Applications
Ground Isolate Most Logic
Families TTL/TTL, CMOS/
TTL, CMOS/CMOS, LSTTL/
TTL, CMOS/LSTTL
Low Input Current Line
Receiver
High Voltage Insulation
(HCNW139/138)
EIA RS-232C Line Receiver
Telephone Ring Detector
117 V ac Line Voltage Status
Indicator Low Input Power
Dissipation
Low Power Systems
Ground Isolation
Low Input Current, High Gain
Optocouplers
Technical Data
Features
High Current Transfer Ratio
2000% Typical (4500%
Typical for HCNW139/138)
Low Input Current
Requirements 0.5 mA
TTL Compatible Output
0.1 V V
OL
Typical
Performance Guaranteed
over Temperature 0
C
to 70
C
Base Access Allows Gain
Bandwidth Adjustment
High Output Current
60 mA
Safety Approval
UL Recognized 2500 V rms
for 1 Minute and 5000 V rms*
for 1 Minute per UL 1577
CSA Approved
VDE 0884 Approved with
V
IORM
= 1414 V
peak
for
HCNW139 and HCNW138
BSI Certified (HCNW139 and
HCNW138)
Available in 8-Pin DIP or
SOIC-8 Footprint or
Widebody Package
MIL-STD-1772 Version
Available (HCPL-5700/1)
Description
These high gain series couplers
use a Light Emitting Diode and an
integrated high gain photodetec-
tor to provide extremely high
current transfer ratio between
input and output. Separate pins
for the photodiode and output
stage result in TTL compatible
saturation voltages and high
speed operation. Where desired
the V
CC
and V
O
terminals may be
tied together to achieve conven-
tional photodarlington operation.
A base access terminal allows a
gain bandwidth adjustment to be
made.
6N139
6N138
HCPL-0701
HCPL-0700
HCNW139
HCNW138
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
*5000 V rms/1 minute rating is for HCNW139/138 and Option 020 (6N139/138) products only.
A 0.1
F bypass capacitor connected between pins 8 and 5 is recommended.
Functional Diagram
7
1
2
3
4
5
6
8
NC
ANODE
CATHODE
NC
VCC
VO
GND
TRUTH TABLE
LED
ON
OFF
VO
LOW
HIGH
VB
2
The 6N139, HCPL-0701, and
CNW139 are for use in CMOS,
LSTTL or other low power appli-
cations. A 400% minimum current
transfer ratio is guaranteed over
0 to 70
C operating range for only
0.5 mA of LED current.
The 6N138, HCPL-0700, and
HCNW138 are designed for use
mainly in TTL applications.
Current Transfer Ratio (CTR) is
300% minimum over 0 to 70
C
for an LED current of 1.6 mA
(1 TTL Unit load ). A 300%
minimum CTR enables operation
with 1 TTL Load using a 2.2 k
pull-up resistor.
Selection for lower input current
down to 250
A is available upon
request.
The HCPL-0701 and HCPL-0700
are surface mount devices
packaged in an industry standard
SOIC-8 footprint.
The SOIC-8 does not require
"through holes" in a PCB. This
package occupies approximately
one-third the footprint area of the
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
The HCNW139 and HCNW138
are packaged in a widebody
encapsulation that provides creep-
age and clearance dimensions
suitable for safety approval by
regulatory agencies worldwide.
Selection Guide
Widebody
8-Pin DIP
Package
Hermetic
(300 Mil)
Small Outline SO-8
(400 mil)
Single and
Dual
Single
Dual
Minimum
Absolute
Dual
Single
Channel
Channel
Channel
Single
Input ON
Maxi-
Channel
Channel
Package
Package
Package
Channel
Current
Minimum
mum
Packages
Package
HCPL-
HCPL-
HCPL-
Package
(I
F
)
CTR
V
CC
HCPL-
6N139
2731
[1]
0701
0731
HCNW139
0.5 mA
400%
18 V
6N138
2730
[1]
0700
0730
HCNW138
1.6 mA
300%
7 V
HCPL-4701
[1]
4731
[1]
070A
[1]
073A
[1]
40
A
800%
18 V
0.5 mA
300%
20 V
5701
[1]
5700
[1]
5731
[1]
5730
[1]
Note:
