Metal Oxide Varistors
CT0603K25G
SMD Multilayer Varistor with Ni barrier Termination
B72500T0250K060
Data Sheet
ISSUE DATE
09.08.02
ISSUE
e
PUBLISHER
KB VS PE
PAGE
1/6
Designation system:
CT
= Chip with Three-layer-termination (Ag/Ni/Sn)
0603
= Dimensions of the device 06x03 (Length x width in 1/100 inch)
K
= Tolerance of the varistor voltage ( 10 %)
25
= Max. RMS operating voltage
G
= Taped version, cardboard tape, 7" reel (4000 pcs /reel)
Figure
:
l = 1,6 0,15
b = 0,8 0,1
s = 0,9 max
k = 0,1 - 0,4
(All dimensions in mm)
l
b
s
k
Metal Oxide Varistors
CT0603K25G
SMD Multilayer Varistor with Ni barrier Termination
B72500T0250K060
Data Sheet
ISSUE DATE
09.08.02
ISSUE
e
PUBLISHER
KB VS PE
PAGE
2/6
V-I-Characteristic
Derating Field
10
10
10
10
10
10
5
100
5
1000
5
10000
3
2
1
0
-1
5
5
5
1x
2
10
10
4
10
5
2
10
3
10
tr
max
i
A
s
t
max
i
6
10
r
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
2
10
3
A
i
1
200
v
2
4
6
8
10
20
40
60
80
100
200
V
VAR9236A
Metal Oxide Varistors
CT0603K25G
SMD Multilayer Varistor with Ni barrier Termination
B72500T0250K060
Data Sheet
ISSUE DATE
09.08.02
ISSUE
e
PUBLISHER
KB VS PE
PAGE
3/6
Electrical Data
Max. operating voltage
RMS voltage
Veff = 25 V
DC voltage
VDC = 31 V
Varistor voltage (@ 1 mA)
VV = 35.1 42.9 V
Max. clamping voltage (@ 1 A)
VC = 67 V
Max. average power dissipation
Pmax = 3 mW
Max. surge current (8/20 s)
max = 1 x 30 A
Max. energy absorption (2 ms)
Emax = 1 x 0.3 J
Capacitance (@ 1 MHz, 1 V, 25C), typical
C
typ.
= 90 pF
Response time
< 0.5 ns
Operating temperature range
-40 ... +125 C
Storage temperature (mounted parts)
-40 ... +150 C
100
0
10
20
30
40
50
60
70
80
90
%
-55
C
Ambient temperature
Max. current, energy, operating voltage and average power
dissipation depending on ambient temperature
70
80
90
100
110
120
130
140
150
Metal Oxide Varistors
CT0603K25G
SMD Multilayer Varistor with Ni barrier Termination
B72500T0250K060
Data Sheet
ISSUE DATE
09.08.02
ISSUE
e
PUBLISHER
KB VS PE
PAGE
4/6
Recommended solder pad layout
A = 1,0 mm
B = 1,0 mm
C = 1,0 mm
D = 3,0 mm
Recommended soldering temperature profiles
The components should be soldered within 12 months after delivery from EPCOS. The parts
are to be left in the original packing in order to avoid any soldering problems caused by
oxidized terminals.
Storage temperature: -25 to 45C
Relative humidity: <75% annual average, <95% on max. 30 days in a year.
The usage of mild, non activated fluxes for soldering is recommended, as well as a proper
cleaning of the PCB.
A
A
D
C
B
B
100C...130C
235C...260C
10 s
max. 2C/s
0
50
100
150
200
250
s
0
50
100
150
200
250
300
t
C
T
max 2C/s
180 C
215 C
ca 245 C
ca. 40 s
ca. 100 s
0
50
100
150
200
250
s
t
0
50
100
150
200
250
300
C
T
Wave soldering
IR reflow soldering
with cooling ca. 5C/s
2.Wave
1.Wave
Metal Oxide Varistors
CT0603K25G
SMD Multilayer Varistor with Ni barrier Termination
B72500T0250K060
Data Sheet
ISSUE DATE
09.08.02
ISSUE
e
PUBLISHER
KB VS PE
PAGE
5/6
Taping and Packaging:
Taping: Tape and reel packing according to IEC 60286-3
Tape material: Cardboard
Dimensions and tolerances:
Definition
Symbol
Dimension
[mm]
Tolerance
[mm]
Compartment width
A
0
0.95
0.2
Compartment length
B
0
1.8
0.2
Sprocket hole diameter
D
0
1.5
+0.1 /-0
Sprocket hole pitch
P
0
4.0
0.1
1)
Distance center hole to center compartment
P
2
2.0
0.05
Pitch of the component compartments
P
1
4.0
0.1
Tape width
W
8.0
0.3
Distance edge to center of hole
E
1.75
0.1
Distance center hole to center compartment
F
3.5
0.05
Distance compartment to edge
G
0.75
min.
Overall thickness
T
2
1.1
max.
Thickness tape
T
0.9
max.
1)
0.2 mm over any 10 pitches
Package: 8 mm tape:
P1
0
A
G
F
E
W
P
D
P
0
2
0
T
2
B
0
T
T
1
1
T
Direction of unreeling
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