FAST RECOVERY
PPR
2.0
Amp
Max. DC Reverse Current @ PRV and 25
o
C, I
R
1.0
100
I
FSM
(8.3
ms)
Amp
STG
-55 to +150
o
C
Thermal Resistance (Total Bridge), R0 j-c
7.0typ.
o
C/ W
-
A
PRV/ l eg
50V
100V
200V
400V
600V
800V
1000V
Type No.
PPR05
PPR10
PPR20
PPR40
PPR60
PPR80
PPR100
Max. Reverse Recovery , T
rr
(Fig.4)
200
Nano Sec.
Ambient Operating Temperature Range,T
A
-55 to +150
o
C
NOTE:
O
EDI reserves the right to change these specifications at any time without notice.
T
h
is
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a
rk
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te
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gn
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on
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th
e
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p
o
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nt
p
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f U
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d
er
w
rit
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rs
L
a
b
or
a
to
ri
es
, i
nc
.
PPR SERIES
ELECTRICAL CHARACTERISTICS PER LEG
(at T
A
=25 C Unl es s Oth erw ise Spe ci fie d)
Maximum lead and terminal temperature for soldering, 3/8 inch from case,5 seconds at 250 C.
SINGLE-PHASE FULL WAVE BRIDGE
5.0 AMPERES HEAT SINK MOUNTING
2.0 AMPERES FOR P.C. BOARD MOUNTING
Max. Forward Voltage Drop, V
F
=1.3 V @ I
F
=
Max. Peak Surge Current,
Storage Temperature Range, T
Figure 1
Figure 3
I
F(AV)
. AVERAGE FORWARD CURRENT (AMP)
P
T
(
A
V
)
.
T
O
T
A
L
A
V
E
R
A
G
E
P
O
W
E
R
D
I
S
S
I
P
A
T
I
O
N
(
W
A
T
T
S
)
0
0
2
4
6
8
BRIDGE OUTPUT
RES IND LOADS
0
2
4
0
20
40
60
80
100
120
I
F
(
A
V
)
.
A
V
E
R
A
G
E
F
O
R
W
A
R
D
C
U
R
R
E
N
T
(
A
M
P
)
BRIDGE OUTPUT
RES IND LOADS
O
TEMPERATURE ( C)
6
8
140
3
6
9
12
15
1.0A
0.5A
T RR
ZERO
REFERENCE
0.25A
R R
1, 2 NON-INDUCTIVE RESISTORS
PULSE GENERATOR - HEWLETT PACKARD 214A OR EQUIV
.
IKC REP.RATE, 10 SEC. PULSE WIDTH
ADJUST PULSE AMPLITUDE FOR PEAK IR
TEST CIRCUIT
PULSE
GENERATOR
D.U.T.
SCOPE
R
2
1 OHM
R1
50 OHM
+
-
PPR
21 GRAY OAKS AVENUE * YONKERS. NEW YORK 10710 914-965-4400 * FAX 914-965-5531 * 1-800-678-0828
ELECTRONIC DEVICES, INC.
DESIGNERS AND MANUFACTURERS OF SOLID STATE DEVICES SINCE 1951.
E
e-mail:sales@edidiodes.com
W
website: http://www.edidiodes.com
*
160
A
B
A=CASE TEMPERATURE HEAT SINK MOUNTED
B=AMBIENT TEMPERATURE
NON- REPETITIVE SURGE CURRENT
0.1SEC
1.0SEC
100
75
50
25
0
1
2
3
4
5
6
7
9 10
20
30
40 50 60
8
CYCLES(60 Hz)
%
M
A
X
I
M
U
M
S
U
R
G
E
Figure 2
PPR SERIES MECHANICAL OUTLINE
+
_
C
AC
B
A
A
AC
E
D
F
LTR
A
B
C
D
E
F
INCHES
.411-.441
.137-.167 DIA
.590-.610
.038-.042
1.000 MIN
.300 MAX
7.62 MAX
25.4 MIN
.97-1.07
14.99-15.49
MILLIMETERS
10.44-11.20
3.48-4.24 DIA
Figure 4
NOTE: A thin film of silicone thermal compound is recommended between the Minibridge
case and mounting surface for improved thermal conduction.
PPR SERIES CURRENT DERATING
POWER DISSIP ATION
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