1. Technical data are on separate HP publications.
3
IF
8
VCC
2
3
ICC
VF
ANODE
CATHODE
+
VB
IB
6
5
GND
VO
IO
7
SHIELD
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
6N139#XXX
020 = 5000 V rms/1 Minute UL Rating Option*
300 = Gull Wing Surface Mount Option
500 = Tape and Reel Packaging Option
Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for
information.
*For 6N139 and 6N138 only.
Gull wing surface mount option applies to through hole parts only.
Schematic
4
9.65 0.25
(0.380 0.010)
1.78 (0.070) MAX.
1.19 (0.047) MAX.
HP XXXXZ
YYWW
DATE CODE
1.080 0.320
(0.043 0.013)
2.54 0.25
(0.100 0.010)
0.51 (0.020) MIN.
0.65 (0.025) MAX.
4.70 (0.185) MAX.
2.92 (0.115) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).
5
6
7
8
4
3
2
1
5 TYP.
OPTION CODE*
UL
RECOGNITION
UR
0.254
+ 0.076
- 0.051
(0.010
+ 0.003)
- 0.002)
7.62 0.25
(0.300 0.010)
6.35 0.25
(0.250 0.010)
TYPE NUMBER
*MARKING CODE LETTER FOR OPTION NUMBERS
"L" = OPTION 020
OPTION NUMBERS 300 AND 500 NOT MARKED.
Package Outline Drawings
8-Pin DIP Package (6N139/6N138)**
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N139/6N138)
0.635 0.25
(0.025 0.010)
12 NOM.
9.65 0.25
(0.380 0.010)
0.635 0.130
(0.025 0.005)
7.62 0.25
(0.300 0.010)
5
6
7
8
4
3
2
1
9.65 0.25
(0.380 0.010)
6.350 0.25
(0.250 0.010)
1.016 (0.040)
1.194 (0.047)
1.194 (0.047)
1.778 (0.070)
9.398 (0.370)
9.906 (0.390)
4.826
(0.190)
TYP.
0.381 (0.015)
0.635 (0.025)
PAD LOCATION (FOR REFERENCE ONLY)
1.080 0.320
(0.043 0.013)
4.19
(0.165)
MAX.
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.254
+ 0.076
- 0.051
(0.010
+ 0.003)
- 0.002)
**JEDEC Registered Data.
5
Small Outline SO-8 Package (HCPL-0701/HCPL-0700)
8-Pin Widebody DIP Package (HCNW139/HCNW138)
5
6
7
8
4
3
2
1
11.15 0.15
(0.442 0.006)
1.78 0.15
(0.070 0.006)
5.10
(0.201)
MAX.
1.55
(0.061)
MAX.
2.54 (0.100)
TYP.
DIMENSIONS IN MILLIMETERS (INCHES).
7 TYP.
0.254
+ 0.076
- 0.0051
(0.010
+ 0.003)
- 0.002)
11.00
(0.433)
9.00 0.15
(0.354 0.006)
MAX.
10.16 (0.400)
TYP.
HP
HCNWXXXX
YYWW
DATE CODE
TYPE NUMBER
0.51 (0.021) MIN.
0.40 (0.016)
0.56 (0.022)
3.10 (0.122)
3.90 (0.154)
XXX
YWW
8
7
6
5
4
3
2
1
5.994 0.203
(0.236 0.008)
3.937 0.127
(0.155 0.005)
0.406 0.076
(0.016 0.003)
1.270
(0.050)
BSG
5.080 0.127
(0.200 0.005)
3.175 0.127
(0.125 0.005)
1.524
(0.060)
45 X
0.432
(0.017)
0.228 0.025
(0.009 0.001)
TYPE NUMBER
(LAST 3 DIGITS)
DATE CODE
0.305
(0.012)
MIN.
