Data Sheet
Data Sheet
Multilayer ceramic capacitors
Date:
October 2006
EPCOS AG 2006. Reproduction, publication and dissemination of this data sheet and the
information contained therein without EPCOS' prior express consent is prohibited.
Array capacitors, C0G
2
10/06
Please read Cautions and warnings and
Important notes at the end of this document.
Ordering code system
B37830
R
0
101
K
0
2
Packaging
1 cardboard tape, 180-mm reel
3 cardboard tape, 330-mm reel
^
^
Internal coding: 0 or decimal place for cap. values <10 pF
Capacitance tolerance
J
5%
K
10% (standard for C0G)
M
20% (standard for X7R)
^
^
^
Rated voltage
Rated voltage [VDC]
Code
16
25
50
9
0
5
Internal coding
"R" indicates array capacitor
Type and size
Chip size
(inch / mm)
0405 / 1012
0508 / 1220
0612 / 1632
Temperature characteristic
C0G
X7R
B37830
B37831
B37940
B37941
B37871
B37872
1
2 2-fold array
4 4-fold array
^
^
Capacitance, coded
(example)
100
10 10
0
pF = 10 pF
101
10 10
1
pF = 100 pF
220
22 10
0
pF = 22 pF
^
^
^
Array
C0G
Multilayer ceramic capacitors
3
10/06
Please read Cautions and warnings and
Important notes at the end of this document.
Features
Reduction of mounting time and mounting costs
Space saving on the PCB
To AEC-Q200
Applications
Suitable for electronic circuits with parallel line layout
Coupling and filtering, particularly in RF circuits
Resonant circuits
Filter circuits
Termination
For soldering: Nickel barrier terminations (Ni)
Options
Alternative capacitance tolerances available on request
Delivery mode
Cardboard tape,180-mm and 330-mm reel available
Electrical data
Temperature characteristic
C0G
Climatic category (IEC 60068-1)
55/125/56
Standard
EIA
Dielectric
Class 1
Rated voltage
V
R
25,
50
VDC
Test voltage
V
test
2.5 V
R
/5 s
VDC
Capacitance range / E series
C
R
10 pF ... 1.0 nF (E6)
Temperature coefficient
0
30 10
6
/K
Dissipation factor (limit value)
tan
d
<1.0 10
3
Insulation resistance
1)
at + 25
C
R
ins
>10
5
M
W
Insulation resistance
1)
at +125
C
R
ins
>10
4
M
W
Time constant
1)
at + 25
C
t >1000
s
Time constant
1)
at +125
C
t >100
s
Operating temperature range
T
op
55 ... +125
C
Ageing
none
1) For C
R
>10 nF the time constant
t = C R
ins
is given.
Array
C0G
Multilayer ceramic capacitors
4
10/06
Please read Cautions and warnings and
Important notes at the end of this document.
C0G
Multilayer ceramic capacitors
Capacitance tolerances
Dimensional drawing
2-fold array (case size 0405)
4-fold array (case sizes 0508 and 0612)
Dimensions (mm)
Tolerances to CECC 32101-801
Code letter
J
K
(standard)
Tolerance
5%
10%
2-fold array
4-fold array
Case size
(inch)
(mm)
0405
1012
0508
1220
0612
1632
l 1.37
0.15
2.00
0.2
3.20
0.2
b 1.00
+0/0.15
1.25
0.15
1.60
0.2
s 0.70
max.
0.85
0.1
0.85
0.1
k 0.36
0.1
0.30
0.1
0.40
0.15
e 0.64
0.50
0.1
0.80
0.15
u 0.20
0.1
0.20 +0.3/0.1
0.20 +0.3/0.1
k
e
KKE0330-R
s
u
b
e
s
e
k
u
b
KKE0331-Z
C0G
5
10/06
Please read Cautions and warnings and
Important notes at the end of this document.
