CYStech Electronics Corp.
Spec. No. : C327SA
Issued Date : 2003.04.04
Revised Date :
Page No. : 1/3
CSMA400XSA
CYStek Product Specification
CSMA400XSA Series
1.0Amp. Surface Mount Glass Passivated Type Rectifiers
Features
For surface mounted application
Low forward voltage drop and low leakage current
High current capability
Easy pick and place
High surge current capability
Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0 Utilizing Flame
Retardant Epoxy Molding Compound.
High temperature soldering: 250
C/10 seconds at terminals
Exceeds environmental standards of MIL-S-19500/228
Mechanical Data
Case: SMA/DO-214AC Molded Plastic.
Terminals: Solder plated. Solderable per MIL-STD-750 Method
Polarity: Indicated by cathode band.
Packaging: 12mm tape per EIA STD RS-481.
Weight: 0.06 gram, 0.0018 ounce
Maximum Ratings and Electrical Characteristics
Rating at 25
C ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive
or inductive load. For capacitive load, derate current by 20%.
Type Number
CSMA
4001
CSMA
4002
CSMA
4003
CSMA
4004
CSMA
4005
CSMA
4006
CSMA
4007
Units
Maximum Recurrent Peak Reverse Voltage
50
100
200
400
600
800
1000
V
Maximum
RMS
Voltage
35 70 140 280 420 560 700 V
Maximum DC Blocking Voltage
50
100
200
400
600
800
1000
V
Maximum Average
Forward Rectified Current @TL=110
C
1 A
Peak Forward Surge Current, 8.3ms Single
Half Sine-wave Superimposed on
Rated Load(JEDEC method)
30 A
Maximum Instantaneous
Forward Voltage @ 1.0A
1.1 V
Maximum DC Reverse Current at
Rated DC Blocking Voltage
5(@Ta=25
C)
50(@Ta=125
C)
uA
Maximum Reverse Recovery Time
(Note 1)
1.8
uS
Typical Junction Capacitance
(Note 2)
12
pF
Operating Temperature Range Tj
-55 to +150
C
Storage Temperature Range Tstg
-55 to +150
C
Note1: Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A
Note2: Measured at 1 MHz and Applied VR=4.0Volts
CYStech Electronics Corp.
Spec. No. : C327SA
Issued Date : 2003.04.04
Revised Date :
Page No. : 3/3
CSMA400XSA
CYStek Product Specification
SMA/DO-214AC Dimension
*:Typical
Inches Millimeters
Inches Millimeters
DIM
Min. Max. Min. Max.
DIM
Min. Max. Min. Max.
A 0.177 0.185 4.4 4.8 E 0.060 0.067 1.5 1.7
B 0.094 0.110 2.4 2.8 F
0.04(typ) 1.0(typ)
C 0.012(typ)
0.3(typ) G 0.04(typ)
1.0(typ)
D
0.150
0.165
3.8
4.2
- - - - -
Notes :
1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
Lead : 42 Alloy ; solder plating
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
B
A
C
D
E
F
G
SMA Plastic Surface
Mounted Package
CYStek Package Code:SA
Marking Code:
Device 4001 4002 4003 4004
Code
A1 A2 A3 A4
Device 4005 4006 4007
Code A5 A6 A7
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