2002 California Micro Devices Corp. All rights reserved.
12/13/02
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214
L Fax: 408.263.7846 L www.calmicro.com
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2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
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12/13/02
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12/13/02
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214
L Fax: 408.263.7846
L www.calmicro.com
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4
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L Fax: 408.263.7846 L www.calmicro.com
12/13/02
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2002 California Micro Devices Corp. All rights reserved.
12/13/02
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214
L Fax: 408.263.7846
L www.calmicro.com
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Power Supply Ripple Rejection
0
20
40
60
80
10
100
1000
10000
100000
FREQUENCY [Hz]
RIPPLE REJECTION [dB]
150m A
10mA
1mA
100uA
VIN = 3.8V, VOUT = 2.8V
COUT = 10uF Cer.
CBYP = 0.01uF
Power Supply Ripple Rejection
0
20
40
60
80
10
100
1000
10000
100000
FREQUENCY [Hz]
RIPPLE REJECTION [dB]
150mA
10mA
1mA
100uA
VIN = 3.8V, VOUT = 2.8V
COUT = 1uF Cer.
CBYP = 0.01uF
Power Supply Ripple Rejection
0
20
40
60
80
10
100
1000
10000
100000
FREQUENCY [Hz]
RIPPLE REJECTION [dB]
150mA
10mA
1mA
100uA
VIN = 3.8V, VOUT = 2.8V
COUT = 1uF Cer.
NO BYP CAP
Power Supply Ripple Rejection
Vs. Voltage Drop (1kHz)
0
20
40
60
80
0.00
0.25
0.50
0.75
1.00
1.25
1.50
DROPOUT VOLTAGE [V]
RIPPLE REJECTION [dB]
100uA
1mA
10mA
100mA
150mA
Noise Performance
Noise Performance
2002 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214
L Fax: 408.263.7846 L www.calmicro.com
12/13/02
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Ground Current vs. Input (5mA Load)
0
10
20
30
40
50
60
70
80
0
1
2
3
4
5
6
INPUT VOLTAGE [V]
GROUND CURRENT [uA]
Ground Current vs. Load (VIN = 3.8V)
0
25
50
75
100
0
50
100
150
200
LOAD CURRENT [mA]
GROUND CURRENT [uA]
Load Regulation (VIN = 3.8V)
2.78
2.79
2.80
2.81
2.82
0
50
100
150
200
LOAD CURRENT [mA]
VOUT[
V]
Dropout Voltage vs. Load Current (VOUT = 2.7V)
0
50
100
150
200
250
0
50
100
150
200
LOAD CURRENT [mA]
DROPOUT VOLTAGE [m
V]
Line Regulation (5mA Load)
2.5
2.6
2.7
2.8
2.9
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
INPUT VOLTAGE [V]
OUTPUT VOLTAGE [
V]
Foldback Current Limiting (VIN = 3.8V)
0.0
1.0
2.0
3.0
4.0
0
100
200
300
400
500
LOAD CURRENT [mA]
OUTPUT VOLTAGE [
V]
2002 California Micro Devices Corp. All rights reserved.
12/13/02
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214
L Fax: 408.263.7846
L www.calmicro.com
7
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Load transient (10% to 100%) Step Response
Line Transient (1Vpp) Step Response
Enable Response (CBYP = 10nF)
Disable Response (CBYP = 10nF)
2002 California Micro Devices Corp. All rights reserved.
8
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214
L Fax: 408.263.7846 L www.calmicro.com
12/13/02
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The overall junction to ambient thermal resistance
(
JA
) for device power dissipation (P
D
) consists prima-
rily of two paths in series. The first path is the junction
to the case (
JC
) which is defined by the package style,
and the second path is case to ambient (
CA
) thermal
resistance which is dependent on board layout. The
final operating junction temperature for any set of con-
ditions can be estimated by the following thermal equa-
tion:
T
JUNC
= T
AMB
+ P
D
(
JC
) + P
D
(
CA
)
= T
AMB
+ P
D
(
JA
)
The CM3014 uses a SOT23-5 package. When this
package is mounted on a double-sided printed circuit
board with two square inches of copper allocated for
"heat spreading", the resulting
JA
is 175
C/W.
Based on a maximum power dissipation of 320mW
(Load x Vin-Vout = 150mA x 2.2V) with an ambient of
70
C the resulting junction temperature will be:
T
JUNC
= T
AMB
+ P
D
(
JA
)
= 70
C + 315mW (175C/W)
= 70
C + 57.75C = 127.75C
7KHUPDO FKDUDFWHULVWLFV ZHUH PHDVXUHG XVLQJ D GRXEOH
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FRQQHFWHG WR WKH *1' SLQV IRU KHDW VSUHDGLQJ
Measurements showing performance up to a junction
temperature of 125
C were performed under light load
conditions (1mA). This allows the ambient temperature
to be representative of the internal junction tempera-
ture.
Note: The use of multi-layer board construction with
separate ground and power planes will further enhance
the overall thermal performance. In the event of no
copper area being dedicated for heat spreading, a
multi-layer board construction using only the minimum
size pad layout will typically provide the CM3014 with
an overall
JA
of 175
C/W, which allows up to 450mW
to be dissipated safely.
3OHDVH FRQVXOW &$0' 7HFKQLFDO 6XSSRUW IRU DVVLVWDQFH
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Output Voltage Change vs. Temperature (1mA Load)
-50
-40
-30
-20
-10
0
10
20
30
40
50
-50
-25
0
25
50
75
100
125
TEMPERATURE [
o
C]
OUTPUT CHANGE [mV]
Ground Current vs. Temperature
0
20
40
60
80
100
0
25
50
75
100
125
JUNCTION TEMPERATURE [
o
C]
GROUND CURRENT [uA]
2002 California Micro Devices Corp. All rights reserved.
12/13/02
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214
L Fax: 408.263.7846
L www.calmicro.com
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2002 California Micro Devices Corp. All rights reserved.
10
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214
L Fax: 408.263.7846 L www.calmicro.com
12/13/02
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