2005 California Micro Devices Corp. All rights reserved.
09/16/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
1
CM1424
MultiMedia Card EMI Filter Array with ESD Protection
Features
Three channels of EMI filtering, each with ESD
protection
Two channels of ESD protection
Flow-through routing for MMC interface
15kV ESD protection (IEC 61000-4-2, contact
discharge)
30kV ESD protection (HBM)
Greater than 30dB of attenuation at 1GHz
Chip Scale Package features extremely low
lead inductance for optimum filter and ESD
performance
10-bump, 1.998mm x 1.458mm footprint Chip
Scale Package (CSP)
Available with OptiGuard
TM
coating for improved
reliability
Lead-free version available
Applications
MultiMedia Card (MMC) slot in mobile handsets
and other handheld devices such as digital cam-
eras and MP3 players
I/O port protection for mobile handsets, notebook
computers, PDAs etc.
EMI filtering for data ports in cell phones, PDAs or
notebook computers
Product Description
The CM1424 is an EMI filter array integrating 3 pi-filters
(C-R-C) and 2 channels of ESD protection. The
CM1424 has component values of 12pF
-
100
-
12pF.
The parts include avalanche-type ESD diodes on every
pin, which provide a very high level of protection for
sensitive electronic components that may be subjected
to electrostatic discharge (ESD). The ESD diodes con-
nected to the filter ports safely dissipate ESD strikes of
15kV, beyond the maximum requirement of the
IEC61000-4-2 international standard. Using the MIL-
STD-883 (Method 3015) specification for Human Body
Model (HBM) ESD, the pins are protected for contact
discharges at greater than
30kV.
The ESD diodes on pins A2 and C2 safely dissipate
ESD strikes of
15kV, well beyond the maximum
requirement of the IEC 61000-4-2 international stan-
dard.
This device is particularly well-suited for portable elec-
tronics (e.g. mobile handsets, PDAs, notebook comput-
ers) because of its small package and easy-to-use pin
assignments. In particular, the CM1424 is ideal for EMI
filtering and protecting data lines from ESD for the Mul-
tiMedia Card (MMC) slot in mobile handsets.
The CM1424 devices are optionally available with Opti-
Guard
TM
coating which results in improved reliability.
The CM1424 is available in space-saving, low-profile,
chip-scale packages with optional lead-free finishing.
Electrical Schematic
100
12pF
12
p
F
A3
C1
C3
A1
100
12pF
12
p
F
A2
ESD Channel 1
EMI Filter + ESD Channel 1
EMI Filter + ESD Channel 2
A4
C4
100
12pF
12
p
F
EMI Filter + ESD Channel 3
C2
ESD Channel 2
CMD
CLK
DAT0
CMD
CLK
DAT0
2005 California Micro Devices Corp. All rights reserved.
2
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
09/16/05
CM1424
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "
+
" character for the top side orientation mark.
EMI+ESD3
EMI+ESD2
GND
EMI+ESD3 EMI+ESD2
C4
C3
B2
A3
A4
Orientation
Marking
ESD2
EMI+ESD1
GND
ESD1
EMI+ESD1
C2
C1
B1
A1
A2
A1
EMI+ESD3
EMI+ESD2
GND
EMI+ESD3 EMI+ESD2
C4
C3
B2
A3
A4
Orientation
Marking
ESD2
EMI+ESD1
GND
ESD1
EMI+ESD1
C2
C1
B1
A1
A2
A1
N243
3
1
4
2
C
B
A
Orientation
Marking
(see note 2)
N241
3
1
4
2
C
B
A
Orientation
Marking
(see note 2)
PACKAGE / PINOUT DIAGRAMS
Notes:
BOTTOM VIEW
CM1424 CSP Package (Uncoated)
(Bumps Up View)
TOP VIEW
(Bumps Down View)
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
BOTTOM VIEW
CM1424 CSP Package (OptiGuard
TM
coated)
(Bumps Up View)
TOP VIEW
(Bumps Down View)
PIN DESCRIPTIONS
PIN(s)
NAME
DESCRIPTION
PIN(s)
NAME
DESCRIPTION
A1
EMI+ESD1
CMD Filter Channel 1
C1
EMI+ESD1
CMD Filter Channel 1
A2
ESD1
ESD Channel 1
C2
ESD2
ESD Channel 2
A3
EMI+ESD2
CLK Filter Channel 2
C3
EMI+ESD2
CLK Filter Channel 2
A4
EMI+ESD3
DAT0 Filter Channel 3
C4
EMI+ESD3
DAT0 Filter Channel 3
B1-B2
GND
Device Ground
PART NUMBERING INFORMATION
Bumps
PKG
Standard Finish
Lead-free Finish
2
No Coating
OptiGuard
TM
Coated
No Coating
OptiGuard
TM
Coated
Ordering Part
Number
1
Part
Marking
Ordering Part
Number
1
Part
Marking
Ordering Part
Number
1
Part
Marking
Ordering Part
Number
1
Part
Marking
10
CSP
CM1424-01CS
N241
CM1424-03CS
N243
CM1424-01CP
N241
CM1424-03CP
N243
2005 California Micro Devices Corp. All rights reserved.
09/16/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
3
CM1424
Specifications
Note 1: T
A
=25
C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: These parameters are guaranteed by design and characterization.
