NEC's 870 MHz GaAs CATV
POWER DOUBLER AMPLIFIER
OUTLINE DIMENSIONS
(Units in mm)
PACKAGE OUTLINE H02
FEATURES
GaAs ACTIVE DEVICES
LOW DISTORTION
HIGH LINEAR GAIN:
MC-7881 - GL = 18 dB MIN at f = 870 MHz
MC-7882 - GL = 20 dB MIN at f = 870 MHz
MC-7883 - GL = 22 dB MIN at f = 870 MHz
MC-7884 - GL = 25 dB MIN at f = 870 MHz
LOW RETURN LOSS
LOW GAIN CHANGE OVER TEMPERATURE
SPECIFIED FOR 79, 110, and 132 CHANNELS
PERFORMANCE
HIGH RELIABILITY AND RUGGEDNESS:
Withstands environmental extremes as well as Silicon
devices (Surge, ESD, Etc.)
V
DD
9
1
In
Out
Gnd
2 3 7 8
2.54
0.38
21.5 MAX
12.9 MAX
6-32 unc 2B
2.54
0.25
1 2 3 5
7 8 9
4.19
0.13
14.85 MAX
4.25
+ 0.25
- 0.35
4.0
0.25
5
10.75
0.25
27.5 MAX
38.1
0.25
45.08 MAX
0.51
0.05
0.51
0.05
2.62
0.35
3.2 MAX
A
0.38.. A
25.4
0.25
19.05
0.38
8.1 MAX
2.5
6.3
0.05
APPLICATIONS
CATV HEADEND SYSTEMS
CATV OPTICAL NODES
CATV DISTRIBUTION AMPS
MC-7882
MC-7883
MC-7884
MC-7881
ELECTRICAL CHARACTERISTICS
(T
A
= 305 C, V
DD
= 24 V, Z
S
= Z
L
= 75
)
PART NUMBER
MC-7881
MC-7882
MC-7883 MC-7884
SYMBOLS
CHARACTERISTICS
UNITS
MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX
TEST CONDITIONS
BW
Frequency Range
MHz
50
870
50
870
50
870
50
870
G
L
Linear Gain
dB
18.0
19.0 20.0
21.0 22.0
23.0 25.0
26.0
f = 870 MHz
S
Gain Slope
dB
0.2
0.6
1.0
0.4
0.8
1.2
0.6
1.0
1.4
0.6
1.0
1.4
f = 40 to 870 MHz
Gf
Gain Flatness
dB
0.6
0.6
0.6
0.6
40 to 870 MHz;
Peak to Valley
NF
Noise Figure 1
dB
6.5
6.0
5.5
5.0
f = 50 MHz
Noise Figure 2
7.0
6.5
6.0
5.5
f = 870 MHz
RLi
Input Return Loss
dB
20.0
20.0
20.0
20.0
40 to 160MHz
19.0
19.0
20.0
20.0
160 to 320 MHz
17.5
17.5
19.0
19.0
320 to 640 MHz
16.0
16.0
17.0
17.0
640 to 870 MHz
RLo
Output Return Loss
dB
20.0
20.0
20.0
20.0
40 to 160MHz
19.0
20.0
20.0
20.0
160 to 320 MHz
17.5
19.0
19.0
19.0
320 to 640 MHz
16.0
18.0
18.0
18.0
640 to 870 MHz
continued on next page
DESCRIPTION
NEC's MC-7881, MC-7882, MC-7883, and MC-7884 are GaAs
Multi-Chip Modules designed for use as output stages in CATV
applications up to 870 MH
z
. The only difference between these
devices is gain, which is 18 dB, 20 dB, 22 dB, and 25 dB
respectively. Because these units are GaAs devices they have
low distortion, low noise figure, and low return loss across the
entire frequency band.
Like the previous generation of products, these devices sur-
vive such hazards as surge and ESD as well as their silicon
competitors, but deliver superior performance with low DC
current required. All devices are assembled and tested using
fully automated equipment to maximize consistency in part to
part performance, and reliability is assured by NEC's strin-
gent quality and process control procedures. These parts come
in industry compatible hybrid packages.
MC 7881, 7882, 7883, 7884
ABSOLUTE
MAXIMUM RATINGS
1
(T
CASE
= 25 C)
SYMBOLS
PARAMETERS
UNITS
RATINGS
V
DD
Supply Voltage
V
30
V
I
Input Voltage (Single Tone)
2
dBmV
65
T
C
Operating Case Temperature
C
-30 to +100
T
STG
Storage Temperature
C
-40 to +100
Note:
1. Operation in excess of any one of these parameters may result
in permanent damage.
2. Maximum single channel power applied to the input for 1 minute
with no measurable degradation in performance.
SYMBOLS PARAMETERS
UNITS
MIN
TYP MAX
V
DD
Supply Voltage
V
23.5
24.0
24.5
V
i
Input Voltage
1
, MC-7881
dBmV
36.0
39.0
MC-7882
34.0
37.0
MC-7883
32.0
35.0
MC-7884
29.0
32.0
T
C
Operating Case
C
-30
+25
+85
Temperature
RECOMMENDED
OPERATING CONDITIONS
(Z
s
= Z
L
= 75
)
Note:
1. Test Conditions: 110 Channels, 10 dB tilted across the band.
1. The space between PC board and root of the lead should be
kept more than 1 mm to prevent undesired stress on the lead and
also should be kept less than 4 mm to prevent undesired parasitic
inductance.
Recommended space is 2.0 to 3.0 mm typical.
2. Recommended torque strength of the screw is 59 to 78 Ncm.
3. Form the ground pattern as wide as possible to minimize ground
impedance. (to prevent undesired oscillation)
All the ground pins must be connected together with wide ground
pattern to decrease impedance difference.
NOTES ON CORRECT USE
This product should be soldered in the following recommended
conditions. Other soldering methods and conditions than the
recommended conditions are to be consulted with our sales
representatives.
RECOMMENDED SOLDERING CONDITIONS
Soldering
Soldering
Condition
Method
Conditions
Symbol
Pin Part Heating
Pin area temperature: less
than 260C
1
Hour: Within 2 sec./pin
Note.
1. The point of pin part heating must be kept at a distance of more
than 1.2 mm from the root of lead.
Note:
1. Measured per US standard methods and procedures (using selective level meter).
ELECTRICAL CHARACTERISTICS, cont.
(T
A
= 305 C, V
DD
= 24 V, Z
S
= Z
L
= 75
)
PART NUMBER
MC-7881
MC-7882
MC-7883 MC-7884
SYMBOLS CHARACTERISTICS
UNITS
MIN TYP MAX MIN TYP MAX MIN TYP MAX MIN TYP MAX
TEST CONDITIONS
I
DD
Operating Current
mA
310
360
310
360
310
360
310
360
RF OFF
CTB
Composite Triple Beat
dBc
-60
-60
-60
-60
110 Channels,
XMod
Cross Modulation
1
dBc
-55
-55
-55
-55
V
OUT
= 52 dBmV at
CSO
Composite Second Order
dBc
-63
-63
-63
-63
745.25 MHz, 10 dB tilted
across the band
PART NUMBER
PACKAGE
QUANTITY
MC-7881
7-pin special with heatsink
50pcs max/ Tray
MC-7882
7-pin special with heatsink
50pcs max/ Tray
MC-7883
7-pin special with heatsink
50pcs max/ Tray
MC-7884
7-pin special with heatsink
50pcs max/ Tray
ORDERING INFORMATION
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
A Business Partner of NEC
Compound Semiconductor Devices, Ltd.
03/16/2003
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