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Электронный компонент: APT50M75JLLU3

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APT50M75JLLU3
A
P
T
5
0M
75J
L
L
U
3 R
e
v 0
A
p
r
i
l
,
2004
APT website http://www.advancedpower.com
1 8




ISOTOP
Absolute maximum ratings
These Devices are sensitive to Electrostatic Discharge. Proper Handing Procedures Should Be Followed.
A
S
G
D

Symbol Parameter
Max
ratings
Unit
V
DSS
Drain - Source Breakdown Voltage
500
V
T
c
= 25C
51
I
D
Continuous Drain Current
T
c
= 80C
39
I
DM
Pulsed Drain current
204
A
V
GS
Gate - Source Voltage
30
V
R
DSon
Drain - Source ON Resistance
75
m
W
P
D
Maximum Power Dissipation
T
c
= 25C
290
W
I
AR
Avalanche current (repetitive and non repetitive)
51
A
E
AR
Repetitive Avalanche Energy
50
E
AS
Single Pulse Avalanche Energy
2500
mJ
IF
AV
Maximum Average Forward Current
Duty cycle=0.5
Tc = 80C
30
IF
RMS
RMS Forward Current (Square wave, 50% duty)
39
A
V
DSS
= 500V
R
DSon
= 75m
W max @ Tj = 25C
I
D
= 51A @ Tc = 25C
Application
AC and DC motor control
Switched Mode Power Supplies
Features
Power MOS 7
MOSFETs
- Low
R
DSon
- Low input and Miller capacitance
- Low gate charge
- Fast intrinsic reverse diode
- Avalanche energy rated
- Very
rugged
ISOTOP
Package (SOT-227)
Very low stray inductance
High level of integration
Benefits
Outstanding performance at high frequency operation
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Very rugged
Low profile
ISOTOP
Buck chopper
MOSFET Power Module
A
D
G
S
APT50M75JLLU3
A
P
T
5
0M
75J
L
L
U
3 R
e
v 0
A
p
r
i
l
,
2004
APT website http://www.advancedpower.com
2 8
All ratings @ T
j
= 25C unless otherwise specified
Electrical Characteristics
Symbol Characteristic
Test
Conditions
Min Typ Max Unit
BV
DSS
Drain - Source Breakdown Voltage V
GS
= 0V, I
D
= 250A
500
V
V
GS
= 0V,V
DS
= 500V
T
j
= 25C
100
I
DSS
Zero Gate Voltage Drain Current
V
GS
= 0V,V
DS
= 400V
T
j
= 125C
500
A
R
DS(on)
Drain Source on Resistance
V
GS
= 10V, I
D
= 25.5A
75
m
W
V
GS(th)
Gate Threshold Voltage
V
GS
= V
DS
, I
D
= 1mA
3
5
V
I
GSS
Gate Source Leakage Current
V
GS
= 20
V, V
DS
= 0V
100
nA
Dynamic Characteristics
Symbol Characteristic
Test
Conditions
Min Typ Max Unit
C
iss
Input
Capacitance
5590
C
oss
Output
Capacitance
1180
C
rss
Reverse Transfer Capacitance
V
GS
= 0V
V
DS
= 25V
f = 1MHz
85
pF
Q
g
Total gate Charge
123
Q
gs
Gate Source Charge
33
Q
gd
Gate Drain Charge
V
GS
= 10V
V
Bus
= 250V
I
D
= 51A
65
nC
T
d(on)
Turn-on Delay Time
10
T
r
Rise Time
20
T
d(off)
Turn-off Delay Time
21
T
f
Fall Time
Resistive Switching
V
GS
= 15V
V
Bus
= 250V
I
D
= 51A
R
G
= 0.6
W
5
ns
Eon
Turn-on Switching Energy
u
755
Eoff
Turn-off Switching Energy
v
Inductive switching @ 25C
V
GS
= 15V, V
Bus
= 330V
I
D
= 51A,
R
G
= 5
726
J
Eon
Turn-on Switching Energy
u
1241
Eoff
Turn-off Switching Energy
v
Inductive switching @ 125C
V
GS
= 15V, V
Bus
= 330V
I
D
= 51A,
R
G
= 5
846
J
u Eon includes diode reverse recovery
v In accordance with JEDEC standard JESD24-1.
APT50M75JLLU3
A
P
T
5
0M
75J
L
L
U
3 R
e
v 0
A
p
r
i
l
,
2004
APT website http://www.advancedpower.com
3 8

