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Электронный компонент: OPA644U

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1
OPA644
Comp
2
6
3
Comp
Gain Stage
In
In+
V
OUT
I
BIAS
I
BIAS
+V
S
V
S
4, 5
7, 8
Gain Stage
Buffer
Low Distortion Current Feedback
OPERATIONAL AMPLIFIER
DESCRIPTION
The OPA644 is a wideband precision current feed-
back operational amplifier featuring exceptionally high
open loop transimpedance and high slew rate. The
current feedback architecture allows for excellent
large signal bandwidth, even at high gains. The high
transimpedance allows this op amp to be used in
applications requiring 16 bits or more of accuracy.
This extra transimpedance at high bandwidths gives
very low distortion and low differential gain and
phase errors. The high slew rate and well-behaved
pulse response allow for superior large signal ampli-
fication in a variety of RF, video and other signal
processing applications. Fabricated on an advanced
complementary bipolar process, the OPA644 offers
exceptional performance in monolithic form.
APPLICATIONS
q
HIGH-SPEED SIGNAL PROCESSING
q
HIGH-RESOLUTION VIDEO
q
PULSE AMPLIFICATION
q
COMMUNICATIONS
q
ADC/DAC GAIN AMPLIFIER
q
RF AMPLIFICATION
q
MEDICAL IMAGING
q
AUDIO AMPLIFICATION
FEATURES
q
SLEW RATE: 2500V/
s
q
VERY LOW DIFFERENTIAL GAIN/PHASE
ERROR: 0.008%/0.009
q
LOW DISTORTION AT 5MHz: 85dBc
q
HIGH BANDWIDTH: 500MHz
q
HIGH OPEN LOOP TRANSIMPEDANCE:
2.0M
q
HIGH LINEARITY
q
FAST 12-BIT SETTLING: 21ns to 0.01%
q
UNITY-GAIN STABLE
International Airport Industrial Park Mailing Address: PO Box 11400, Tucson, AZ 85734 Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 Tel: (520) 746-1111 Twx: 910-952-1111
Internet: http://www.burr-brown.com/ FAXLine: (800) 548-6133 (US/Canada Only) Cable: BBRCORP Telex: 066-6491 FAX: (520) 889-1510 Immediate Product Info: (800) 548-6132
OPA644
OPA644
1993 Burr-Brown Corporation
PDS-1187D
Printed in U.S.A. March, 1998
OPA644
2
SPECIFICATIONS
ELECTRICAL
At T
A
= +25
C, V
S
=
5V, R
L
= 100
, C
L
= 2pF, R
FB
= 402
and all four power supply pins are used, unless otherwise noted.
OPA644U
OPA644UB
PARAMETER
CONDITIONS
MIN
TYP
MAX
MIN
TYP
MAX
UNITS
OFFSET VOLTAGE
Input Offset Voltage
2.5
6
2
3
mV
Average Drift
20
10
V/
C
Power Supply Rejection
V
S
=
4.5 to
5.5V
40
65
60
75
dB
INPUT BIAS CURRENT
(1)
Non-Inverting
20
40
15
20
A
Over Specified Temperature
24
90
20
50
A
Inverting
2
25
T
10
A
Over Specified Temperature
4
35
3
25
A
NOISE
Input Voltage Noise Density
f = 100Hz
10.3
T
nV/
Hz
f = 1kHz
2.9
T
nV/
Hz
f = 10kHz
1.9
T
nV/
Hz
f = 1MHz
1.9
T
nV/
Hz
f
B
= 100Hz to 200MHz
33.6
T
Vrms
Inverting Input Bias Current
Noise Density: f = 10MHz
15
T
pA/
Hz
Non-Inverting Input Current
Noise Density: f = 10MHz
15
T
pA/
Hz
INPUT VOLTAGE RANGE
Common-Mode Input Range
2.0
2.25
T
T
V
Over Specified Temperature
1.8
2.1
T
T
V
Common-Mode Rejection
V
CM
=
2V
35
55
45
65
dB
INPUT IMPEDANCE
Non-Inverting
500 || 1.0
T
k
|| pF
Inverting
20
46
Open-Loop Transimpedance
V
O
=
2V, R
L
= 1k
1.4
2.0
T
T
M
FREQUENCY RESPONSE
Closed-Loop Bandwidth
G = +1V/V
500
T
MHz
G = +2V/V
300
T
MHz
G = +5V/V
180
T
MHz
G = +10V/V
125
T
MHz