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
Storage Temperature Range
-65 to +150
C
DC Power per Resistor
100
mW
DC Package Power Rating
300
mW
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
C
ELECTRICAL OPERATING CHARACTERISTICS
1
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
R
Resistance
80
100
120
C
Capacitance
At 2.5V DC, 1MHz, 30mV
AC
9
12
15
pF
V
DIODE
Diode Standoff Voltage
I
DIODE
= 10
A
6.0
V
I
LEAK
Diode Leakage Current (reverse bias)
V
DIODE
= +3.3V
100
300
nA
V
SIG
Signal Clamp Voltage
Positive Clamp
Negative Clamp
I
LOAD
= 10mA
5.6
-1.5
6.8
-0.8
9.0
-0.4
V
V
V
ESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Notes 2 and 3
30
15
kV
kV
R
DYN
Dynamic Resistance
Positive
Negative
1.6
0.4
f
C
Cut-off Frequency
Z
SOURCE
=50
, Z
LOAD
=50
Channel R=100
,
Channel C=12pF
157
MHz
2005 California Micro Devices Corp. All rights reserved.
4
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
09/16/05
CM1424
Performance Information
Typical Filter Performance (T
A
=25C, DC Bias=0V, 50 Ohm Environment)
Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B1)
Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2)
2005 California Micro Devices Corp. All rights reserved.
09/16/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
5
CM1424
Performance Information (cont'd)
Typical Filter Performance (T
A
=25C, DC Bias=0V, 50 Ohm Environment)
Figure 3. Insertion Loss VS. Frequency (A4-C4 to GND B2)
Figure 4. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5VDC and 25C)
2005 California Micro Devices Corp. All rights reserved.
6
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
09/16/05
CM1424
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
Figure 5. Recommended Non-Solder Mask Defined Pad Illustration
Figure 6. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 7. Lead-free (SnAgCu) Solder
Ball Reflow Profile
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask defined pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.125mm - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
0.330mm Round
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance -- Edge To Corner Ball
+50
m
Solder Ball Side Coplanarity
+20
m
Maximum Dwell Time Above Liquidous (183C)
60 seconds
Maximum Soldering Temperature for a Eutectic Device using Eutectic Solder Paste
240C
Maximum Soldering Temperature for a Lead-free Device using Lead-free Solder Paste
260C
Solder Mask Opening
0.325mm DIA.
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
200
250
150
100
50
0
1:00.0
2:00.0
3:00.0
4:00.0
Time (minutes)
T
emperature
(
C)
2005 California Micro Devices Corp. All rights reserved.
09/16/05
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
7
CM1424
Mechanical Details (cont'd)
CM1424 devices are supplied in custom Chip Scale
Packages (CSP) and are available with optional Opti-
Guard
TM
coating.
CM1424 Mechanical Specifications
The package dimensions for the CM1424 are pre-
sented below.
Note 1: Applies to uncoated devices only.
Note 2: Applies to OptiGuard
TM (coated) devices only.
Package Dimensions for
CM1424 Chip Scale Package
PACKAGE DIMENSIONS
Package
Custom CSP
Bumps
10
Dim
Millimeters
Inches
Min
Nom
Max
Min
Nom
Max
A1
1.953 1.998 2.043 0.0769 0.0787 0.0804
A2
1.413 1.458 1.503 0.0556 0.0574 0.0592
B1
0.495 0.500 0.505 0.0195 0.0197 0.0199
B2
0.245 0.250 0.255 0.0096 0.0098 0.0100
B3
0.430 0.435 0.440 0.0169 0.0171 0.0173
B4
0.430 0.435 0.440 0.0169 0.0171 0.0173
C1
0.199 0.249 0.299 0.0078 0.0098 0.0118
C2
0.244 0.294 0.344 0.0096 0.0116 0.0135
D1
1
0.562 0.606 0.650 0.0221 0.0239 0.0256
D2
1
0.356 0.381 0.406 0.0140 0.0150 0.0160
D3
2
0.575 0.644 0.714 0.0226 0.0254 0.0281
D4
2
0.368 0.419 0.470 0.0145 0.0165 0.0185
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
A
B
C
1
C1
B1
A1
B3
C2
DIMENSIONS IN MILLIMETERS
D3
D4
A2
BOTTOM VIEW
SIDE
VIEW
2
B2
B4
3
4
OptiGuard
TM
Coating
OptiGuard
TM
Coated CSP
A
B
C
1
C1
B1
A1
B3
C2
D1
D2
A2
BOTTOM VIEW
SIDE
VIEW
2
B2
B4
3
4
Non-coated CSP
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
SOLDER BUMPS
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
SOLDER BUMPS
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
2005 California Micro Devices Corp. All rights reserved.
8
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.cmd.com
09/16/05
CM1424
Mechanical Details (cont'd)
CSP Tape and Reel Specifications
Figure 8. Tape and Reel Mechanical Data
PART
NUMBER
CHIP SIZE (mm)
POCKET SIZE (mm)
B
0
X A
0
X K
0
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P
0
P
1
CM1424-01
1.998x 1.458 x 0.606
2.29 x 1.6 x 0.81
8mm
178mm (7")
3500
4mm
4mm
CM1424-03
1.998 x 1.458 x 0.644
2.29 x 1.6 x 0.81
8mm
178mm (7")
3500
4mm
4mm
Top
For Tape Feeder Reference
Cover
Tape
P
1
Only including Draft.
Concentric Around B.
K
o
Embossment
User Direction of Feed
0.2 mm
P
o
Center Lines
of Cavity
W
10 Pitches Cumulative
Tolerance On Tape
A
o
B
o
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