defining a degree of excellence
Bel Fuse Inc.
198 Van Vorst Street, Jersey City, NJ 07302 Tel: 201-432-0463 Fax: 201-432-9542 E-Mail: BelFuse@belfuse.com
Website: http://www.belfuse.com
Specifications subject to change without notice.
S553-3873-23
(1)
-1.0
-18
-40
-50
A
S558-3873-27
-1.0
-18
-40
-50
B
MECHANICAL
SCHEMATICS
960024A
A
B
Designed for use with either Broadcom BCM 5000 or
BCM 5100 100Base-T4 PHY transceivers
Complies with IEEE 802.3u standards
HIGH SPEED LAN MAGNETICS
Low profile, surface mount packaging, rated to 225C
peak IR reflow temperature
2000 Vrms isolation
(1) Requires the use of external filter (see Application Notes).
ELECTRICALS AT 25C
Insertion Loss
Return Loss
Crosstalk
Common to Common
(dB) Typ
(dB) Max
(dB) Min
Mode Rej (dB) Min
Part No.
1-12.5MHz
1-12.5MHz
1-12.5MHz
1MHz-60MHz
Schematic
defining a degree of excellence
Corporate Office
Bel Fuse Inc.
198 Van Vorst Street, Jersey City, NJ 07302-4496
Tel: 201-432-0463
Fax: 201-432-9542
E-Mail: BelFuse@belfuse.com
Internet: http://www.belfuse.com
Far East Office
Bel Fuse Ltd.
8F/8 Luk Hop Street
San Po Kong
Kowloon, Hong Kong
Tel: 852-2328-5515
Fax: 852-2352-3706
European Office
Bel Fuse Europe Ltd.
Preston Technology Management Centre
Marsh Lane, Preston PR1 8UD
Lancashire, U.K.
Tel: 44-1772-556601
Fax: 44-1772-888366
960024A
APPLICATION NOTES
APPLICATION CIRCUIT
HIGH SPEED LAN MAGNETICS
The S553-3873-23 and S558-3873-27 have been designed for use with Broadcom BCM 5000 and BCM 5100
100Base-T4 transceivers. Utilization of the S553-3873-23 with the BCM 5000 requires additional differential filtering
placed as discrete components externally on the PCB layout. Bel can provide information regarding the required
circuit and component values. Both of these Bel parts can be used in 100Base-T4 adapter card or multi-port
repeater applications with category 3, 4 or 5 UTP/STP media cable.
Bel's low profile, surface mount packaging is ideal for high speed pick and place machinery. Parts can be shipped
on tape and reel for high speed placement. Construction processes have been implemented for thermal compatibility
with high temperature IR reflow assembly processing. Post dipping of leads assist with PC board solderability.
Each part is optically inspected to meet rigid coplanarity requirements.
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