbitration, to respond as a slave in the same cycle.
Serial Clock Generation
The I
2
C master in the system generates the serial clock for a
transfer. The master channel can be configured to operate in
fast mode (400 kHz) or standard mode (100 kHz).
The bit rate is defined in the I2C0DIV MMR as follows:
)
(2
)
2
(
DIVL
DIVH
f
f
UCLK
k
serialcloc
+
+
+
=
where:
f
UCLK
= clock before the clock divider.
DIVH = the high period of the clock.
DIVL = the low period of the clock.
Thus, for 100 kHz operation,
DIVH = DIVL = 0CF
and for 400 kHz,
DIVH = DIVL = 032
The I2CDIV register corresponds to DIVH:DIVL.
Slave Addresses
The registers I2C0ID0, I2C0ID1, I2C0ID2, and I2C0ID3
contain the device IDs. The device compares the four I2C0IDx
registers to the address byte. The seven most significant bits of
either ID register must be identical to that of the seven most
significant bits of the first address byte received to be correctly
addressed. The LSB of the ID registers, the transfer direction
bit, is ignored in the process of address recognition.
ADuC7019/20/21/22/24/25/26/27
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I
2
C Registers
The I
2
C peripheral interface consists of 18 MMRs, which are
discussed in this section.
I2CxMSTA Registers
Name
Address
Default Value
Access
I2C0MSTA 0xFFFF0800 0x00
R
I2C1MSTA 0xFFFF0900 0x00
R
I2CxMSTA are status registers for the master channel.
Table 59. I2C0MSTA MMR Bit Descriptions
Bit Description
7
Master Transmit FIFO Flush. Set by user to flush the master
Tx FIFO. Cleared automatically once the master Tx FIFO is
flushed. This bit also flushes the slave receive FIFO.
6
Master Busy. Set automatically if the master is busy. Cleared
automatically.
5
Arbitration Loss. Set in multimaster mode if another master
has the bus. Cleared when the bus becomes available.
4
No ACK. Set automatically if there is no acknowledge of the
address by the slave device. Cleared automatically by
reading the I2C0MSTA register.
3
Master Receive IRQ. Set after receiving data. Cleared
automatically by reading the I2C0MRX register.
2
Master Transmit IRQ. Set at the end of a transmission.
Cleared automatically by writing to the I2C0MTX register.
1
Master Transmit FIFO Underflow. Set automatically if the
master transmit FIFO is underflowing. Cleared
automatically by writing to the I2C0MTX register.
0
Master TX FIFO Empty. Set automatically if the master
transmit FIFO is empty. Cleared automatically by writing to
the I2C0MTX register.
I2CxSSTA Registers
Name
Address
Default Value
Access
I2C0SSTA 0xFFFF0804 0x01
R
I2C1SSTA 0xFFFF0904 0x01
R
I2CxSSTA are status registers for the slave channel.
Table 60. I2C0SSTA MMR Bit Descriptions
Bit Value
Description
31 to
15
Reserved. These bits should be written as 0.
14
START Decode Bit. Set by hardware if the
device receives a valid START + matching
address. Cleared by an I
2
C STOP condition
or an I
2
C general call reset.
13
Repeated START Decode Bit. Set by hardware
if the device receives a valid repeated START +
matching address. Cleared by an I
2
C STOP
condition, a read of the I2CSSTA register,
or an I
2
C general call reset.
12, 11
ID Decode Bits.
00
Received Address Natched ID Register 0.
01
Received Address Matched ID Register 1.
10
Received Address Matched ID Register 2.
11
Received Address Matched ID Register 3.
10
Stop After Start and Matching Address
Interrupt. Set by hardware if the slave device
receives an I
2
C STOP condition after a previous
I
2
C START condition and matching address.
Cleared by a read of the I2C0SSTA register.
9, 8
General Call ID.
00
No General Call.
01
General Call Reset and Program Address.
10
General Call Program Address.
11
General Call Matching Alternative ID.
7 General Call Interrupt. Set if the slave device
receives a general call of any type. Cleared by
setting Bit 8 of the I2CxCFG register. If it is a
general call reset, then all registers are at their
default values. If it is a hardware general call,
then the Rx FIFO holds the second byte of the
general call. This is similar to the I2C0ALT
register (unless it is a general call to reprogram
the device address). For more details, see I
2
C
bus specification, version 2.1, Jan. 2000.
6 Slave Busy. Set automatically if the slave is
busy. Cleared automatically.
5 No ACK. Set if master asking for data and no
data is available. Cleared automatically by
reading the I2C0SSTA register.
4 Slave Receive FIFO Overflow. Set automatically
if the slave receive FIFO is overflowing. Cleared
automatically by reading the I2C0SSTA register.
3 Slave Receive IRQ. Set after receiving data.
Cleared automatically by reading the I2C0SRX
register or flushing the FIFO.
2 Slave Transmit IRQ. Set at the end of a trans-
mission. Cleared automatically by writing to
the I2C0STX register.
1 Slave Transmit FIFO Underflow. Set automatically
if the slave transmit FIFO is underflowing.
Cleared automatically by writing to the
I2C0SSTA MMR.
0 Slave Transmit FIFO Empty. Set automatically if
the slave transmit FIFO is empty. Cleared
automatically by writing to the I2C0STX register.
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I2CxSRX Registers
Name
Address
Default Value
Access
I2C0SRX 0xFFFF0808 0x00
R
I2C1SRX 0xFFFF0908 0x00
R
I2CxSRX are receive registers for the slave channel.
I2CxSTX Registers
Name
Address
Default Value
Access
I2C0STX 0xFFFF080C 0x00
W
I2C1STX 0xFFFF090C 0x00
W
I2CxSTX are transmit registers for the slave channel.
I2CxMRX Registers
Name
Address
Default Value
Access
I2C0MRX 0xFFFF0810 0x00
R
I2C1MRX 0xFFFF0910 0x00
R
I2CxMRX are receive registers for the master channel.
I2CxMTX Registers
Name
Address
Default Value
Access
I2C0MTX 0xFFFF0814 0x00
W
I2C1MTX 0xFFFF0914 0x00
W
I2CxSTXare transmit registers for the master channel.
I2CxCNT Registers
Name
Address
Default Value
Access
I2C0CNT 0xFFFF0818 0x00
RW
I2C1CNT 0xFFFF0918 0x00
RW
I2CxCNT are master receive data count registers. If a master
read transfer sequence is initiated, then the I2CxCNT registers
denote the number of bytes (-1) to be read from the slave
device. By default, this counter is 0, which corresponds to
expected 1 byte.
I2CxADR Registers
Name
Address
Default Value
Access
I2C0ADR 0xFFFF081C 0x00
RW
I2C1ADR 0xFFFF091C 0x00
RW
I2CxADR are master address byte registers. The I2CxADR
value is the device address that the master wants to
communicate with. It automatically transmits at the start of a
master transfer sequence if there is no valid data in the
I2CxMTX register when the master enable bit is set.
I2CxBYTE Registers
Name
Address
Default Value
Access
I2C0BYTE 0xFFFF0824 0x00
RW
I2C1BYTE 0xFFFF0924 0x00
RW
I2CxBYTE are broadcast byte registers. Data written to these
register do not go through the TxFIFO. This data is transmitted
at the start of a transfer sequence before the address. Once the
byte has been transmitted and acknowledged, the I2C expects
another byte written in I2CxBYTE or an address written to the
address register.
I2CxALT Registers
Name
Address
Default Value
Access
I2C0ALT 0xFFFF0828 0x00
RW
I2C1ALT 0xFFFF0928 0x00
RW
I2CxALT are hardware general call ID registers used in slave
mode.
I2CxCFG Registers
Name
Address
Default Value
Access
I2C0CFG 0xFFFF082C 0x00
RW
I2C1CFG 0xFFFF092C 0x00
RW
I2CxCFG are configuration registers.
ADuC7019/20/21/22/24/25/26/27
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Table 61. I2C0CFG MMR Bit Descriptions
Bit Description
31 to 15
Reserved. These bits should be written by the user as 0.
14
Enable Stop Interrupt. Set by the user to generate an interrupt upon receiving a stop condition and after receiving a valid start
condition + matching address. Cleared by the user to disable the generation of an interrupt upon receiving a stop condition.
13 Reserved.
12 Reserved.
11
Enable stretch SCL (holds SCL low). Set by the user to stretch the SCL line. Cleared by the user to disable stretching of the SCL line.
10
Set this bit to generate an interrupt after the negative edge of the 8
th
clock of a data byte and before the ACK bit is generated.
9
Slave Tx FIFO request interrupt enable. Set by the user to disable the slave Tx FIFO request interrupt. Cleared by the user to generate
an interrupt request just after the negative edge of the clock for the R/W bit. This allows the user to input data into the slave Tx FIFO
if it is empty. At 400 ksps and the core clock running at 41.78 MHz, the user has 45 clock cycles to take appropriate action, taking
interrupt latency into account.
8
General call status bit clear. Set by the user to clear the general call status bits. Cleared automatically by hardware after the general
call status bits have been cleared.
