2005 California Micro Devices Corp. All rights reserved.
10/04/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
1
CM1400-03
6 Channel EMI Filter Array with ESD Protection
Features
Functionally and pin compatible with CSPEMI306A
device
OptiGuard
TM
coated for improved reliability at
assembly
Six channels of EMI filtering for data ports
Pi-style EMI filters in a capacitor-resistor-capacitor
(C-R-C) network
40dB absolute attenuation (typical) at 1 GHz
35dB attenuation (typical) at 1 GHz relative to pass
band
15kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
30kV ESD protection on each channel (HBM)
15-bump, 2.960mm X 1.330mm footprint
Chip Scale Package (CSP)
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
Lead-free version available
Applications
EMI filtering and ESD protection for both data
and I/O ports
Wireless Handsets
Handheld PCs / PDAs
MP3 Players
Notebooks
Desktop PCs
Product Description
The CM1400-03 is a six channel low-pass filter array
that reduces EMI/RFI emissions while at the same time
providing ESD protection. It is used on data ports on
mobile devices. To reduce EMI/RFI emissions, the
CM1400-03 integrates a pi-style filter (C-R-C) for each
of the 6 channels. Each high quality filter provides
greater than 30dB attenuation in the 800-2700 MHz
range relative to the pass band attenuation. These pi-
style filters also support bidirectional filtering, control-
ling EMI both to and from a data port connector.
In addition, the CM1400-03 provides a very high level
of protection for sensitive electronic components that
may be subjected to electrostatic discharge (ESD).
The input pins are designed and characterized to
safely dissipate ESD strikes of
15kV, exceeding the
maximum requirement of the IEC 61000-4-2 interna-
tional standard. Using the MIL-STD-883 (Method 3015)
specification for Human Body Model (HBM) ESD, the
device provides protection for contact discharges to
greater than
30kV.
The CM1400-03 is particularly well suited for portable
electronics (e.g., cellular telephones, PDAs, notebook
computers) because of its small package footprint and
low weight.
The CM1400-03 incorporates OptiGuard
TM
coating
which results in improved reliability at assembly. The
CM1400-03 is available in a space-saving, low-profile
chip scale package with optional lead-free finishing.
Electrical Schematic
100
30pF
30pF
FILTERn*
GND
FILTERn*
* See Package/Pinout Diagram for expanded pin information.
(Pins B1-B3)
1 of 6 EMI/RFI + ESD Channels
2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
10/04/05
CM1400-03
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN(s)
NAME
DESCRIPTION
A1
FILTER1
Filter Channel 1
A2
FILTER2
Filter Channel 2
A3
FILTER3
Filter Channel 3
A4
FILTER4
Filter Channel 4
A5
FILTER5
Filter Channel 5
A6
FILTER6
Filter Channel 6
B1-B3
GND
Device Ground
C1
FILTER1
Filter Channel 1
C2
FILTER2
Filter Channel 2
C3
FILTER3
Filter Channel 3
C4
FILTER4
Filter Channel 4
C5
FILTER5
Filter Channel 5
C6
FILTER6
Filter Channel 6
N003
4
3
2
6
5
1
C
B
A
Orientation
Marking
(see note 2)
PACKAGE / PINOUT DIAGRAMS
Notes:
BOTTOM VIEW
CM1400-03CS/CP
CSP Package
(Bumps Up View)
TOP VIEW
(Bumps Down View)
FILTER5
FILTER6
GND
FILTER5
FILTER6
A6
A5
Orientation
Marking
B3
C6
C5
FILTER3
FILTER4
GND
FILTER3
FILTER4
A4
A3
B2
C4
C3
FILTER1
FILTER2
GND
FILTER1
FILTER2
A2
A1
B1
C2
C1
A1
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PART NUMBERING INFORMATION
Pins
Package
Standard Finish
Lead-free Finish
2
Ordering Part
Number
1
Part Marking
Ordering Part
Number
1
Part Marking
15
CSP
CM1400-03CS
N003
CM1400-03CP
N003
2005 California Micro Devices Corp. All rights reserved.
10/04/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
3
CM1400-03
Specifications
Note 1: T
A
=25
C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
then clamping voltage is measured at Pin C1.
Note 4: These parameters are guaranteed by design and characterization.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
Storage Temperature Range
-65 to +150
C
DC Power per Resistor
100
mW
DC Package Power Rating
600
mW
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
C
ELECTRICAL OPERATING CHARACTERISTICS
(SEE NOTE1)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
R
Resistance
80
100
120
C
Capacitance
At 2.5V DC
24
30
36
pF
TCR
Temperature Coefficient of Resistance
1200
ppm/C
TCC
Temperature Coefficient of Capacitance
At 2.5V DC
-300
ppm/C
V
DIODE
Diode Voltage (reverse bias)
I
DIODE
=10
A
6.0
V
I
LEAK
Diode Leakage Current (reverse bias)
V
DIODE
=3.3V
100
nA
V
SIG
Signal Voltage
Positive Clamp
Negative Clamp
I
LOAD
= 10mA
5.6
-1.5
6.8
-0.8
9.0
-0.4
V
V
V
ESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Notes 2 and 4
30
15
kV
kV
V
CL
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2, 3 and 4
+10
-5
V
V
f
C
Cut-off Frequency
Z
SOURCE
=50
, Z
LOAD
=50
R=100
, C=30pF
58
MHz
2005 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
10/04/05
CM1400-03
Performance Information
Typical Filter Performance (T
A
=25C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss vs. Frequency (A1-C1 to GND B2)
Figure 2. Insertion Loss vs. Frequency (A2-C2 to GND B2)
