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Электронный компонент: W48S111-14

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PRELIMINARY
Spread Spectrum Desktop/Notebook System
Frequency Generator
W48S111-14
Cypress Semiconductor Corporation
3901 North First Street
San Jose
CA 95134
408-943-2600
October 28, 1999, rev. 0.7
Features
Maximized EMI suppression using Cypress's Spread
Spectrum Technology
Reduces measured EMI by as much as 10 dB
I
2
C programmable to 133 MHz
Two skew-controlled copies of CPU output
SEL100/66# selects CPU frequency (100 or 66.8 MHz)
Seven copies of PCI output (synchronous w/CPU
output)
One copy of 14.31818-MHz IOAPIC output
One copy of 48-MHz USB output
Selectable 24-/48-MHz clock is determined by resistor
straps on power-up
One high-drive output buffer that produces a copy of
the 14.318-MHz reference
Isolated core VDD pin for noise reduction
Key Specifications
Supply Voltages:....................................... V
DDQ3
= 3.3V5%
V
DDQ2
= 2.5V5%
CPU Cycle to Cycle Jitter: .......................................... 200 ps
CPU, PCI Output Edge Rate:
.........................................
1 V/ns
CPU0:1 Output Skew: ................................................ 175 ps
PCI_F, PCI1:6 Output Skew: .......................................500 ps
CPU to PCI Skew: ........................ 1.5 to 4.0 ns (CPU Leads)
REF2X/SEL48#, SCLOCK, SDATA: ............... 250-k
pull-up
Note: Internal pull-up resistors should not be relied upon for
setting I/O pins HIGH.
Table 1. Pin Selectable Frequency
SEL100/66#
CPU(0:1)
PCI
1
100 MHz
33.3 MHz
0
66.8 MHz
33.4 MHz
Pin Configuration
Block Diagram
VDDQ3
REF2X/SEL48#
VDDQ3
IOAPIC
CPU0
CPU1
PCI_F
XTAL
PLL Ref Freq
PLL 1
100/66#_SEL
X2
X1
VDDQ3
PCI1
PCI2
PCI3
PCI4
PCI5
48MHz
24/48MHz
PLL2
2/3
OSC
VDDQ2
PCI6
GND
GND
VDDQ3
GND
GND
I
2
C
SCLOCK
SDATA
LOGIC
X1
X2
GND
PCI_F
PCI1
PCI2
PCI3
PCI4
VDDQ3
PCI5
PCI6
VDDQ3
48MHz
24/48MHz
GND
REF2X/SEL48#
VDDQ3
VDDQ2
IOAPIC
VDDQ2
CPU0
CPU1
VDDQ3
GND
SDATA
SCLOCK
SEL100/66#
GND
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
W48S111-14
PRELIMINARYPRELIMI-
2
Pin Definitions
Pin Name
Pin
No.
Pin
Type
Pin Description
CPU0:1
22, 21
O
CPU Clock Outputs 0 through 1: These two CPU clocks run at a frequency set by
SEL100/66#. Output voltage swing is set by the voltage applied to VDDQ2.
PCI1:6
PCI_F
5, 6, 7, 8, 10,
11, 4
O
PCI Bus Clock Outputs 1 through 6 and PCI_F: These seven PCI clock outputs
run synchronously to the CPU clock. Voltage swing is set by the power connection
to VDDQ3.
IOAPIC
24
O
I/O APIC Clock Output: Provides 14.318-MHz fixed frequency. The output voltage
swing is set by the power connection to VDDQ2.
48MHz
13
O
48-MHz Output: Fixed 48-MHz USB clock. Output voltage swing is controlled by
voltage applied to VDDQ3.
24/48MHz
14
O
24-MHz or 48-MHz Output: Frequency is set by the state of pin 27 on power-up.
REF2X/SEL48#
27
I/O
I/O Dual-Function REF2X and SEL48# pin: Upon power-up, the state of SEL48#
is latched. The initial state is set by either a 10K resistor to GND or to V
DD
. A 10K
resistor to GND causes pin 14 to output 48 MHz. If the pin is strapped to V
DD
, pin
14 will output 24 MHz. After 2 ms, the pin becomes a high-drive output that produces
a copy of 14.318 MHz.
SEL100/66# 16
I
Frequency Selection Input: Selects CPU clock frequency as shown in Table 1 on
page 1.
SDATA
18
I/O
I
2
C Data Pin: Data should be presented to this input as described in the I
2
C section
of this data sheet. Internal 250-k
pull-up resistor.
