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Электронный компонент: CY7C1350G-133BGC

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PRELIMINARY
4-Mbit (128K x 36) Pipelined SRAM
with NoBLTM Architecture
CY7C1350G
Cypress Semiconductor Corporation
3901 North First Street
San Jose
,
CA 95134
408-943-2600
Document #: 38-05524 Rev. *A
Revised October 14, 2004
Features
Pin compatible and functionally equivalent to ZBTTM
devices
Internally self-timed output buffer control to eliminate
the need to use OE
Byte Write capability
128K x 36 common I/O architecture
Single 3.3V power supply
2.5V/3.3V I/O Operation
Fast clock-to-output times
-- 2.6 ns (for 250-MHz device)
-- 2.6 ns (for 225-MHz device)
-- 2.8 ns (for 200-MHz device)
-- 3.5 ns (for 166-MHz device)
-- 4.0 ns (for 133-MHz device)
-- 4.5 ns (for 100-MHz device)
Clock Enable (CEN) pin to suspend operation
Synchronous self-timed writes
Asynchronous output enable (OE)
Lead-Free 100 TQFP and 119 BGA packages
Burst Capability--linear or interleaved burst order
"ZZ" Sleep mode option
Functional Description
[1]
The CY7C1350G is a 3.3V, 128K x 36 synchronous-pipelined
Burst SRAM designed specifically to support unlimited true
back-to-back Read/Write operations without the insertion of
wait states. The CY7C1350G is equipped with the advanced
No Bus LatencyTM (NoBLTM) logic required to enable consec-
utive Read/Write operations with data being transferred on
every clock cycle. This feature dramatically improves the
throughput of the SRAM, especially in systems that require
frequent Write/Read transitions.
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. All data outputs pass through
output registers controlled by the rising edge of the clock. The
clock input is qualified by the Clock Enable (CEN) signal,
which, when deasserted, suspends operation and extends the
previous clock cycle. Maximum access delay from the clock
rise is 2.6 ns (250-MHz device)
Write operations are controlled by the four Byte Write Select
(BW
[A:D]
) and a Write Enable (WE) input. All writes are
conducted with on-chip synchronous self-timed write circuitry.
Three synchronous Chip Enables (CE
1
, CE
2
, CE
3
) and an
asynchronous Output Enable (OE) provide for easy bank
selection and output tri-state control. In order to avoid bus
contention, the output drivers are synchronously tri-stated
during the data portion of a write sequence.
Note:
1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.
A0, A1, A
C
MODE
BW
A
BW
B
WE
CE1
CE2
CE3
OE
READ LOGIC
DQs
DQP
A
DQP
B
DQP
C
DQP
D
D
A
T
A
S
T
E
E
R
I
N
G
O
U
T
P
U
T
B
U
F
F
E
R
S
MEMORY
ARRAY
E
E
INPUT
REGISTER 0
ADDRESS
REGISTER 0
WRITE ADDRESS
REGISTER 1
WRITE ADDRESS
REGISTER 2
WRITE REGISTRY
AND DATA COHERENCY
CONTROL LOGIC
BURST
LOGIC
A0'
A1'
D1
D0
Q1
Q0
A0
A1
C
ADV/LD
ADV/LD
E
INPUT
REGISTER 1
S
E
N
S
E
A
M
P
S
E
CLK
CEN
WRITE
DRIVERS
BW
C
BW
D
ZZ
SLEEP
CONTROL
O
U
T
P
U
T
R
E
G
I
S
T
E
R
S
Logic Block Diagram
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PRELIMINARY
CY7C1350G
Document #: 38-05524 Rev. *A
Page 2 of 15
Selection Guide
250 MHz
225 MHz
200 MHz
166 MHz
133 MHz
100 MHz
Unit
Maximum Access Time
2.6
2.6
2.8
3.5
4.0
4.5
ns
Maximum Operating Current
325
290
265
240
225
205
mA
Maximum CMOS Standby Current
40
40
40
40
40
40
mA
Shaded area contains advance information. Please contact your local Cypress sales representative for availability of these parts.