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 0.254 (0.205 0.010)
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
0.203 0.102
(0.008 0.004)
7
PIN ONE
0 ~ 7
*
*
6
1.00 0.15
(0.039 0.006)
7 NOM.
12.30 0.30
(0.484 0.012)
0.75 0.25
(0.030 0.010)
11.00
(0.433)
5
6
7
8
4
3
2
1
11.15 0.15
(0.442 0.006)
9.00 0.15
(0.354 0.006)
1.3
(0.051)
12.30 0.30
(0.484 0.012)
6.15
(0.242)TYP.
0.9
(0.035)
PAD LOCATION (FOR REFERENCE ONLY)
1.78 0.15
(0.070 0.006)
4.00
(0.158)
MAX.
1.55
(0.061)
MAX.
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
0.254
+ 0.076
- 0.0051
(0.010
+ 0.003)
- 0.002)
MAX.
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW139/HCNW138)
Note: Use of nonchlorine activated fluxes is highly recommended.
Solder Reflow Temperature Profile (HCPL-07XX and Gull Wing Surface Mount
Option 300 Parts)
240
T = 115C, 0.3C/SEC
0
T = 100C, 1.5C/SEC
T = 145C, 1C/SEC
TIME MINUTES
TEMPERATURE C
220
200
180
160
140
120
100
80
60
40
20
0
260
1
2
3
4
5
6
7
8
9
10
11
12
7
Regulatory Information
The 6N139/138, HCNW139/138,
and HCPL-0701/0700 have been
approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
VDE
Approved according to VDE 0884/
06.92 (HCNW139/138 only).
BSI
Certification according to
BS415:1994,
(BS EN60065:1994);
BS EN60950:1992
(BS7002:1992) and
EN41003:1993 for Class II
applications (HCNW139/
HCNW138 only.)
Insulation and Safety Related Specifications
8-Pin DIP
Widebody
(300 Mil)
SO-8
(400 Mil)
Parameter
Symbol
Value
Value
Value
Units
Conditions
Minimum External
L(101)
7.1
4.9
9.6
mm
Measured from input terminals
Air Gap (External
to output terminals, shortest
Clearance)
distance through air.
Minimum External
L(102)
7.4
4.8
10.0
mm
Measured from input terminals
Tracking (External
to output terminals, shortest
Creepage)
distance path along body.
Minimum Internal
0.08
0.08
1.0
mm
Through insulation distance,
Plastic Gap
conductor to conductor, usually
(Internal Clearance)
the direct distance between the
photoemitter and photodetector
inside the optocoupler cavity.
Minimum Internal
NA
NA
4.0
mm
Measured from input terminals
Tracking (Internal
to output terminals, along
Creepage)
internal cavity.
Tracking Resistance
CTI
200
200
200
Volts
DIN IEC 112/VDE 0303 Part 1
(Comparative
Tracking Index)
Isolation Group
IIIa
IIIa
IIIa
Material Group
(DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
8
VDE 0884 Insulation Related Characteristics (HCNW139 and HCNW138)
Description
Symbol
Characteristic
Units
Installation Classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage
600 V rms
I-IV
for rated mains voltage
1000 V rms
I-III
Climatic Classification
55/100/21
Pollution Degree (DIN VDE 0110/1.89)
2
Maximum Working Insulation Voltage
V
IORM
1414
V
peak
Input to Output Test Voltage, Method b*
V
PR
= 1.875 x V
IORM
, 100% Production Test with t
P
= 1 sec,
V
PR
2652
V
peak
Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
V
PR
= 1.5 x V
IORM
, Type and Sample Test,
V
PR
2121
V
peak
t
P
= 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage*
(Transient Overvoltage, t
ini
= 10 sec)
V
IOTM
8000
V
peak
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 11, Thermal Derating curve.)