SCLOCK
17
I
I
2
C clock Pin: The I
2
C data clock should be presented to this input as described in
the I
2
C section of this data sheet.
X1
1
I
Crystal Connection or External Reference Frequency Input: Connect to either
a 14.318-MHz crystal or other reference signal.
X2
2
I
Crystal Connection: An input connection for an external 14.318-MHz crystal. If
using an external reference, this pin must be left unconnected.
VDDQ3
9, 12, 20, 26
P
Power Connection: Power supply for core logic and PLL circuitry, PCI, 48/24MHz,
and Reference output buffers. Connect to 3.3V supply.
VDDQ2
23, 25
P
Power Connection: Power supply for IOAPIC and CPU output buffers. Connect to
2.5V supply.
GND
3, 15, 19, 28
G
Ground Connections: Connect all ground pins to the common system ground
plane.
W48S111-14
PRELIMINARYPRELIMI-
3
Functional Description
I/O Pin Operation
Pin 27 is a dual-purpose l/O pin. Upon power-up this pin acts
as a logic input, allowing the determination of assigned device
functions. A short time after power-up, the logic state of the pin
is latched and the pin becomes a clock output. This feature
reduces device pin count by combining clock outputs with input
select pins.
An external 10-k
"strapping" resistor is connected between
the l/O pin and ground or V
DD
. Connection to ground sets a
latch to "0," connection to V
DD
sets a latch to "1." Figure 1 and
Figure 2 show two suggested methods for strapping resistor
connections.
Upon W48S111-14 power-up, the first 2 ms of operation is
used for input logic selection. During this period, the Refer-
ence clock output buffer is three-stated, allowing the output
strapping resistor on the l/O pin to pull the pin and its associ-
ated capacitive clock load to either a logic HIGH or LOW state.
At the end of the 2-ms period, the established logic "0" or "1"
condition of the l/O pin is then latched. Next the output buffer
is enabled, which converts the l/O pin into an operating clock
output. The 2-ms timer is started when V
DD
reaches 2.0V. The
input bit can only be reset by turning V
DD
off and then back on
again.
It should be noted that the strapping resistor has no significant
effect on clock output signal integrity. The drive impedance of
clock output is 40
(nominal) which is minimally affected by
the 10-k
strap to ground or V
DD
. As with the series termina-
tion resistor, the output strapping resistor should be placed as
close to the l/O pin as possible in order to keep the intercon-
necting trace short. The trace from the resistor to ground or
V
DD
should be kept less than two inches in length to prevent
system noise coupling during input logic sampling.
When the clock output is enabled following the 2-ms input pe-
riod, a 14.318-MHz output frequency is delivered on the pin,
assuming that V
DD
has stabilized. If V
DD
has not yet reached
full value, output frequency initially may be below target but will
increase to target once V
DD
voltage has stabilized. In either
case, a short output clock cycle may be produced from the
CPU clock outputs when the outputs are enabled.
Power-on
Reset
Timer
Output Three-state
Data
Latch
Hold
Q
D
W48S111-14
V
DD
Clock Load
10 k
Output
Buffer
(Load Option 1)
10 k
(Load Option 0)
Output
Low
Output Strapping Resistor
Series Termination Resistor
Figure 1. Input Logic Selection Through Resistor Load Option
Power-on
Reset
Timer
Output Three-state
Data
Latch
Hold
Q
D
W48S111-14
V
DD
Clock Load
R
10 k
Output
Buffer
Output
Low
Output Strapping Resistor
Series Termination Resistor
Jumper Options
Resistor Value R
Figure 2. Input Logic Selection Through Jumper Option
W48S111-14
PRELIMINARYPRELIMI-
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Serial Data Interface
The W48S111-14 features a two-pin, serial data interface that
can be used to configure internal register settings that control
particular device functions. Upon power-up, the W48S111-14
initializes with default register settings. Therefore, the use of
this serial data interface is optional. The serial interface is
write-only (to the clock chip) and is the dedicated function of
device pins SDATA and SCLOCK. In motherboard applica-
tions, SDATA and SCLOCK are typically driven by two logic
outputs of the chipset. Clock device register changes are nor-
mally made upon system initialization, if required. The inter-
face can also be used during system operation for power man-
agement functions. Table 2 summarizes the control functions
of the serial data interface.
Operation
Data is written to the W48S111-14 in ten bytes of eight bits
each. Bytes are written in the order shown in Table 3.