Multilayer ceramic capacitors
C0G
Recommended solder pad
2-fold array (case size 0405)
4-fold array (case sizes 0508 and 0612)
Recommended dimensions (mm) for reflow soldering
Termination
Case size
(inch/mm)
Type
A
B
C
D
P
0405/1012
2-fold array
0.50 ...
0.55
0.45 ...
0.50
1.45 ...
1.60
0.30 ...
0.35
0.64
0.10
0508/1220
4-fold array
0.50 ...
0.70
0.60 ...
0.70
1.60 ...
2.10
0.25 ...
0.35
0.50
0.005
0612/1632
4-fold array
0.70 ...
0.90
0.80 ...
1.00
2.20 ...
2.80
0.30 ...
0.40
0.80
0.005
KKE0302-L
D
P
A
B
C
KKE0309-9
D
P
A
B
C
Inner electrode
KKE0366-S-E
AgPd
Substrate electrode
Ag
Intermediate electrode
Ni
External electrode
Sn
(nickel barrier)
Termination
Ceramic body
C0G
6
10/06
Please read Cautions and warnings and
Important notes at the end of this document.
C0G
Multilayer ceramic capacitors
Product range array capacitors, C0G
2-fold arrays
4-fold arrays
Size
1)
inch
mm
0405
1012
0508
1220
0612
1632
Type
B37830
B37940
B37871
25
50
50
10 pF
15 pF
22 pF
33 pF
47 pF
68 pF
100 pF
150 pF
180 pF
220 pF
330 pF
470 pF
680 pF
1.0 nF
1) l
b (inch) / l b (mm)
V
R
(VDC)
C
R
C0G
7
10/06
Please read Cautions and warnings and
Important notes at the end of this document.
Multilayer ceramic capacitors
C0G
Ordering codes and packing for C0G arrays, 25 VDC, nickel barrier terminations
Chip thickness
Cardboard tape,
180-mm reel
Cardboard tape,
330-mm reel
*
1
*
3
C
R
1)
Ordering code
2)
mm
pcs/reel
pcs/reel
Case size 0405, 25 VDC, 2-fold arrays
10
.
pF
B37830R0100K02*
0.6
0.1
5000
20000
15
.
pF
B37830R0150K02*
0.6
0.1
5000
20000
22
.
pF
B37830R0220K02*
0.6
0.1
5000
20000
33
.
pF
B37830R0330K02*
0.6
0.1
5000
20000
47
.
pF
B37830R0470K02*
0.6
0.1
5000
20000
68
.
pF
B37830R0680K02*
0.6
0.1
5000
20000
100
.
pF
B37830R0101K02*
0.6
0.1
5000
20000
150
.
pF
B37830R0151K02*
0.6
0.1
5000
20000
180
.
pF
B37830R0181K02*
0.6
0.1
5000
20000
1) Other capacitance values on request.
2) The table contains the ordering codes for the standard capacitance tolerance.
For other available capacitance tolerances see page 128.
^
^
C0G; 0405
8
10/06
Please read Cautions and warnings and
Important notes at the end of this document.
C0G
Multilayer ceramic capacitors
Ordering codes and packing for C0G arrays, 50 VDC, nickel barrier terminations
Chip thickness
Cardboard tape,
180-mm reel
Cardboard tape,
330-mm reel
*
1
*
3
C
R
1)
Ordering code
2)
mm
pcs/reel
pcs/reel
Case size 0508, 50 VDC, 4-fold arrays
10
.
pF
B37940R5100K04*
0.85
0.1
4000
16000
15
.
pF
B37940R5150K04*
0.85
0.1
4000
16000
22
.
pF
B37940R5220K04*
0.85
0.1
4000
16000
33
.
pF
B37940R5330K04*
0.85
0.1
4000
16000
47
.
pF
B37940R5470K04*
0.85
0.1
4000
16000
68
.
pF
B37940R5680K04*
0.85
0.1
4000
16000
100
.
pF
B37940R5101K04*
0.85
0.1
4000
16000
150
.
