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Электронный компонент: FS6244-03

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American Microsystems, Inc. reserves the right to change the detail specifications as may be required to permit improvements in the design of its products.
2.28.02
FS6244
FS6244
FS6244
FS6244
Dual PLL Clock Generator IC
Dual PLL Clock Generator IC
Dual PLL Clock Generator IC
Dual PLL Clock Generator IC
ISO9001
ISO9001
ISO9001
ISO9001
1.0 Features
Dual phase-locked loop (PLL) device with three out-
put clock frequencies
On-chip crystal oscillator for reference frequency
generation
3.3V or 5V supply voltage available
Small circuit board footprint (16-pin 0.150
SOIC)
Custom frequency selections available - contact your
local AMI Sales Representative for more information
Figure 1: Pin Configuration
1
16
2
3
4
5
6
7
8
15
14
13
12
11
10
9
n/c
XOUT
XIN
VDD
VSS
CLKA
n/c
n/c
n/c
CLKC
VSS
n/c
VDD
CLKB
n/c
n/c
FS6244
16-pin (0.150
) SOIC
2.0 Description
The FS6244 is a monolithic CMOS clock generator IC
designed to minimize cost and component count in digital
video/audio systems.
Two high-resolution phase-locked loops generate three
output clocks through an array of post-dividers. All fre-
quencies are ratiometrically derived from the crystal os-
cillator frequency. The locking of all the output frequen-
cies together can eliminate unpredictable artifacts in
video systems and reduce electromagnetic interference
(EMI) due to frequency harmonic stacking.
Table 1: Version Information
DEVICE
VDD
(nom)
F
XIN
(MHz)
CLKA
(MHz)
CLKB
(MHz)
CLKC
(MHz)
FS6244-03
5
27.000
11.2896
(+1.1 ppm)
3.6864
27.000
NOTE: Contact AMI for custom versions
Figure 2: Block Diagram
CRYSTAL
OSC.
FS6244
PLL
XOUT
XIN
CLKC
CLKA
DIVIDER
ARRAY
PLL
CLKB
2
2.28.02
FS6244
FS6244
FS6244
FS6244
Dual PLL Clock Generator IC
Dual PLL Clock Generator IC
Dual PLL Clock Generator IC
Dual PLL Clock Generator IC
ISO9001
ISO9001
ISO9001
ISO9001
Table 2: Pin Descriptions
Key: AI = Analog Input; AO = Analog Output; DI = Digital Input; DI
U
= Input with Internal Pull-Up; DI
D
= Input with Internal Pull-Down; DIO = Digital Input/Output; DI-3 = Three-Level Digital Input,
DO = Digital Output; P = Power/Ground; # = Active Low pin
PIN
TYPE
NAME
DESCRIPTION
1
-
N/C
No Connection
2
AO
XOUT
Crystal Oscillator Drive
3
AI
XIN
Crystal Oscillator Feedback
4
P
VDD
Power Supply (+3.3V or +5V)
5
P
VSS
Ground
6
DO
CLKA
Clock Output A
7
-
N/C
No Connection
8
-
N/C
No Connection
9
-
N/C
No Connection
10
DO
CLKC
Clock Output C
11
P
VSS
Ground
12
-
N/C
No Connection
13
P
VDD
Power Supply (+3.3V or +5V)
14
DO
CLKB
Clock Output B
15
-
N/C
No Connection
16
-
N/C
No Connection
3.0 Functional Block Description
3.1
Phase-Locked Loop (PLL)
The on-chip PLLs are a standard frequency- and phase-
locked loop architecture. The PLL multiplies the reference
oscillator to the desired frequency by a ratio of integers.
The frequency multiplication is exact with a zero synthe-
sis error unless otherwise indicated in the frequency ta-
ble.
3.2 Crystal
Oscillator
The Crystal Oscillator provides a stable, low-jitter fre-
quency reference for the rest of the FS6244 system com-
ponents. Loading capacitance for the crystal is internal to
the FS6244. No external components (other than the
resonator itself) are required for operation of the crystal
oscillator.
3
2.28.02
FS6244
FS6244
FS6244
FS6244
Dual VCXO Clock Generator IC
Dual VCXO Clock Generator IC
Dual VCXO Clock Generator IC
Dual VCXO Clock Generator IC
ISO9001
ISO9001
ISO9001
ISO9001
4.0 Electrical
Specifications
Table 3: Absolute Maximum Ratings
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These conditions represent a stress rating only, and functional operation of the device at
these or any other conditions above the operational limits noted in this specification is not implied. Exposure to maximum rating conditions for extended conditions may affect device performance,
functionality, and reliability.
PARAMETER
SYMBOL
MIN.
MAX.
UNITS
Supply Voltage (V
SS
= ground)
V
DD
V
SS
-0.5
7
V
Input Voltage, dc
V
I
V
SS
-0.5
V
DD
+0.5
V
Output Voltage, dc
V
O
V
SS
-0.5
V
DD
+0.5
V
Input Clamp Current, dc (V
I
< 0 or V
I
> V
DD
)
I
IK
-50
50
mA
Output Clamp Current, dc (V
I
< 0 or V
I
> V
DD
)
I
OK
-50
50
mA
Storage Temperature Range (non-condensing)
T
S
-65
150
C
Ambient Temperature Range, Under Bias
T
A
-55
125
C
Junction Temperature
T
J
125
C
Lead Temperature (soldering, 10s)
260
C
Input Static Discharge Voltage Protection (MIL-STD 883E, Method 3015.7)
2
kV
CAUTION: ELECTROSTATIC SENSITIVE DEVICE
Permanent damage resulting in a loss of functionality or performance may occur if this device is subjected to a high-energy elec-
trostatic discharge.