Table 2. Serial Data Interface Control Functions Summary
Control Function
Description
Common Application
Clock Output Disable
Any individual clock output(s) can be disabled. Dis-
abled outputs are actively held LOW.
Unused outputs are disabled to reduce EMI
and system power. Examples are clock out-
puts to unused PCI slots.
CPU Clock Frequency
Selection
Provides CPU/PCI frequency selections beyond the
100- and 66.8-MHz selections that are provided by
the SEL100/66# pin. Frequency is changed in a
smooth and controlled fashion.
For alternate microprocessors and power
management options. Smooth frequency tran-
sition allows CPU frequency change under
normal system operation.
Output Three-state
Puts all clock outputs into a high-impedance state.
Production PCB testing.
Test Mode
All clock outputs toggle in relation to X1 input, inter-
nal PLL is bypassed. Refer to Table 4.
Production PCB testing.
(Reserved)
Reserved function for future device revision or pro-
duction device testing.
No user application. Register bit must be writ-
ten as 0.
Table 3. Byte Writing Sequence
Byte
Sequence
Byte Name
Bit Sequence
Byte Description
1
Slave Address
11010010
Commands the W48S111-14 to accept the bits in Data Bytes 36 for
internal register configuration. Since other devices may exist on the same
common serial data bus, it is necessary to have a specific slave address
for each potential receiver. The slave receiver address for the
W48S111-14 is 11010010. Register setting will not be made if the Slave
Address is not correct (or is for an alternate slave receiver).
2
Command
Code
Don't Care
Unused by the W48S111-14, therefore bit values are ignored ("don't
care"). This byte must be included in the data write sequence to maintain
proper byte allocation. The Command Code Byte is part of the standard
serial communication protocol and may be used when writing to another
addressed slave receiver on the serial data bus.
3
Byte Count
Don't Care
Unused by the W48S111-14, therefore bit values are ignored ("don't
care"). This byte must be included in the data write sequence to maintain
proper byte allocation. The Byte Count Byte is part of the standard serial
communication protocol and may be used when writing to another ad-
dressed slave receiver on the serial data bus.
4
Data Byte 0
Don't Care
Refer to Cypress SDRAM drivers.
5
Data Byte 1
6
Data Byte 2
7
Data Byte 3
Refer to Table 4
The data bits in these bytes set internal W48S111-14 registers that con-
trol device operation. The data bits are only accepted when the Address
Byte bit sequence is 11010010, as noted above. For description of bit
control functions, refer to Table 4, Data Byte Serial Configuration Map.
8
Data Byte 4
9
Data Byte 5
10
Data Byte 6
W48S111-14
PRELIMINARYPRELIMI-
5
Writing Data Bytes
Each bit in the data bytes control a particular device function
except for the "reserved" bits which must be written as a logic
0. Bits are written MSB (most significant bit) first, which is bit
7. Table 4 gives the bit formats for registers located in Data
Bytes 36.
Table 5 details additional frequency selections that are avail-
able through the serial data interface.
Table 6 details the select functions for Byte 3, bits 1 and 0.
Note:
1.
Bits 0 and 1 of Data byte 6 in Table 4 MUST be programmed as the same value.
Table 4. Data Bytes 36 Serial Configuration Map
Bit(s)
Affected Pin
Control Function
Bit Control
Default
Pin No.
Pin Name
0
1
Data Byte 3
7
--
--
(Reserved)
--
--
0
6
--
--
SEL_2
Refer to Table 5
0
5
--
--
SEL_1
Refer to Table 5
0
4
--
--
SEL_0
Refer to Table 5
0
3
--
--
Frequency Table
Selection
Frequency Controlled
by external SEL100/
66# pin (Table 1)
Frequency Controlled
by BYT3 SEL_(2:0)
(Table 5)
0
2
--
--
(Reserved)
--
--
0
10
--
--
Bit 1
Bit 0
Function (See Table 6 for function details)
0
0
Normal Operation
0
1
Test Mode
1
0
Spread Spectrum on
1
1
All Outputs Three-stated
00
Data Byte 4
7
--
--
(Reserved)
--
--
0
6
14
24/48MHz
Clock output disable
Low
Active
1
5
--
--
(Reserved)
--
--
0
4
--
--
(Reserved)
--
--
0
3
--
--
(Reserved)
--
--
0
2
21
CPU1
Clock Output Disable
Low
Active
1
1
--
--
(Reserved)
--
--
0
0
22
CPU0
Clock Output Disable
Low
Active
1
Data Byte 5
7
4
PCI_F
Clock Output Disable
Low
Active
1
6
11
PCI6
Clock Output Disable
Low
Active
1
5
10
PCI5
Clock Output Disable
Low
Active
1
4
-
--
(Reserved)
--
--
0
3
8
PCI4
Clock Output Disable
Low
Active
1
2
7
PCI3
Clock Output Disable
Low
Active
1
1
6
PCI2
Clock Output Disable
Low
Active
1
0
5
PCI1
Clock Output Disable
Low
Active
1
Data Byte 6
7
--
--
(Reserved)
--
--
0
6
--
--
(Reserved)
--
--
0
5
24
IOAPIC
Clock Output Disable
Low
Active
1
4
--
--
(Reserved)
--
--
0
3
--
--
(Reserved)
--
--
0
2
--
--
(Reserved)
--
--
0
1
27
REF2X
Clock Output Disable
Low
Active
1
[1]
0
27
REF2X
Clock Output Disable
Low
Active
1
[1]
W48S111-14
PRELIMINARYPRELIMI-
6
Note:
2.