7
Master serial clock enable bit. Set by user to enable generation of the serial clock in master mode. Cleared by user to disable serial
clock in master mode.
6
Loop back enable bit. Set by user to internally connect the transition to the reception to test user software. Cleared by user to
operate in normal mode.
5
Start back-off disable bit. Set by user in multimaster mode. If losing arbitration, the master immediately tries to retransmit. Cleared
by user to enable start back-off. After losing arbitration, the master waits before trying to retransmit.
4
Hardware general call enable. When this bit and the general call enable bit are set, and have received a general call (address 0x00)
and a data byte, the devices checks the contents of the I2C0ALT against the receive register. If they match, then the device has
received a hardware general call. This is used if a device needs urgent attention from a master device without knowing which
master it needs to turn to. This is a call "to whom it may concern." The ADuC7019/20/21/22/24/25/26/27 watch for these addresses.
The device that requires attention embeds its own address into the message. All masters listen and the master that knows how to
handle the device contacts its slave and acts appropriately. The LSB of the I2C0ALT register should always be written to a 1, as per
I
2
C January 2000 specification.
3
General call enable bit. Set this bit to enable the slave device to ACK an I
2
C general call, address 0x00 (write). The device then
recognizes a data bit. If it receives a 0x06 as the data byte, "Reset and write programmable part of slave address by hardware", then
the I
2
C interface resets as per the I
2
C January 2000 specification. This command can be used to reset an entire I
2
C system. The
general call interrupt status bit sets on any general call. It is up to the user to take correct action by setting up the I
2
C interface after
a reset. If it receives a 0x04 as the data byte, "Write programmable part of slave address by hardware," then the general call interrupt
status bit sets on any general call. It is up to the user to take correct action by reprogramming the device address.
2 Reserved.
1 Master
enable
bit.
Set by user to enable the master I
2
C channel. Cleared by user to disable the master I
2
C channel.
0
Slave enable bit. Set by user to enable the slave I
2
C channel. A slave transfer sequence is monitored for the device address in
I2C0ID0, I2C0ID1, I2C0ID2, and I2C0ID3. If the device address is recognized, the part participates in the slave transfer sequence.
Cleared by user to disable the slave I
2
C channel.
I2CxDIV Registers
Name
Address
Default Value
Access
I2C0DIV 0xFFFF0830 0x1F1F
RW
I2C1DIV 0xFFFF0930 0x1F1F
RW
I2CxDIV are the clock divider registers.
I2CxIDx Registers
Name
Address
Default Value
Access
I2C0ID0 0xFFFF0838 0x00
RW
I2C0ID1 0xFFFF083C 0x00
RW
I2C0ID2 0xFFFF0840 0x00
RW
I2C0ID3 0xFFFF0844 0x00
RW
I2C1ID0 0xFFFF0938 0x00
RW
I2C1ID1 0xFFFF093C 0x00
RW
I2C1ID2 0xFFFF0940 0x00
RW
I2C1ID3 0xFFFF0944 0x00
RW
I2CxID0, I2CxID1, I2CxID2, and I2CxID3 are slave address
device ID registers of I2Cx.
I2CxCCNT Registers
Name
Address
Default Value
Access
I2C0CCNT 0xFFFF0848 0x01
RW
I2C1CCNT 0xFFFF0948 0x01
RW
I2CxCCNT are 8-bit start/stop generation counters. They hold
off SDA low for start and stop conditions.
I2CxFSTA Registers
Name
Address
Default Value
Access
I2C0FSTA 0xFFFF084C 0x0000
R
I2C1FSTA 0xFFFF094C 0x0000
R
I2CxFSTA are FIFO status registers.
ADuC7019/20/21/22/24/25/26/27
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Table 62. I2C0FSTA MMR Bit Descriptions
Bit Value Description
15 to
10
Reserved.
9
Master transmit FIFO flush. Set by the user to
flush the master Tx FIFO. Cleared automatically
once the master Tx FIFO is flushed. This bit also
flushes the slave receive FIFO.
8
Slave transmit FIFO flush. Set by the user to
flush the slave Tx FIFO. Cleared automatically
once the slave Tx FIFO is flushed.
7, 6
Master Rx FIFO status bits.
00
FIFO
empty.
01
Byte written to FIFO.
10
1 byte in FIFO.
11
FIFO
full.
5, 4
Master Tx FIFO status bits.
00
FIFO
empty.
01
Byte written to FIFO.
10
1 byte in FIFO.
11
FIFO
full.
3, 2
Slave Rx FIFO status bits.
00
FIFO
empty.
01
Byte written to FIFO.
10
1 byte in FIFO.
11
FIFO
full.
1, 0
Slave Tx FIFO status bits.
00
FIFO
empty.
01
Byte written to FIFO.
10
1 byte in FIFO.
11
FIFO
full.
PROGRAMMABLE LOGIC ARRAY (PLA)
Every ADuC7019/20/21/22/24/25/26/27 integrates a fully
programmable logic array (PLA), which consists of two
independent but interconnected PLA blocks. Each block
consists of eight PLA elements, which gives each part a total
of 16 PLA elements.
Each PLA element contains a two-input look-up table that can
be configured to generate any logic output function based on
two inputs and a flip-flop. This is represented in Figure 61.
04
95
5-
0
33
4
2
0
1
3
A
B
LOOK-UP
TABLE
Figure 61. PLA Element
In total, 30 GPIO pins are available on each ADuC7019/20/21/
22/24/25/26/27 for the PLA. These include 16 input pins and 14
output pins, which need to be configured in the GPxCON
register as PLA pins before using the PLA. Note that the
comparator output is also included as one of the 16 input pins.
The PLA is configured via a set of user MMRs. The output(s) of
the PLA can be routed to the internal interrupt system, to the
CONV
START
signal of the ADC, to a MMR, or to any of the 16
PLA output pins.
The two blocks can be interconnected as follows:
Output of Element 15 (Block 1) can be fed back to Input 0 of
Mux 0 of Element 0 (Block 0)
Output of Element 7 (Block 0) can be fed back to the Input 0
of Mux 0 of Element 8 (Block 1)
Table 63. Element Input/Output
PLA Block 0
PLA Block 1
Element Input
Output Element Input Output
0 P1.0
P1.7
8 P3.0
P4.0
1 P1.1
P0.4
9 P3.1
P4.1
2 P1.2
P0.5
10 P3.2
P4.2
3 P1.3
P0.6
11 P3.3
P4.3
4 P1.4
P0.7
12 P3.4
P4.4
5 P1.5
P2.0
13 P3.5
P4.5
6 P1.6
P2.1
14 P3.6
P4.6
7 P0.0
P2.2
15 P3.7
P4.7
PLA MMRs Interface
The PLA peripheral interface consists of the 22 MMRs
described in this section.
PLAELMx Registers
Name
Address
Default Value
Access
PLAELM0 0xFFFF0B00 0x0000
RW
PLAELM1 0xFFFF0B04 0x0000
RW
PLAELM2 0xFFFF0B08 0x0000
RW
PLAELM3 0xFFFF0B0C 0x0000
RW
PLAELM4 0xFFFF0B10 0x0000
RW
PLAELM5 0xFFFF0B14 0x0000
RW
PLAELM6 0xFFFF0B18 0x0000
RW
PLAELM7 0xFFFF0B1C 0x0000
RW
PLAELM8 0xFFFF0B20 0x0000
RW
PLAELM9 0xFFFF0B24 0x0000
RW
PLAELM10 0xFFFF0B28
0x0000
RW
PLAELM11 0xFFFF0B2C 0x0000
RW
PLAELM12 0xFFFF0B30
0x0000
RW
PLAELM13 0xFFFF0B34
0x0000
RW
PLAELM14 0xFFFF0B38
0x0000
RW
PLAELM15 0xFFFF0B3C 0x0000
RW
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 71 of 92
PLAELMx are Element 0 to Element 15 control registers. They
configure the input and output mux of each element, select the
function in the look-up table, and bypass/use the flip-flop. See
Table 64 and Table 66.
Table 64. PLAELMx MMR Bit Descriptions
Bit Value
Description
31 to
11
Reserved.
10, 9
Mux (0) Control (see Table 66).
8, 7
Mux (1) Control (see Table 66).
6 Mux (2) Control. Set by user to select the
output of mux (0). Cleared by user to select
the bit value from PLADIN.
5 Mux (3) Control. Set by user to select the
input pin of the particular element. Cleared
by user to select the output of mux (1).
4 to 1
Look-Up Table Control.
0000
0.
0001
NOR.
0010
B AND NOT A.
0011
NOT
A.
0100
A AND NOT B.
0101
NOT
B.
0110
EXOR.
0111
NAND.
1000
AND.
1001
EXNOR.
1010
B.
1011
NOT A OR B.
1100
A.
1101
A OR NOT B.
1110
OR.
1111
1.
0 Mux (4) Control. Set by user to bypass the flip-
flop. Cleared by user to select the flip-flop
(cleared by default).
