1 Megabit SRAM / 8 Megabit FLASH
DP3SZ128512X816NY5
ADVANCED INFORMATION
DESCRIPTION:
The DP3SZ128512X816NY5 modules are a
revolutionary new memory subsystem using
Dense-Pac Microsystems' TSOP stacking
technology. The Module packs 1-Megabit of
CMOS SRAM and 8-Megabits of FLASH EEPROM
in an area of 0.546 in
2
, while maintaining a total
height of .094 inches maximum.
The DP3SZ128512X816NY5 module contains two
individual TSOP packages, one TSOP containing a
128Kx8 SRAM memory device and on TSOP
containing a 512Kx16 FLASH memory device.
Using the TSOP Stack family of modules offer a
higher board density of memory than available with
conventional through-hole, surface mount or
hybrid techniques.
FEATURES:
Access Time:
70, 80, 100ns max.
Single 3.3 Volt Supply
Fully Static Operation
- No clock or refresh required
TTL Compatible Inputs and Outputs
Common Data Inputs and Outputs
10,000 Erase/Program Cycles (min.)
Package: 56-Pin TSOP Stack
FUNCTIONAL BLOCK DIAGRAM
PIN NAMES
A0 - A18
Address Inputs
I/O0 - I/O15
Data Input/Output
FCS
FLASH Chip Enable
RAMCS
SRAM Low Chip Enable
BYTE
Select 8-Bit or 16-Bit Mode (FLASH)
RY/BY
Ready/Busy Output (FLASH)
WE
Write Enable
OE
Output Enable
V
DD
Power (+5V)
V
SS
Ground
N.C.
No Connect
1Meg SRAM/8Meg FLASH, 70 - 100ns, TSOP STACK
30A195-00
A
This document contains information on a product under consideration for
development at Dense-Pac Microsystems, Inc. Dense-Pac reserves the right
to change or discontinue information on this product without prior notice.
FUNCTIONAL BLOCK DIAGRAM
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DP3SZ128512X816NY5
Dense-Pac Microsystems, Inc.
ADVANCED INFORMATION
Dense-Pac Microsystems, Inc.
7321 Lincoln Way Garden Grove , California 92841-1431
(714) 898-0007 (800) 642-4477
(Outside CA)
FAX: (714) 897-1772 http://www.dense-pac.com
MECHANICAL DRAWING
ORDERING INFORMATION
30A195-00
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