CPU and PCI frequency selections are listed in Table 1 and Table 5.
Table 5. Additional Frequency Selections through Serial Data Interface Data Bytes
Input Conditions
Output Frequency
If Spread Is On
Data Byte 3, Bit 3 = 1
CPU, SDRAM
Clocks (MHz)
PCI Clocks
(MHz)
Spread Percentage
Bit 6
SEL_2
Bit 5
SEL_1
Bit 4
SEL_0
0
0
0
68.5
34.25
0.5% Center
0
0
1
75
37.5
0.5% Center
0
1
0
83.3
41.6
0.5% Center
0
1
1
66.8
33.4
0.5% Center
1
0
0
103
34.25
0.5% Center
1
0
1
112
37.3
0.5% Center
1
1
0
133.3
44.43
0.5% Center
1
1
1
100
33.3
0.5% Center
Table 6. Select Function for Data Byte 3, Bits 0:1
Function
Input Conditions
Output Conditions
Data Byte 3
CPU0:1
PCI_F, PCI1:6
REF2X,
IOAPIC
48MHZ
24MHZ
Bit 1
Bit 0
Normal Operation
0
0
Note 2
Note 2
14.318 MHz
48 MHz
24 MHz
Test Mode
0
1
X1/2
CPU/2, 3, or 4
X1
X1/2
X1/4
Spread Spectrum On
1
0
0.5%
0.5%
14.318 MHz
48 MHz
24 MHz
Three-state
1
1
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
W48S111-14
PRELIMINARYPRELIMI-
7
Absolute Maximum Ratings
Stresses greater than those listed in this table may cause per-
manent damage to the device. These represent a stress rating
only. Operation of the device at these or any other conditions
above those specified in the operating sections of this specifi-
cation is not implied. Maximum conditions for extended peri-
ods may affect reliability.
Parameter
Description
Rating
Unit
V
DD
, V
IN
Voltage on any pin with respect to GND
0.5 to +7.0
V
T
STG
Storage Temperature
65 to +150
C
T
A
Operating Temperature
0 to +70
C
T
B
Ambient Temperature under Bias
55 to +125
C
ESD
PROT
Input ESD Protection
2 (min.)
kV
DC Electrical Characteristics:
T
A
= 0C to +70C, V
DDQ3
= 3.3V5%, V
DDQ2
= 2.5V5%
Parameter
Description
Test Condition
Min.
Typ.
Max.
Unit
Supply Current
I
DDQ3
Combined 3.3V Supply Current
CPUCLK =100 MHz
Outputs Loaded
[3]
85
mA
I
DDQ3
Combined 2.5V Supply Current
CPUCLK =100 MHz
Outputs Loaded
[3]
30
mA
Logic Inputs
V
IL
Input Low Voltage
GND
0.3
0.8
V
V
IH
Input High Voltage
2.0
V
DD
+
0.3
V
I
IL
Input Low Current
[4]
25
A
I
IH
Input High Current
[4]
10
A
I
IL
Input Low Current (SEL100/66#)
5
A
I
IH
Input High Current (SEL100/66#)
5
A
Clock Outputs
V
OL
Output Low Voltage
I
OL
= 1 mA
50
mV
V
OH
Output High Voltage
I
OH
= 1 mA
3.1
V
V
OH
Output High Voltage
CPU0:1, IOAPIC I
OH
= 1 mA
2.2
V
I
OL
Output Low Current
CPU0:1
V
OL
= 1.25V
50
70
100
mA
PCI_F, PCI1:6
V
OL
= 1.5V
60
80
120
mA
IOAPIC
V
OL
= 1.25V
40
85
140
mA
REF2X
V
OL
= 1.5V
100
130
152
mA
48MHz, 24MHz
V
OL
= 1.5V
40
50
76
mA
I
OH
Output High Current
CPU0:1
V
OL
= 1.25V
50
70
100
mA
PCI_F, PCI1:6
V
OL
= 1.5V
60
70
120
mA
IOAPIC
V
OL
= 1.25V
40
87
155
mA
REF2X
V
OL
= 1.5V
100
130
150
mA
48MHz, 24MHz
V
OL
= 1.5V
40
50
94
mA
Notes:
3.