G = +20V/V
80
T
MHz
Slew Rate
(1)
G = +2, 2V Step
2500
T
V/
s
Settling Time: 0.01%
G = +2, 2V Step
21
T
ns
0.1%
G = +2, 2V Step
16.5
T
ns
1%
G = +2, 2V Step
5.5
T
ns
Overload Recovery Time
(2)
60
T
ns
Spurious Free Dynamic Range
G = 1, f = 5.0MHz
84
86
dBc
V
O
= 2Vp-p
G = 1, f = 20MHz
dBc
Differential Gain Error at 3.58MHz
G = +2V/V, V
O
= 0V to 1.4V
0.008
T
%
R
L
= 150
Differential Phase Error at 3.58MHz
G = +2V/V, V
O
= 0V to 1.4V
0.009
T
Degrees
R
L
= 150
Gain Flatness to 1dB
G = +1
250
T
MHz
OUTPUT
Current Output
40
60
50
66
mA
Over Specified Temperature
30
45
40
50
mA
Voltage Output
No Load
Over Specified Temperature
3.0
3.5
T
T
V
Voltage Output
R
L
= 100
Over Specified Temperature
2.75
3.25
T
T
V
Short Circuit Current
75
T
mA
Output Resistance
1MHz, G = +2V/V
0.2
T
POWER SUPPLY
Specified Operating Voltage
T
MIN
to T
MAX
5
T
V
Operating Voltage Range
T
MIN
to T
MAX
4.5
5.5
T
T
V
Quiescent Current
T
MIN
to T
MAX
18
26
T
T
mA
TEMPERATURE RANGE
Specification: U
40
+85
T
T
C
Thermal Resistance,
JA
U, UB
8-Pin SO-8
125
T
C/W
T
Specification same as OPA644U.
NOTES: (1) Slew rate is rate of change from 10% to 90% of the output voltage step. (2) Time for the output to resume linear operation after saturation.
3
OPA644
1
2
3
4
8
7
6
5
+V
S2
(1)
+V
S1
Output
V
S2
(1)
NC
Input
+Input
V
S1
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user's own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
PIN CONFIGURATION (All Packages)
Top View
SO-8
NOTE: (1) Making use of all four power supply pins is highly recommended,
although not required. Using these four pins, instead of just pins 4 and 7, will
lower the effective pin impedance and substantially lower distortion.
PACKAGE /ORDERING INFORMATION
PACKAGE DRAWING
PRODUCT
PACKAGE
NUMBER
(1)
OPA644U, UB
SO-8 Surface Mount
182
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book. (2) The "B" grade of the
SO-8 package will be marked with a "B" by pin 8.
ABSOLUTE MAXIMUM RATINGS
Power Supply ..............................................................................
5.5VDC
Internal Power Dissipation .......................... See Thermal Considerations
Differential Input Voltage ..................................................................
1.2V
Input Voltage Range ............................................................................
V
S
Storage Temperature Range: U, UB ............................ 40
C to +125
C
Lead Temperature (soldering, 10s) .............................................. +300
C
(soldering, SO-8 3s) ....................................... +260
C
Junction Temperature (T
J
) ............................................................ +175
C
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
OPA644
4
SUPPLY CURRENT vs TEMPERATURE
20
19
18
17
16
75
50
25
0
25
50
75
100
125
Ambient Temperature (C)
Supply Current (mA)
PSR AND CMR vs TEMPERATURE
80
70
60
50
40
75
50
25
0
25
50
75
100
125
PSR, CMR (dB)
PSR+
CMR
PSR
Temperature (C)
TYPICAL PERFORMANCE CURVES
At T
A
= +25
C, V
S
=
5V, R
L
= 100
, C
L
= 2pF, R
FB
= 402
and all four power supply pins are used, unless otherwise noted. R
FB
= 25
for a gain of +1.
