2004 California Micro Devices Corp. All rights reserved.
06/28/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
1
CM1203
1, 2 and 3-Channel ESD Arrays in CSP
Features
Functionally and pin compatible with CMD's
CSPESD301/302/303 family of devices
OptiGuard
TM
coated for improved reliability at
assembly
1, 2 or 3 channels of ESD protection
15kV ESD protection (IEC 61000-4-2, contact
discharge)
30kV ESD protection (HBM)
Supports both AC and DC signal applications
Low leakage current (<100nA)
Chip Scale Package features extremely low lead
inductance for optimum ESD and filter perfor-
mance
4 bump, 1.06 x 0.93mm footprint Chip Scale Pack-
age (CSP)
Lead-free version available
Applications
I/O port protection
EMI filtering for data ports
Cellphones, notebook computers, PDAs
Wireless Handsets
MP3 Players
Digital Still Cameras
Handheld PCs
Product Description
The CM1203 comprises a family of 1, 2, and 3-channel
ESD protection arrays, which integrate two, three and
four identical avalanche-style diodes. It is intended that
one of these diodes is connected to GND and the other
diodes provide ESD protection for up to 3 lines
depending upon the configuration utilized. The back-
to-back diode connections provide ESD protection for
nodes that have AC signals up to 5.9V peak. These
devices provide a very high level of protection for sen-
sitive electronic components that may be subjected to
electrostatic discharge (ESD). The diodes are
designed and characterized to safely dissipate ESD
strikes of 15kV, well beyond the maximum require-
ments of the IEC 61000-4-2 international standard.
Using the MIL-STD-883 (Method 3015) specification
for Human Body Model (HBM) ESD, these devices pro-
tect against contact discharges of greater than 30kV.
The diodes also provide some EMI filtering, when used
in combination with a PCB trace or series resistor.
These devices are particularly well-suited for portable
electronics (e.g. cellular telephones, PDAs, notebook
computers) because of their small package format and
easy-to-use pin assignments.
The CM1203 incorporates OptiGuard
TM
coating which
results in improved reliability at assembly. The CM1203
is available in a space-saving, low-profile, chip-scale
package with optional lead-free finishing.
Electrical Schematics
B1
A2
B2
B1
A2
B2
B1
A2
A1
CM1203-01
CM1203-02
CM1203-03
2004 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
06/28/04
CM1203
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "
+
" character for the top side orientation mark.
B2
B1
A1
A2
Orientation
Marking
A1
2
1
B
A
n*
Orientation
Marking
(see note 2)
PACKAGE / PINOUT DIAGRAMS
Notes:
CM1203
TOP VIEW
BOTTOM VIEW
(Bumps Down View)
(Bumps Up View)
* See ordering information for
appropriate part marking.
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
4-Bump CSP Package
3) All 4 bumps are always present. Unused bumps are electrically unconnected.
PART NUMBERING INFORMATION
Bumps
Package
Standard Finish
Lead-free Finish
2
Ordering Part
Number
1
Part Marking
Ordering Part
Number
1
Part Marking
4
CSP
CM1203-01CS
P
CM1203-01CP
P
4
CSP
CM1203-02CS
Q
CM1203-02CP
Q
4
CSP
CM1203-03CS
R
CM1203-03CP
R
2004 California Micro Devices Corp. All rights reserved.
06/28/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
3
CM1203
Specifications
Note 1: T
A
=25
C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to
another diode, one at a time.
Note 3: Unused pins are left open.
Note 4: These parameters are guaranteed by design and char-
acterization.