PLACLK Register
Name
Address
Default Value
Access
PLACLK 0xFFFF0B40 0x00
RW
PLACLK is a clock selection for the flip-flops of Block 0 and
clock selection for the flip-flops of Block 1.
Table 65. PLACLK MMR Bit Descriptions
Bit Value Description
7
Reserved
6 to 4
Block 1 Clock Source Selection
000
GPIO Clock on P0.5
001
GPIO Clock on P0.0
010
GPIO Clock on P0.7
011
HCLK
100
OCLK (32.768 kHz)
101
Timer1
Overflow
Other Reserved
3
Reserved
2 to 0
Block 0 Clock Source Selection
000
GPIO Clock on P0.5
001
GPIO Clock on P0.0
010
GPIO Clock on P0.7
011
HCLK
100
OCLK (32.768 kHz)
101
Timer1
Overflow
Other Reserved
Table 66. Feedback Configuration
Bit
Value
PLAELM0
PLAELM1 to PLAELM7
PLAELM8
PLAELM9 to PLAELM15
10 to 9
00
Element 15
Element 0
Element 7
Element 8
01
Element 2
Element 2
Element 10
Element 10
10
Element 4
Element 4
Element 12
Element 12
11
Element 6
Element 6
Element 14
Element 14
8 to 7
00
Element 1
Element 1
Element 9
Element 9
01
Element 3
Element 3
Element 11
Element 11
10
Element 5
Element 5
Element 13
Element 13
11
Element 7
Element 7
Element 15
Element 15
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 72 of 92
PLAIRQ Register
Name
Address
Default Value
Access
PLAIRQ 0xFFFF0B44 0x00000000 RW
PLAIRQ enables IRQ0 and/or IRQ1 and selects the source of
the IRQ.
Table 67. PLAIRQ MMR Bit Descriptions
Bit Value
Description
15 to 13
Reserved.
12 PLA IRQ1 Enable Bit. Set by user to enable
IRQ1 output from PLA. Cleared by user to
disable IRQ1 output from PLA.
11 to 8
PLA IRQ1 Source.
0000
PLA Element 0.
0001
PLA Element 1.
1111
PLA Element 15.
7 to 5
Reserved.
4 PLA IRQ0 Enable Bit. Set by user to enable
IRQ0 output from PLA. Cleared by user to
disable IRQ0 output from PLA.
3 to 0
PLA IRQ0 Source.
0000
PLA Element 0.
0001
PLA Element 1.
1111
PLA Element 15.
PLAADC Register
Name
Address
Default Value
Access
PLAADC 0xFFFF0B48 0x00000000
RW
PLAADC is a PLA source from the ADC start conversion
signal.
Table 68. PLAADC MMR Bit Descriptions
Bit Value
Description
31 to 5
Reserved.
4 ADC Start Conversion Enable Bit. Set by user
to enable ADC start conversion from PLA.
Cleared by user to disable ADC start
conversion from PLA.
3 to 0
ADC Start Conversion Source.
0000
PLA Element 0.
0001
PLA Element 1.
1111
PLA Element 15.
PLADIN Register
Name
Address
Default Value
Access
PLADIN 0xFFFF0B4C 0x00000000 RW
PLADIN is a data input MMR for PLA.
Table 69. PLADIN MMR Bit Descriptions
Bit Description
31 to 16
Reserved
15 to 0
Input Bit to Element 15 to Element 0
PLADOUT Register
Name
Address
Default Value
Access
PLADOUT 0xFFFF0B50 0x00000000
R
PLADOUT is a data output MMR for PLA. This register is
always updated.
Table 70. PLADOUT MMR Bit Descriptions
Bit Description
31 to 16
Reserved
15 to 0
Output Bit from Element 15 to Element 0
PLALCK Register
Name
Address
Default Value
Access
PLALCK 0xFFFF0B54 0x00
W
PLALCK is a PLA lock option. Bit 0 is written only once. When
set, it does not allow modifying any of the PLA MMR, except
PLADIN. A PLA tool is provided in the development system to
easily configure the PLA.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 73 of 92
PROCESSOR REFERENCE PERIPHERALS
INTERRUPT SYSTEM
There are 23 interrupt sources on the ADuC7019/20/21/22/24/
25/26/27 that are controlled by the interrupt controller. Most
interrupts are generated from the on-chip peripherals, such as
ADC and UART. Four additional interrupt sources are
generated from external interrupt request pins, IRQ0, IRQ1,
IRQ2, and IRQ3. The ARM7TDMI CPU core only recognizes
interrupts as one of two types, a normal interrupt request IRQ
or a fast interrupt request FIQ. All the interrupts can be masked
separately.
The control and configuration of the interrupt system is
managed through nine interrupt-related registers, four
dedicated to IRQ, and four dedicated to FIQ. An additional
MMR is used to select the programmed interrupt source. The
bits in each IRQ and FIQ registers (except for Bit 23) represent
the same interrupt source as described in Table 71.
Table 71. IRQ/FIQ MMRs Bit Description
Bit Description
0
All Interrupts OR'ed
1 SWI
2 Timer0
3 Timer1
4
Wake-Up Timer Timer2
5
Watchdog Timer Timer3
6 Flash
Control
7 ADC
Channel
8 PLL
Lock
9 I
2
C0 Slave
10 I
2
C0 Master
11 I
2
C1 Master
12 SPI
Slave
13 SPI
Master
14 UART
15 External
IRQ0
16 Comparator
17 PSM
18 External
IRQ1
19 PLA
IRQ0
20 PLA
IRQ1
21 External
IRQ2
22 External
IRQ3
23
PWM Trip (IRQ only)/ PWM Sync (FIQ only)
IRQ
The interrupt request (IRQ) is the exception signal to enter the
IRQ mode of the processor. It is used to service general-
purpose interrupt handling of internal and external events.
The four 32-bit registers dedicated to IRQ are: IRQSTA,
IRQSIG, IRQEN, and IRQCLR.
IRQSTA Register
Name
Address
Default Value
Access
IRQSTA 0xFFFF0000 0x00000000 R
IRQSTA (read-only register) provides the current enabled IRQ
source status. When set to 1 that source should generate an
active IRQ request to the ARM7TDMI core. There is no priority
encoder or interrupt vector generation. This function is
implemented in software in a common interrupt handler
routine. All 32 bits are logically OR'ed to create the IRQ signal
to the ARM7TDMI core.
IRQSIG Register
Name
Address
Default Value
Access
IRQSIG 0xFFFF0004
0x00XXX000 R
IRQSIG reflects the status of the different IRQ sources. If a
peripheral generates an IRQ signal, then the corresponding bit
in the IRQSIG is set; otherwise it is cleared. The IRQSIG bits are
cleared when the interrupt in the particular peripheral is
cleared. All IRQ sources can be masked in the IRQEN MMR.
IRQSIG is read-only.
IRQEN Register
Name
Address
Default Value
Access
IRQEN 0xFFFF0008
0x00000000 RW
IRQEN provides the value of the current enable mask. When bit
is set to 1, the source request is enabled to create an IRQ
exception. When bit is set to 0, the source request is disabled or
masked, which does not
create an IRQ exception.
IRQCLR Register
Name
Address
Default Value
Access
IRQCLR 0xFFFF000C 0x00000000 W
IRQCLR (write-only register) clears the IRQEN register in
order to mask an interrupt source. Each bit set to 1 clears the
corresponding bit in the IRQEN register without affecting the
remaining bits. The pair of registers, IRQEN and IRQCLR,
independently manipulates the enable mask without requiring
an atomic read-modify-write.
FIQ
The fast interrupt request (FIQ) is the exception signal to enter
the FIQ mode of the processor. It is provided to service data
transfer or communication channel tasks with low latency. The
FIQ interface is identical to the IRQ interface providing the
second-level interrupt (highest priority). Four 32-bit registers
are dedicated to FIQ: FIQSIG, FIQEN, FIQCLR, and FIQSTA.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 74 of 92
FIQSTA Register
Name
Address
Default Value
Access
FIQSTA 0xFFFF0100
0x00000000 R
FIQSIG Register
Name
Address
Default Value
Access
FIQSIG 0xFFFF0104
0x00XXX000 R
FIQEN Register
Name
Address
Default Value
Access
FIQEN 0xFFFF0108
0x00000000 RW
FIQCLR Register
Name
Address
Default Value
Access
FIQCLR 0xFFFF010C
0x00000000 W
Bit 31 to Bit 1 of FIQSTA are logically OR'ed to create the FIQ
signal to the core and Bit 0 of both the FIQ and IRQ registers
(FIQ source).
The logic for FIQEN and FIQCLR does not allow an interrupt
source to be enabled in both IRQ and FIQ masks. A bit set to 1
in FIQEN does, as a side-effect, clear the same bit in IRQEN.
Also, a bit set to 1 in IRQEN does, as a side-effect, clear the
same bit in FIQEN. An interrupt source can be disabled in both
IRQEN and FIQEN masks.
