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This document contains information on a product under development at Advanced Micro Devices. The information
is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed
product without notice.

Publication# 25686

Rev: B Amendment/8

Issue Date: February 9, 2005

Refer to AMD's Website (www.amd.com) for the latest information.

Am29DL32xG

32 Megabit (4 M x 8-Bit/2 M x 16-Bit)
CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory

DISTINCTIVE CHARACTERISTICS

ARCHITECTURAL ADVANTAGES
Simultaneous Read/Write operations

-- Data can be continuously read from one bank while

executing erase/program functions in other bank

-- Zero latency between read and write operations

Multiple bank architectures

-- Three devices available with different bank sizes

(refer to Table 3)

256-byte SecSiTM (Secured Silicon) Sector

-- Factory locked and identifiable: 16 bytes available for

secure, random factory Electronic Serial Number;
verifiable as factory locked through autoselect
function. ExpressFlash option allows entire sector to
be available for factory-secured data

-- Customer lockable: One time programmable. Once

locked, data cannot be changed.

Zero Power Operation

-- Sophisticated power management circuits reduce

power consumed during inactive periods to nearly
zero

Package options

-- 63-ball FBGA

-- 48-ball FBGA

-- 48-pin TSOP

-- 64-ball Fortified BGA

Top or bottom boot block
Manufactured on 0.17 µm process technology
Compatible with JEDEC standards

-- Pinout and software compatible with

single-power-supply flash standard

PERFORMANCE CHARACTERISTICS
High performance

-- Access time as fast 70 ns

-- Program time: 4 µs/word typical utilizing Accelerate

function

Ultra low power consumption (typical values)

-- 2 mA active read current at 1 MHz

-- 10 mA active read current at 5 MHz

-- 200 nA in standby or automatic sleep mode

Minimum 1 million erase cycles guaranteed per

sector

20 year data retention at 125°C

-- Reliable operation for the life of the system

SOFTWARE FEATURES
Data Management Software (DMS)

-- AMD-supplied software manages data programming,

enabling EEPROM emulation

-- Eases historical sector erase flash limitations

Supports Common Flash Memory Interface (CFI)
Erase Suspend/Erase Resume

-- Suspends erase operations to allow programming in

same bank

Data# Polling and Toggle Bits

-- Provides a software method of detecting the status of

program or erase cycles

Unlock Bypass Program command

-- Reduces overall programming time when issuing

multiple program command sequences

HARDWARE FEATURES
Any combination of sectors can be erased
Ready/Busy# output (RY/BY#)

-- Hardware method for detecting program or erase

cycle completion

Hardware reset pin (RESET#)

-- Hardware method of resetting the internal state

machine to the read mode

WP#/ACC input pin

-- Write protect (WP#) function allows protection of two

outermost boot sectors, regardless of sector protect
status

-- Acceleration (ACC) function accelerates program

timing

Sector protection

-- Hardware method of locking a sector, either

in-system or using programming equipment, to
prevent any program or erase operation within that
sector

-- Temporary Sector Unprotect allows changing data in

protected sectors in-system

For new designs involving TSOP packages, S29JL032H supersedes Am29DL32xG and is the factory recom-
mended migration path. Please refer to the S29JL032H Datasheet for specifications and ordering information.

For new designs involving Fine-pitch BGA (FBGA) packages, S29PL032J supersedes Am29DL32xG and is the
factory-recommended migration path. Please refer to the S29PL032J Datasheet for specifications and ordering
information.

Am29DL32xG

February 9, 2005

D A T A S H E E T

GENERAL DESCRIPTION

The Am29DL32xG family consists of 32 megabit, 3.0
vol t -o n l y fl a sh m e m o r y d ev ic e s, o rg a n ized a s
2,097,152 words of 16 bits each or 4,194,304 bytes of
8 bits each. Word mode data appears on DQ15DQ0;
byte mode data appears on DQ7DQ0. The device is
designed to be programmed in-system with the stan-
dard 3.0 volt V

supply, and can also be programmed

in standard EPROM programmers.

The devices are available with an access time of 70,
90, or 120 ns. The devices are offered in 48-pin TSOP,
48-ball or 63-ball FBGA, and 64-ball Fortified BGA
packages. Standard control pins--chip enable (CE#),
write enable (WE#), and output enable (OE#)--control
normal read and write operations, and avoid bus con-
tention issues.

The devices requires only a single 3.0 volt power
supply for both read and write functions. Internally
generated and regulated voltages are provided for the
program and erase operations.