All clock outputs loaded with maximum lump capacitance test load specified in the AC Electrical Characteristics section.
4.
W48S111-14 logic inputs have internal pull-up devices, except SEL100/66# (pull-ups not full CMOS level).
W48S111-14
PRELIMINARYPRELIMI-
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AC Electrical Characteristics
T
A
= 0C to +70C, V
DDQ3
= 3.3V5%,V
DDQ2
= 2.5V 5%, f
XTL
= 14.31818 MHz
AC clock parameters are tested and guaranteed over stated operating conditions using the stated lump capacitive load at the
clock output; Spread Spectrum clocking is disabled.
Notes:
5.
X1 input threshold voltage (typical) is V
DD
/2.
6.
The W48S111-14 contains an internal crystal load capacitor between pin X1 and ground and another between pin X2 and ground. Total load placed on crystal
is 14 pF; this includes typical stray capacitance of short PCB traces to crystal.
7.
X1 input capacitance is applicable when driving X1 with an external clock source (X2 is left unconnected).
Crystal Oscillator
V
TH
X1 Input Threshold Voltage
[5]
V
DDQ3
= 3.3V
1.65
V
C
LOAD
Load Capacitance, as seen by
External Crystal
[6]
14
pF
C
IN,X1
X1 Input Capacitance
[7]
Pin X2 unconnected
28
pF
Pin Capacitance/Inductance
C
IN
Input Pin Capacitance
Except X1 and X2
5
pF
C
OUT
Output Pin Capacitance
6
pF
L
IN
Input Pin Inductance
7
nH
DC Electrical Characteristics:
T
A
= 0C to +70C, V
DDQ3
= 3.3V5%, V
DDQ2
= 2.5V5% (continued)
Parameter
Description
Test Condition
Min.
Typ.
Max.
Unit
CPU Clock Outputs, CPU0:1 (Lump Capacitance Test Load = 20 pF)
Parameter
Description
Test Condition/Comments
CPU = 66.8 MHz
CPU = 100 MHz
Unit
Min.
Typ. Max.
Min.
Typ.
Max.
t
P
Period
Measured on rising edge at 1.25V
15
15.5
10
10.5
ns
t
H
High Time
Duration of clock cycle above 2.0V
5.2
3.0
ns
t
L
Low Time
Duration of clock cycle below 0.4V
5.0
2.8
ns
t
R
Output Rise Edge Rate Measured from 0.4V to 2.0V
1
4
1
4
V/ns
t
F
Output Fall Edge Rate
Measured from 2.0V to 0.4V
1
4
1
4
V/ns
t
D
Duty Cycle
Measured on rising and falling edge at
1.25V
45
55
45
55
%
t
JC
Jitter, Cycle-to-Cycle
Measured on rising edge at 1.25V. Max-
imum difference of cycle time between
two adjacent cycles.
200
200
ps
t
SK
Output Skew
Measured on rising edge at 1.25V
175
175
ps
f
ST
Frequency Stabiliza-
tion from Power-up
(cold start)
Assumes full supply voltage reached
within 1 ms from power-up. Short cycles
exist prior to frequency stabilization.
3
3
ms
Z
o
AC Output Impedance
Average value during switching transi-
tion. Used for determining series termi-
nation value.
20
20
W48S111-14
PRELIMINARYPRELIMI-
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PCI Clock Outputs, PCI1:6 and PCI_F (Lump Capacitance Test Load = 30 pF
Parameter
Description
Test Condition/Comments
CPU = 66.8/100 MHz
Unit
Min.
Typ.
