ChipFind - документация

Электронный компонент: 8302401FX

Скачать:  PDF   ZIP

Document Outline

1
3
2
4
8
6
7
5
VCC
GND
VOUT
Hermetically Sealed, Low I
F
,
Wide V
CC
, High Gain
Optocouplers
Technical Data
Features
Dual Marked with Device
Part Number and DSCC
Drawing Number
Manufactured and Tested on
a MIL-PRF-38534 Certified
Line
QML-38534, Class H and K
Five Hermetically Sealed
Package Configurations
Performance Guaranteed,
Over -55
C to +125
C
Low Input Current
Requirement: 0.5 mA
High Current Transfer
Ratio: 1500% Typical @
I
F
= 0.5 mA
Low Output Saturation
Voltage: 0.11 V Typical
1500 Vdc Withstand Test
Voltage
High Radiation Immunity
6N138/9, HCPL-2730/31
Function Compatibility
Reliability Data
Applications
Military and Space
High Reliability Systems
Telephone Ring Detection
Microprocessor System
Interface
Transportation, Medical, and
Life Critical Systems
Isolated Input Line Receiver
EIA RS-232-C Line Receiver
Voltage Level Shifting
Isolated Input Line Receiver
Isolated Output Line Driver
Logic Ground Isolation
Harsh Industrial Environments
Current Loop Receiver
System Test Equipment
Isolation
Process Control
Input/Output Isolation
Description
These units are single, dual, and
quad channel, hermetically sealed
optocouplers. The products are
capable of operation and storage
over the full military temperature
range and can be purchased as
either standard product or with
full MIL-PRF-38534 Class Level
H or K testing or from the appro-
priate DSCC Drawing. All devices
are manufactured and tested on a
MIL-PRF-38534 certified line and
are included in the DSCC Quali-
fied Manufacturers List QML-
38534 for Hybrid Microcircuits.
Each channel contains a GaAsP
light emitting diode which is
optically coupled to an integrated
high gain photon detector. The
high gain output stage features
an open collector output providing
both lower saturation voltage and
higher signaling speed than
possible with conventional photo-
Darlington optocouplers. The
shallow depth and small junctions
offered by the IC process
provides better radiation
immunity than conventional
photo transistor optocouplers.
The supply voltage can be
operated as low as 2.0 V without
adversely affecting the
parametric performance.
Functional Diagram
Multiple Channel Devices
Available
Truth Table
(Positive Logic)
Input
Output
On (H)
L
Off (L)
H
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
*See matrix for available extensions.
5962-89810
HCPL-573X
HCPL-673X
5962-89785
5962-98002
6N140A*
HCPL-675X
83024
HCPL-570X
HCPL-177K
The connection of a 0.1
F bypass capacitor between V
CC
and GND is recommended.
2
These devices have a 300%
minimum CTR at an input current
of only 0.5 mA making them ideal
for use in low input current
applications such as MOS, CMOS,
low power logic interfaces or line
receivers. Compatibility with high
voltage CMOS logic systems is
assured by specifying I
CCH
and
I
OH
at 18 Volts.
Upon special request, the follow-
ing device selections can be
made: CTR minimum of up to
600% at 0.5 mA, and lower
output leakage current levels to
100
A.
Package styles for these parts are
8 and 16 pin DIP through hole
(case outlines P and E respec-
tively), 16 pin DIP flat pack (case
outline F), and leadless ceramic
chip carrier (case outline 2).
Devices may be purchased with a
variety of lead bend and plating
options. See Selection Guide
table for details. Standard
Military Drawing (SMD) parts are
available for each package and
lead style.
Because the same electrical die
(emitters and detectors) are used
for each channel of each device
listed in this data sheet, absolute
maximum ratings, recommended
operating conditions, electrical
specifications, and performance
characteristics shown in the
figures are similar for all parts
except as noted. Additionally, the
same package assembly processes
and materials are used in all
devices. These similarities justify
the use of a common data base
for die related reliability and
certain limited radiation test
results.
