Series HP3
Technical
METAL CASE, CASE-MOUNTED
SEMICONDUCTORS
HP3 Series for Single TO-3 or Stud Mount
DESCRIPTION OF CURVES
A.
B.
C.
D.
E.
N.C. Horiz. Device Only
Mounted to G-10.
N.C Horiz. & Vert. With
Dissipator.
200 FPM w/Diss.
500 FPM w/Diss.
1000 FPM w/Diss.
Thermal Resistance Case to Sink is 0.1-0.3
C/W w/Joint Compound.
Derate 1.0
C/watt for unplated part in natural convection only.
Ordering Information
CTS IERC PART NO.
Unplated
Comm'l. Black
Anodize
Mil. Black Anodize
Semiconductor
Accommodated
Hole patt. ref.
no.
Max. Weight
(Grams)
HP3-000-U
HP3-T03-U
HP3-T03-33U
HP3-000-CB
HP3-T03-CB
HP3-T03-33CB
HP3-000-B
HP3-T03-B
HP3-T03-33B
Undrilled
T0-3
T0-3 IC
--
16
17
55.0
55.0
55.0
HP3-T03-44U
HP3-436-U
HP3-T015-U
HP3-T06-U
HP3-420-U
HP3-T03-44CB
HP3-436-CB
HP3-T015-CB
HP3-T06-CB
HP3-420-CB
HP3-T03-44B
HP3-436-B
HP3-T015-B
HP3-T06-B
HP3-420-B
T0-3 PANEL MOUNT
T0-3 (4 PIN)
T0-15, D0-5
T0-6, T0-36
UNIVERSAL
31
18
23
19
27
55.0
55.0
55.0
55.0
55.0
HP3 for Dual TO-3 Outline
DESCRIPTION OF CURVES
A.
B.
C.
D.
E.
N.C. Horiz. Device Only
Mounted to G-10.
N.C Horiz. & Vert. With
Dissipator.
200 FPM w/Diss.
500 FPM w/Diss.
1000 FPM w/Diss.
Thermal Resistance Case to Sink is 0.1-0.3
C/W w/Joint Compound.
Derate 2.0
C/watt for unplated part in natural convection only.
Ordering Information
CTS IERC PART NO.
Unplated
Comm'l. Black
Anodize
Mil. Black Anodize
Semiconductor
Accommodated
Hole patt. ref.
no.
Max. Weight
(Grams)
HP3-T03-4U
HP3-437-U
HP3-T03-4CB
HP3-437-CB
HP3-T03-4B
HP3-437-B
Two TO-3s
Two TO-3s (4 pin)
6
12
55.0
55.0
HP3 for Three TO-3 Outline
DESCRIPTION OF CURVES
A.
B.
C.
D.
E.
N.C. Horiz. Device Only
Mounted to G-10.
N.C Horiz. & Vert. With
Dissipator.
200 FPM w/Diss.
500 FPM w/Diss.
1000 FPM w/Diss.
Thermal Resistance Case to Sink is 0.1-0.3
C/W w/Joint Compound.
Derate 3.0
C/watt for unplated part in natural convection only.
Ordering Information
CTS IERC PART NO.
Unplated
Comm'l. Black
Anodize
Mil. Black Anodize
Semiconductor
Accommodated
Hole patt. ref.
no.
Max. Weight
(Grams)
HP3-T03-8U
HP3-T03-8CB
HP3-T03-8B
Three TO-3s
13
55.0
HOLE PATTERNS
6. Hole pattern no. 124 accomodates two TO-3s. Available in
HP3 series heat dissipators only.
12. Hole pattern no. 437 accommodates two TO-3s (4-pin).
Available in HP3 series heat dissipators only.
13. Hole pattern no. 186 accommodates three TO-3s. Available
in HP3 series heat dissipators only.
16. Hole pattern no. 1 accommodates T0-3s. Available in UP,
UP1, UP2, HP1, and HP3 series heat dissipators.
17. Hole pattern no. 202 accommodates T0-3 ICs. Available in
UP, UP1, UP2, HP1, and HP3 series heat dissipators.
18. Hole pattern no. 436 accomodates T0-3s (4-pin). Available
in UP, UP1, UP2, HP1, and HP3 series heat dissipators.
19. Hole pattern no. 2 accommodates T0-6s or T0-36s.
Available in UP, UP1, UP2, HP1, and HP3 series heat
dissipators.
23. Hole pattern no. 3 accommodates T0-15s, D0-5s and other
1/4" stud mount devices. Available in UP, UP1, UP2, HP1, and
HP3 series heat dissipators.
27. Hole pattern no. 420 (Universal) accommodates T0-3s, T0-
66s, T0-126s, T0-127s, or T0-220s. Available in UP, UP1, UP2,
HP1, and HP3 series heat dissipators.
31. Hole pattern no. 213 accommodates one TO-3 (panel
mounted). Available in HP1 and HP3 series heat dissipators
only.
CTS IERC, Heat Sinks and Thermal Management Solutions
413 North Moss Street, Burbank, California 91502 Tel: (818) 842-7277 Fax: (818) 848-8872
Rev. 04-13-04
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