pF
B37940R5151K04*
0.85
0.1
4000
16000
220
.
pF
B37940R5221K04*
0.85
0.1
4000
16000
Case size 0612, 50 VDC, 4-fold arrays
10
.
pF
B37871R5100K04*
0.85
0.1
4000
16000
15
.
pF
B37871R5150K04*
0.85
0.1
4000
16000
22
.
pF
B37871R5220K04*
0.85
0.1
4000
16000
33
.
pF
B37871R5330K04*
0.85
0.1
4000
16000
47
.
pF
B37871R5470K04*
0.85
0.1
4000
16000
68
.
pF
B37871R5680K04*
0.85
0.1
4000
16000
100
.
pF
B37871R5101K04*
0.85
0.1
4000
16000
150
.
pF
B37871R5151K04*
0.85
0.1
4000
16000
220
.
pF
B37871R5221K04*
0.85
0.1
4000
16000
330
.
pF
B37871R5331K04*
0.85
0.1
4000
16000
470
.
pF
B37871R5471K04*
0.85
0.1
4000
16000
680
.
pF
B37871R5681K04*
0.85
0.1
4000
16000
1.0 nF
B37871R5102K04*
0.85
0.1
4000
16000
1) Other capacitance values on request.
2) The table contains the ordering codes for the standard capacitance tolerance.
For other available capacitance tolerances see page 128.
^
^
C0G; 0508 and 0612
9
10/06
Please read Cautions and warnings and
Important notes at the end of this document.
Multilayer ceramic capacitors
C0G
Typical characteristics
1)
Capacitance change
DC/C
25
versus
temperature T (tolerance range
)
Capacitance change
DC/C
0
versus
superimposed DC voltage V
Impedance |Z| versus
frequency f
Dissipation factor tan
d versus
temperature T
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
KKE0107-F
25
T
0
20 40
60 80
120
0
0.2
0.4
0.6
1.0
%
C
C
55
_
_
40 20
_
_
1.0
0.8
_
0.6
_
0.4
_
0.2
_
C
KKE0357-T
0
V
V
0
0.1
0.2
0.3
0.5
%
C
C
0
0.1
_
_
0.2
_
0.3
_
0.4
_
0.5
10
20
30
40
50
KKE0367-4
10
0
10
1
10
2
10
3
Z
10
f
2
_
MHz
10
_
1
10
0
1
10
10
2
10
3
10
4
5
10
10 pF
100 pF
1 nF
KKE0118-V
tan
T
0
20 40 60 80 100
140
60
_
40
_
20
_
5
10
_
10
4
_
10
3
_
10
2
_
C
C0G
10
10/06
Please read Cautions and warnings and
Important notes at the end of this document.
C0G
Multilayer ceramic capacitors
Typical characteristics
1)
Insulation resistance R
ins
versus
temperature T
Capacitance change
DC/C
1
versus
time t
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
KKE0129-B
R
T
2
10
ins
0
20
40
60
80
100
140
10
3
10
4
10
5
10
6
10
8
M
C
KKE0100-S
t
h
10
0
10
1
10
2
10
3
C
C
1
_
10
15
20
_
_
_
5
0
%
5
C0G
11
10/06
Multilayer ceramic capacitors
Cautions and warnings
Notes on the selection of ceramic capacitors
In the selection of ceramic capacitors, the following criteria must be considered:
1. Depending on the application, ceramic capacitors used to meet high quality requirements should
at least satisfy the specifications to AEC-Q200. They must meet quality requirements going
beyond this level in terms of ruggedness (e.g. mechanical, thermal or electrical) in the case of
critical circuit configurations and applications (e.g. in safety-relevant applications such as ABS
and airbag equipment or durable industrial goods).
2. At the connection to the battery or power supply (e.g. clamp 15 or 30 in the automobile) and at
positions with stranding potential, to reduce the probability of short circuits following a fracture,
two ceramic capacitors must be connected in series and/or a ceramic capacitor with integrated
series circuit should be used. The MLSC from EPCOS contains such a series circuit in a single
component.