Case Temperature
T
S
175
C
Current (Input Current I
F
, P
S
= 0)
I
S,INPUT
400
mA
Output Power
P
S,OUTPUT
700
mW
Insulation Resistance at T
S
, V
IO
= 500 V
R
S
> 10
9
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, (VDE 0884) for a
detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in
application.
9
Absolute Maximum Ratings*
(No Derating Required up to 85
C)
Parameter
Symbol
Min.
Max.
Units
Storage Temperature
T
S
-55
125
C
Operating Temperature**
T
A
- 40
85
C
Average Forward Input Current
I
F(AVG)
20
mA
Peak Forward Input Current
I
FPK
40
mA
(50% Duty Cycle, 1 ms Pulse Width)
Peak Transient Input Current
I
F(TRAN)
1.0
A
(<1
s Pulse Width, 300 pps)
Reverse Input Voltage
V
R
5
V
HCNW139/138
3
V
Input Power Dissipation
P
I
35
mW
Output Current (Pin 6)
I
O
60
mA
Emitter Base Reverse Voltage (Pin 5-7)
V
EB
0.5
V
Supply Voltage and Output Voltage
V
CC
-0.5
18
V
(6N139, HCPL-0701, HCNW139)
Supply Voltage and Output Voltage
V
CC
-0.5
7
V
(6N138, HCPL-0700, HCNW138)
Output Power Dissipation
P
O
100
mW
Total Power Dissipation
P
T
135
mW
Lead Solder Temperature (for Through Hole Devices)
260
C for 10 sec., 1.6 mm below seating plane
HCNW139/138
260
C for 10 sec., up to seating plane
Reflow Temperature Profile
See Package Outline Drawings section
(for SOIC-8 and Option #300)
*JEDEC Registered Data for 6N139 and 6N138.
**0
C to 70
C on JEDEC Registration.
Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
Units
Power Supply Voltage
V
CC
4.5
18
V
Forward Input Current (ON)
I
F(ON)
0.5
12.0
mA
Forward Input Voltage (OFF)
V
F(OFF)
0
0.8
V
Operating Temperature
T
A
0
70
C
10
Electrical Specifications
0
C
T
A
70
C, 4.5 V
V
CC
18 V, 0.5 mA
I
F(ON)
12 mA, 0 V
V
F(OFF)
0.8 V, unless otherwise
specified. All Typicals at T
A
= 25
C. See Note 7.
Parameter
Sym.
Device
Min. Typ.** Max. Units
Test Conditions
Fig.
Note
Current Transfer
CTR
6N139
400* 2000 5000
%
I
F
= 0.5 mA
V
CC
= 4.5
2, 3
1, 2,
Ratio
HCPL-0701
V
O
= 0.4 V
4
HCNW139
400
4500
6N139
500* 1600 2600
I
F
= 1.6 mA
HCPL-0701
HCNW139
500
3000
300
1600
I
F
= 5.0 mA
200
850
I
F
= 12 mA
6N138
300* 1600 2600
I
F
= 1.6 mA
HCPL-0700
HCNW138
1500
Logic Low Output
V
OL
6N139
0.1
0.4
V
I
F
= 0.5 mA,
V
CC
= 4.5
1
2
Voltage
HCPL-0701
I
O
= 2 mA
HCNW139
I
F
= 1.6 mA,
I
O
= 8 mA
I
F
= 5.0 mA,
I
O
= 15 mA
0.2
I
F
= 12 mA,
I
O
= 24 mA