Diode ratings and characteristics
Symbol Characteristic
Test
Conditions
Min Typ Max Unit
I
F
= 30A
1.6
1.8
I
F
= 60A
1.9
V
F
Diode Forward Voltage
I
F
= 30A
T
j
= 125C
1.4
V
V
R
= 600V
T
j
= 25C
250
I
RM
Maximum Reverse Leakage Current
V
R
= 600V
T
j
= 125C
500
A
C
T
Junction
Capacitance
V
R
=
200V
44 pF
Reverse Recovery Time
I
F
=1A,V
R
=30V
di/dt =100A/s
T
j
= 25C
23
T
j
= 25C
85
t
rr
Reverse Recovery Time
T
j
= 125C
160
ns
T
j
= 25C
4
I
RRM
Maximum Reverse Recovery Current
T
j
= 125C
8
A
T
j
= 25C
130
Q
rr
Reverse Recovery Charge
I
F
= 30A
V
R
= 400V
di/dt =200A/s
T
j
= 125C
700
nC
t
rr
Reverse Recovery Time
70
ns
Q
rr
Reverse Recovery Charge
1300
nC
I
RRM
Maximum Reverse Recovery Current
I
F
= 30A
V
R
= 400V
di/dt =1000A/s
T
j
= 125C
30 A


Thermal and package characteristics
Symbol Characteristic
Min Typ Max Unit
MOSFET
0.27
R
thJC
Junction
to
Case
Diode
1.21
R
thJA
Junction to Ambient (IGBT & Diode)
20
C/W
V
ISOL
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz
2500 V
T
J
,T
STG
Storage
Temperature
Range
-55
150
T
L
Max Lead Temp for Soldering:0.063" from case for 10 sec
300
C
Torque Mounting
torque
(Mounting = 8-32 or 4mm Machine and terminals = 4mm Machine)
1.5
N.m
Wt Package
Weight
29.2 g
Typical
MOSFET
Performance Curve
APT50M75JLLU3
A
P
T
5
0M
75J
L
L
U
3 R
e
v 0
A
p
r
i
l
,
2004
APT website http://www.advancedpower.com
4 8
APT50M75JLLU3
A
P
T
5
0M
75J
L
L
U
3 R
e
v 0
A
p
r
i
l
,
2004
APT website http://www.advancedpower.com
5 8
APT50M75JLLU3
A
P
T
5
0M
75J
L
L
U
3 R
e
v 0
A
p
r
i
l
,
2004
APT website http://www.advancedpower.com
6 8
Typical Diode Performance Curve
APT50M75JLLU3
A
P
T
5
0M
75J
L
L
U
3 R
e
v 0
A
p
r
i
l
,
2004
APT website http://www.advancedpower.com
7 8
APT50M75JLLU3
A
P
T
5
0M
75J
L
L
U
3 R
e
v 0
A
p
r
i
l
,
2004
APT website http://www.advancedpower.com
8 8
SOT-227 (ISOTOP
) Package Outline
31.5 (1.240)
31.7 (1.248)
Dimensions in Millimeters and (Inches)
7.8 (.307)
8.2 (.322)
30.1 (1.185)
30.3 (1.193)
38.0 (1.496)
38.2 (1.504)
14.9 (.587)
15.1 (.594)
11.8 (.463)
12.2 (.480)
8.9 (.350)
9.6 (.378)
Hex Nut M4
(4 places)
0.75 (.030)
0.85 (.033)
12.6 (.496)
12.8 (.504)
25.2 (0.992)
25.4 (1.000)
1.95 (.077)
2.14 (.084)
*
r = 4.0 (.157)
(2 places)
4.0 (.157)
4.2 (.165)
(2 places)
W=4.1 (.161)
W=4.3 (.169)
H=4.8 (.187)
H=4.9 (.193)
(4 places)
3.3 (.129)
3.6 (.143)
Emitter terminals are shorted
internally. Current handling
capability is equal for either
Emitter terminal.

ISOTOP
is a Registered Trademark of SGS Thomson

APT reserves the right to change, without notice, the specifications and information contained herein
APT's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.
Source
Gate
Drain
Anode