145 Adams Avenue
Hauppauge, NY 11788 USA
Tel:
(631) 435-1110
Fax: (631) 435-1824
www.centralsemi.com
PROCESS
CPQ165
TRIAC
25 Amp, 600 Volt TRIAC Chip
PRINCIPAL DEVICE TYPES
CQDD-25M Series
CQ220-25M Series
CQ220-25MFP Series
GEOMETRY
PROCESS DETAILS
R0 (20 -January 2006)
Process
Glass Passivated Mesa
Die Size
165 x 165 MILS
Die Thickness
8.6 MILS 0.6 MILS
MT1 Bonding Pad Area
134 x 83 MILS
Gate Bonding Pad Area
35 x 35 MILS
Top Side Metalization
Al - 45,000
Back Side Metalization
Al/Mo/Ni/Ag - 32,000
GROSS DIE PER 4 INCH WAFER
376
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