Series LB66B1

Technical

METAL CASE, CASE-MOUNTED
SEMICONDUCTORS

Part Number Series LB66B1

Natural Conv. (

C/W): 17.1

Forced Air (

C/W): 5.3

Mounting Envelope: 1.40" x 1.12" x .50"

DESCRIPTION OF CURVES

C.
D.
E.

N.C. Horiz. Device Only
Mounted to G-10.
N.C Horiz. & Vert. With
Dissipator.
200 FPM w/Diss.
500 FPM w/Diss.
1000 FPM w/Diss.

Thermal Resistance Case to Sink is 0.5-0.7

C/W w/Joint Compound.

Derate 1.4

C/watt for unplated part in natural convection only.

Ordering Information

CTS IERC PART NO.

Unplated

Comm'l. Black

Anodize

Mil. Black

Anodize

Semiconductor

Accommodated

Hole patt. ref.

no.

Max. Weight

(Grams)

LB66B1-76U
LB66B1U
LB66B1-67U
LB66B1-77U

LB66B1-76CB
LB66B1CB
LB66B1-67CB
LB66B1-77CB

LB66B1-76B
LB66B1B
LB66B1-67B
LB66B1-77B

Undrilled

TO-66

TO-66 IC
TO-66 IC

(Socket)

9
7

6.2
6.2
6.2
6.2

HOLE PATTERNS

9. Hole Pattern no. 133 accommodates TO-66s. Available in LB
series heat dissipators only.

7. Hole pattern no. 191 accommodates To-66 Ics. Available in
LA-A, LA-B, and LB series heat dissipators only.

10. Hole pattern no. 225 accommodates TO-66 ICs (socket).
Available in LB series heat dissipators only.

CTS IERC, Heat Sinks and Thermal Management Solutions
413 North Moss Street, Burbank, California 91502 Tel: (818) 842-7277 Fax: (818) 848-8872

Rev. 08-29-03