APEX MICROTECHNOLOGY CORPORATION TELEPHONE (520) 690-8600 FAX (520) 888-3329 ORDERS (520) 690-8601 EMAIL prodlit@apexmicrotech.com
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INTRODUCTION
Fast and easy breadboarding of circuits using the PA241DF
IS possible with the EK13 evaluation kit. The amplifier may
be surface mounted directly to the PC board. The PA241DF
is soldered to a 2-square inch area of foil on the PC board for
heat sinking. This foil heat sink is connected toVs. Connec-
tions are provided for required power supply bypassing, phase
compensation components, and a current limit resistor. A large
area for component mounting provides flexibility and makes a
multitude of circuit configurations possible.
PARTS LIST
Part #
Description
Quantity
EVAL15
PC Board
1
OX7R105KWN
1F Ceramic Capacitor
1
HS24
Heatsink
1
High voltages will be present. Use caution in
handling and probing when power is applied.
CAUTION
ASSEMBLY
The PA241DF is a surface mount device and should be
assembled to the EVAL15 PC board using surface mount
processes. Solder paste may be dispensed or screen-printed
on the DUT pads. The heat tab on the back of the PA241DF
provides maximum heat dissipation capabilities when soldered
to the PCB metalization that runs under the DUT on the DUT
side of the board. Solder should be applied here also. For
prototype purposes, the tab can be thermally connected to the
PCB metalization using thermal grease.
The PA241DF and HS24 should be reflowed to the PCB
using a solder reflow furnace. If this is not available, a heat
plate capable of solder reflow temperatures may be used. or,
though time consuming, the leads may be soldered individually
to the PCB with a soldering iron. In this case the use of thermal
grease under the heat tab is recommended instead of solder
for the thermal connection.
APEX MICROTECHNOLOGY CORPORATION 5980 NORTH SHANNON ROAD TUCSON, ARIZONA 85741 USA APPLICATIONS HOTLINE: 1 (800) 546-2739
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EVALUATION KIT
FOR PA241DF PIN-OUT
EK13
This data sheet has been carefully checked and is believed to be reliable, however, no responsibility is assumed for possible inaccuracies or omissions. All specifications are subject to change without notice.
EK13U REV C NOVEMBER 2004 2004 Apex Microtechnology Corp.
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