2005 California Micro Devices Corp. All rights reserved.
10/04/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
5
CM1400-03
Performance Information (cont'd)
Typical Filter Performance (T
A
=25C, DC Bias=0V, 50 Ohm Environment)
Figure 3. Insertion Loss vs. Frequency (A3-C3 to GND B2)
Figure 4. Insertion Loss vs. Frequency (A4-C4 to GND B2)
2005 California Micro Devices Corp. All rights reserved.
6
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
10/04/05
CM1400-03
Performance Information (cont'd)
Typical Filter Performance (T
A
=25C, DC Bias=0V, 50 Ohm Environment)
Figure 5. Insertion Loss vs. Frequency (A5-C5 to GND B2)
Figure 6. Insertion Loss vs. Frequency (A6-C6 to GND B2)
2005 California Micro Devices Corp. All rights reserved.
10/04/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
7
CM1400-03
Performance Information (cont'd)
Typical Filter Performance (T
A
=25C, DC Bias=0V, 50 Ohm Environment)
Figure 7. Comparison of Filter Response Curves for CM1400-03 with DC Bias
2005 California Micro Devices Corp. All rights reserved.
8
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
10/04/05
CM1400-03
Performance Information (cont'd)
Figure 8. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5VDC and 25C)
Figure 9. Resistance vs. Temperature
(normalized to resistance at 25C)
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
0
1
2
3
4
5
DC Input Voltage (V)
Normalized Capacitance
T = -40C
T = +25C
T = +70C
0.900
0.920
0.940
0.960
0.980
1.000
1.020
1.040
1.060
1.080
1.100
-40
-20
0
20
40
60
80
100
Temperature ['C]
Nornalized Resistance
2005 California Micro Devices Corp. All rights reserved.
10/04/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
9
CM1400-03
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
Figure 10. Recommended Non-Solder Mask Defined Pad Illustration
Figure 11. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 12. Lead-free (SnAgCu) Solder
Ball Reflow Profile
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance -- Edge To Corner Ball
+50
m
Solder Ball Side Coplanarity
+20
m
Maximum Dwell Time Above Liquidous
60 seconds
Maximum Soldering Temperature for Eutectic Devices using a Eutectic Solder Paste
240C
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste
260C
Solder Mask Opening
0.325mm DIA.
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
200
250
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
T
emperature
(
C)
2005 California Micro Devices Corp. All rights reserved.
10
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
10/04/05
CM1400-03
Mechanical Details
CSP Mechanical Specifications
The CM1400-03 is supplied in a custom Chip Scale
Package (CSP). Dimensions are presented below. For
complete information on the CSP, see the California
Micro Devices CSP Package Information document.
Package Dimensions for
CM1400-03 Chip Scale Package
CSP Tape and Reel Specifications
Figure 13. Tape and Reel Mechanical Data
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
15
Dim
Millimeters
Inches
Min
Nom
Max
Min
Nom
Max
A1
2.915 2.960 3.005 0.1148 0.1165 0.1183
A2
1.285 1.330 1.375 0.0506 0.0524 0.0541
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.245 0.250 0.255 0.0096 0.0098 0.0100
B3
0.430 0.435 0.440 0.0169 0.0171 0.0173
B4
0.430 0.435 0.440 0.0169 0.0171 0.0173
C1
0.180 0.230 0.280 0.0071 0.0091 0.0110
C2
0.180 0.230 0.280 0.0071 0.0091 0.0110
D1
0.575 0.644 0.714 0.0226 0.0254 0.0281
D2
0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
A
B
C
3
4
5
6
C1
B1
A1
B3
C2
DIMENSIONS IN MILLIMETERS
D1
D2
A2
BOTTOM VIEW
SIDE
VIEW
1
2
B2
B4
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
SOLDER BUMPS
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
OptiGuard
TM
Coating
PART NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B
0
X A
0
X K
0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P
0
P
1
CM1400-03
2.96 X 1.33 X 0.644
3.10 X 1.45 X 0.74
8mm
178mm (7")
3500
4mm
4mm
Top
For Tape Feeder Reference
Cover
Tape
P
1
Only including Draft.
Concentric Around B.
K
o
Embossment
User Direction of Feed
0.2 mm
P
o
Center Lines
of Cavity
W
10 Pitches Cumulative
Tolerance On Tape
A
o
B
o
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