General Specifications
Flangeless Terminations
200 Watts, 50
Model RFP-200-50TB
Resistive Element:
Thick film
Substrate:
Beryllium oxide ceramic
Cover:
Alumina ceramic
Lead(s):
99.99% pure silver (.005" thk)
Outline Drawing
TB
RFP
200-50
.042
.175
.070
.225
.350
.120
Notes: Tolerance is .010, unless otherwise specified. Operating
temperature is -55C to +150C (see chart). Designed to meet or
exceed applicable portions of MIL-E-5400. All dimensions are in
inches. Lead length 0.15" minimum.
Specifications subject to change without notice.
Electrical Specifications
Resistance Value:
50 ohms, 5%
Frequency Range:
DC - 2.0 GHz
Power:
200 Watts
V.S.W.R.:
1.35:1
Flangeless T
e
rminations
Features
DC - 2.0 GHz
200 Watts
BeO Ceramic
Welded Silver Leads
Non-Nichrome Resistive
Element
Low VSWR
100% Tested
1
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
VER. 12/5/01
Flangeless T
e
rminations
Model RFP-200-50TB
Typical Performance
2
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Power Derating
Suggested Mounting Procedures
BOARD EVEN
WITH LEAD.
MIN.
(2 PLACES)
.025
THAN LEAD.
BOARD LOWER
SCALE:
SUGGESTED STRESS RELIEF METHODS
1. Make sure that the devices are mounted on flat surfaces
(.001" under the device) to optimize the heat transfer.
2. Position device on mounting surface and solder in place
using an indalloy type or an SN63 type solder.
3. Solder leads in place using an SN63 type solder with a
controlled temperature iron (210C).
THAN LEAD.
BOARD HIGHER
SCALE:
NOT RECOMMENDED APPLICATION
BOARD LOWER
THAN LEAD.
% OF RATED POWER
150
125
100
75
50
25
100
75
25
50
0
CASE TEMPERATURE -- C
PDF 
ZIP