Pin Configuration
A
A
A
A
A
1
A
0
NC /
2
88M
NC /
1
44M
V
SS
V
DD
N
C
/
36M
A
A
A
A
A
A
DQP
B
DQ
B
DQ
B
V
DDQ
V
SS
DQ
B
DQ
B
DQ
B
DQ
B
V
SS
V
DDQ
DQ
B
DQ
B
V
SS
NC
V
DD
DQ
A
DQ
A
V
DDQ
V
SS
DQ
A
DQ
A
DQ
A
DQ
A
V
SS
V
DDQ
DQ
A
DQ
A
DQP
A
DQP
C
DQ
C
DQ
C
V
DDQ
V
SS
DQ
C
DQ
C
DQ
C
DQ
C
V
SS
V
DDQ
DQ
C
DQ
C
NC
V
DD
NC
V
SS
DQ
D
DQ
D
V
DDQ
V
SS
DQ
D
DQ
D
DQ
D
DQ
D
V
SS
V
DDQ
DQ
D
DQ
D
DQP
D
A
A
CE
1
CE
2
BW
D
BW
C
BW
B
BW
A
CE
3
V
DD
V
SS
CL
K
WE
CEN
OE
A
A
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
A
AD
V
/
LD
ZZ
MODE
NC
/
72M
NC /
18
M
NC /
9
M
CY7C1350G
100-Pin TQFP
BYTE B
BYTE A
BYTE C
BYTE D
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PRELIMINARY
CY7C1350G
Document #: 38-05524 Rev. *A
Page 3 of 15
Pin Configuration
(continued)
2
3
4
5
6
7
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
DQ
A
V
DDQ
NC
NC
DQ
C
DQ
D
DQ
C
DQ
D
A
A
A
A
NC / 18M
V
DDQ
CE
2
A
V
DDQ
V
DDQ
V
DDQ
V
DDQ
NC
NC
A
DQ
C
DQ
C
DQ
D
DQ
D
NC
V
DD
A
NC / 72M
DQP
D
A
A
ADV/LD
A
CE
3
NC
V
DD
A
A
NC
V
SS
V
SS
NC
DQP
B
DQ
B
DQ
B
DQ
A
DQ
B
DQ
B
DQ
A
DQ
A
NC
NC
NC
V
DDQ
NC
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
V
SS
MODE
CE
1
V
SS
OE
V
SS
V
DDQ
BW
C
NC / 9M
V
SS
WE
V
DDQ
V
DD
V
SS
V
DD
V
SS
CLK
NC
BW
A
CEN
V
SS
V
DDQ
V
SS
ZZ
NC
A
A
A1
A0
V
SS
V
DD
DQP
C
DQ
B
A
NC / 36M
DQ
C
DQ
B
DQ
C
DQ
C
DQ
C
DQ
B
DQ
B
DQ
A
DQ
A
DQ
A
DQ
A
DQP
A
DQ
D
DQ
D
DQ
D
DQ
D
BW
D
119-Ball Bump BGA
BW
B
NC
Pin Definitions
Name
I/O
Description
A0, A1, A
Input-
Synchronous
Address Inputs used to select one of the 128K address locations. Sampled at the rising edge
of the CLK. A
[1:0]
are fed to the two-bit burst counter.
BW
[A:D]
Input-
Synchronous
Byte Write Inputs, active LOW. Qualified with WE to conduct writes to the SRAM. Sampled on
the rising edge of CLK.
WE
Input-
Synchronous
Write Enable Input, active LOW. Sampled on the rising edge of CLK if CEN is active LOW. This
signal must be asserted LOW to initiate a write sequence.
ADV/LD
Input-
Synchronous
Advance/Load Input. Used to advance the on-chip address counter or load a new address. When
HIGH (and CEN is asserted LOW) the internal burst counter is advanced. When LOW, a new
address can be loaded into the device for an access. After being deselected, ADV/LD should be
driven LOW in order to load a new address.