Figure 1. Parameter Legend
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
Storage Temperature Range
-65 to +150
C
DC Package Power Rating
200
mW
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
C
ELECTRICAL OPERATING CHARACTERISTICS
1
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
V
SO
Diode Stand-off Voltage
I
DIODE
=
10A
5.9
V
I
LEAK
Diode Leakage Current
V
IN
=3.3V
100
nA
V
SIG
Small Signal Clamp Voltage
Positive Clamp
Negative Clamp
I
DIODE
= 10mA
I
DIODE
= -10mA
6.0
-9.2
7.6
-7.6
9.2
-6.0
V
V
V
ESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Notes 2, 3 and 4
30
15
kV
kV
V
CL
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Between adjacent bumps
Between diagonal bumps
Notes 2, 3 and 4
19.5
19.9
V
V
R
D
Dynamic Resistance
Between adjacent bumps
Between diagonal bumps
Notes 2, 3 and 4
0.85
1.10
C
Capacitance
At 0VDC, 1MHz, 30mVAC
27
pF
3.3V
10mA
10
A
V
SIG
V
CL
V
I
ESD
I
LEAK
slope = 1
/
R
D
V
SO
I
2004 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
06/28/04
CM1203
Performance Information
Figure 2. Typical EMI Filter Performance (0VDC, 50 Ohm Environment)
Figure 3. Typical Capacitance vs. Input Voltage (normalized to 0VDC)
2004 California Micro Devices Corp. All rights reserved.
06/28/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
5
CM1203
Performance Information (cont'd)
Figure 4. Low Current I-V Curve
Figure 5. High Current I-V Curve
2
2
4
6
8
-6
-4
-2
4
6
8
-8
-6
-4
-2
I (
A)
V (V)
-8
-2.0
-1.5
-1.0
-0.5
0.0
0.5
1.0
1.5
2.0
-12 -11 -10 -9
-8
-7
-6
-5
-4
-3
-2
-1
0
1
2
3
4
5
6
7
8
9
10 11 12
High Current I-V Characteristic - Pads A1 to A2
Current
[A]
Voltage [V]
2004 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
06/28/04
CM1203
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
Figure 6. Recommended Non-Solder Mask Defined Pad Illustration
Figure 7. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 8. Lead-free (SnAgCu) Solder
Ball Reflow Profile
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance -- Edge To Corner Ball
+50
m
Solder Ball Side Coplanarity
+20
m
Maximum Dwell Time Above Liquidous
60 seconds
Soldering Maximum Temperature
260C
Solder Mask Opening
0.325mm DIA.
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
200
250
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
T
emperature
(
C)
2004 California Micro Devices Corp. All rights reserved.
06/28/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
7
CM1203
Mechanical Details
CSP Mechanical Specifications
CM1203 devices are packaged in a custom Chip Scale
Package (CSP). Dimensions are shown below. For
complete information on CSP packaging, see the Cali-
fornia Micro Devices CSP Package Information docu-
ment.
Package Dimensions for
CM1203 Chip Scale Package
CSP Tape and Reel Specifications
Figure 9. Tape and Reel Mechanical Data
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
4
Dim
Millimeters
Inches
Min
Nom
Max
Min
Nom
Max
A1
0.881
0.925
0.971
0.0347
0.0365
0.0382
A2
1.015
1.060
1.105
0.0400
0.0417
0.0435
B1
0.495
0.500
0.505
0.0195
0.0197
0.0199
B2
0.495
0.500
0.505
0.0195
0.0197
0.0199
C1
0.163
0.213
0.263
0.0064
0.0084
0.0104
C2
0.230
0.280
0.330
0.0091
0.0110
0.0130
D1
0.600
0.670
0.739
0.0236
0.0264
0.0291
D2
0.394
0.445
0.495
0.0155
0.0175
0.0195
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
A
B
1
C1
B1
A1
C2
DIMENSIONS IN MILLIMETERS
D1
D2
A2
BOTTOM VIEW
SIDE
VIEW
2
B2
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
SOLDER BUMPS
95.5/3.8/0.7 Sn/Ag/Cu (Lead-free)
OptiGuard
TM
Coating
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B
0
X A
0
X K
0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P
0
P
1
CM1203
1.06 X 0.93 X 0.670
1.14 X 1.00 X 0.70
8mm
178mm (7")
3500
4mm
4mm
Top
For tape feeder reference
Cover
Tape
P
1
only including draft.
Concentric around B.
K
o
Embossment
User Direction of Feed
0.2 mm
P
o
Center Lines
of Cavity
W
10 Pitches Cumulative
Tolerance On Tape
A
o
B
o
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