OUTPUT CURRENT vs TEMPERATURE
80
70
60
50
60
40
20
0
20
40
60
80
100
120
140
Output Current (mA)
Ambient Temperature (C)
I
O
+
I
O
HARMONIC DISTORTION vs FREQUENCY
(G = +2, V
O
= 2Vp-p, R
L
= 100
)
100k
Frequency (Hz)
1M
10M
100M
Harmonic Distortion (dBc)
40
60
80
100
2f
O
3f
O
HARMONIC DISTORTION vs FREQUENCY
(G = 1, V
O
= 2Vp-p, R
L
= 100
)
100k
Frequency (Hz)
1M
10M
100M
Harmonic Distortion (dBc)
40
60
80
100
2f
O
3f
O
HARMONIC DISTORTION vs FREQUENCY
(G = +5, V
O
= 2Vp-p, R
L
= 100
)
100k
Frequency (Hz)
1M
10M
100M
Harmonic Distortion (dBc)
40
60
80
100
2f
O
3f
O
5
OPA644
HARMONIC DISTORTION vs TEMPERATURE
(G = 1, V
O
= 2Vp-p, R
L
= 100
, f
O
= 5MHz)
70
80
90
100
75
50
25
0
25
50
75
100
125
Harmonic Distorotion (dBc)
Temperature (C)
2f
O
3f
O
TYPICAL PERFORMANCE CURVES
(CONT)
At T
A
= +25
C, V
S
=
5V, R
L
= 100
, C
L
= 2pF, R
FB
= 402
and all four power supply pins are used, unless otherwise noted. R
FB
= 25
for a gain of +1.
HARMONIC DISTORTION vs FREQUENCY
(G = +10, V
O
= 2Vp-p, R
L
= 100
)
100k
Frequency (Hz)
1M
10M
100M
Harmonic Distortion (dBc)
40
60
80
100
2f
O
3f
O
5MHz HARMONIC DISTORTION vs OUTPUT SWING
(G = 1, R
L
= 100
)
70
80
90
100
0
1
2
3
4
Output Swing (V)
Harmonic Distortion (dBc)
2f
O
3f
O
10MHz HARMONIC DISTORTION vs OUTPUT SWING
(G = 1, R
L
= 100
)
70
80
90
100
0
1
2
3
4
Output Swing (V)
Harmonic Distortion (dBc)
2f
O
3f
O
THIRD-ORDER INTERCEPT POINT vs FREQUENCY
(G = 1, R
L
= 50
, R
FB
= 402
)
70
60
50
40
30
1M
10M
100M
Frequency (Hz)
Third-Order Intercept Point (dBm)
NON-INVERTING INPUT
VOLTAGE NOISE vs FREQUENCY
(G = +10)
40
30
20
10
0
10
100
1k
10k
100k
1M
10M
Frequency (Hz)
Voltage Noise (nV/
Hz)
OPA644
6
LARGE SIGNAL TRANSIENT RESPONSE
(G = +2, R
L
= 100
)
Time (5ns/Div)
2.0
1.6
1.2
0.8
0.4
0
0.4
0.8
1.2
1.6
2.0
Voltage (V)
FEEDBACK RESISTOR
vs GAIN FOR OPTIMUM BANDWIDTH
8
7
6
5
4
3
2
1
0
10
100
1k
50
500
Feedback Resistance (
)
Non-Inverting Gain (V/V)
G = +10V/V CLOSED-LOOP
SMALL SIGNAL BANDWIDTH
29
26
23
20
17
14
11
8
5
1M
10M
100M
1G
0
45
90
135
Frequency (Hz)
Gain (dB)
Phase Shift ()
Gain
Closed-Loop Phase
Bandwidth
= 144MHz
G = +5V/V CLOSED-LOOP
SMALL SIGNAL BANDWIDTH
20
17
14
11
8
5
2
1M
10M
100M
1G
0
45
90
135
Frequency (Hz)
Gain (dB)
Phase Shift ()
Gain
Closed-Loop Phase
Bandwidth
= 181MHz
G = +2V/V CLOSED-LOOP
SMALL SIGNAL BANDWIDTH
15
12
9
6
3
0
3
6
9
12
1M
10M
100M
1G
0
45
90
135
180
Frequency (Hz)
Gain (dB)
Gain
Closed-Loop Phase
Bandwidth
= 335MHz
G = +1V/V CLOSED-LOOP
SMALL SIGNAL BANDWIDTH
9
6
3
0
3
6
9
12
15
18
21
1M
10M
100M
1G
10G
Frequency (Hz)
Gain (dB)
180
225
270
315
360
Phase Shift ()