Programmed Interrupts
Because the programmed interrupts are nonmaskable, they are
controlled by another register, SWICFG, which simultaneously
writes into the IRQSTA and IRQSIG registers, and/or the
FIQSTA and FIQSIG registers. The 32-bit register dedicated to
software interrupt is SWICFG described in Table 72. This MMR
allows the control of programmed source interrupt.
SWICFG Register
Name
Address
Default Value
Access
SWICFG 0xFFFF0010 0x00000000
W

Table 72. SWICFG MMR Bit Descriptions
Bit Description
31 to 3
Reserved.
2
Programmed Interrupt-FIQ. Setting/Clearing this bit
corresponds with setting/clearing Bit 1 of FIQSTA
and FIQSIG.
1
Programmed Interrupt-IRQ. Setting/Clearing this bit
corresponds with setting/clearing Bit 1 of IRQSTA
and IRQSIG.
0 Reserved.
Note that any interrupt signal must be active for at least the
equivalent of the interrupt latency time, to be detected by the
interrupt controller and to be detected by the user in the
IRQSTA/FIQSTA register.
TIMERS
The ADuC7019/20/21/22/24/25/26/27 have four general-
purpose timer/counters:
1. Timer0
2. Timer1
3. Timer2 or Wake-Up Timer
4. Timer3 or Watchdog Timer
These four timers in their normal mode of operation can be
either free-running or periodic.
In free-running mode, the counter decreases from the
maximum value until zero scale and starts again at the
minimum value. (It also increases from the minimum value
until full scale and starts again at the maximum value.)
In periodic mode, the counter decrements/increments from the
value in the load register (TLD MMR) until zero/full scale and
starts again at the value stored in the load register.
The timer interval is calculated as follow:
(
)
clock
source
prescaler
LD
T
Interval
=
The value of a counter can be read at any time by accessing
its value register (TVAL). Note that when a timer is being
clocked from a clock other than core clock, an incorrect value
could be read (due to asynchronous clock system). In this
configuration, TVAL should always be read twice. If the two
readings are different, then it should be read a third time to
get the correct value.
Timers are started by writing in the control register of the
corresponding timer (TCON).
In normal mode, an IRQ is generated each time the value of the
counter reaches zero when counting down. It is also generated
each time the counter value reaches full-scale when counting
up. An IRQ can be cleared by writing any value to clear the
register of that particular timer (TCLRI).
When using an asynchronous clock-to-clock timer, the interrupt
in the timer block could take more time to clear than the time it
takes for the code in the interrupt routine to execute. Ensure that
the interrupt signal is cleared before leaving the interrupt service
routine. This can be done by checking the IRQSTA MMR.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 75 of 92
Timer0 (RTOS Timer)
Timer0 is a general-purpose, 16-bit timer (count-down) with a
programmable prescaler (see Figure 62). The prescaler source is
the core clock frequency (HCLK) and can be scaled by factors
of 1, 16, or 256.
04
95
5-
0
34
16-BIT
LOAD
TIMER0
VALUE
16-BIT
DOWN
COUNTER
PRESCALER
/1, 16 OR 256
HCLK
TIMER0 IRQ
ADC CONVERSION
Figure 62. Timer0 Block Diagram
Timer0's interface consists of four MMRS: T0LD, T0VAL,
T0CON, and T0CLRI.
T0LD Register
Name
Address
Default Value
Access
T0LD 0xFFFF0300
0x0000
RW
T0LD is a 16-bit load register.
T0VAL Register
Name
Address
Default Value
Access
T0VAL 0xFFFF0304
0xFFFF
R
T0VAL is a 16-bit read-only register representing the current
state of the counter.
T0CON Register
Name
Address
Default Value
Access
T0CON 0xFFFF0308
0x0000
RW
T0CON is the configuration MMR described in Table 73.
Table 73. T0CON MMR Bit Descriptions
Bit Value
Description
31 to 8
Reserved.
7 Timer0 Enable Bit. Set by user to enable Timer0.
Cleared by user to disable Timer0 by default.
6 Timer0 Mode. Set by user to operate in
periodic mode. Cleared by user to operate in
free-running mode. Default mode.
5, 4
Reserved.
3, 2
Prescale.
00
Core Clock/1. Default value.
01
Core
Clock/16.
10
Core
Clock/256.
11
Undefined. Equivalent to 00.
1, 0
Reserved.
T0CLRI Register
Name
Address
Default Value
Access
T0CLRI 0xFFFF030C
0xFF
W
T0CLRI is an 8-bit register. Writing any value to this register
clears the interrupt.
Timer1 (General-Purpose Timer)
Timer1 is a general-purpose, 32-bit timer (count-down or
count-up) with a programmable prescaler. The source can be
the 32 kHz external crystal, the core clock frequency, or an
external GPIO, P1.0 or P0.6. This source can be scaled by a
factor of 1, 16, 256, or 32768.
The counter can be formatted as a standard 32-bit value or as
Hours: Minutes: Seconds: Hundredths.
Timer1 has a capture register (T1CAP), which can be triggered
by a selected IRQ source initial assertion. This feature can be
used to determine the assertion of an event more accurately
than the precision allowed by the RTOS timer when the IRQ is
serviced.
Timer1 can be used to start ADC conversions as shown in the
block diagram in Figure 63.
0495
5-
03
5
32kHz OSCILLATOR
HCLK
P0.6
P1.0
IRQ[31:0]
PRESCALER
/1, 16, 256
OR 32768
32-BIT
UP/DOWN
COUNTER
32-BIT
LOAD
TIMER1
VALUE
CAPTURE
TIMER1 IRQ
ADC CONVERSION
Figure 63. Timer1 Block Diagram
Timer1's interface consists of five MMRS: T1LD, T1VAL,
T1CON, T1CLRI, and T1CAP.
T1LD Register
Name
Address
Default Value
Access
T1LD 0xFFFF0320
0x00000000 RW
T1LD is a 16-bit load register.
T1VAL Register
Name
Address
Default Value
Access
T1VAL 0xFFFF0324
0xFFFFFFFF R
T1VAL is a 16-bit read-only register that represents the current
state of the counter.
T1CON Register
Name
Address
Default Value
Access
T1CON 0xFFFF0328
0x0000
RW
T1CON is the configuration MMR described in Table 74.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 76 of 92
Table 74. T1CON MMR Bit Descriptions
Bit Value
Description
31 to
18
Reserved.
17 Event select bit. Set by user to enable time
capture of an event. Cleared by user to
disable time capture of an event
16 to
12
Event select range, 0 to 31. These events are
as described in Table 71. All events are offset
by two, that is, event 2 in Table 71 becomes
event zero for the purposes of Timer1.
11 to 9
Clock select.
000
Core clock (HCLK).
001
External 32.768 kHz crystal.
010
P1.0 raising edge triggered.
011
P0.6 raising edge triggered.
8 Count up. Set by user for Timer1 to count up.
Cleared by user for Timer1 to count down by
default.
7 Timer1 enable bit. Set by user to enable
Timer1. Cleared by user to disable Timer1 by
default.
6 Timer1 mode. Set by user to operate in
periodic mode. Cleared by user to operate in
free-running mode. Default mode.
5, 4
Format.
00 Binary.
01 Reserved.
10
Hr:Min:Sec:Hundredths (23 hours to 0 hour).
11
Hr:Min:Sec:Hundredths (255 hours to 0 hour).
3 to 0
Prescale:
0000
Source
clock/1.
0100
Source
clock/16.
1000
Source
clock/256.
1111
Source
clock/32768.
T1CLRI Register
Name
Address
Default Value
Access
T1CLRI 0xFFFF032C
0xFF
W
T1CLRI is an 8-bit register. Writing any value to this register
clears the Timer1 interrupt.
T1CAP Register
Name
Address
Default Value
Access
T1CAP 0xFFFF0330
0x00000000 R
T1CAP is a 32-bit register. It holds the value contained in
T1VAL when a particular event occurred. This event must be
selected in T1CON.
Timer2 (Wake-Up Timer)
Timer2 is a 32-bit wake-up timer (count-down or count-up)
with a programmable prescaler. The source can be the 32 kHz
external crystal, the core clock frequency, or the internal 32 kHz
oscillator. The clock source can be scaled by a factor of 1, 16,
256, or 32768.The wake-up timer continues to run when the
core clock is disabled.
The counter can be formatted as plain 32-bit value or as
Hours: Minutes: Seconds: Hundredths.
Timer2 can be used to start ADC conversions as shown in the
block diagram Figure 64.
04
95
5-
0
3
6
INTERNAL
OSCILLATOR
EXTERNAL
CRYSTAL
HCLK
PRESCALER
/1, 16, 256
OR 32768
32-BIT
UP/DOWN
COUNTER
32-BIT
LOAD
TIMER2
VALUE
TIMER2 IRQ
Figure 64. Timer2 Block Diagram
Timer2 interface consists in four MMRS: T2LD, T2VAL,
T2CON, and T2CLRI.
T2LD Register
Name
Address
Default Value
Access
T2LD 0xFFFF0340
0x00000000 RW
T2LD is a 16-bit register load register.