Max.
t
P
Period
Measured on rising edge at 1.5V
30
ns
t
H
High Time
Duration of clock cycle above 2.4V
12
ns
t
L
Low Time
Duration of clock cycle below 0.4V
12
ns
t
R
Output Rise Edge Rate
Measured from 0.4V to 2.4V
1
4
V/ns
t
F
Output Fall Edge Rate
Measured from 2.4V to 0.4V
1
4
V/ns
t
D
Duty Cycle
Measured on rising and falling edge at 1.5V
45
55
%
t
JC
Jitter, Cycle-to-Cycle
Measured on rising edge at 1.5V. Maximum
difference of cycle time between two adjacent cycles.
250
ps
t
SK
Output Skew
Measured on rising edge at 1.5V
500
ps
t
O
CPU to PCI Clock Skew
Covers all CPU/PCI outputs. Measured on rising
edge at 1.5V. CPU leads PCI output.
1.5
4
ns
f
ST
Frequency Stabilization
from Power-up (cold
start)
Assumes full supply voltage reached within 1 ms
from power-up. Short cycles exist prior to frequency
stabilization.
3
ms
Z
o
AC Output Impedance
Average value during switching transition. Used for
determining series termination value.
20
IOAPIC Clock Output (Lump Capacitance Test Load = 20 pF)
Parameter
Description
Test Condition/Comments
CPU = 66.8/100 MHz
Unit
Min.
Typ.
Max.
f
Frequency, Actual
Frequency generated by crystal oscillator
14.31818
MHz
t
R
Output Rise Edge Rate
Measured from 0.4V to 2.0V
1
4
V/ns
t
F
Output Fall Edge Rate
Measured from 2.0V to 0.4V
1
4
V/ns
t
D
Duty Cycle
Measured on rising and falling edge at 1.25V
45
55
%
f
ST
Frequency Stabilization
from Power-up (cold start)
Assumes full supply voltage reached within
1 ms from power-up. Short cycles exist prior to
frequency stabilization.
1.5
ms
Z
o
AC Output Impedance
Average value during switching transition. Used
for determining series termination value.
15
REF2X Clock Output (Lump Capacitance Test Load = 20 pF)
Parameter
Description
Test Condition/Comments
CPU = 66.8/100 MHz
Unit
Min.
Typ.
Max.
f
Frequency, Actual
Frequency generated by crystal oscillator
14.318
MHz
t
R
Output Rise Edge Rate
Measured from 0.4V to 2.4V
0.5
2
V/ns
t
F
Output Fall Edge Rate
Measured from 2.4V to 0.4V
0.5
2
V/ns
t
D
Duty Cycle
Measured on rising and falling edge at 1.5V
45
55
%
f
ST
Frequency Stabilization from
Power-up (cold start)
Assumes full supply voltage reached within
1 ms from power-up. Short cycles exist prior to
frequency stabilization.
3
ms
Z
o
AC Output Impedance
Average value during switching transition. Used
for determining series termination value.
20
W48S111-14
PRELIMINARYPRELIMI-
10
Document #: 38-00854
48-MHz and 24-MHz Clock Output (Lump Capacitance Test Load = 20 pF)
Parameter
Description
Test Condition/Comments
CPU = 66.8/100 MHz
Unit
Min.
Typ.
Max.
f
Frequency, Actual
Determined by PLL divider ratio (see m/n below)
48.008
24.004
MHz
f
D
Deviation from 48 MHz
(48.008 48)/48
+167
ppm
m/n
PLL Ratio
(14.31818 MHz x 57/17 = 48.008 MHz)
57/17, 57/34
t
R
Output Rise Edge Rate
Measured from 0.4V to 2.4V
0.5
2
V/ns
t
F
Output Fall Edge Rate
Measured from 2.4V to 0.4V
0.5
2
V/ns
t
D
Duty Cycle
Measured on rising and falling edge at 1.5V
45
55
%
f
ST
Frequency Stabilization
from Power-up (cold start)
Assumes full supply voltage reached within 1 ms
from power-up. Short cycles exist prior to fre-
quency stabilization.
3
ms
Z
o
AC Output Impedance
Average value during switching transition. Used
for determining series termination value.
25
Ordering Information
Ordering Code
Freq. Mask
Code
Package
Name
Package Type
W48S111
-04
G
28-pin SOIC (300 mils)
W48S111-14
PRELIMINARY
Cypress Semiconductor Corporation, 1999. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
Package Diagram
28-Pin Small Outline Integrated Circuit (SOIC, 300 mils)