6N138
0.1
I
F
= 1.6 mA,
HCPL-0700
I
O
= 4.8 mA
HCNW138
Logic High
I
OH
6N139
0.05
100
A
V
O
= V
CC
= 18 V I
F
= 0 mA
2
Output Current
HCPL-0701
HCNW139
6N138
0.1
250
V
O
= V
CC
= 7 V
HCPL-0700
HCNW138
Logic Low Supply
I
CCL
6N138/139
0.4
1.5
mA
I
F
= 1.6 mA, V
O
= Open,
10
2
Current
HCPL-0701/
V
CC
= 18 V
0700
HCNW139
0.5
2
HCNW138
Logic High
I
CCH
6N138/139
0.01
10
A
I
F
= 0 mA, V
O
= Open,
2
Supply Current
HCPL-0701/
V
CC
= 18 V
0700
HCNW139
1
HCNW138
Input Forward
V
F
6N138
1.25
1.40
1.7*
V
T
A
= 25
C
I
F
= 1.6 mA
4, 8
Voltage
6N139
HCPL-0701
1.75
HCPL-0700
HCNW139
1.0
1.45
1.85
T
A
= 25
C
HCNW138
0.95
1.95
Input Reverse
BVR
5.0*
V
I
R
= 10
A, T
A
= 25
C
HCNW139
3.0
I
R
= 100
A, T
A
= 25
C
HCNW138
Temperature
V
F
-1.8
mV/
C I
F
= 1.6 mA
8
Coefficient of
T
A
Forward Voltage
Input
C
IN
60
pF
f = 1 MHz, V
F
= 0 V
Capacitance
HCNW139
90
HCNW138
*JEDEC Registered Data for 6N139 and 6N138.
**All typical values at T
A
= 25
C and V
CC
= 5 V, unless otherwise noted.
Breakdown
Voltage
11
Switching Specifications (AC)
Over recommended operating conditions (T
A
= 0 to 70
C), V
CC
= 5 V, unless otherwise specified.
Parameter
Sym.
Device
Min.
Typ.**
Max. Units Test Conditions
Fig.
Note
Propagation Delay
t
PHL
6N139
5
25*
s
T
A
= 25
C
5, 6,
2, 4
30
I
F
= 0.5 mA,
Rl = 4.7 k
6N139
0.2
1*
s
T
A
= 25
C
2
I
F
= 12 mA,
Rl = 270
HCNW139
1.1
6N138
1.6
10*
s
T
A
= 25
C
I
F
= 1.6 mA,
15
Rl = 2.2 k
HCNW138
11
Propagation Delay
t
PLH
6N139
18
60*
s
T
A
= 25
C
5, 6,
2, 4
90
I
F
= 0.5 mA,
Rl = 4.7 k
HCNW139
115
6N139
2
7*
s
T
A
= 25
C
10
I
F
= 12 mA,
HCNW139
Rl = 270
HCNW139
1.1
6N138
10
35*
s
T
A
= 25
C
I
F
= 1.6 mA,
Rl = 2.2 k
6N138
50
HCPL-0700
HCNW139
70
Common Mode
|CM
H
|
1000
10000
V/
s
I
F
= 0 mA,
13
5, 6
Transient Immunity
T
A
= 25
C
at Logic High Output
Rl = 2.2 k
|V
CM
| = 10 Vp-p
Common Mode
|CM
L
|
1000
10000
V/
s
I
F
= 1.6 mA,
13
5, 6
Transient Immunity
T
A
= 25
C
at Logic Low Output
Rl = 2.2 k
|V
CM
| = 10 Vp-p
*JEDEC Registered Data for 6N139 and 6N138.
**All typical values at T
A
= 25
C and V
CC
= 5 V, unless otherwise noted.
Time to Logic Low at
Output
HCPL-0701
HCNW139
HCPL-0701
HCPL-0700
HCNW138
Time to Logic High
at Output
HCPL-0701
HCNW139
HCPL-0701
HCPL-0700
HCNW138
7, 9,
12
7, 9,
12
12
Package Characteristics
Parameter
Sym.
Min.
Typ.**
Max. Units
Test Conditions
Fig.