3. Ceramic capacitors with the temperature characteristics Z5U and Y5V do not satisfy the require-
ments to AEC-Q200 and are mechanically and electrically less rugged than C0G or X7R/X8R
ceramic capacitors. In applications that must satisfy high quality requirements, therefore, these
capacitors should not be used as discrete components (see the chapter "Effects on mechanical,
thermal and electrical stress", point 1.4).
4. For ESD protection, preference should be given to the use of multilayer varistors (MLV) (see the
chapter "Effects on mechanical, thermal and electrical stress", point 1.4).
5. An application-specific derating or continuous operating voltage must be considered in order to
cushion (unexpected) additional stresses (see the chapter "Reliability").
The following should be considered in circuit board design
1. If technically feasible in the application, preference should be given to components having an
optimal geometrical design.
2. At least FR4 circuit board material should be used.
3. Geometrically optimal circuit boards should be used, ideally those that cannot be deformed.
4. Ceramic capacitors must always be placed a sufficient minimum distance from the edge of the
circuit board. High bending forces may be exerted there when the panels are separated and dur-
ing further processing of the board (such as when incorporating it into a housing).
5. Ceramic capacitors should always be placed parallel to the possible bending axis of the circuit
board.
6. No screw connections should be used to fix the board or to connect several boards. Compo-
nents should not be placed near screw holes. If screw connections are unavoidable, they must
be cushioned (for instance by rubber pads).
12
10/06
Multilayer ceramic capacitors
Cautions and warnings
The following should be considered in the placement process
1. Ensure correct positioning of the ceramic capacitor on the solder pad.
2. Caution when using casting, injection-molded and molding compounds and cleaning agents,
as these may damage the capacitor.
3. Support the circuit board and reduce the placement forces.
4. A board should not be straightened (manually) if it has been distorted by soldering.
5. Separate panels with a peripheral saw, or better with a milling head (no dicing or breaking).
6. Caution in the subsequent placement of heavy or leaded components (e.g. transformers or
snap-in components): danger of bending and fracture.
7. When testing, transporting, packing or incorporating the board, avoid any deformation of the
board not to damage the components.
8. Avoid the use of excessive force when plugging a connector into a device soldered onto the
board.
9. Ceramic capacitors must be soldered only by the mode (reflow or wave soldering) permissible
for them (see the chapter "Soldering directions").
10. When soldering the most gentle solder profile feasible should be selected (heating time, peak
temperature, cooling time) in order to avoid thermal stresses and damage.
11. Ensure the correct solder meniscus height and solder quantity.
12. Ensure correct dosing of the cement quantity.
13. Ceramic capacitors with an AgPd external termination are not suited for the lead-free solder
process: they were developed only for conductive adhesion technology.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
13
10/06
Multilayer ceramic capacitors
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As
a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them
than the customers themselves. For these reasons, it is always ultimately incumbent on the
customer to check and decide whether an EPCOS product with the properties described in the
product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of passive electronic components
or failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in which
the malfunction or failure of a passive electronic component could endanger human life or health
(e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of
suitable design of the customer application or other action taken by the customer (e.g.
installation of protective circuitry or redundancy) that no injury or damage is sustained by third
parties in the event of malfunction or failure of a passive electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as "hazardous"). Useful information on this will be found in our
Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more
detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products.
Consequently, we cannot guarantee that all products named in this publication will always be
available.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current version
of the "General Terms of Delivery for Products and Services in the Electrical Industry"
published by the German Electrical and Electronics Industry Association (ZVEI).
7. The trade names EPCOS, EPCOS-JONES, Baoke, CeraDiode, CSSP, MLSC, PhaseCap,
PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMID, SIOV, SIP5D, SIP5K, UltraCap,
WindCap are trademarks registered or pending in Europe and in other countries. Further
information will be found on the Internet at www.epcos.com/trademarks.
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