Simultaneous Read/Write Operations with
Zero Latency

The Simultaneous Read/Write architecture provides
simultaneous operation by dividing the memory
space into two banks. The device can improve overall
system performance by allowing a host system to pro-
gram or erase in one bank, then immediately and si-
multaneously read from the other bank, with zero
latency. This releases the system from waiting for the
completion of program or erase operations.

The Am29DL32xG device family uses multiple bank
architectures to provide flexibility for different applica-
tions. Three devices are available with the following
bank sizes:

Am29DL32xG Features

The

SecSi

(Secured Silicon) Sector

is an extra sector

capable of being permanently locked by AMD or cus-
tomers. The SecSi Indicator Bit (DQ7) is perma-
nently set to a 1 if the part is factory locked, and set
to a 0 if customer lockable. This way, customer lock-
able parts can never be used to replace a factory
locked par t. Current version of device has 256
bytes, which differs from previous versions of this
device.

Factory locked parts provide several options. The
SecSi Sector may store a secure, random 16 byte
ESN (Electronic Serial Number), customer code (pro-

grammed through AMD's ExpressFlash service), or
both.

DMS (Data Management Software) allows systems
to easily take advantage of the advanced architecture
of the simultaneous read/write product line by allowing
removal of EEPROM devices. DMS will also allow the
system software to be simplified, as it will perform all
functions necessary to modify data in file structures,
as opposed to single-byte modifications. To write or
update a particular piece of data (a phone number or
configuration data, for example), the user only needs
to state which piece of data is to be updated, and
where the updated data is located in the system. This
i s a n a d va n t a g e c o m p a r e d t o s y s t e m s w h e r e
user-written software must keep track of the old data
location, status, logical to physical translation of the
data onto the Flash memory device (or memory de-
vices), and more. Using DMS, user-written software
does not need to interface with the Flash memory di-
rectly. Instead, the user's software accesses the Flash
memory by calling one of only six functions. AMD pro-
vides this software to simplify system design and soft-
ware integration efforts.

The device offers complete compatibility with the
JEDEC single-power-supply Flash command set
standard. Commands are written to the command
register using standard microprocessor write timings.
Reading data out of the device is similar to reading
from other Flash or EPROM devices.

The host system can detect whether a program or
erase operation is complete by using the device sta-
tus bits: RY/BY# pin, DQ7 (Data# Polling) and
DQ6/DQ2 (toggle bits). After a program or erase cycle
has been completed, the device automatically returns
to the read mode.

The sector erase architecture allows memory sec-
tors to be erased and reprogrammed without affecting
the data contents of other sectors. The device is fully
erased when shipped from the factory.

Hardware data protection measures include a low
V

detector that automatically inhibits write opera-

tions during power transitions. The hardware sector
protection feature disables both program and erase
operations in any combination of the sectors of mem-
ory. This can be achieved in-system or via program-
ming equipment.

The device offers two power-saving features. When
addresses have been stable for a specified amount of
time, the device enters the automatic sleep mode.
The system can also place the device into the
standby mode. Power consumption is greatly re-
duced in both modes.

Device

Bank 1

Bank 2

DL322

DL323

DL324

February 9, 2005

Am29DL32xG

D A T A S H E E T

TABLE OF CONTENTS

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . .4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . .5
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . .8
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 10

Table 1. Device Bus Operations .........................................................10

Word/Byte Configuration .................................................................................10
Requirements for Reading Array Data ......................................................... 10
Writing Commands/Command Sequences .................................................. 11

Accelerated Program Operation ................................................................ 11
Autoselect Functions ...................................................................................... 11

Simultaneous Read/Write Operations
with Zero Latency ............................................................................................... 11
Standby Mode .........................................................................................................11
Automatic Sleep Mode ....................................................................................... 11
RESET#: Hardware Reset Pin ......................................................................... 12
Output Disable Mode ........................................................................................ 12

Table 2. Device Bank Divisions ..........................................................12
Table 3. Top Boot Sector Addresses .................................................13
Table 4. Top Boot SecSi

Sector Addresses ......................................14

Table 5. Bottom Boot Sector Addresses .............................................15
Table 6. Bottom Boot SecSi

Sector Addresses ................................16

Autoselect Mode ..................................................................................................17

Table 7. Autoselect Codes, (High Voltage Method) .............................17

Sector/Sector Block Protection and Unprotection ...................................18

Table 8. Top Boot Sector/Sector Block Addresses
for Protection/Unprotection ...............................................................18
Table 9. Bottom Boot Sector/Sector Block Addresses
for Protection/Unprotection ...............................................................18

Write Protect (WP#) ........................................................................................ 19
Temporary Sector Unprotect ......................................................................... 19

Figure 1. Temporary Sector Unprotect Operation ............................... 19
Figure 2. In-System Sector Protection/
Sector Unprotection Algorithms......................................................... 20

