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Электронный компонент: P35-5202

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Data
sheet
www.bookham.com
Thinking RF solutions
MMIC SP3T
Switch 20 - 40GHz
This P35-5202-000-200 engineering datasheet describes
a high performance Gallium Arsenide monolithic single pole
three throw broadband RF switch. It is suitable for use in
broadband communications, instrumentation and electronic
warfare applications. Control is effected by the application of
0V and -5V levels to the control lines.
The die is fabricated using Bookham Technology's 0.2m
gate length HEMT process and is fully protected using
Silicon Nitride passivation for excellent performance and
reliability.
Features
Broadband Switch
Low insertion loss <3.0dB
typically 20-40GHz
Isolation typically >40dB at
20-40GHz
www.bookham.com
Engineering Datasheet
www.bookham.com
Thinking RF solutions
www.bookham.com
Parameter
Conditions Min
Typ
Max
Units
Insertion Loss
20 GHz
-
2.7
-
dB
30 GHz
-
2.4
-
dB
40 GHz
-
2.9
-
dB
Isolation
20 GHz
-
40
-
dB
30 GHz
-
40
-
dB
40 GHz
-
40
-
dB
Input Return Loss
1
20 - 40GHz
-
9
-
dB
Output Return Loss
1
20 - 40GHz
-
9
-
dB
Control Voltage
-
0V/-5V
-
Volts
Electrical Performance
Ambient temperature = 22+/- 3 C , Zo = 50
, Gate control voltage = 0V/-5V
Output Return Loss (dB)
0
2
4
6
8
10
12
14
16
18
20
15
20
25
30
35
40
45
Frequency (GHz)
Return Loss (dB)
P35-5202-000-200
Notes
1. Return loss measured in low loss state.
Input Return Loss (dB)
0
5
10
15
20
25
30
35
15
20
25
30
35
40
45
Frequency (GHz)
Return Loss (dB)
Insertion Loss (dB)
0
1
2
3
4
5
6
15
20
25
30
35
40
45
Frequency (GHz)
Loss (dB)
Isolation (dB)
0
5
10
15
20
25
30
35
40
45
50
15
20
25
30
35
40
45
Frequency (GHz)
Loss (dB)
Typical Performance at 22 C (Simulated Including Bondwire)
P35-5202-000-200
www.bookham.com
462/SM/XXXXX/200 Issue Draft
Bookham Technology 2003 Bookham is a registered trademark of Bookham Technology plc
MMICS
Bookham Technology plc
Caswell
Towcester
Northamptonshire
NN12 8EQ
UK
Tel: +44 (0) 1327 356 789
Fax: +44 (0) 1327 356 698
rfsales@bookham.com
Important Notice
Bookham Technology has a policy of
continuous improvement. As a result
certain parameters detailed on this flyer
may be subject to change without notice.
If you are interested in a particular product
please request the product specification
sheet, available from any RF sales
representative.
Absolute Maximum Ratings
Max control voltage
-8V
Max I/P power
TBD dBm
Chip size:
1.9 x 2.2mm
Bond pad size:
120m square
RF Bond pad size:
120m x 80m
Chip thickness:
100m
Ordering Information
P35-5202-000-200