CLK
Input-Clock
Clock Input. Used to capture all synchronous inputs to the device. CLK is qualified with CEN.
CLK is only recognized if CEN is active LOW.
CE
1
Input-
Synchronous
Chip Enable 1 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with
CE
2
and CE
3
to select/deselect the device.
CE
2
Input-
Synchronous
Chip Enable 2 Input, active HIGH. Sampled on the rising edge of CLK. Used in conjunction with
CE
1
and CE
3
to select/deselect the device.
CE
3
Input-
Synchronous
Chip Enable 3 Input, active LOW. Sampled on the rising edge of CLK. Used in conjunction with
CE
1
and
CE
2
to select/deselect the device.
OE
Input-
Asynchronous
Output Enable, asynchronous input, active LOW. Combined with the synchronous logic block
inside the device to control the direction of the I/O pins. When LOW, the I/O pins are allowed to
behave as outputs. When deasserted HIGH, I/O pins are tri-stated, and act as input data pins. OE
is masked during the data portion of a write sequence, during the first clock when emerging from
a deselected state, when the device has been deselected.
CEN
Input-
Synchronous
Clock Enable Input, active LOW. When asserted LOW the Clock signal is recognized by the
SRAM. When deasserted HIGH the Clock signal is masked. Since deasserting CEN does not
deselect the device, CEN can be used to extend the previous cycle when required.
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PRELIMINARY
CY7C1350G
Document #: 38-05524 Rev. *A
Page 4 of 15
Functional Overview
The CY7C1350G is a synchronous-pipelined Burst SRAM
designed specifically to eliminate wait states during
Write/Read transitions. All synchronous inputs pass through
input registers controlled by the rising edge of the clock. The
clock signal is qualified with the Clock Enable input signal
(CEN). If CEN is HIGH, the clock signal is not recognized and
all internal states are maintained. All synchronous operations
are qualified with CEN. All data outputs pass through output
registers controlled by the rising edge of the clock. Maximum
access delay from the clock rise (t
CO
) is 2.6 ns (250-MHz
device).
Accesses can be initiated by asserting all three Chip Enables
(CE
1
, CE
2
, CE
3
) active at the rising edge of the clock. If Clock
Enable (CEN) is active LOW and ADV/LD is asserted LOW,
the address presented to the device will be latched. The
access can either be a read or write operation, depending on
the status of the Write Enable (WE). BW
[A:D]
can be used to
conduct Byte Write operations.
Write operations are qualified by the Write Enable (WE). All
writes are simplified with on-chip synchronous self-timed write
circuitry.
Three synchronous Chip Enables (CE
1
, CE
2
, CE
3
) and an
asynchronous Output Enable (OE) simplify depth expansion.
All operations (Reads, Writes, and Deselects) are pipelined.
ADV/LD should be driven LOW once the device has been
deselected in order to load a new address for the next
operation.
Single Read Accesses
A read access is initiated when the following conditions are
satisfied at clock rise: (1) CEN is asserted LOW, (2) CE
1
, CE
2
,
and CE
3
are ALL asserted active, (3) the Write Enable input
signal WE is deasserted HIGH, and (4) ADV/LD is asserted
LOW. The address presented to the address inputs is latched
into the Address Register and presented to the memory core
and control logic. The control logic determines that a read
access is in progress and allows the requested data to
propagate to the input of the output register. At the rising edge
of the next clock the requested data is allowed to propagate
through the output register and onto the data bus, provided OE
is active LOW. After the first clock of the read access the output
buffers are controlled by OE and the internal control logic. OE
must be driven LOW in order for the device to drive out the
requested data. During the second clock, a subsequent
operation (Read/Write/Deselect) can be initiated. Deselecting
the device is also pipelined. Therefore, when the SRAM is
deselected at clock rise by one of the chip enable signals, its
output will tri-state following the next clock rise.
Burst Read Accesses
The CY7C1350G has an on-chip burst counter that allows the
user the ability to supply a single address and conduct up to
four Reads without reasserting the address inputs. ADV/LD
must be driven LOW in order to load a new address into the
SRAM, as described in the Single Read Access section above.
