General Specifications
Flanged Terminations
10 Watts, 50
Model RFP-10-50TVR
Resistive Element:
Thick film
Substrate:
Beryllium oxide ceramic
Cover:
Alumina ceramic
Mounting Flange:
Copper, nickel plated per
QQ-N-290
Lead(s):
99.99% pure silver (.005" thk)
Outline Drawing
.120 MAX.
.062
.100
.116 DIA.
.050
.100
.200
.100
.300
50
Notes: Tolerance is .010, unless otherwise specified. Operating
temperature is -55C to +150C (see chart). Designed to meet or
exceed applicable portions of MIL-E-5400. All dimensions are in
inches. Lead length 0.15" minimum.
Specifications subject to change without notice.
Electrical Specifications
Resistance Value:
50 ohms, 5%
Frequency Range:
DC - 4.0 GHz
Power:
10 Watts
V.S.W.R.:
1.25:1
Flanged T
e
rminations
Features
DC - 4.0 GHz
10 Watts
BeO Ceramic
Welded Silver Leads
Non-Nichrome Resistive
Element
Low VSWR
100% Tested
1
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
VER. 12/5/01
Flanged T
e
rminations
Model RFP-10-50TVR
Typical Performance
2
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Power Derating
Suggested Mounting Procedures
1. Make sure that the devices are mounted on flat surfaces
(.001" under the device) to optimize the heat transfer.
2. Drill & tap the heatsink for the appropriate thread size to be
used.
3. Coat heatsink with a minimum amount of high quality
silicone grease (.001" max. thickness).
4. Position device on mounting surface and secure using
socket head screws, flat & split washers. Torque screws to
the appropriate value. Make sure that the device is flat
against the heatsink. (Care should be taken to avoid
upward pressure of the leads towards the lid).
5. Solder leads in place using an SN63 type solder with a
controlled temperature iron (210C).
BOARD EVEN
WITH LEAD.
THAN LEAD.
BOARD LOWER
SUGGESTED STRESS RELIEF METHODS
(2 PLACES)
.025
MIN.
SCALE:
NOT RECOMMENDED APPLICATION
BOARD LOWER
THAN LEAD.
THAN LEAD.
BOARD HIGHER
SCALE:
% OF RATED POWER
150
125
100
75
50
25
100
75
25
50
0
CASE TEMPERATURE -- C
PDF 
ZIP