Note
Input-Output Momentary
V
ISO
2500
V rms
RH < 50%, t = 1 min.,
3, 8
Withstand Voltage
T
A
= 25
C
Option 020
5000
3, 9
HCNW139
HCNW138
Resistance (Input-Output)
R
I-O
10
12
V
I-O
= 500 Vdc
3
RH < 45%
Capacitance (Input-Output)
C
I-O
0.6
pF
f = 1 MHz
3
**All typicals at T
A
= 25
C, unless otherwise noted.
The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output
continuous voltage rating. For the continuous voltage rating refer to the VDE 0884 Insulation Characteristics Table (if applicable),
your equipment level safety specification or HP Application Note 1074 entitled "Optocoupler Input-Output Endurance Voltage."
Notes:
1. DC CURRENT TRANSFER RATI0
(CTR) is defined as the ratio of output
collector current, I
O
, to the forward
LED input current, I
F
, times 100%.
2. Pin 7 Open.
3. Device considered a two-terminal
device. Pins 1, 2, 3, and 4 shorted
together and Pins 5, 6, 7, and 8 shorted
together.
4. Use of a resistor between pin 5 and 7
will decrease gain and delay time.
Significant reduction in overall gain can
occur when using resistor values below
47 k
. For more information, please
contact your local HP Components
representative.
5. Common mode transient immunity in a
Logic High level is the maximum toler-
able (positive) dV
CM
/dt of the common
mode pulse, V
CM
, to assure that the
output will remain in a Logic High state
(i.e., V
O
> 2.0 V). Common mode
transient immunity in a Logic Low level
is the maximum tolerable (negative)
dV
CM
/dt of the common mode pulse,
V
CM
, to assure that the output will
remain in a Logic Low state (i.e.,
V
O
< 0.8 V).
6. In applications where dV/dt may exceed
50,000 V/
s (such as static discharge) a
series resistor, R
CC
, should be included
to protect the detector IC from
destructively high surge currents. The
recommended value is R
CC
= 220
.
7. Use of a 0.1
F bypass capacitor
connected between pins 8 and 5
adjacent to the device is recommended.
8. In accordance with UL 1577, each
optocoupler is proof tested by applying
an insulation test voltage 3000 V rms
for 1 second (leakage detection current
limit, I
I-O
< 5
A). This test is per-
formed before the 100% production test
shown in the VDE 0884 Insulation
Related Characteristics Table, if
applicable.
9. In accordance with UL 1577, each
optocoupler is proof tested by applying
an insulation test voltage > 6000 V rms
for 1 second (leakage detection current
limit, I
I-O
< 5
A). This test is per-
formed before the 100% production test
for partial discharge (method b) shown
in the VDE 0884 Insulation Related
Characteristics Table, if applicable.
13
RL LOAD RESISTANCE k
100
0.1
1.0
TIME s
10
10
1
IF ADJUSTED FOR VOL = 2 V
TA = 25 C
tf
tr
Figure 1. 6N138/6N139 DC Transfer
Characteristics.
Figure 6. Propagation Delay vs.
Temperature.
Figure 5. Propagation Delay vs.
Temperature.
Figure 2. Current Transfer Ratio vs.
Forward Current 6N138/6N139.
Figure 3. 6N138/6N139 Output
Current vs. Input Diode Forward
Current.
Figure 4. Input Diode Forward
Current vs. Forward Voltage.
Figure 7. Propagation Delay vs.
Temperature.
Figure 8. Forward Voltage vs.
Temperature.
Figure 9. Nonsaturated Rise and Fall
Times vs. Load Resistance.