Selection Guide-Package Styles and Lead Configuration Options
16 pin
20 Pad
Package
16 pin DIP
8 pin DIP
8 pin DIP
Flat Pack
LCCC
Lead Style
Through Hole
Through Hole
Through Hole
Unformed Leads
Surface Mount
Channels
4
1
2
4
2
Common Channel Wiring
V
CC
, GND
None
V
CC
, GND
V
CC
, GND
None
Agilent Part # & Options
Commercial
6N140A*
HCPL-5700
HCPL-5730
HCPL-6750
HCPL-6730
MIL-PRF-38534 Class H
6N140A/883B
HCPL-5701
HCPL-5731
HCPL-6751
HCPL-6731
MIL-PRF-38534 Class K
HCPL-177K
HCPL-570K
HCPL-573K
HCPL-675K
HCPL-673K
Standard Lead Finish
Gold Plate
Gold Plate
Gold Plate
Gold Plate
Solder Pads
Solder Dipped
Option #200
Option #200
Option #200
Butt Cut/Gold Plate
Option #100
Option #100
Option #100
Gull Wing/Soldered
Option #300
Option #300
Option #300
Crew Cut/Gold Plate
Option #600
Option #600
Option #600
Class H SMD Part #
Prescript for all below
None
5962-
5962-
None
5962-
Either Gold or Solder
8302401EX
8981001PX
8978501PX
8302401FX
89785022X
Gold Plate
8302401EC
8981001PC
8978501PC
8302401FC
Solder Dipped
8302401EA
8981001PA
8978501PA
89785022A
Butt Cut/Gold Plate
8302401YC
8981001YC
8978501YC
Butt Cut/Soldered
8302401YA
8981001YA
8978501YA
Gull Wing/Soldered
8302401XA
8981001XA
8978501ZA
Crew Cut/Gold Plate
8302401ZC
Available
Available
Crew Cut/Soldered
8302401ZA
Available
Available
Class K SMD Part #
Prescript for all below
5962-
5962-
5962-
5962-
5962-
Either Gold or Solder
9800201KEX
8981002KPX
8978503KPX
9800201KFX
8978504K2X
Gold Plate
9800201KEC
8981002KPC
8978503KPC
9800201KFC
Solder Dipped
9800201KEA
8981002KPA
8978503KPA
8978504K2A
Butt Cut/Gold Plate
9800201KYC
8981002KYC
8978503KYC
Butt Cut/Soldered
9800201KYA
8981002KYA
8978503KYA
Gull Wing/Soldered
9800201KXA
8981002KXA
8978503KZA
Crew Cut/Gold Plate
9800201KZC
Available
Available
Crew Cut/Soldered
9800201KZA
Available
Available
*JEDEC registered part.
3
Functional Diagrams
16 pin DIP
8 pin DIP
8 pin DIP
16 pin Flat Pack
20 Pad LCCC
Through Hole
Through Hole
Through Hole
Unformed Leads
Surface Mount
4 Channels
1 Channel
2 Channels
4 Channels
2 Channels
Note: All DIP and flat pack devices have common V
CC
and ground. LCCC (leadless ceramic chip carrier) package has isolated channels
with separate V
CC
and ground connections.
5
7
6
8
12
10
11
9
GND
V
O4
V
O3
1
3
2
4
16
14
15
13
V
CC
V
O2
V
O1
1
3
2
4
8
6
7
5
V
CC
GND
V
O2
V
O1
5
7
6
8
12
10
11
9
GND
V
O4
V
O3
1
3
2
4
16
14
15
13
V
CC
V
O2
V
O1
Outline Drawings
16 Pin DIP Through Hole, 4 Channels
Leadless Device Marking
Leaded Device Marking
1
3
2
4
8
6
7
5
V
CC
GND
V
OUT
4.45 (0.175)
MAX.