T2VAL Register
Name
Address
Default Value
Access
T2VAL 0xFFFF0344
0xFFFFFFFF R
T2VAL is a 16-bit read-only register that represents the current
state of the counter.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 77 of 92
T2CON Register
Name
Address
Default Value
Access
T2CON 0xFFFF0348
0x0000
RW
T2CON is the configuration MMR described in Table 75.
Table 75. T2CON MMR Bit Descriptions
Bit Value
Description
31 to
11
Reserved.
10, 9
Clock source.
00 External
crystal.
01 External
crystal.
10 Internal
oscillator.
11
Core clock (41 MHz/2
CD
).
8 Count up. Set by user for Timer2 to count up.
Cleared by user for Timer2 to count down by
default.
7 Timer2 enable bit. Set by user to enable Timer2.
Cleared by user to disable Timer2 by default.
6 Timer2 mode. Set by user to operate in
periodic mode. Cleared by user to operate in
free-running mode. Default mode.
5, 4
Format:
00 Binary.
01 Reserved.
10
Hr:Min:Sec:Hundredths (23 hours to 0 hour).
11
Hr:Min:Sec:Hundredths (255 hours to 0 hour).
3 to 0
Prescale:
0000
Source clock/1 by default.
0100
Source
clock/16.
1000
Source clock/256 expected for format 2 and 3.
1111
Source
clock/32768.
T2CLRI Register
Name
Address
Default Value
Access
T2CLRI 0xFFFF034C
0xFF
W
T2CLRI is an 8-bit register. Writing any value to this register
clears the Timer2 interrupt.
Timer3 (Watchdog Time)
Timer3 has two modes of operation, normal mode and
watchdog mode. The watchdog timer is used to recover from
an illegal software state. Once enabled, it requires periodic
servicing to prevent it from forcing a reset of the processor.
Normal Mode
Timer3 in normal mode is identical to Timer0, except for the
clock source and the count-up functionality. The clock source is
32 kHz from the PLL and can be scaled by a factor of 1, 16, or
256 (see Figure 65).
04
95
5-
03
7
32.768kHz
PRESCALER
/1, 16 OR 256
16-BIT
UP/DOWN
COUNTER
16-BIT
LOAD
TIMER3
VALUE
WATCHDOG
RESET
TIMER3 IRQ
Figure 65. Timer3 Block Diagram
Watchdog Mode
Watchdog mode is entered by setting Bit 5 in T3CON MMR.
Timer3 decreases from the value present in T3LD register until
zero. T3LD is used as timeout. The maximum timeout can be
512 seconds using the prescaler/256, and full-scale in T3LD.
Timer3 is clocked by the internal 32 kHz crystal when
operating in the watchdog mode. Note that to enter watchdog
mode successfully, Bit 5 in the T3CON MMR must be set after
writing to the T3LD MMR.
If the timer reaches 0, a reset or an interrupt occurs, depending
on Bit 1 in T3CON register. To avoid reset or interrupt, any value
must be written to T3ICLR before the expiration period. This
reloads the counter with T3LD and begins a new timeout period.
As soonas watchdog mode is entered, T3LD and T3CON are
write-protected. These two registers cannot be modified until a
reset clears the watchdog enable bit, which causes Timer3 to
exit watchdog mode.
The Timer3 interface consists of four MMRS: T3LD, T3VAL,
T3CON, and T3CLRI.
T3LD Register
Name
Address
Default Value
Access
T3LD 0xFFFF0360
0x0000
RW
T3LD is a 16-bit register load register.
T3VAL Register
Name
Address
Default Value
Access
T3VAL 0xFFFF0364
0xFFFF
R
T3VAL is a 16-bit read-only register that represents the current
state of the counter.
T3CON Register
Name
Address
Default Value
Access
T3CON 0xFFFF0368
0x0000
RW
T3CON is the configuration MMR described in Table 76.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 78 of 92
Table 76. T3CON MMR Bit Descriptions
Bit Value Description
31
to 9
Reserved.
8
Count up. Set by user for Timer3 to count up.
Cleared by user for Timer3 to count down by
default.
7
Timer3 enable bit. Set by user to enable
Timer3. Cleared by user to disable Timer3 by
default.
6
Timer3 mode. Set by user to operate in
periodic mode. Cleared by user to operate
in free-running mode. Default mode.
5
Watchdog mode enable bit. Set by user to
enable watchdog mode. Cleared by user to
disable watchdog mode by default.
4
Secure clear bit. Set by user to use the secure
clear option. Cleared by user to disable the
secure clear option by default.
3, 2
Prescale:
00
Source clock/1 by default.
01
Source
clock/16.
10
Source
clock/256.
11
Undefined. Equivalent to 00.
1
Watchdog IRQ option bit. Set by user to
produce an IRQ instead of a reset when
the watchdog reaches 0. Cleared by user to
disable the IRQ option.
0
Reserved.
T3CLRI Register
Name
Address
Default Value
Access
T3CLRI 0xFFFF036C
0x00
W
T3CLRI is an 8-bit register. Writing any value to this register
clears the Timer3 interrupt in normal mode or resets a new
timeout period in watchdog mode.
Secure Clear Bit (Watchdog Mode Only)
The secure clear bit is provided for a higher level of protection.
When set, a specific sequential value must be written to T3ICLR
to avoid a watchdog reset. The value is a sequence generated by
the 8-bit linear feedback shift register (LFSR) polynomial = X8
+ X6 + X5 + X + 1 as shown in Figure 66.
0
495
5-
0
38
CLOCK
Q
D
4
Q
D
5
Q
D
3
Q
D
7
Q
D
6
Q
D
2
Q
D
1
Q
D
0
Figure 66. 8-Bit LFSR
The initial value or seed is written to T3ICLR before entering
watchdog mode. After entering watchdog mode, a write to
T3ICLR must match this expected value. If it matches, the
LFSR is advanced to the next state when the counter reload
happens. If it fails to match the expected state, reset is
immediately generated, even if the count has not yet expired.
The value 000 should not be used as an initial seed due to the
properties of the polynomial. The value 000 is always
guaranteed to force an immediate reset. The value of the LFSR
cannot be read; it must be tracked/generated in software.
Example of a sequence:
1. Enter initial seed, 0AA, in T3ICLR before starting Timer3
in watchdog mode.
2. Enter 0AA in T3ICLR; Timer3 is reloaded.
3. Enter 037 in T3ICLR; Timer3 is reloaded.
4. Enter 06E in T3ICLR; Timer3 is reloaded.
5. Enter 066. 0DC was expected; the watchdog reset the chip.
EXTERNAL MEMORY INTERFACING
The ADuC7026 and ADuC7027 are the only models in their
series that feature an external memory interface The external
memory interface requires a larger number of pins. This is why
it is only available on larger pin count packages. The XMCFG
MMR must be set to 1 to use the external port.
Although 32-bit addresses are supported internally, only the
lower 16 bits of the address are on external pins.
The memory interface can address up to four 128 kB of
asynchronous memory (SRAM or/and EEPROM).
The pins required for interfacing to an external memory are
shown in Table 77.
Table 77. External Memory Interfacing Pins
Pin Function
AD[15:0] Address/Data
Bus
A16
Extended Addressing for 8-Bit Memory Only
MS[3:0] Memory
Select
Pins
WR Write
Strobe
RS Read
Strobe
AE
Address Latch Enable
BHE, BLE
Byte Write Capability
There are four external memory regions available as described
in Table 78. Associated with each region are the pins MS[3:0].
These signals allow access to the particular region of external
memory. The size of each memory region can be 128 kB maxi-
mum, 64 k 16 or 128 k 8. To access 128 k with an 8-bit
memory, an extra address line (A16) is provided. (See the
example in Figure 67.) The four regions are configured
independently.
Table 78. Memory Regions
Address Start
Address End
Contents
0x10000000
0x1000FFFF
External Memory 0
0x20000000
0x2000FFFF
External Memory 1
0x30000000
0x3000FFFF
External Memory 2
0x40000000
0x4000FFFF
External Memory 3
Each external memory region can be controlled through three
MMRs: XMCFG, XMxCON, and XMxPAR.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 79 of 92
0
49
55
-
03
9
LATCH
ADuC7026/
ADuC7027
AD15:0
A16
EPROM
64k 16-BIT
A0:15
D0D15
CS
RAM
128k 8-BIT
A0:15
A16
D0D7
CS
WE
OE
WE
OE
AE
MS0
MS1
WS
RS
Figure 67. Interfacing to External EPROM/RAM
XMCFG Register
Name
Address
Default Value
Access
XMCFG 0xFFFFF000 0x00
RW
XMCFG is set to 1 to enable external memory access. This must
be set to 1 before any port pins function as external memory
access pins. The port pins must also be individually enabled via
the GPxCON MMR.
XMxCON Registers
Name
Address
Default Value
Access
XM0CON 0xFFFFF010 0x00
RW
XM1CON 0xFFFFF014 0x00
RW
XM2CON 0xFFFFF018 0x00
RW
XM3CON 0xFFFFF01C 0x00
RW
XMxCON are the control registers for each memory region.