0
1.0
2.0
VO OUTPUT VOLTAGE V
I
O
OUTPUT CURRENT mA
50
25
0
5.0 mA
TA = 25 C
VCC = 5 V
4.5 mA
4.0 mA
3.5 mA
3.0 mA
2.5 mA
2.0 mA
1.5 mA
1.0 mA
0.5 mA
IF FORWARD CURRENT mA
2000
1600
800
400
0.1
1.0
CTR CURRENT TRANSFER RATIO %
10
1200
0
VCC = 5 V
VO = 0.4 V
85C
70C
25C
70C
-40C
IF INPUT DIODE FORWARD CURRENT mA
0.01
0.01
0.1
10
I
O
OUTPUT CURRENT mA
0.1
1.0
10
100
TA = 25 C
TA = 0 C
TA = 70 C
TA = 85 C
TA = -40 C
1
1.6
1.5
1.4
1.3
-60
-20
20
40
100
V
F
FORWARD VOLTAGE V
TA TEMPERATURE C
60
80
0
-40
1.2
IF = 1.6 mA
VF FORWARD VOLTAGE V
100
10
0.1
0.01
1.1
1.2
1.3
1.4
I F
FORWARD CURRENT mA
1.6
1.5
1.0
0.001
1000
VF
+
TA = 25C
TA = 0C
IF
TA = 85C
TA = 70C
TA = -40C
40
35
30
25
20
10
-60
-20
20
40
100
t P
PROPAGATION DELAY s
TA TEMPERATURE C
5
60
80
0
-40
0
IF = 0.5 mA
RL = 4.7 k
1/f = 50 s
15
tPLH
tPHL
24
21
18
15
12
6
-60
-20
20
40
100
t P
PROPAGATION DELAY s
TA TEMPERATURE C
3
60
80
0
-40
0
IF = 1.6 mA
RL = 2.2 k
1/f = 50 s
9
tPLH
tPHL
4
3
2
1
-60
-20
20
40
100
t P
PROPAGATION DELAY s
TA TEMPERATURE C
60
80
0
-40
0
IF = 12 mA
RL = 270 k
1/f = 50 s
tPLH
tPHL
14
VO
PULSE
GEN.
Z = 50
t = 5 ns
O
r
I MONITOR
F
IF
0.1 F
L
R
CL = 15 pF*
RM
0
tPHL
tPLH
O
V
IF
OL
V
1.5 V
1.5 V
5 V
+5 V
7
1
2
3
4
5
6
8
10% DUTY CYCLE
I/f < 100 s
(SATURATED
RESPONSE)
tf
tr
O
V
(NON-SATURATED
RESPONSE)
5 V
90%
10%
90%
10%
* INCLUDES PROBE AND
FIXTURE CAPACITANCE
Figure 12. Switching Test Circuit.
Figure 11. Thermal Derating Curve,
Dependence of Safety Limiting Value
with Case Temperature per VDE 0884.
Figure 10. Logic Low Supply Current
vs. Forward Current.
0.8
0.6
0.4
0.2
0
4
8
10
16
I CCL
LOGIC LOW SUPPLY CURRENT mA
IF FORWARD CURRENT
12
14
6
2
0
VCC = 18 V
0.1
0.3
0.5
0.7
VCC = 5 V
OUTPUT POWER P
S
, INPUT CURRENT I
S
0
0
TS CASE TEMPERATURE C
175
1000
50
400
125
25
75
100
150
600
800
200
100
300
500
700
900
PS (mW)
IS (mA)
WIDEBODY
15
Figure 13. Test Circuit for Transient Immunity and Typical Waveforms.
VO
IF
L
R
A
B
PULSE GEN.
VCM
+
VFF
O
V
OL
V
O
V
0 V 10%
90%
90%
10%
SWITCH AT A: I = 0 mA
F
SWITCH AT B: I = 1.6 mA
F
CM
V
tr
tf
5 V
+5 V
7
1
2
3
4
5
6
8
RCC (SEE NOTE 6)
10 V
tr, tf = 16 ns
For technical assistance or the location of
your nearest Hewlett-Packard sales office,
distributor or representative call:
Americas/Canada: 1-800-235-0312 or
408-654-8675
Far East/Australasia: Call your local HP
sales office.
Japan: (81 3) 3335-8152
Europe: Call your local HP sales office.
Data subject to change.
Copyright 1998 Hewlett-Packard Co.
Obsoletes 5965-3599E
Printed in U.S.A.
5968-1085E (7/98)
www.hp.com/go/isolator
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