20.06 (0.790)
20.83 (0.820)
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
0.89 (0.035)
1.65 (0.065)
8.13 (0.320)
MAX.
7.36 (0.290)
7.87 (0.310)
0.20 (0.008)
0.33 (0.013)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
3.81 (0.150)
MIN.
GND
1
V
O2
19
20
2
3
V
O1
8
7
V
CC2
V
CC1
10
GND
2
15
13
12
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
50434
Agilent DESIGNATOR
Agilent P/N
DSCC SMD*
DSCC SMD*
PIN ONE/
ESD IDENT
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
Agilent CAGE CODE*
*QUALIFIED PARTS ONLY
A QYYWWZ
XXXXXX
XXXX
XXXXXX
XXX 50434
Agilent DESIGNATOR
Agilent P/N
PIN ONE/
ESD IDENT
COUNTRY OF MFR.
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
DSCC SMD*
DSCC SMD*
Agilent CAGE CODE*
*QUALIFIED PARTS ONLY
4
Outline Drawings (continued)
16 Pin Flat Pack, 4 Channels
20 Terminal LCCC Surface Mount, 2 Channels
8 Pin DIP Through Hole, 1 and 2 Channel
8.13 (0.320)
MAX.
5.23
(0.206)
MAX.
2.29 (0.090)
MAX.
7.24 (0.285)
6.99 (0.275)
1.27 (0.050)
REF.
0.46 (0.018)
0.36 (0.014)
11.13 (0.438)
10.72 (0.422)
2.85 (0.112)
MAX.
0.89 (0.035)
0.69 (0.027)
0.31 (0.012)
0.23 (0.009)
0.88 (0.0345)
MIN.
9.02 (0.355)
8.76 (0.345)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
1.02 (0.040) (3 PLCS)
4.95 (0.195)
5.21 (0.205)
8.70 (0.342)
9.10 (0.358)
1.78 (0.070)
2.03 (0.080)
0.51 (0.020)
0.64
(0.025)
(20 PLCS)
1.52 (0.060)
2.03 (0.080)
METALIZED
CASTILLATIONS (20 PLCS)
2.16 (0.085)
TERMINAL 1 IDENTIFIER
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
1.14 (0.045)
1.40 (0.055)
3.81 (0.150)
MIN.
4.32 (0.170)
MAX.
9.40 (0.370)
9.91 (0.390)
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
0.76 (0.030)
1.27 (0.050)
8.13 (0.320)
MAX.
7.36 (0.290)
7.87 (0.310)
0.20 (0.008)
0.33 (0.013)
7.16 (0.282)
7.57 (0.298)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
5
Hermetic Optocoupler Options
Option
Description
100
200
300
600
Lead finish is solder dipped rather than gold plated. This option is available on commercial and hi-rel
product in 8 and 16 pin DIP. DSCC Drawing part numbers contain provisions for lead finish. All leadless
chip carrier devices are delivered with solder dipped terminals as a standard feature.
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is
available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details). Contact
factory for the availability of this option on DSCC part types.
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is
available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details). This
option has solder dipped leads.
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is
available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details).
1.14 (0.045)
1.40 (0.055)
4.32 (0.170)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
1.14 (0.045)
1.40 (0.055)
4.32 (0.170)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
7.36 (0.290)
7.87 (0.310)
0.20 (0.008)
0.33 (0.013)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
1.40 (0.055)
1.65 (0.065)
4.57 (0.180)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
1.14 (0.045)
1.25 (0.049)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
7.36 (0.290)
7.87 (0.310)
0.20 (0.008)
0.33 (0.013)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
3.81 (0.150)
MAX.
1.02 (0.040)
TYP.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
0.51 (0.020)
MIN.
4.57 (0.180)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
9.65 (0.380)
9.91 (0.390)
5 MAX.
4.57 (0.180)
MAX.
0.20 (0.008)
0.33 (0.013)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).