They allow the enabling/disabling of a memory region and
control the data bus width of the memory region.
Table 79. XMxCON MMR Bit Descriptions
Bit Description
1
Selects between 8-bit and 16-bit data bus width. Set by the
user to select a 16-bit data bus. Cleared by the user to
select an 8-bit data bus.
0
Enables memory region. Set by the user to enable memory
region. Cleared by the user to disable the memory region.
XMxPAR Registers
Name
Address
Default Value
Access
XM0PAR 0xFFFFF020 0x70FF
RW
XM1PAR 0xFFFFF024 0x70FF
RW
XM2PAR 0xFFFFF028 0x70FF
RW
XM3PAR 0xFFFFF02C 0x70FF
RW
XMxPAR are registers that define the protocol used for
accessing the external memory for each memory region.
Table 80. XMxPAR MMR Bit Descriptions
Bit Description
15
Enable byte write strobe. This bit is only used for two, 8-
bit memory sharing the same memory region. Set by
the user to gate the A0 output with the WR output. This
allows byte write capability without using BHE and BLE
signals. Cleared by user to use BHE and BLE signals.
14 to
12
Number of wait states on the address latch enable
strobe.
11 Reserved.
10
Extra address hold time. Set by the user to disable extra
hold time. Cleared by the user to enable one clock cycle
of hold on the address in read and write.
9
Extra bus transition time on read. Set by the user to disable
extra bus transition time. Cleared by the user to enable
one extra clock before and after the read strobe (RS).
8
Extra bus transition time on write. Set by the user to disable
extra bus transition time. Cleared by the user to enable
one extra clock before and after the write strobe (WS).
7 to 4
Number of write wait states. Select the number of wait
states added to the length of the WS pulse. 0x0 is 1clock;
0xF is 16 clock cycles (default value).
3 to 0
Number of read wait states. Select the number of wait
states added to the length of the RS pulse. 0x0 is 1 clock;
0xF is 16 clock cycles (default value).
Figure 68, Figure 69, Figure 70, and Figure 71 show the timing
for a read cycle, a read cycle with address hold and bus turn
cycles, a write cycle with address and write hold cycles, and a
write cycle with wait sates, respectively.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 80 of 92
04
95
5-
04
0
MCLK
AD16:0
ADDRESS
DATA
MSx
AE
RS
Figure 68. External Memory Read Cycle
04
95
5-
04
1
DATA
ADDRESS
EXTRA ADDRESS
HOLD TIME
(BIT-10)
BUS TURN OUT CYCLE
(BIT-9)
BUS TURN OUT CYCLE
(BIT-9)
MCLK
AD16:0
MSx
AE
RS
Figure 69. External Memory Read Cycle with Address Hold and Bus Turn Cycles
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 81 of 92
04
95
5-
04
2
DATA
ADDRESS
EXTRA ADDRESS
HOLD TIME
(BIT-10)
WRITE HOLD ADDRESS
AND DATA CYCLES
(BIT-8)
WRITE HOLD ADDRESS
AND DATA CYCLES
(BIT-8)
MCLK
AD16:0
MSx
AE
WS
Figure 70. External Memory Write Cycle with Address and Write Hold Cycles
0
49
55
-
04
3
DATA
ADDRESS
1 WRITE STROBE WAIT STATE
(BIT-7 TO BIT-4)
1 ADDRESS WAIT STATE
(BIT-14 TO BIT-12)
MCLK
AD16:0
MSx
AE
WS
Figure 71. External Memory Write Cycle with Wait States
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 82 of 92
HARDWARE DESIGN CONSIDERATIONS
POWER SUPPLIES
The ADuC7019/20/21/22/24/25/26/27 operational power
supply voltage range is 2.7 V to 3.6 V. Separate analog and
digital power supply pins (AV
DD
and IOV
DD
, respectively) allow
AV
DD
to be kept relatively free of noisy digital signals often
present on the system IOV
DD
line. In this mode, the part can
also operate with split supplies, that is, using different voltage
levels for each supply. For example, the system can be designed
to operate with an IOV
DD
voltage level of 3.3 V while the AV
DD
level can be at 3 V, or vice versa. A typical split supply
configuration is shown in Figure 72.
04
95
5-
04
4
ADuC7026
0.1
F
ANALOG
SUPPLY
10
F
73
74
AV
DD
75
DACV
DD
8
GND
REF
70
DACGND
71
AGND
67
REFGND
26
IOV
DD
54
25
IOGND
53
0.1
F
+
DIGITAL
SUPPLY
10
F
+
Figure 72. External Dual Supply Connections
As an alternative to providing two separate power supplies, the
user can reduce noise on AV
DD
by placing a small series resistor
and/or ferrite bead between AV
DD
and IOV
DD
, and then
decouple AV
DD
separately to ground. An example of this
configuration is shown in Figure 73. With this configuration,
other analog circuitry (such as op amps, voltage reference, and
others) can be powered from the AV
DD
supply line as well.
0
495
5-
0
45
ADuC7026
0.1
F
BEAD
1.6
73
74
AV
DD
75
DACV
DD
8
GND
REF
70
DACGND
71
AGND
67
REFGND
26
IOV
DD
54
25
IOGND
53
0.1
F
DIGITAL SUPPLY
10
F
10
F
+
Figure 73. External Single Supply Connections
Notice that in both Figure 72 and Figure 73, a large value
(10 F) reservoir capacitor sits on IOV
DD
, and a separate 10 F
capacitor sits on AV
DD
. In addition, local small-value (0.1 F)
capacitors are located at each AV
DD
and IOV
DD
pin of the chip.
As per standard design practice, be sure to include all of these
capacitors and ensure the smaller capacitors are close to each
AV
DD
pin with trace lengths as short as possible. Connect the
ground terminal of each of these capacitors directly to the
underlying ground plane. Finally, note that the analog and
digital ground pins on the ADuC7019/20/21/22/24/25/26/27
must be referenced to the same system ground reference point
at all times.
Linear Voltage Regulator
Each ADuC7019/20/21/22/24/25/26/27 requires a single 3.3 V
supply, but the core logic requires a 2.6 V supply. An on-chip
linear regulator generates the 2.6 V from IOV
DD
for the core
logic. LV
DD
Pin 21 is the 2.6 V supply for the core logic. An
external compensation capacitor of 0.47 F must be connected
between LV
DD
and DGND (as close as possible to these pins) to
act as a tank of charge as shown Figure 74.
04
95
5-
04
6
ADuC7026
0.47
F
27
LV
DD
28
DGND
Figure 74. Voltage Regulator Connections
The LV
DD
pin should not be used for any other chip. It is also
recommended to use excellent power supply decoupling on
IOV
DD
to help improve line regulation performance of the on-
chip voltage regulator.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 83 of 92
GROUNDING AND BOARD LAYOUT
RECOMMENDATIONS
As with all high resolution data converters, special attention
must be paid to grounding and PC board layout of
ADuC7019/20/21/22/24/25/26/27-based designs in order to
achieve optimum performance from the ADCs and DAC.
Although the ADuC7019/20/21/22/24/25/26/27 have separate
pins for analog and digital ground (AGND and IOGND), the
user must not tie these to two separate ground planes unless the
two ground planes are connected very close to the part. This is
illustrated in the simplified example shown in Figure 75a. In
systems where digital and analog ground planes are connected
together somewhere else (at the system's power supply, for
example), the planes can not be reconnected near the part,
because a ground loop would result. In these cases, tie all the
ADuC7019/20/21/22/24/25/26/27's AGND and IOGND pins to
the analog ground plane, as illustrated in Figure 75b. In systems
with only one ground plane, ensure that the digital and analog
components are physically separated onto separate halves of the
board so that digital return currents do not flow near analog
circuitry and vice versa. The ADuC7019/20/21/22/24/25/26/27
can then be placed between the digital and analog sections, as
illustrated in Figure 75c.
04
95
5-
0
47
a.
PLACE ANALOG
COMPONENTS HERE
PLACE DIGITAL
COMPONENTS HERE
AGND
DGND
b.
PLACE ANALOG
COMPONENTS
HERE
PLACE DIGITAL
COMPONENTS HERE
AGND
DGND
c.
PLACE ANALOG
COMPONENTS HERE
PLACE DIGITAL
COMPONENTS HERE
DGND
Figure 75. System Grounding Schemes
In all of these scenarios, and in more complicated real-life
applications, pay particular attention to the flow of current from
the supplies and back to ground. Make sure the return paths for
all currents are as close as possible to the paths the currents
took to reach their destinations. For example, do not power
components on the analog side, as seen in Figure 75b, with
IOV
DD
because that would force return currents from IOV
DD
to
flow through AGND. Also, avoid digital currents flowing under
analog circuitry, which could occur if a noisy digital chip is
placed on the left half of the board shown in Figure 75c. If
possible, avoid large discontinuities in the ground plane(s)
(such as those formed by a long trace on the same layer),
because they force return signals to travel a longer path. In
addition, make all connections to the ground plane directly,
with little or no trace separating the pin from its via to ground.