Gain
Closed-Loop Phase
Bandwidth
= 558MHz
TYPICAL PERFORMANCE CURVES
(CONT)
At T
A
= +25
C, V
S
=
5V, R
L
= 100
, C
L
= 2pF, R
FB
= 402
and all four power supply pins are used, unless otherwise noted. R
FB
= 25
for a gain of +1.
7
OPA644
SMALL SIGNAL TRANSIENT RESPONSE
(G = +2, R
L
= 100
)
Time (5ns/Div)
200
160
120
80
40
0
40
80
120
160
200
Voltage (mV)
0.000
0.002
0.004
0.006
0.008
0
0.7
1.4
DC Offset (V)
Differential Gain (%)
0.008
0
0.7
1.4
DC Offset (V)
Differential Phase (
)
0.000
0.004
0.006
0.002
TYPICAL PERFORMANCE CURVES
(CONT)
At T
A
= +25
C, V
S
=
5V, R
L
= 100
, C
L
= 2pF, R
FB
= 402
and all four power supply pins are used unless, otherwise noted. R
FB
= 25
for a gain of +1.
AUDIO PRECISION THD+N vs FREQUENCY
80
85
90
95
100
105
110
115
120
20
100
1k
10k
20k
THD + N (dBc)
FREQUENCY (Hz)
RECOMMENDED ISOLATION RESISTANCE
vs CAPACITIVE LOAD
25
20
15
10
5
0
0
5
10
15
20
25
Capacitive Load (pF)
Isolation Resistance (
)
OPA644
8
APPLICATIONS INFORMATION
THEORY OF OPERATION
This current feedback architecture offers the following im-
portant advantages over voltage feedback architectures: (1)
the high slew rate allows the large signal performance to
approach the small signal performance, and: (2) there is very
little bandwidth degradation at higher gain settings.
The current feedback architecture of the OPA644 provides
the traditional strength of excellent large signal response
with the unusual addition of very high open-loop
transimpedance. This high open-loop transimpedance al-
lows the OPA644 to be used in applications requiring
16 bits or more of accuracy and dynamic linearity.
DC GAIN TRANSFER CHARACTERISTICS
The circuit in Figure 1 shows the equivalent circuit for
calculating the DC gain. When operating the device in the
inverting mode, the input signal error current (I
E
) is ampli-
fied by the open-loop transimpedance gain (T
O
). The output
signal generated is equal to T
O
x
I
E
. Negative feedback is
applied through R
FB
such that the device operates at a gain
equal to R
FB
/R
FF
.
Inverting Gain = (R
FB
/R
FF
)/(1+1/Loop Gain)
(1)
Non-inverting Gain = (1 + R
FB
/R
FF
)/(1 + 1/Loop Gain) (2)
where: Loop Gain = T(o)/(R
FB
)
x
(1/(1+T(o)/(R
FB
/R
FF
))
At higher gains the small value inverting input impedance
(R
INV
) causes an apparent loss in bandwidth. This can be
seen from the equation:
Factual = F
IDEAL
/(1 + (R
INV
/R
FB
) (1 + R
FB
/R
FF
))
(3)
This loss in bandwidth at high gains can be corrected
without affecting stability by lowering the value of the
feedback resistor from the specified value of 402
.