SecSi

(Secured Silicon) Sector

Flash Memory Region ........................................................................................ 21

Factory Locked: SecSi Sector Programmed and Protected At the Fac-
tory ...................................................................................................................... 21
Customer Lockable: SecSi Sector NOT Programmed or Protected At
the Factory ........................................................................................................ 21

Hardware Data Protection .............................................................................. 21

Low VCC Write Inhibit ............................................................................... 22
Write Pulse "Glitch" Protection ............................................................... 22
Logical Inhibit .................................................................................................. 22
Power-Up Write Inhibit ............................................................................... 22

Common Flash Memory Interface (CFI) . . . . . . .22

Table 10. CFI Query Identification String............................................. 22
Table 11. System Interface String...................................................... 23
Table 12. Device Geometry Definition................................................. 23
Table 13. Primary Vendor-Specific Extended Query............................. 24

Command Definitions . . . . . . . . . . . . . . . . . . . . . .24

Reading Array Data ........................................................................................... 24
Reset Command ..................................................................................................25
Autoselect Command Sequence ....................................................................25
Enter SecSi

Sector/Exit SecSi Sector

Command Sequence ..........................................................................................25
Byte/Word Program Command Sequence .................................................25

Unlock Bypass Command Sequence ........................................................26

Figure 3. Program Operation............................................................. 26

Chip Erase Command Sequence ...................................................................26
Sector Erase Command Sequence ................................................................ 27
Erase Suspend/Erase Resume Commands .................................................. 27

Figure 4. Erase Operation.................................................................. 28
Table 14. Command Definitions......................................................... 29

Write Operation Status . . . . . . . . . . . . . . . . . . . . . 30

DQ7: Data# Polling ............................................................................................30

Figure 5. Data# Polling Algorithm...................................................... 30

RY/BY#: Ready/Busy# .........................................................................................31
DQ6: Toggle Bit I ................................................................................................ 31

Figure 6. Toggle Bit Algorithm........................................................... 31

DQ2: Toggle Bit II .............................................................................................. 32
Reading Toggle Bits DQ6/DQ2 ..................................................................... 32
DQ5: Exceeded Timing Limits ........................................................................ 32
DQ3: Sector Erase Timer ................................................................................ 32

Table 15. Write Operation Status .......................................................33

Absolute Maximum Ratings . . . . . . . . . . . . . . . . . 34

Figure 7. Maximum Negative Overshoot Waveform............................ 34
Figure 8. Maximum Positive Overshoot Waveform.............................. 34

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 35

Figure 9. I

CC1

Current vs. Time (Showing Active and

Automatic Sleep Currents)................................................................ 36
Figure 10. Typical I

CC1

vs. Frequency................................................. 36

Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Figure 11. Test Setup....................................................................... 37
Figure 12. Input Waveforms and Measurement Levels........................ 37

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 38

Figure 13. Read Operation Timings.................................................... 38
Figure 14. Reset Timings................................................................... 39

Word/Byte Configuration (BYTE#) ..............................................................40

Figure 15. BYTE# Timings for Read Operations................................... 40
Figure 16. BYTE# Timings for Write Operations.................................. 40

Erase and Program Operations .......................................................................41

Figure 17. Program Operation Timings............................................... 42
Figure 18. Accelerated Program Timing Diagram................................ 42
Figure 19. Chip/Sector Erase Operation Timings................................. 43
Figure 20. Back-to-back Read/Write Cycle Timings............................. 44
Figure 21. Data# Polling Timings (During Embedded Algorithms)........ 44
Figure 22. Toggle Bit Timings (During Embedded Algorithms)............. 45
Figure 23. DQ2 vs. DQ6.................................................................... 45

Temporary Sector Unprotect ........................................................................46

Figure 24. Temporary Sector Unprotect Timing Diagram..................... 46
Figure 25. Sector/Sector Block Protect and Unprotect Timing Diagram. 47

Alternate CE# Controlled Erase and Program Operations .................48

Figure 26. Alternate CE# Controlled Write (Erase/Program)
Operation Timings............................................................................ 49

Erase And Programming Performance . . . . . . . . 50
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 50
TSOP Pin and Fine-Pitch BGA Capacitance. . . . 50
Data Retention . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . 51

FBD063--63-ball Fine-Pitch Ball Grid Array (FBGA) 8 x 14 mm .......... 51
FBD048--Fine-Pitch Ball Grid Array, 6 x 12 mm ..................................... 52
TS 048--Thin Small Outline Package .......................................................... 53

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . . 55

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: AM29DL323GB70

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: AM29DL323GB70