CYStech Electronics Corp.
Spec. No. : C335N3
Issued Date : 2003.05.30
Revised Date :
Page No. : 1/4
CMBD2004/A/C/SN3
CYStek Product Specification
High voltage switching (double) diodes
CMBD2004/A/C/SN3
Description
High voltage switching diodes encapsulated in a SOT-23 small plastic SMD package.
Single diodes and double diodes with different pinning are available.
Features
Fast switching speed
Low forward voltage drop
Small plastic SMD package
Mechanical Data
Case : SOT-23, molded plastic
Terminals : Solderable per MIL-STD-202 Method 208
Weight : 0.008 grams(approx.)
Pinning Outline
Description
Pin
CMBD2004 CMBD2004A CMBD2004C CMBD2004S
1
A K1 A1 A1
2
NC K2 A2 K2
3
K A1,A2 K1,K2 K1,A1
SOT-23
1
2
3
(1) CMBD2004
(3)CMBD2004C
(2)CMBD2004A
(4)CMBD2004S
Diode configuration and symbol
Marking:
Type Marking
Code
CMBD2004 N3
D53
CMBD2004AN3 DB8
CMBD2004CN3 DB7
CMBD2004SN3 DB6
CYStech Electronics Corp.
Spec. No. : C335N3
Issued Date : 2003.05.30
Revised Date :
Page No. : 2/4
CMBD2004/A/C/SN3
CYStek Product Specification
Absolute Maximum Ratings
(Ta=25, unless otherwise specified)
Maximum Temperatures
Storage Temperature Tstg ................................................................................................... -65~+150
C
Junction Temperature Tj ............................................................................................................. +150
C
Maximum Power Dissipation
Total Power Dissipation Ptot
(Note)
........................................................................................... 350 mW
Maximum Voltages and Currents
Repetitive Peak Reverse Voltage V
RRM
............................................................................................ 300 V
DC Blocking Voltage V
R
...................................................................................... 240V
RMS Reverse Voltage V
R
(
RMS)
................................................................................ 170V
Continuous Forward Current I
F
(Note)
..................................................................... 225 mA
Peak Repetitive Forward Current I
FRM
(Note)
............................................................625 mA.
Surge Non-repetitive Forward Current I
FSM
@ tp=1s ........................................................................ 4A
@ tp=1s........................................................ 1A
Thermal Resistance, Junction to Ambient Air R
JA
....................................................357/W
Note : Parts mounted on FR-4 board. For double diodes, Ptot is the total power dissipation of both diodes.
Characteristics
(Ta=25
C)
Characteristic Symbol Condition Min.
Max.
Unit
Reverse Breakdown Voltage
V
BR
I
R
=100A 300
-
V
V
F
(1) I
F
=20mA -
870
mV
Forward Voltage
(Note)
V
F
(2) I
F
=100mA -
1000
mV
I
R
(1)
V
R
=240V,Tj=25
- 100 nA
Reverse Leakage Current
(Note)
I
R
(2)
V
R
=240V,Tj=150
100
A
Diode Capacitance
C
D
V
R
=0V, f=1MHz
-
5
pF
Reverse Recovery Time
t
rr
I
F
=I
R
=30mA RL=100
measured at IR=3mA
- 50 ns
Notes
:
Pulse test, tp=380s, duty cycle<2%.
CYStech Electronics Corp.
Spec. No. : C335N3
Issued Date : 2003.05.30
Revised Date :
Page No. : 3/4
CMBD2004/A/C/SN3
CYStek Product Specification
Characteristic Curves
Forward Characteristics
0.01
0.1
1
10
100
1000
0
1
2
Instantaneous Forward Voltage---V
F
(V)
Instantaneous Forward Current---I
F
(mA)
Reverse Leakage Current vs Junction Temperature
0.01
0.1
1
10
100
0
100
200
Junction Temperature---Tj()
Reverse Leakage Current---I
R
(A)
Power Derating Curve
0
50
100
150
200
250
300
350
400
0
50
100
150
200
Ambient Temperature---T
A
()
Power Dissipation---P
D
(mW)
CYStech Electronics Corp.
Spec. No. : C335N3
Issued Date : 2003.05.30
Revised Date :
Page No. : 4/4
CMBD2004/A/C/SN3
CYStek Product Specification
SOT-23 Dimension
CMBD2004 N3 : Single Diode (Marking Code D53)
CMBD2004AN3 : Common Anode. (Marking Code DB8)
CMBD2004CN3 : Common Cathode. (Marking Code DB7)
CMBD2004SN3 : Series Connected. (Marking Code DB6)
*: Typical
Inches Millimeters
Inches Millimeters
DIM
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.1102
0.1204 2.80 3.04 J 0.0034
0.0070 0.85 0.177
B 0.0472
0.0630 1.20 1.60 K 0.0128 0.0266 0.32 0.67
C 0.0335
0.0512 0.89 1.30 L 0.0335 0.0453 0.85 1.15
D 0.0118
0.0197 0.30 0.50 S 0.0830
0.1083 2.10 2.75
G 0.0669
0.0910 1.70 2.30 V 0.0098 0.0256 0.25 0.65
H
0.0005
0.0040
0.013
0.10
Notes:
1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
H
J
K
D
A
L
G
V
C
B
3
2
1
S
Marking:
L4_
Diagram:
3-Lead SOT-23 Plastic Surface Mounted
Package. CYStek Package Code: N3
DXX
PDF 
ZIP