OFFSET VOLTAGE AND NOISE
The output offset is the algebraic sum of the input voltage
and current sources that influence DC operation. The output
offset is calculated by the following equation:
Output Offset Voltage =
Ib
N
x
R
N
(1 + R
FB
/R
G
)
V
IO
(4)
(1 + R
FB
/R
G
)
Ib
I
x
R
FB
If all terms are divided by the gain (1 + R
F
/R
G
) it can be
observed that input referred offsets improve as gain in-
creases.
The effective noise at the output of the amplifier can be
determined by taking the root sum of the squares of equation
4 and applying the spectral noise values found in the Typical
Performance Curve graph section. This applies to noise from
the op amp only. Note that both the noise figure and
equivalent input offset voltages improve as the closed-loop
gain increases (by keeping R
F
fixed and reducing R
I
with
R
N
= 0
).
V
O
T
O
C
C
L
S
R
S
C
1
V
I
V
N
R
FF
R
FB
I
E
+
FIGURE 1. Equivalent Circuit.
For non-inverting operation, the input signal is applied to the
non-inverting (high impedance buffer) input. The output
(buffer) error current (I
E
) is generated at the low impedance
inverting input. The signal generated at the output is fed
back to the inverting input such that the overall gain is (1 +
R
FF
/R
I
).
Where a voltage-feedback amplifier has two symmetrical
high impedance inputs, a current feedback amplifier has a
low inverting (buffer output) impedance and a high non-
inverting (buffer input) impedance.
The closed-loop gain for the OPA644 can be calculated
using the following equations:
FIGURE 2. Output Offset Voltage Equivalent Circuit.
INCREASING BANDWIDTH AT HIGH GAINS
The closed-loop bandwidth can be extended at high gains by
reducing the value of the feedback resistor R
FB
(refer to Figure
1). This bandwidth reduction is caused by the feedback
current being split between R
S
and R
FF
. As the gain increases
(for a fixed R
FB
), more feedback current is shunted through
R
FF
, which reduces closed-loop bandwidth. To maintain speci-
fied bandwidth, the following equations can be used to
approximate R
F
and R
I
for any gain from
1 to
15:
R
FB
R
G
Ib
I
R
N
Ib
N
9
OPA644
R
FB
= 424
8G (+ for inverting and for non-inverting)
R
FF
= (424 8G)/(G 1) (non-inverting)
R
I
= (424 + 8G)/G (inverting)
G = Closed-loop gain
WIRING PRECAUTIONS
Maximizing the OPA644's capability requires some wiring
precautions and high-frequency layout techniques. Oscilla-
tion, ringing, poor bandwidth and settling, gain peaking, and
instability are typical problems plaguing all high-speed
amplifiers when they are improperly used. In general, all
printed circuit board conductors should be wide to provide
low resistance, low impedance signal paths. They should
also be as short as possible. The entire physical circuit
should be as small as practical. Stray capacitances should be
minimized, especially at high impedance nodes, such as the
amplifier's input terminals. Stray signal coupling from the
output or power supplies to the inputs should be minimized.
All circuit element leads should be no longer than 1/4 inch
(6mm) to minimize lead inductance, and low values of
resistance should be used. This will minimize time constants
formed with the circuit capacitances and will eliminate
stray, parasitic circuits.
Grounding is the most important application consideration
for the OPA644, as it is with all high-frequency circuits.
Oscillations at high frequencies can easily occur if good
grounding techniques are not used. A heavy ground plane
(2 oz. copper recommended) should connect all unused
areas on the component side. Good ground planes can
reduce stray signal pickup, provide a low resistance, low
inductance common return path for signal and power, and
can conduct heat from active circuit package pins into
ambient air by convection.
