Series LB66B2

Technical

METAL CASE, CASE-MOUNTED
SEMICONDUCTORS

Part Number Series LB66B2

Natural Conv. (

C/W): 19.7

Forced Air (

C/W): 6.4

Mounting Envelope: 1.40" x 1.12" x .31"

DESCRIPTION OF CURVES

C.
D.
E.

N.C. Horiz. Device Only
Mounted to G-10.
N.C Horiz. & Vert. With
Dissipator.
200 FPM w/Diss.
500 FPM w/Diss.
1000 FPM w/Diss.

Thermal Resistance Case to Sink is 0.5-0.7

C/W w/Joint Compound.

Derate 1.4

C/watt for unplated part in natural convection only.

Ordering Information

CTS IERC PART NO.

Unplated

Comm'l. Black

Anodize

Mil. Black

Anodize

Semiconductor

Accommodated

Hole patt. ref.

no.

Max. Weight

(Grams)

LB66B2-76U
LB66B2U
LB66B2-67U
LB66B2-77U

LB66B2-76CB
LB66B2CB
LB66B2-67CB
LB66B2-77CB

LB66B2-76B
LB66B2B
LB66B2-67B
LB66B2-77B

Undrilled
TO-66
TO-66 IC
TO-66 IC
(Socket)

9
7

4.8
4.8
4.8
4.8

HOLE PATTERNS

9. Hole Pattern no. 133 accommodates TO-66s. Available in LB
series heat dissipators only.

7. Hole pattern no. 191 accommodates To-66 Ics. Available in
LA-A, LA-B, and LB series heat dissipators only.

10. Hole pattern no. 225 accommodates TO-66 ICs (socket).
Available in LB series heat dissipators only.

CTS IERC, Heat Sinks and Thermal Management Solutions
413 North Moss Street, Burbank, California 91502 Tel: (818) 842-7277 Fax: (818) 848-8872

Rev. 08-29-03