4 Megabit High Speed CMOS SRAM
DPS128X32XJ3
ADVANCED INFORMATION
DESCRIPTION:
The DPS128X32XJ3 is a 128K x 8 "J" Leaded Ceramic
Surface Mount Module. It contains four individual
128K x 8 SRAMs, packaged in their own hermetically
sealed SLCCs making the module suitable for
commercial, industrial and military applications.
The DPS128X32XJ3 module utilizes asynchronous
circuitry and may be maintained in any state for an
indefinite period of time. All pins are TTL compatible,
and a single +5V power supply is required.
By using Dense-Pac Microsystems' ceramic Stackable
Leadless Chip Carriers (SLCC), the "Stack'' family of
modules offers a higher board density of memory than
available with conventional through-hole, surface
mount, module, or most hybrid techniques.
FEATURES:
Organization: 128K x 32, 256K x 16, 512K x 8
Access Times: 15, 17, 20, 25, 35ns (max.)
Fully Static Operation;
No Clock or Refresh Required
TTL Compatible Input and Output
Common Data Input and Output
Single +5V Power Supply,
10% Tolerance
Three State Output
Standard Packages:
68-Pin "J" Leaded
Ceramic Surface Mount Module
FUNCTIONAL BLOCK DIAGRAM
Military SRAM Products
128Kx8, 15 - 35ns, LCC/JLCC
30A037-01
B
PIN-OUT DIAGRAM
PIN NAMES
A0 - A16
Address Inputs
I/O0 - I/O31
Data In/Out
CE0 - CE3
Chip Enables
WE0 - WE3
Write Enables
OE
Output Enable
V
DD
Power (+5V)
V
SS
Ground
N.C.
No Connect
This document contains information on a product under consideration for
development at Dense-Pac Microsystems, Inc. Dense-Pac reserves the right
to
c
hange or discontinue information on this product without prior notice.
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DPS128X32XJ3
Dense-Pac Microsystems, Inc
ADVANCED INFORMATION
ORDERING INFORMATION
Dense-Pac Microsystems, Inc.
7321 Lincoln Way Garden Grove , California 92841-1431
(714) 898-0007 (800) 642-4477
(Outside CA)
FAX: (714) 897-1772 http://www.dense-pac.com
LCC MECHANICAL DRAWING
30A210-00
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