Supply bypassing is extremely critical and must always be
used, especially when driving high current loads. Both
power supply leads should be bypassed to ground as close as
possible to the amplifier pins. Tantalum capacitors (2.2
F)
with very short leads are recommended. A parallel 0.01
F
ceramic must also be added. Surface-mount bypass capaci-
tors will produce excellent results due to their low lead
inductance. Additionally, suppression filters can be used to
isolate noisy supply lines. Properly bypassed and modula-
tion-free power supply lines allow full amplifier output and
optimum settling time performance.
Points to Remember
1) Making use of all four power supply pins will lower the
effective power supply inductance seen by the input and
output stages. This will improve the AC performance in-
cluding lower distortion. The lowest distortion is achieved
when running separated traces to V
S1
and V
S2
. Power supply
bypassing with 0.01
F and 2.2
F surface-mount capacitors
is recommended. It is essential to keep the 0.01
F capacitor
very close to the power supply pins. Refer to the demonstra-
tion board figure in the DEM-OPA64X data sheet for
the recommended layout and component placements.
(2) Whenever possible, use surface mount. Don't use point-
to-point wiring as the increase in wiring inductance will be
detrimental to AC performance. However, if it must be used,
very short, direct signal paths are required. The input signal
ground return, the load ground return, and the power supply
common should all be connected to the same physical point
to eliminate ground loops, which can cause unwanted feed-
back.
3) Surface mount on the backside of the PC Board. Good
component selection is essential. Capacitors used in critical
locations should be a low inductance type with a high quality
dielectric material. Likewise, diodes used in critical loca-
tions should be Schottky barrier types, such as HP5082-
2835 for fast recovery and minimum charge storage. Ordi-
nary diodes will not be suitable in RF circuits.
4) Use a small feedback resistor (usually 25
) in unity-gain
voltage follower applications for the best performance. For
gain configurations, resistors used in feedback networks
should have values of a few hundred ohms for best perfor-
mance. Shunt capacitance problems limit the acceptable
resistance range to about 1k
on the high end and to a value
that is within the amplifier's output drive limits on the low
end. Metal film and carbon resistors will be satisfactory, but
wirewound resistors (even "non-inductive" types) are abso-
lutely unacceptable in high-frequency circuits. Feedback
resistors should be placed directly between the output and
the inverting input on the backside of the PC board. This
placement allows for the shortest feedback path and the
highest bandwidth. A longer feedback path than this will
decrease the realized bandwidth substantially. Refer to the
demonstration board layout at the end of the data sheet.
5) Surface-mount components (chip resistors, capacitors,
etc.) have low lead inductance and are therefore strongly
recommended. Circuits using all surface-mount components
with the OPA644U (SO-8 package) will offer the best AC
performance.
6) Avoid overloading the output. Remember that output
current must be provided by the amplifier to drive its own
feedback network as well as to drive its load. Lowest
distortion is achieved with high impedance loads.
7) Don't forget that these amplifiers use
5V supplies.
Although they will operate perfectly well with +5V and
5.2V, use of
15V supplies will destroy the part.
8) Standard commercial test equipment has not been de-
signed to test devices in the OPA644's speed range. Bench-
top op amp testers and ATE systems will require a special
test head to successfully test these amplifiers.
9) Terminate transmission line loads. Unterminated lines,
such as coaxial cable, can appear to the amplifier to be a
capacitive or inductive load. By terminating a transmission
line with its characteristic impedance, the amplifier's load
then appears purely resistive.
10) Plug-in prototype boards and wire-wrap boards will not
be satisfactory. A clean layout using RF techniques is
essential; there are no shortcuts.
OPA644
10
INPUT PROTECTION
Static damage has been well recognized for MOSFET de-
vices, but any semiconductor device deserves protection
from this potentially damaging source. The OPA644 incor-
porates on-chip ESD protection diodes as shown in Figure 3.
This eliminates the need for the user to add external protec-
tion diodes, which can add capacitance and degrade AC
performance.
