Microwave Ceramics and Modules
Filter
2-Pole Filter for W-LAN
B69812N2457G301
Data Sheet
ISSUE DATE
29.04.04
ISSUE
A
PUBLISHER
SAW MWC PD
PAGE
1/4
Features
SMD filter consisting of coupled resonators with stepped impedances
extreme low losses
high attenuations at GSM (900, 1800) and UMTS bands
high attenuation a 2 times center frequency
(NdBa)TiO3 (
r = 88 / TCf =010 ppm/K) with a coating of copper (10
m) and tin (>5
m)
Excellent reflow solderability, no migration effect due to copper/tin metallization
Index
Page 2
Component drawing
Recommended footprint
Page 3
Characteristics
Maximum ratings
Typical passband characteristic
Page 4
Processing information
Soldering requirements
Delivery mode
Microwave Ceramics and Modules
Filter
2-Pole Filter for W-LAN
B69812N2457G301
Data Sheet
ISSUE DATE
29.04.04
ISSUE
A
PUBLISHER
SAW MWC PD
PAGE
2/4
Component drawing
Recommended footprint
View from below onto the solder terminals and view from beside
soldered areas
I/O Pads must be terminated with
50
characteristic impedance
I/O
I/O
G
G
G
G
Marking
Microwave Ceramics and Modules
Filter
2-Pole Filter for W-LAN
B69812N2457G301
Data Sheet
ISSUE DATE
29.04.04
ISSUE
A
PUBLISHER
SAW MWC PD
PAGE
3/4
Characteristics
min.
typ.
max.
Center frequency
fc -
2.45
-
GHz
Insertion loss
IL
0.8
1.2
dB
Passband
B 100
MHz
Amplitude ripple (peak - peak)
0.4
0.8
dB
Standing wave ratio
SWR
1.5
2.0
Impedance
Z
50
Attenuation
at 2150 MHz
25
30
Maximum ratings
IEC climatic category (IEC 68-1)
- 40/+ 90/56
Operating temperature
Top - 20 / + 85
C
Typical passband characteristic
-60
-55
-50
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
2,0
00
2,0
40
2,0
80
2,1
20
2,1
60
2,2
00
2,2
40
2,2
80
2,3
20
2,3
60
2,4
00
2,4
40
2,4
80
2,5
20
2,5
60
2,6
00
2,6
40
2,6
80
2,7
20
2,7
60
2,8
00
Frequency [GHz]
Att
en
uat
ion
[d
B]
S11 [dB]
S21 [dB]
Microwave Ceramics and Modules
Filter
2-Pole Filter for W-LAN
B69812N2457G301
Data Sheet
ISSUE DATE
29.04.04
ISSUE
A
PUBLISHER
SAW MWC PD
PAGE
4/4
Processing information
Wettability acc. to IEC 68-2-58:
75% (after aging)
Soldering Requirements
Profile for eutectic
SnPb solder paste
Profile for leadfree
solder paste
Soldering type
reflow
reflow
Maximum soldering temperature
235 (max. 2 sec.)
260 (max. 2 sec.)
C
(measuring point on top surface of the component) 225 (max. 10 sec.)
250 (max. 10 sec.) C
Recommended soldering conditions (infrared):
20-40 sec.
40-80 sec.
within 10 sec.
Time [sec.]
Temp. [C]
215C10C
30 sec.
2-3 min.
within 10 sec.
Time [sec.]
Temp. [C]
245C5C
2.5 C/s
> - 5 C/s
Delivery mode
Blister tape acc. to IEC 286-3, PS, grey
Pieces/tape: 3000
EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics.
Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry
recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed.
B
B
Profile B-B:
Profile A-A:
Reel: diamerter - 330mm
A
A
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