CYStech Electronics Corp.
Spec. No. : C343SN
Issued Date : 2003.08.19
Revised Date :2003.12.05
Page No. : 1/4
ASD723SN
CYStek Product Specification
Advanced Schottky Barrier Diodes
ASD723SN
Features:
Designed for mounting on small surface
Low stored charge
Majority carrier conduction
Mechanical data:
Case: 0805(2012) Standard package, molded plastic
Terminals : Solder plated, solderable per MIL-STD-750, method 2026.
Polarity: Indicated by cathode band
Mounting position: Any
Weight: 4.8mg (approximately)
Absolute Maximum Ratings(
Ta=25
)
Characteristics Symbol
Value
Unit
Continuous Reverse Voltage
V
R
30 V
Average Rectified Current
I
O
200 mA
Forward Surge Current @ 8.3ms single half sine-wave
superimposed on rated load(JEDEC method)
I
FSM
1.5
A
Capacitance between Terminals @ f=1MHz and applied
10V
DC
Reverse Voltage
C
T
20 pF
Junction Temperature
Tj
-40 to +125
C
Storage Temperature Range
Tstg
-40 to +125
C
Electrical Characteristics
( T
A
=25
C, unless otherwise noted)
Parameter
Condition
Symbol Min Typ Max Unit
Forward Voltage
I
F
= 200mA
DC
V
F
- -
0.55
V
Reverse Current
VR = 30V
DC
I
R
-
-
15
A
CYStech Electronics Corp.
Spec. No. : C343SN
Issued Date : 2003.08.19
Revised Date :2003.12.05
Page No. : 2/4
ASD723SN
CYStek Product Specification
Characteristic Curves
Forward Current Derating Curve
0
20
40
60
80
100
120
0
25
50
75
100
125
150
Ambient Temperature---T
A
()
Percentage of Rated Forward Current---(%)
M ounting on glass
epoxy PCBs
Forward Current vs Forward Voltage
1
10
100
0
0.1
0.2
0.3
0.4
0.5
0.6
Forward Voltage---V
F
(V)
Forward Current---I
F
(mA)
- 25
25
75
125
Reverse Leakage Current vs Reverse Voltage
0.0001
0.001
0.01
0.1
1
10
0
10
20
30
40
Reverse Voltage---V
R
(V)
Reverse Leakage Current---I
R
(mA)
75
25
125
Capacitance vs Reverse Voltage
1
10
100
0
5
10
15
20
25
30
35
Reverse Voltage---V
R
(V)
Capacitance between terminals---C
T
(pF)
CYStech Electronics Corp.
Spec. No. : C343SN
Issued Date : 2003.08.19
Revised Date :2003.12.05
Page No. : 3/4
ASD723SN
CYStek Product Specification
Packing Information
CYStech Electronics Corp.
Spec. No. : C343SN
Issued Date : 2003.08.19
Revised Date :2003.12.05
Page No. : 4/4
ASD723SN
CYStek Product Specification
0805(2012) Dimension
*:Typical
Inches Millimeters
Inches Millimeters
DIM
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.079 0.087 2.00 2.20 C 0.047 0.055 1.20 1.40
B 0.016(typ.) 0.40(typ.) D 0.035 0.043 0.90 1.10
R
0.008(tup.) 0.20(typ.)
Notes :
1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
A
B
C
D
R
0805 surface mount package
CYStek package code: SN
Marking Code : 4
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