All pins on the OPA644 are internally protected from ESD
by means of a pair of back-to-back reverse-biased diodes to
either power supply as shown. These diodes will begin to
conduct when the input voltage exceeds either power supply
by about 0.7V. This situation can occur with loss of the
amplifier's power supplies while a signal source is still
present. The diodes can typically withstand a continuous
current of 30mA without destruction. To insure long term
reliability, however, diode current should be externally lim-
ited to 10mA or so whenever possible.
The OPA644 utilizes a fine geometry high speed process
that withstands 500V using the Human Body Model and
100V using the machine model. However, static damage can
cause subtle changes in amplifier input characteristics with-
out necessarily destroying the device. In precision opera-
tional amplifiers, this may cause a noticeable degradation of
offset voltage and drift. Therefore, static protection is strongly
recommended when handling the OPA644.
OUTPUT DRIVE CAPABILITY
The OPA644 has been optimized to drive 75
and 100
resistive loads. The device can drive 2Vp-p into a 75
load.
This high-output drive capability makes the OPA644 an
ideal choice for a wide range of RF, IF, and video applica-
tions. In many cases, additional buffer amplifiers are un-
needed.
Many demanding high-speed applications such as
ADC/DAC buffers require op amps with low wideband
output impedance. For example, low output impedance is
essential when driving the signal-dependent capacitances at
the inputs of flash A/D converters. As shown in Figure 4,
the OPA644 maintains very low closed-loop output imped-
ance over frequency. Closed-loop output impedance in-
creases with frequency since loop gain is decreasing with
frequency.
THERMAL CONSIDERATIONS
The OPA644 does not require a heat sink for operation in
most environments. At extreme temperatures and under full
load conditions a heat sink may be necessary.
The internal power dissipation is given by the equation
P
D
= P
DQ
+ P
DL
, where P
DQ
is the quiescent power dissipa-
tion and P
DL
is the power dissipation in the output stage due
to the load. (For
V
CC
=
5V, P
DQ
= 10V
x
26mA = 260mW,
max). For the case where the amplifier is driving a grounded
load (R
L
) with a DC voltage (
V
OUT
) the maximum value of
P
DL
occurs at
V
OUT
=
V
CC
/ 2, and is equal to P
DL
, max
= (
V
CC
)
2
/4R
L
. Note that it is the voltage across the output
transistor, and not the load, that determines the power
dissipated in the output stage.
The short-circuit condition represents the maximum amount
of internal power dissipation that can be generated. The
variation of output current with temperature is shown in the
Typical Performance Curves.
CAPACITIVE LOADS
The OPA644's output stage has been optimized to drive low
resistive loads. Capacitive loads, however, will decrease the
amplifier's phase margin which may cause high frequency
peaking or oscillations. Capacitive loads greater than 5pF
should be buffered by connecting a small resistance, usually
5
to 25
, in series with the output as shown in Figure 5.
This is particularly important when driving high capacitance
loads such as flash A/D converters.
100
10
1
0.1
0.01
0.001
10K
100K
1M
10M
100M
Frequency (Hz)
Output Impedance (
)
A
V
= +2V/V
FIGURE 4. Closed-Loop Output Impedance vs Frequency.
FIGURE 5. Driving Capacitive Loads.
OPA644
C
L
R
L
R
S
(R
S
typically 5
to 25
)
402
External
Pin
+V
CC
V
CC
Internal
Circuitry
FIGURE 3. Internal ESD Protection.
ESD Protection diodes internally
connected to all pins.
11
OPA644
In general, capacitive loads should be minimized for opti-
mum high frequency performance. Coax lines can be driven
if the cable is properly terminated. The capacitance of coax
cable (29pF/foot for RG-58) will not load the amplifier
when the coaxial cable or transmission line is terminated in
its characteristic impedance.
COMPENSATION
The OPA644 is internally compensated and is stable in unity
gain with a phase margin of approximately 70
. (Note that,
from a stability standpoint, an inverting gain of 1V/V is
equivalent to a noise gain of 2.) Gain and phase response for
other gains are shown in the Typical Performance Curves.
The high-frequency response of the OPA644 in a good
layout is very flat with frequency.
