2FAI-M16R Integrated Passive & Active Device using MLP
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
I/O PADS
GROUND
PAD
MLP
PACKAGE
General Information
Features
Lead free as standard
RoHS compliant*
ESD protection
Protects up to eight data lines
Low insertion loss
Applications
Cell Phones
PDAs and Notebooks
GPS and SMART Cards
The 2FAI-M16R device, manufactured using Thin Film on
Silicon technology, provides ESD protection for the external
ports of portable electronic devices such as cell phones,
modems and PDAs.
The ESD protection provided by the component enables a
data port to withstand a minimum 8 KV Contact /15 KV Air
Discharge per the ESD test method specified in IEC 61000-4-2.
The device measures 3 mm x 3 mm and is intended to be
mounted directly onto an FR4 printed circuit board. The MLP
device meets typical thermal cycle and bend test specifications.
Electrical Characteristics
Symbol
Minimum
Nominal
Maximum
Unit
(T
A
= 25 C unless otherwise noted)
Resistance
R
180
200
220
Capacitance @ 2.5 V 1 MHz
C
16
20
24
pF
Rated Standoff Voltage
V
WM
5.0
V
Breakdown Voltage @ 1 mA
V
BR
6.0
V
Forward Voltage @ 10 mA
V
F
0.8
V
Leakage Current @ 3 V
I
D
0.1
A
ESD Protection: IEC 61000-4-2
Contact Discharge
8
kV
Air Discharge
15
kV
Thermal Characteristics
(T
A
= 25 C unless otherwise noted)
DC Power Rating
P
100
mW
Operating Temperature Range
T
J
-40 25 +85 C
Storage Temperature Range
T
STG
-55 25 +150 C
Electrical & Thermal Characteristics
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
*RoHS COMPLIANT
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Product Dimensions
Recommended Pad Layout
2FAI-M16R Integrated Passive & Active Device using MLP
FAI
B0412
3.000
(0.1181)
3.000
(0.1181)
0.300
(0.0118)
X 45
CHAMFER
3.000
(0.1181)
0.750 0.05
(0.0295 0.0020)
3.000
(0.1181)
1.55 0.050
(0.061 0.0020)
SQ.
1.50
(0.059)
0.500
(0.0197)
BSC
0.203 0.025
(0.0079 0.0010)
0.230 0.05
(0.009 0.0020)
0.400 0.05
(0.009 0.0020)
0.500
(0.0197)
0.300
(0.0118)
0.700
(0.0276)
4.000
(0.1575)
1.000
(0.0394)
This silicon-based device is packaged using micro leadframe
packaging technology. The MLPs have an exposed die attach
pad that provides the interconnect medium from die to PCB.
The pads are arranged for easy PCB routing. The pitch is
0.5 mm and the dimensions for the packaged device are
shown below.
DIMENSIONS =
MILLIMETERS
(INCHES)
How to Order
2 FAI M 16 R
Thin Film
Model
MLP Package
No. of Solder Pads
Packaging Option
R = Tape and Reel
Packaged 3000 pcs. / 13 reel
(100 % Sn Termination)
Block Diagram
2FAI-M16R Integrated Passive & Active Device using MLP
GND
EXT3
R3
R4
INT3
EXT4
INT5
GND
EXT6
R6
R5
INT6
EXT5
INT5
GND
GND
EXT1
R1
R2
INT1
EXT2
INT2
GND
EXT8
R8
R7
INT8
EXT7
INT7
The MLP Device block diagram below includes the pin names and basic electrical connections associated with each channel.
Frequency Response
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
2FAI-M16R Integrated Passive & Active Device using MLP
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
Device Pin Out
1
EXT2
2
EXT1
3
INT1
4
INT2
12
EXT7
11
EXT8
10
INT8
9
INT7
5
INT3
6
INT4
7
INT5
8
INT6
16
EXT3
15
EXT4
14
EXT5
13
EXT6
The Pin-Out for the device is shown below. Note also that the device is shown with bottom side pads facing up.
Packaging
The surface mount product is packaged in a 12 mm x 8 mm Tape and Reel format per EIA-481 standard.
2FAI-M16R REV. B 03/06
Asia-Pacific:
TEL +886- (0)2 25624117 FAX +886- (0)2 25624116
Europe:
TEL +41-41 768 5555 FAX +41-41 768 5510
The Americas: TEL +1-951 781-5492 FAX +1-951 781-5700
www.bourns.com
Reliable Electronic Solutions
Pin Out Function Pin Out Function Pin Out Function
Pin Out
Function
Pin1
EXT2
Pin5
INT3
Pin9
INT7
Pin13
EXT6
Pin2
EXT1
Pin6
INT4
Pin10
INT8
Pin14
EXT5
Pin3
INT1
Pin7
INT5
Pin11
EXT8
Pin15
EXT4
Pin4
INT2
Pin8
INT6
Pin12
EXT7
Pin16
EXT3
2.0 0.05
(.08 .002)
0.3 0.05
(.01 .002)
3.4 0.1
(.134 .004)
3.4 0.1
(.134 .004)
1.75 0.1
(.07 .004)
5.5 0.3
(.22 .01)
12.0 0.3
(.47 .01)
0.9 0.1
(.035 .004)
ORIENTATION
OF COMPONENT
IN POCKET
BACKSIDE FACING UP
TOP SIDE VIEW
(INTO COMPONENT POCKET)
0.3
(0.01)
4.0 0.1
(.16 .004)
8.0 0.3
(.31 .01)
0.25
(0.010)
TYP.
R
1.5 0.1/-0
(.06 .004/-0)
DIA.
MAX.
R
DIMENSIONS =
MILLIMETERS
(INCHES)
PDF 
ZIP