When connecting fast logic signals (rise/fall time < 5 ns) to any
of the ADuC7019/20/21/22/24/25/26/27's digital inputs, add a
series resistor to each relevant line to keep rise and fall times
longer than 5 ns at the ADuC7019/20/21/22/24/25/26/27 input
pins. A value of 100 or 200 is usually sufficient enough to
prevent high speed signals from coupling capacitively into the
part and affecting the accuracy of ADC conversions.
CLOCK OSCILLATOR
The clock source for the ADuC7019/20/21/22/24/25/26/27 can
be generated by the internal PLL or by an external clock input.
To use the internal PLL, connect a 32.768 kHz parallel resonant
crystal between XCLKI and XCLKO, and connect a capacitor
from each pin to ground as shown Figure 76. This crystal allows
the PLL to lock correctly to give a frequency of 41.78 MHz. If
no external crystal is present, the internal oscillator is used to
give a frequency of 41.78 MHz 3% typically.
04
95
5-
0
4
8
ADuC7026
TO
INTERNAL
PLL
12pF
45
XCLKI
32.768kHz
12pF
44
XCLKO
Figure 76. External Parallel Resonant Crystal Connections
To use an external source clock input instead of the PLL (see
Figure 77), Bit 1 and Bit 0 of PLLCON must be modified.The
external clock uses P0.7 and XCLK.
04
95
5-
0
4
9
ADuC7026
TO
FREQUENCY
DIVIDER
XCLKO
XCLKI
XCLK
EXTERNAL
CLOCK
SOURCE
Figure 77. Connecting an External Clock Source
Using an external clock source, the ADuC7019/20/21/22/
24/25/26/27's specified operational clock speed range is 50 kHz
to 44 MHz 1% to ensure correct operation of the analog
peripherals and Flash/EE.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 84 of 92
POWER-ON RESET OPERATION
An internal power-on reset (POR) is implemented on the
ADuC7019/20/21/22/24/25/26/27. For LV
DD
below 2.35 V
typical, the internal POR holds the part in reset. As LV
DD
rises
above 2.35 V, an internal timer times out for typically 128 ms
before the part is released from reset. The user must ensure that
the power supply IOV
DD
has reached a stable 2.7 V minimum
level by this time. Likewise, on power-down, the internal POR
holds the ADuC7019/20/21/22/24/25/26/27 in reset until LV
DD
has dropped below 2.35 V.
Figure 78 illustrates the operation of the internal POR in detail.
04
95
5-
05
0
IOV
DD
3.3V
2.6V
2.35V TYP
2.35V TYP
128ms TYP
LV
DD
POR
MRST
0.12ms TYP
Figure 78. ADuC7019/20/21/22/24/25/26/27
Internal Power-on Reset Operation
TYPICAL SYSTEM CONFIGURATION
A typical ADuC7020 configuration is shown in Figure 79. It summarizes some of the hardware considerations discussed in the previous
sections. The bottom of the CSP package has an exposed pad that needs to be soldered to a metal plate on the board for mechanical
reasons. The metal plate of the board can be connected to ground.
NOT CONNECTED IN THIS EXAMPLE
30
29
28
27
26
25
XCLKI
24
XCLKO
23
22
21
1
2
3
GND
REF
4
DAC0
5
6
7
8
TMS
9
TDI
10
P0.0
40
39
38
ADC
0
37
AV
DD
36
AG
ND
35
V
RE
F
34 33
P1
.
0
32
P1
.
1
31
11
12
13
TD
O
TC
K
14
IOGN
D
15
IOV
DD
16
LV
DD
DG
ND
17 18
TR
S
T
19
RS
T
20
DV
DD
1k
10
ADuC7020
0.01
F
+
AV
DD
0.47
F
TDO
TCK
TMS
TDI
TRST
JT
A
G
CO
NN
E
C
T
O
R
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
DV
DD
DV
DD
10
0k
10
0k
10
0k
DV
DD
DV
DD
32.768kHz
0.47
F
1k
0.1
F
10
F
10
F
1.5
270
DV
DD
AV
DD
ADP3333-3.3
IN
OUT
SD
GND
1
C1+
2
V+
3
C1
4
C2+
5
C2
6
V
7
T2OUT
8
R2IN
ADM3202
RS232 INTERFACE*
*EXTERNAL UART TRANSCEIVER INTEGRATED IN SYSTEM OR AS
PART OF AN EXTERNAL DONGLE AS DESCRIBED IN uC006.
STANDARD D-TYPE
SERIAL COMMS
CONNECTOR TO
PC HOST
16
V
CC
15
GND
14
T1OUT
13
R1IN
12
R1OUT
11
T1IN
10
T2IN
9
R2OUT
1
2
3
4
5
6
7
8
9
04
95
5-
0
5
1
Figure 79. Typical System Configuration
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 85 of 92
DEVELOPMENT TOOLS
PC-BASED TOOLS
Four types of development systems are available for the
ADuC7019/20/21/22/24/25/26/27 family:
The ADuC7026 QuickStart Plus is intended for new users
who want to have a comprehensive hardware development
environment. Since the ADuC7026 contains the superset of
functions available on the ADuC7019/20/21/22/24/25/26/27
family, it is suitable for users who wish to develop on any of
the parts in this family. All of the parts are fully code
compatible.
The ADuC7020, ADuC7024, and ADuC7026 QuickStartTM
are intended for users who already have an emulator.
These systems consist of the following PC-based (Windows
compatible) hardware and software development tools:
Hardware
ADuC7019/20/21/22/24/25/26/27 evaluation board
Serial port programming cable
RDI compliant JTAG emulator (included in the
ADuC7026 QuickStart Plus only)
Software
Integrated development environment, incorporating
assembler, compiler, and nonintrusive JTAG-based
debugger
Serial downloader software
Example code
Miscellaneous
CD-ROM documentation
IN-CIRCUIT SERIAL DOWNLOADER
The serial downloader is a Windows application that allows
the user to serially download an assembled program to the
on-chip program Flash/EE memory via the serial port on a
standard PC.
The UART based serial downloader is included in all the
development systems and is usable with ADuC7019/20/21/22/
24/25/26/27 that do not contain the "I" suffix in the ordering
guide.
An I
2
C based serial downloader is also available at
www.analog.com. This software requires an USB to I
2
C
adaptor board available from http://www.fh-pforzheim.de/
stw-svs/texte/Dongle.html. The I
2
C based serial downloader
is only usable with the part models containing the "I" suffix
in the ordering guide.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 86 of 92
OUTLINE DIMENSIONS
1
40
10
11
31
30
21
20
4.25
4.10 SQ
3.95
TOP
VIEW
6.00
BSC SQ
PIN 1
INDICATOR
5.75
BCS SQ
12 MAX
0.30
0.23
0.18
0.20 REF
SEATING
PLANE
1.00
0.85
0.80
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.80 MAX
0.65 TYP
4.50
REF
0.50
0.40
0.30
0.50
BSC
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.25 MIN
EXPOSED
PAD
(BOTTOM VIEW)
COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2
Figure 80. 40-Lead Frame Chip Scale Package [LFCSP_VQ]
6 mm x 6 mm Body, Very Thin Quad
(CP-40)
Dimensions shown in millimeters
PIN 1
INDICATOR
TOP
VIEW
8.75
BSC SQ
9.00
BSC SQ
1
64
16
17
49
48
32
33
0.45
0.40
0.35
0.50 BSC
0.20 REF
12 MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
7.50
REF
0.05 MAX
0.02 NOM