DISTORTION
The OPA644's harmonic distortion characteristics into a
100
load are shown vs frequency and power output in the
Typical Performance Curves. Distortion can be further im-
proved by increasing the load resistance as illustrated in
Figure 6. Remember to include the contribution of the
feedback resistance when calculating the effective load re-
sistance seen by the amplifier.
DG and DP of the OPA644 were measured with the amplifier
in a gain of +2V/V with 75
input impedance and the output
back-terminated in 75
. The input signal selected from the
generator was a 0V to 1.4V modulated ramp with sync pulse.
With these conditions the test circuit shown in Figure 7
delivered a 100IRE modulated ramp to the 75
input of the
video analyzer. The signal averaging feature of the analyzer
was used to establish a reference against which the performance
of the amplifier was measured. Signal averaging was also used
to measure the DG and DP of the test signal in order to
eliminate the generator's contribution to measured amplifier
performance. Typical performance of the OPA644 is 0.008%
differential gain and 0.009
differential phase to both NTSC
and PAL standards.
FIGURE 6. 5MHz Harmonic Distortion vs Load Resistance.
50
60
70
80
90
10
100
1k
Load Resistance (
)
100
20
50
200
500
Harmonic Distortion (dBc)
DIFFERENTIAL GAIN AND PHASE
Differential Gain (DG) and Differential Phase (DP) are among
the more important specifications for video applications. DG
is defined as the percent change in closed-loop gain over a
specified change in output voltage level. DP is defined as the
change in degrees of the closed-loop phase over the same
output voltage change. Both DG and DP are specified at the
NTSC sub-carrier frequency of 3.58MHz and the PAL
subcarrier of 4.43MHz. All NTSC measurements were
performed using a Tektronix model VM700A Video
Measurement Set.
FIGURE 7. Configuration for Testing Differential
Gain/Phase.
OPA644
75
75
402
402
75
75
TEK TSG 130A
TEK VM700A
NOISE FIGURE
The OPA644's voltage and current noise spectral densities
are specified in the Typical Performance Curves. For RF
applications, however, Noise Figure (NF) is often the pre-
ferred noise specification since it allows system noise per-
formance to be more easily calculated. The OPA644's Noise
Figure vs Source Resistance is shown in Figure 8.
FIGURE 8. Noise Figure vs Source Resistance.
Source Resistance (
)
10
100
1K
10K
100K
25
20
15
10
5
0
Noise Figure (dB)
NF = 10LOG 1 +
e
n
2
+ (InR
s
)
2
4KTR
S
OPA644
12
OPA644
402
DAC
Digital
Data
In
50
50
V
OUT
= 2V Full Scale
V
OUT
V
OUTNOT
20mA
20mA
150
Gain = 2V/V
SPICE MODELS
Computer simulation using SPICE is often useful when
analyzing the performance of analog circuits and systems.
This is particularly true for Video and RF amplifier circuits
where parasitic capacitance and inductance can have a major
effect on circuit performance. SPICE models using MicroSim
Corporation's PSpice are available for the OPA644. Con-
tract Burr-Brown applications departments to receive a SPICE
Diskette.
DEMONSTRATION BOARDS
Demonstration boards to speed prototyping are available.
Refer to the DEM-OPA64X data sheet for details.
APPLICATIONS
FIGURE 9. Low Distortion Video Amplifier.
OPA644
V
OUT
402
402
Video
Input
75
75
75
Transmission Line
75
FIGURE 10. Output Amplification for a DDS DAC.
13
OPA644
Input
High Speed
12-, 14-, or 16-Bit
ADC
ADS805
499
OPA644
Input
402
100
OPA644
200
OPA644
402
R
F
402
R
G
402
R
F
402
OPA642
402
402
FIGURE 12. Low Distortion ADC Amplifier (G = +5V/V).
FIGURE 11. Wideband, Fast-Settling Instrumentation Amplifier.
Differential Voltage Gain = 5V/V = 1 + 2R
F
/R
G