PRELIMINARY
2005 California Micro Devices Corp. All rights reserved.
6/23/05 430 N. McCarthy Blvd., Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
1
CM1452
LCD & Camera EMI Filter Array with ESD Protection
Features Applications
4, 6 and 8 channels of EMI filtering
15kV ESD protection
(IEC 61000-4-2, contact discharge)
30kV ESD protection (HBM)
Greater than 30dB of attenuation at 1GHz
Chip Scale Package (CSP) with 0.40mm pitch and
0.25mm CSP solder ball which features extremely
low parasitic inductance for optimum filter and ESD
performance
OptiGuard Coating for improved reliability at assembly
Lead-free version available
LCD and Camera data lines in mobile
handsets
I/O port protection for mobile handsets,
notebook computers, PDAs etc.
EMI filtering for data ports in cell phones,
PDAs or notebook computers.
Wireless
handsets
Handheld
PCs/PDAs
LCD and camera modules
General Description
California Micro Devices' CM1452 is a family of pi-style EMI filter arrays with ESD protection, which
integrates four, six and eight filters (C-L-C) in CSP form factor with 0.40mm pitch. Each EMI filter channel
of the CM1452 is implemented as a 3-pole L-C filter where the component values are 20pF-17nH-20pF.
The CM1452's roll-off frequency at -6dB attenuation is 330MHz and can be used in applications where the
data rates are as high as 132Mbps while providing greater than 30dB over the 800MHz to 2.7GHz
frequency range. The parts include ESD diodes on every I/O pin, which provide a very high level of
protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The
ESD protection diodes connected to the filter ports are designed and characterized to safely dissipate ESD
strikes of
15kV, beyond the maximum requirement of the IEC61000-4-2 international standard. Using the
MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for
contact discharges at greater than
30kV.
This device is particularly well suited for wireless handsets, mobile LCD modules and PDAs because of its
small package format and easy-to-use pin assignments. In particular, the CM1452 is ideal for EMI filtering
and protecting data and control lines for the LCD display and camera interface in mobile handsets.
The CM1452 incorporates OptiGuard which results in improved reliability at assembly. The CM1452 is
available in a space saving, low profile Chip Scale Package with optional lead-free finishing
(95.5Sn/3.8Ag/0.7Cu). It is manufactured with a 0.40mm pitch and 0.25mm CSP solder ball to provide up
to 28% board space savings vs. competing CSP devices with 0.50mm pitch and 0.30mm CSP solder ball.
Schematic Diagram
CM1452 schematic diagram of 3-pole L-C filter array with ESD.
PRELIMINARY
2005 California Micro Devices Corp. All rights reserved.
6/23/05 430 N. McCarthy Blvd., Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
2
Package Diagrams
CM1452-04 (4-channel) mechanical diagram.
CM1452-06 (6-channel) mechanical diagram.
CM1452-08 (8-channel) mechanical diagram.
Pin Number
Pin Description
Pin Number
Pin Description
A1 Filter
#1 B3 GND
A2 Filter
#2 B4 GND
A3
Filter #3
C1
Filter #1
A4
Filter #4
C2
Filter #2
A5
Filter #5
C3
Filter #3
A6
Filter #6
C4
Filter #4
A7
Filter #7
C5
Filter #5
A8
Filter #8
C6
Filter #6
B1 GND C7
Filter
#7
B2 GND C8
Filter
#8
PRELIMINARY
2005 California Micro Devices Corp. All rights reserved.
6/23/05 430 N. McCarthy Blvd., Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
3
Part Ordering Information
Pins
Package
Lead-free Finish
10 CSP
CM1452-04CP
15 CSP
CM1452-06CP
20 CSP
CM1452-08CP
Electrical Specifications
Specifications:
(At 25
C unless specified otherwise)
Min.
Typ.
Max. Unit
Channel Inductance
17
nH
Total Channel Capacitance at 2.5Vdc; 1MHz, 30mVac
32
40
48
pF
Capacitance C1 at 2.5V dc; 1MHz, 30mV ac
16
20
24
pF
Cut-off Frequency, Z
SOURCE
= 50
, Z
LOAD
= 50
148 MHz
Roll-off Frequency at -6dB Attenuation, Z
SOURCE
= 50
,
Z
LOAD
= 50
330 MHz
Stand-off Voltage, I = 10mA
5.5
V
Diode Leakage at 3.3V reverse bias voltage
0.1
1.0
A
Signal Clamp Voltage:
Positive Clamp, 10mA
Negative Clamp, -10mA
5.6
-1.5
6.8
-0.8
9.0
-0.4
V
V
In-system ESD withstand voltage*:
Human Body Model (MIL-STD-883, method 3015)
IEC 61000-4-2, contact discharge method
30
15
kV
kV
Dynamic Resistance Positive
Negative
2.3
0.9
Temperature Range:
Operating
Storage
-40
-65
85
150
C
Current per Inductor:
30
mA
DC Package Power Rating:
0.5
W
* ESD applied to input/output pins with respect to GND, one at a time. Clamping voltage is measured at the opposite side of the
EMI filter to the ESD pin (i.e. if ESD is applied to pin A1 then clamping voltage is measured at pin C1). Unused pins are left
open. These parameters are guaranteed by design.
PRELIMINARY
2005 California Micro Devices Corp. All rights reserved.
6/23/05 430 N. McCarthy Blvd., Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
4
Typical EMI Filter Performance
(0V d.c., 50
environment)
Typical Diode Capacitance vs. Input Voltage
(normalized to 2.5V d.c.)
PRELIMINARY
2005 California Micro Devices Corp. All rights reserved.
6/23/05 430 N. McCarthy Blvd., Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
5
PRINTED CIRCUIT BOARD RECOMMENDATIONS
Pad size in PCB
0.240mm
Pad Shape
Round
Pad Definition
Non Solder Mask Defined Pads
Solder Mask Opening
0.290mm Round
Solder Stencil Thickness
0.150mm
Solder Stencil Aperture Opening (Laser cut, 5% tapered walls)
0.300mm (round)
Solder Flux Ratio
50/50 by volume
Solder Paste Type
No Clean
Bond Trace Finish
OSP (Entek Cu Plus 106A)
Tolerance Edge to Corner Ball
50m
Solder Ball Side Coplanarity
20m
Soldering Minimum Temperature
205'C for at least 30 seconds
Maximum Dwell Time above Liquidous (183C)
60 seconds
Soldering Maximum Temperature
260'C for at less than 2 minutes
PRELIMINARY
2005 California Micro Devices Corp. All rights reserved.
6/23/05 430 N. McCarthy Blvd., Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
6
Solder Reflow Profile
Eutectic (SnPb) Solder Ball Reflow
Profile
Lead-free (SnAgCu) Solder Ball Reflow
Profile
Tape & Reel Information
CMD PART #
CHIP SIZE
(mm)
POCKET SIZE
(mm)
Bo x Ao x Ko
TAPE
WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P
0
P
1
CM1452-04CP
1.67 x 1.05 x 0.57
8mm
178mm (7")
3500
4mm
4mm
CM1452-06CP
2.47 x 1.05 x 0.57
8mm
178mm (7")
3500
4mm
4mm
CM1452-08CP
3.30 x 1.05 x 0.57
8mm
178mm (7")
3500
4mm
4mm
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