Aluminum Nitride Terminations
10 Watts, 50
Model RFP-100200N4Z50-2
Outline Drawing
BOTTOM VIEW
SIDE VIEW
TOP VIEW
.100
.200
.035
.020
.040
HATCHED AREA INDICATES
LOCATION OF PROTECTIVE COATING
Aluminum Nitride SMD T
e
rminations
1
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Features
DC 2.0 GHz
10 Watts
Aluminum Nitride (AlN) Ceramic
Surface Mountable
Non-Nichrome Resistive
Element
Low VSWR
100% Tested
Notes: Tolerance is .010, unless otherwise specified. Operating
temperature is -55C to +125C (see chart). Designed to meet or exceed
applicable portions of MIL-E-5400. All dimensions are in inches.
Specifications subject to change without notice.
Electrical Specifications
Resistance Value:
50 ohms, 2%
Frequency Range:
DC - 2.0 GHz
Power:
10 Watts
V.S.W.R.:
1.25:1
General Specifications
Resistive Element:
Thick film
Substrate:
Aluminum nitride ceramic
Terminals:
Tin/Lead, 90/10 over nickel
Available on Tape and Reel for Pick and Place Manufacturing.
VER. 12/5/01
Aluminum Nitride SMD T
e
rminations
Model RFP-100200N4Z50-2
Typical Performance
2
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Power Derating
Suggested Mounting Procedures
FILLED VIA
SOLDER
HEATSINK
PC BOARD
PASTE
SOLDER
SCREW
(2 PLS.)
P.C.B. SOLDER INTERFACE TEMPERATURE --
C
% OF RATED POWER
125
100
75
50
25
100
75
25
50
0
Available on Tape and Reel for Pick and Place Manufacturing.
1. Solder part in place using 60/40 type solder with controlled
temperature iron (700F).
2. Drill thermal vias through PCB and fill with solder, such as
60/40 type.
3. To ensure good thermal connectivity to heat sink, drill and
tap heatsink and mount PCB board to heat sink using
screws.
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