The sequence of the burst counter is determined by the MODE
input signal. A LOW input on MODE selects a linear burst
mode, a HIGH selects an interleaved burst sequence. Both
burst counters use A0 and A1 in the burst sequence, and will
wrap around when incremented sufficiently. A HIGH input on
ADV/LD will increment the internal burst counter regardless of
the state of chip enables inputs or WE. WE is latched at the
beginning of a burst cycle. Therefore, the type of access (Read
or Write) is maintained throughout the burst sequence.
Single Write Accesses
Write accesses are initiated when the following conditions are
satisfied at clock rise: (1) CEN is asserted LOW, (2) CE
1
, CE
2
,
and CE
3
are ALL asserted active, and (3) the Write signal WE
is asserted LOW. The address presented to the address inputs
is loaded into the Address Register. The write signals are
latched into the Control Logic block.
On the subsequent clock rise the data lines are automatically
tri-stated regardless of the state of the OE input signal. This
allows the external logic to present the data on DQs
and
ZZ
Input-
Asynchronous
ZZ "sleep" Input. This active HIGH input places the device in a non-time critical "sleep" condition
with data integrity preserved. During normal operation, this pin can be connected to Vss or left
floating.
DQs
I/O-
Synchronous
Bidirectional Data I/O Lines. As inputs, they feed into an on-chip data register that is triggered
by the rising edge of CLK. As outputs, they deliver the data contained in the memory location
specified by the address during the clock rise of the read cycle. The direction of the pins is
controlled by OE and the internal control logic. When OE is asserted LOW, the pins can behave as
outputs. When HIGH, DQ
s
and DQP
X
are placed in a tri-state condition. The outputs are automati-
cally tri-stated during the data portion of a write sequence, during the first clock when emerging from
a deselected state, and when the device is deselected, regardless of the state of OE.
DQP
[A:D]
I/O-
Synchronous
Bidirectional Data Parity I/O Lines. Functionally, these signals are identical to DQ
s
. During write
sequences, DQP
[A:D]
is controlled by BW
[A:D]
correspondingly.
MODE
Input
Strap pin
Mode Input. Selects the burst order of the device. When tied to GND selects linear burst
sequence. When tied to VDD or left floating selects interleaved burst sequence.
V
DD
Power Supply
Power supply inputs to the core of the device.
V
DDQ
I/O Power Supply Power supply for the I/O circuitry.
V
SS
Ground
Ground for the device.
NC
No Connects. Not internally connected to the die. 9M, 18M, 36M, 72M, 144M and 288M are
address expansion pins in this device and will be used as address pins in their respective densities.
Pin Definitions
(continued)
Name
I/O
Description
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PRELIMINARY
CY7C1350G
Document #: 38-05524 Rev. *A
Page 5 of 15
DQP
[A:D]
. In addition, the address for the subsequent access
(Read/Write/Deselect) is latched into the Address Register
(provided the appropriate control signals are asserted).
On the next clock rise the data presented to DQs
and DQP
[A:D]
(or a subset for Byte Write operations, see Write Cycle
Description table for details) inputs is latched into the device
and the write is complete.
The data written during the Write operation is controlled by
BW
[A:D]
signals. The CY7C1350G provides byte write
capability that is described in the Write Cycle Description table.
Asserting the Write Enable input (WE) with the selected Byte
Write Select (BW
[A:D]
) input will selectively write to only the
desired bytes. Bytes not selected during a Byte Write
operation will remain unaltered. A synchronous self-timed
write mechanism has been provided to simplify the write
operations. Byte write capability has been included in order to
greatly simplify Read/Modify/Write sequences, which can be
reduced to simple byte write operations.
Because the CY7C1350G is a common I/O device, data
should not be driven into the device while the outputs are
active. The Output Enable (OE) can be deasserted HIGH
before presenting data to the DQs
and DQP
[A:D]
inputs. Doing
so will tri-state the output drivers. As a safety precaution, DQs
and DQP
[A:D]
are automatically tri-stated during the data
portion of a write cycle, regardless of the state of OE.
