AT89C51RB2 / RC2 & T89C51IC2 QualPack
Rev. 1 2002 June
2
1 Table of contents
1
TABLE OF CONTENTS ....................................................................................................................................................2
2
GENERAL INFORMATION.............................................................................................................................................3
3
TECHNOLOGY INFORMATION...................................................................................................................................4
3.1
W
AFER
P
ROCESS
T
ECHNOLOGY
....................................................................................................................................4
3.2
P
RODUCT
D
ESIGN
..........................................................................................................................................................5
3.3
D
EVICE CROSS SECTION
.................................................................................................................................................6
4
QUALIFICATION ..............................................................................................................................................................7
4.1
Q
UALIFICATION METHODOLOGY
....................................................................................................................................7
4.2
Q
UALIFICATION TEST METHODS
.....................................................................................................................................8
4.3
W
AFER
L
EVEL
R
ELIABILITY
..........................................................................................................................................9
4.3.1
Electromigration.......................................................................................................................................................9
4.3.2
Hot carriers injection .............................................................................................................................................11
4.3.3
Time Dependent Dielectric Breakdown..................................................................................................................12
4.3.4
FLASH characteristics ...........................................................................................................................................14
4.3.4.1
Cell endurance .................................................................................................................................................................14
4.3.4.2
Cell retention ...................................................................................................................................................................15
4.3.4.3
Cell Read Disturb ............................................................................................................................................................16
4.3.4.4
Wafer probe Data retention measurement........................................................................................................................17
4.4
D
EVICE RELIABILITY
....................................................................................................................................................18
4.4.1
AT89C51RC2 tests..................................................................................................................................................18
4.4.2
AT89C51RC2 reliability calculation ......................................................................................................................19
4.5
P
ACKAGING RELIABILITY
.............................................................................................................................................20
4.6
Q
UALIFICATION STATUS
..............................................................................................................................................20
5
ENVIRONMENTAL INFORMATION ..........................................................................................................................21
6
OTHER DATA ..................................................................................................................................................................22
6.1
ISO9001
AND
QS9000 C
ERTIFICATES
.........................................................................................................................22
6.2
D
ATA
B
OOK
R
EFERENCE
.............................................................................................................................................23
6.3
R
EVISION
H
ISTORY
......................................................................................................................................................23
AT89C51RB2 / RC2 & T89C51IC2 QualPack
Rev. 1 2002 June
3
2 General Information
Product Name:
AT89C51RC2 / RB2
Function:
8-bit Microcontrollers with 32KB / 16KB FLASH
Product Name:
T89C51IC2
Function:
8-bit Microcontroller with 32KB FLASH
Two Wires Interface (TWI), 32KHz Oscillator
Wafer Process:
Logic CMOS 0.35um with embedded FLASH
Available Package Types
PLCC 44, VQFP 44 1.4mm, PDIL40
(not available for T89C51IC2)
Other Forms:
Die, Wafer
Locations:
Process Development,
Atmel Colorado Springs, USA
Product Development
Atmel Nantes, France
Wafer Plant
Atmel Colorado Springs, USA
QC Responsibility
Atmel Nantes, France
Probe Test
Atmel Colorado Springs, USA
Assembly
Dependant upon Package
Final Test
Dependant upon Package
Lot Release
Atmel Nantes, France
Shipment Control
Global Logistic Center, Philippines
Quality Assurance
Atmel Nantes, France
Reliability Testing
Atmel Nantes, France
Failure Analysis
Atmel Nantes, France
Quality Management
Atmel Nantes, France
Signed: Pascal LECUYER
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