Table 4: Operating Conditions
PARAMETER
SYMBOL
CONDITIONS/DESCRIPTION
MIN.
TYP.
MAX.
UNITS
Supply Voltage (3.3 volt system)
V
DD
SEE NOTE 1
3.0
3.3
3.6
V
Supply Voltage (5.0 volt system)
V
DD
SEE NOTE 1
4.5
5.0
5.5
V
Ambient Operating Temperature Range
T
A
SEE NOTE 1
0
70
C
Crystal Resonator Frequency
f
XTAL
Fundamental Mode
5
27
MHz
NOTE 1: These specifications represent generic FS6244 device capability. Device specifications for a particular version (i.e. FS6244-xx) are guaranteed only with the operating voltage and refer-
ence frequency specified in Version Information.
4
2.28.02
FS6244
FS6244
FS6244
FS6244
Dual PLL Clock Generator IC
Dual PLL Clock Generator IC
Dual PLL Clock Generator IC
Dual PLL Clock Generator IC
ISO9001
ISO9001
ISO9001
ISO9001
Table 5: DC Electrical Specifications (V
DD
= 3.3V nominal)
Unless otherwise stated, V
DD
= 3.3V 10%, no load on any output, and ambient temperature range T
A
= 0C to 70C. Parameters denoted with an asterisk ( * ) represent nominal characterization
data and are not production tested to any specific limits. Where given, MIN and MAX characterization data are
3
from typical. Negative currents indicate current flows out of the device.
PARAMETER
SYMBOL
CONDITIONS/DESCRIPTION
MIN.
TYP.
MAX.
UNITS
Overall
Supply Current, Dynamic, with Loaded
Outputs
I
DD
f
XTAL
= 27MHz; C
L
= 10pF, V
DD
= 3.3V
(depends on output frequencies)
15
mA
Crystal Oscillator
Crystal Loading Capacitance
C
L(xtal)
As seen by a crystal connected to XIN and
XOUT
17
pF
Crystal Drive Level
R
XTAL
=20
;
200
uW
Crystal Oscillator Feedback (XIN)
Threshold Bias Voltage
V
TH
860
mV
High-Level Input Current
I
IH
34
A
Low-Level Input Current
I
IL
-21
A
Crystal Oscillator Drive (XOUT)
High-Level Output Source Current
I
OH
V(XIN) = 0V, V
O
= 0V
-0.5
mA
Low-Level Output Sink Current
I
OL
V(XIN) = 3.3V, V
O
= 3.3V
15
mA
Clock Outputs (CLKx)
High-Level Output Source Current *
I
OH
V
O
= 2.0V
-40
mA
Low-Level Output Sink Current *
I
OL
V
O
= 0.4V
17
mA
Short Circuit Source Current *
I
OSH
V
O
= 0V; shorted for 30s, max.
-55
mA
Short Circuit Sink Current *
I
OSL
V
O
= 3.3V; shorted for 30s, max.
55
mA
5
2.28.02
FS6244
FS6244
FS6244
FS6244
Dual VCXO Clock Generator IC
Dual VCXO Clock Generator IC
Dual VCXO Clock Generator IC
Dual VCXO Clock Generator IC
ISO9001
ISO9001
ISO9001
ISO9001
Table 6: DC Electrical Specifications (V
DD
= 5V nominal)
Unless otherwise stated, V
DD
= 5.0V 10%, no load on any output, and ambient temperature range T
A
= 0C to 70C. Parameters denoted with an asterisk ( * ) represent nominal characterization
data and are not production tested to any specific limits. Where given, MIN and MAX characterization data are
3
from typical. Negative currents indicate current flows out of the device.
PARAMETER
SYMBOL
CONDITIONS/DESCRIPTION
MIN.
TYP.
MAX.
UNITS
Overall
Supply Current, Dynamic, with Loaded
Outputs
I
DD
f
XTAL
= 27MHz; C
L
= 10pF, V
DD
= 5.0V
(-03 version)
25
mA
Crystal Oscillator
Crystal Loading Capacitance
C
L(xtal)
As seen by a crystal connected to XIN and
XOUT
17
pF
Crystal Drive Level
R
XTAL
=20
;
300
uW
Crystal Oscillator Feedback (XIN)
Threshold Bias Voltage
V
TH
950
mV
High-Level Input Current
I
IH
50
A
Low-Level Input Current
I
IL
-21
A
Crystal Oscillator Drive (XOUT)
High-Level Output Source Current
I
OH
V(XIN) = 0V, V
O
= 0V
-1
mA
Low-Level Output Sink Current
I
OL
V(XIN) = 5V, V
O
= 5V
20
mA
Clock Outputs (CLKx)
High-Level Output Source Current *
I
OH
V
O
= V
DD
0.4V
-25
mA
Low-Level Output Sink Current *
I
OL
V
O
= 0.4V
25
mA
Short Circuit Source Current *
I
OSH
V
O
= 0V; shorted for 30s, max.
-80
mA
Short Circuit Sink Current *
I
OSL
V
O
= 5V; shorted for 30s, max.
80
mA