Burst Write Accesses
The CY7C1350G has an on-chip burst counter that allows the
user the ability to supply a single address and conduct up to
four Write operations without reasserting the address inputs.
ADV/LD must be driven LOW in order to load the initial
address, as described in the Single Write Access section
above. When ADV/LD is driven HIGH on the subsequent clock
rise, the chip enables (CE
1
, CE
2
, and CE
3
) and WE inputs are
ignored and the burst counter is incremented. The correct
BW
[A:D]
inputs must be driven in each cycle of the burst write
in order to write the correct bytes of data.
Sleep Mode
The ZZ input pin is an asynchronous input. Asserting ZZ
places the SRAM in a power conservation "sleep" mode. Two
clock cycles are required to enter into or exit from this "sleep"
mode. While in this mode, data integrity is guaranteed.
Accesses pending when entering the "sleep" mode are not
considered valid nor is the completion of the operation
guaranteed. The device must be deselected prior to entering
the "sleep" mode. CE
1
, CE
2
, and CE
3
, must remain inactive
for the duration of t
ZZREC
after the ZZ input returns LOW.
Interleaved Burst Address Table
(MODE = Floating or V
DD
)
First Address
A1, A0
Second
Address
A1, A0
Third
Address
A1, A0
Fourth
Address
A1, A0
00
01
10
11
01
00
11
10
10
11
00
01
11
10
01
00
Linear Burst Address Table (MODE = GND)
First Address
A1, A0
Second
Address
A1, A0
Third
Address
A1, A0
Fourth
Address
A1, A0
00
01
10
11
01
10
11
00
10
11
00
01
11
00
01
10
Truth Table
[2, 3, 4, 5, 6, 7, 8]
Operation
Address Used
CE
ZZ
ADV/LD
WE BW
x
OE CEN CLK
DQ
Deselect Cycle
None
H
L
L
X
X
X
L
L-H tri-state
Continue Deselect Cycle
None
X
L
H
X
X
X
L
L-H tri-state
Read Cycle (Begin Burst)
External
L
L
L
H
X
L
L
L-H Data Out (Q)
Read Cycle (Continue Burst)
Next
X
L
H
X
X
L
L
L-H Data Out (Q)
NOP/Dummy Read (Begin Burst)
External
L
L
L
H
X
H
L
L-H tri-state
Dummy Read (Continue Burst)
Next
X
L
H
X
X
H
L
L-H tri-state
Write Cycle (Begin Burst)
External
L
L
L
L
L
X
L
L-H Data In (D)
Write Cycle (Continue Burst)
Next
X
L
H
X
L
X
L
L-H Data In (D)
NOP/WRITE ABORT (Begin Burst) None
L
L
L
L
H
X
L
L-H tri-state
WRITE ABORT (Continue Burst)
Next
X
L
H
X
H
X
L
L-H tri-state
IGNORE CLOCK EDGE (Stall)
Current
X
L
X
X
X
X
H
L-H --
SNOOZE MODE
None
X
H
X
X
X
X
X
X
tri-state
Notes:
2. X ="Don't Care." H = Logic HIGH, L = Logic LOW. CE stands for ALL Chip Enables active. BWx = L signifies at least one Byte Write Select is active, BWx = Valid
signifies that the desired byte write selects are asserted, see Write Cycle Description table for details.
3. Write is defined by BW
X
, and WE. See Write Cycle Descriptions table.
4. When a write cycle is detected, all DQs are tri-stated, even during byte writes.
5. The DQ and DQP pins are controlled by the current cycle and the OE signal. OE is asynchronous and is not sampled with the clock.
6. CEN = H, inserts wait states.
7. Device will power-up deselected and the DQs in a tri-state condition, regardless of OE.
8. OE is asynchronous and is not sampled with the clock rise. It is masked internally during write cycles. During a read cycle DQs and DQP
[A:D]
= tri-state when
OE is inactive or when the device is deselected, and DQs and DQP
[A:D]
= data when OE is active.