0.60 MAX
0.60 MAX
*4.85
4.70 SQ
4.55
SEATING
PLANE
PIN 1
INDICATOR
EXPOSED PAD
(BOTTOM VIEW)
0.30
0.25
0.18
*COMPLIANT TO JEDEC STANDARDS MO-220-VMMD
EXCEPT FOR EXPOSED PAD DIMENSION
Figure 81. 64-Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm x 9 mm Body, Very Thin Quad
(CP-64-1)
Dimensions shown in millimeters
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 87 of 92
COMPLIANT TO JEDEC STANDARDS MS-026-BCD
TOP VIEW
(PINS DOWN)
1
16
17
33
32
48
49
64
0.27
0.22
0.17
0.50
BSC
LEAD PITCH
10.00
BSC SQ
12.00
BSC SQ
PIN 1
1.60
MAX
0.75
0.60
0.45
VIEW A
0.20
0.09
1.45
1.40
1.35
0.08 MAX
COPLANARITY
VIEW A
ROTATED 90 CCW
SEATING
PLANE
0.15
0.05
7
3.5
0
Figure 82. 64-Lead Low Profile Quad Flat Package [LQFP]
(ST-64-2)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MS-026-BDD
0.15
0.05
1.45
1.40
1.35
0.20
0.09
0.08 MAX
COPLANARITY
VIEW A
ROTATED 90 CCW
SEATING
PLANE
7
3.5
0
TOP VIEW
(PINS DOWN)
1
21
41
40
60
61
80
20
12.00
BSC SQ
0.50
BSC
LEAD PITCH
0.27
0.22
0.17
14.00
BSC SQ
1.60
MAX
0.75
0.60
0.45
VIEW A
PIN 1
Figure 83. 80-Lead Low Profile Quad Flat Package [LQFP]
(ST-80-1)
Dimensions shown in millimeters
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 88 of 92
ORDERING GUIDE
Model
ADC
Channels
DAC
Channels FLASH/RAM PWM GPIO Downloader
Temperature
Range
Package
Description
Package
Option
ADuC7019BCPZ62I
1
5
2
3
62 kB/8 kB
Single
14
I
2
C 40C
to
+125C
40-Lead LFCSP_VQ
CP-40
ADuC7019BCPZ62I-RL
1
5
2
3
62 kB/8 kB
Single
14
I
2
C 40C
to
+125C
40-Lead LFCSP_VQ
CP-40
ADuC7019BCPZ62IRL7
1
5
2
3
62 kB/8 kB
Single
14
I
2
C 40C
to
+125C
40-Lead LFCSP_VQ
CP-40
ADuC7020BCPZ62
1
5
4
62 kB/8 kB
Single
14
UART
40C to
+125C
40-Lead LFCSP_VQ
CP-40
ADuC7020BCPZ62-RL
1
5
4
62 kB/8 kB
Single
14
UART
40C to
+125C
40-Lead LFCSP_VQ
CP-40
ADuC7020BCPZ62-RL7
1
5
4
62 kB/8 kB
Single
14
UART
40C to
+125C
40-Lead LFCSP_VQ
CP-40
ADuC7020BCPZ62I
1
5 4 62
kB/8
kB
Single
14
I
2
C 40C
to
+125C
40-Lead LFCSP_VQ
CP-40
ADuC7020BCPZ62I-RL
1
5 4 62
kB/8
kB
Single
14
I
2
C 40C
to
+125C
40-Lead LFCSP_VQ
CP-40
ADuC7020BCPZ62IRL7
1
5 4 62
kB/8
kB
Single
14
I
2
C 40C
to
+125C
40-Lead LFCSP_VQ
CP-40
ADuC7021BCPZ62
1
8
2
62 kB/8 kB
Single
13
UART
40C to
+125C
40-Lead LFCSP_VQ
CP-40
ADuC7021BCPZ62-RL
1
8
2
62 kB/8 kB
Single
13
UART
40C to
+125C
40-Lead LFCSP_VQ
CP-40
ADuC7021BCPZ62-RL7
1
8
2
62 kB/8 kB
Single
13
UART
40C to
+125C
40-Lead LFCSP_VQ
CP-40
ADuC7021BCPZ62I
1
8 2 62
kB/8
kB
Single
13
I
2
C 40C
to
+125C
40-Lead LFCSP_VQ
CP-40
ADuC7021BCPZ62I-RL
1
8 2 62
kB/8
kB
Single
13
I
2
C 40C
to
+125C
40-Lead LFCSP_VQ
CP-40
ADuC7021BCPZ62IRL7
1
8 2 62
kB/8
kB
Single
13
I
2
C 40C
to
+125C
40-Lead LFCSP_VQ
CP-40
ADuC7021BCPZ32
1
8
2
32 kB/4 kB
Single
13
UART
40C to
+125C
40-Lead LFCSP_VQ
CP-40
ADuC7021BCPZ32-RL
1
8
2
32 kB/4 kB
Single
13
UART
40C to
+125C
40-Lead LFCSP_VQ
CP-40
ADuC7021BCPZ32-RL7
1
8
2
32 kB/4 kB
Single
13
UART
40C to
+125C
40-Lead LFCSP_VQ
CP-40
ADuC7022BCPZ62
1
10
62 kB/8 kB
Single
13
UART
40C to
+125C
40-Lead LFCSP_VQ
CP-40
ADuC7022BCPZ62-RL
1
10
62 kB/8 kB
Single
13
UART
40C to
+125C
40-Lead LFCSP_VQ
CP-40
ADuC7022BCPZ62-RL7
1
10
62 kB/8 kB
Single
13
UART
40C to
+125C
40-Lead LFCSP_VQ
CP-40
ADuC7022BCPZ32
1
10
32 kB/4 kB
Single
13
UART
40C to
+125C
40-Lead LFCSP_VQ
CP-40
ADuC7022BCPZ32-RL
1
10
32 kB/4 kB
Single
13
UART
40C to
+125C
40-Lead LFCSP_VQ
CP-40
ADuC7022BCPZ32-RL7
1
10
32 kB/4 kB
Single
13
UART
40C to
+125C
40-Lead LFCSP_VQ
CP-40
ADuC7024BCPZ62
1
10
2
62 kB/8 kB
Three
Phase
30 UART
40C
to
+125C
64-Lead LFCSP_VQ
CP-64-1
ADuC7024BCPZ62-RL
1
10
2
62 kB/8 kB
Three
Phase
30 UART
40C
to
+125C
64-Lead LFCSP_VQ
CP-64-1
ADuC7024BCPZ62-RL7
1
10
2
62 kB/8 kB
Three
Phase
30 UART
40C
to
+125C
64-Lead LFCSP_VQ
CP-64-1
ADuC7024BSTZ62
1
10
2
62 kB/8 kB
Three
Phase
30 UART
40C
to
+125C
64-Lead LQFP
ST-64-2
ADuC7024BSTZ62-RL
1
10
2
62 kB/8 kB
Three
Phase
30 UART
40C
to
+125C
64-Lead LQFP
ST-64-2
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 89 of 92
Model
ADC
Channels
DAC
Channels
FLASH/RAM PWM GPIO Downloader
Temperature
Range
Package
Description
Package
Option
ADuC7025BCPZ62
1
12
62 kB/8 kB
Three
Phase
30 UART
40C
to
+125C
64-Lead LFCSP_VQ
CP-64-1
ADuC7025BCPZ62-RL
1
12
62 kB/8 kB
Three
Phase
30 UART
40C
to
+125C
64-Lead LFCSP_VQ
CP-64-1
ADuC7025BCPZ62-RL7
1
12
62 kB/8 kB
Three
Phase
30 UART
40C
to
+125C
64-Lead LFCSP_VQ
CP-64-1
ADuC7025BCPZ32
1
12
32 kB/4 kB
Three
Phase
30 UART
40C
to
+125C
64-Lead LFCSP_VQ
CP-64-1
ADuC7025BCPZ32-RL
1
12
32 kB/4 kB
Three
Phase
30 UART
40C
to
+125C
64-Lead LFCSP_VQ
CP-64-1
ADuC7025BCPZ32-RL7
1
12
32 kB/4 kB
Three
Phase
30 UART
40C
to
+125C
64-Lead LFCSP_VQ
CP-64-1
ADuC7025BSTZ62
1
12
62 kB/8 kB
Three
Phase
30 UART
40C
to
+125C
64-Lead LQFP
ST-64-2
ADuC7025BSTZ62-RL
1
12
62 kB/8 kB
Three
Phase
30 UART
40C
to
+125C
64-Lead LQFP
ST-64-2
ADuC7026BSTZ62
1
,
3
12
4
62 kB/8 kB
Three
Phase
40 UART
40C
to
+125C
80-Lead LQFP
ST-80-1
ADuC7026BSTZ62-RL
1, 3
12
4
62 kB/8 kB
Three
Phase
40 UART
40C
to
+125C
80-Lead LQFP
ST-80-1
ADuC7026BSTZ62I
1
, 3
12
4
62 kB/8 kB
Three
Phase
40 I
2
C 40C
to
+125C
80-Lead LQFP
ST-80-1
ADuC7026BSTZ62I-RL
1, 3
12
4
62 kB/8 kB
Three
Phase
40 I
2
C 40C
to
+125C
80-Lead LQFP
ST-80-1
ADuC7027BSTZ62
1
,
3
16
62 kB/8 kB
Three
Phase
40 UART
40C
to
+125C
80-Lead LQFP
ST-80-1
ADuC7027BSTZ62-RL
1,
3
16
62 kB/8 kB
Three
Phase
40 UART
40C
to
+125C
80-Lead LQFP
ST-80-1
EVAL_ADuC7020MK
ADuC7020
MiniKit
EVAL_ADuC7020QS
ADuC7020
QuickStart
Development
System
EVAL_ADuC7024QS
ADuC7024
QuickStart
Development
System
EVAL_ADuC7026QS
ADuC7026
QuickStart
Development
System
EVAL_ADuC7026QSP
ADuC7026
QuickStart Plus
Development
System
1
Z = Pb-free part.
2
One of the ADC channels is internally buffered.
3
Includes external memory interface.
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 90 of 92
NOTES
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 91 of 92
NOTES
ADuC7019/20/21/22/24/25/26/27
Rev. 0 | Page 92 of 92
NOTES
Purchase of licensed I
2
C components of Analog Devices or one of its sublicensed Associated Companies conveys a license for the purchaser under the Philips I
2
C Patent
Rights to use these components in an I
2
C system, provided that the system conforms to the I
2
C Standard Specification as defined by Philips.
2005 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04955-0-10/05(0)