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Электронный компонент: P35-4227-000-200

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Data
sheet
www.bookham.com
Thinking RF solutions
GaAs MMIC SPDT
Reflective/Terminated
Switch, DC - 6GHz
The P35-4227-000-200 is a high performance Gallium
Arsenide single pole double throw broadband RF switch. It
is suitable for use in broadband communications and
instrumentation applications. The RF outputs can be
terminated with either a 50
load or short circuit. The
switch is controlled by the application of complimentary 0V/-
5V or 0/-8V signals to the control lines in accordance with
the truth tables below. There is a choice of two line or four
line control. Four line control allows the use of an `all-off'
state.
This die is fabricated using Bookham's 0.5 m gate length
MESFET process (F14) and is fully protected using Silicon
Nitride passivation for excellent performance and reliability.
This device is also available in a packaged form.
Features
Broadband performance
High Isolation; 40dB typ
at 3GHz
Low insertion loss; 0.8dB typ
at 3GHz
Ultra low DC power
consumption
Fast switching speed;
3ns typical
www.bookham.com
www.bookham.com
Thinking RF solutions
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Notes
1. Return Loss measured in low loss switch state.
2. Input power at which insertion loss compresses by 1dB.
3. Input power 10dBm/tone
Reflective Terminated
Parameter Conditions
Min
Typ
Max
Min
Typ
Max
Unit
Insertion Loss
DC - 1GHz
-
0.8
1.2
-
0.7
1.2
dB
1 - 4GHz
-
1.0
1.3
-
0.9
1.3
dB
4 - 6GHz
-
1.3
1.8
-
1.2
1.6
dB
Isolation
DC - 1GHz
48
45
-
48
55
-
dB
1 - 4GHz
34
35
-
34
40
-
dB
4 - 6GHz
30
32
-
30
33
-
dB
Input Return Loss
1
DC - 1GHz
20
27
-
20
24
-
dB
1 - 4GHz
18
26
-
18
20
-
dB
4 - 6GHz
15
25
-
15
18
-
dB
Output Return Loss
1
DC - 1GHz
20
30
-
20
24
-
dB
1 - 4GHz
18
28
-
18
22
-
dB
4 - 6GHz
15
25
-
15
20
-
dB
1dB power
0/-5V Control; 50MHz
-
20
-
-
21
-
dBm
compression point
2
0/-5V Control; 2GHz
-
27
-
-
27
-
dBm
0/-8V Control; 50MHz
-
22
-
-
22
-
dBm
0/-8V Control; 2GHz
-
30
-
-
30
-
dBm
Switching Speed
50% Control to 10%90%RF
-
3
8
-
3
8
ns
Third Order Intercept
3
500MHz 46
46
dBm
Electrical Performance
Ambient temperature = 22 3 C , Zo = 50
, Control voltages = 0V/-5V unless otherwise stated
P35-4227-000-200
Typical Performance at 22 C
Insertion Loss
Isolation
Input Return Loss
Output Return Loss
Thinking RF solutions
www.bookham.com
Absolute Maximum Ratings
Max control voltage
-8V
Max I/P power
+30 dBm
Operating temperature
-55 C to +125 C
Storage temperature
-65 C to +150 C
P35-4227-000-200
Chip Outline
Electrical Schematic
Switching Truth Table (2 line control)
Handling, Mounting and Bonding Instructions
The back of the die is gold metallised and can be die-attached manually
onto gold, eutectically with Au-Sn (80:20) or with low temperature
conductive epoxy. The maximum allowable die temperature is 310 C for
2 minutes. Bonds should be made onto the exposed gold pads with 17
or 25 microns pure gold or half-hard gold wire. Bonding should be
achieved with the die face at 225 C to 275 C with a heated
thermosonic wedge (approx. 125 C) and a maximum force of 60 grams.
Ball bonds may be used but care must be taken to ensure the ball size is
compatible with the bonding pads shown. The length of the bond wires
should be minimised to reduce parasitic inductance, particularly those to
the RF and ground pads.
If all four control pads are uniquely connected then the `all-off' state is
achievable in accordance with the truth table above. Alternatively simpler
two-line control may be used, whereby each control line should be
bonded to a pair of control pads. If the RF outputs are to be terminated
in a 50
load then the pads marked `T' should be connected to ground.
Otherwise the pads marked `R' should be grounded to provide a short
circuit termination.
www.bookham.com
462/SM/00042/200 Issue 2
Bookham Technology 2003 Bookham is a registered trademark of Bookham Technology plc
MMICS
Bookham Technology plc
Caswell
Towcester
Northamptonshire
NN12 8EQ
UK
Tel: +44 (0) 1327 356 789
Fax: +44 (0) 1327 356 698
rfsales@bookham.com
Important Notice
Bookham Technology has a policy of
continuous improvement. As a result
certain parameters detailed on this flyer
may be subject to change without notice.
If you are interested in a particular product
please request the product specification
sheet, available from any RF sales
representative.
P35-4227-000-200
Die size
0.99 x 0.64mm
Bond pad size 90 m x 90 m
minimum
Die thickness: 200 m
Switching Truth Table (4 line control)
1 & 2
3 & 4
RF IN-RF1
RF IN-RF2
0V
-5V
Low loss
Isolated
-5V
0V
Isolated
Low loss
1
2
3
4
RF IN-RF1 RF IN-RF 2
0V 0V -5V -5V Low
loss Isolated
-5V -5V 0V 0V
Isolated Low loss
0V -5V -5V 0V
Isolated Isolated
Ordering Information
P35-4227-000-200