Metal Oxide Varistors
CT0402S11AG
SMD Multilayer Varistor with Ni-Barrier Termination B72590T0110S160
Data Sheet
ISSUE DATE
13.02.03
ISSUE
c
PUBLISHER
KB VS PE
PAGE
1/6
Designation System
CT =
Chip with Three-layer-termination
0402 = Dimensions of the device 04x02 (Length x width in 1/100 inch)
S...A =
Special tolerance A of the varistor voltage
11
= Max. operating voltage (RMS voltage)
G
= Taped version, cardboard tape, 7" reel (10000 pcs/reel)
Figure
l = 1,0 0,15
b = 0,5 0,10
s = 0,5 0,10
k = 0,2 0,10
Coplanarity < 0,1
(All dimensions in mm)
As far as patents or other rights of third parties are concerned, liability is only assumed for components per se, not for
applications, processes and circuits implemented within components or assemblies. The information describes the type of
component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved.
l
b
s
k
Metal Oxide Varistors
CT0402S11AG
SMD Multilayer Varistor with Ni-Barrier Termination B72590T0110S160
Data Sheet
ISSUE DATE
13.02.03
ISSUE
c
PUBLISHER
KB VS PE
PAGE
2/6
V-I-Characteristic
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
A
i
1
100
v
2
4
6
8
10
20
40
60
80
100
V
VAR9678A
Derating Field
10
10
10
10
10
10
5
100
5
1000
5
10000
5
5
5
1x
tr
max
i
A
s
t
max
i
r
2
1
0
-1
-2
Metal Oxide Varistors
CT0402S11AG
SMD Multilayer Varistor with Ni-Barrier Termination B72590T0110S160
Data Sheet
ISSUE DATE
13.02.03
ISSUE
c
PUBLISHER
KB VS PE
PAGE
3/6
Electrical Data
Max. operating voltage
RMS
voltage Veff = 11 V
DC
voltage
VDC = 14 V
Varistor voltage (@ 1 mA)
Vv = 16.5 20.3 V
Max. clamping voltage (@ 1 A)
VC = 35 V
Max. average power dissipation
Pmax = 3 mW
Max. surge current (8/20 s)
max = 1 x 10 A
Max. energy absorption (2 ms)
Emax = 1 x 7.5 mJ
Capacitance (@ 1kHz, 1 V; 25C; typical)
C = 120 pF
Response
time
< 0.5 ns
Operating
temperature
-55 ... +85 C
Storage temperature (mounted parts)
-55 ... +125 C
Termination
material Ag/Ni/Sn
(thickness not specified, adjusted to fulfill wettability specification acc. to IEC 60068-2-58)
Part weight
0.002 g
100
0
10
20
30
40
50
60
70
80
90
%
-55
C
Ambient temperature
Max. current, energy, operating voltage and average power
dissipation depending on ambient temperature
70
80
90
100
110
120
130
140
150
Metal Oxide Varistors
CT0402S11AG
SMD Multilayer Varistor with Ni-Barrier Termination B72590T0110S160
Data Sheet
ISSUE DATE
13.02.03
ISSUE
c
PUBLISHER
KB VS PE
PAGE
4/6
Recommended Geometry of Solder Pads
A = 0,6 mm
B = 0,6 mm
C = 0,5 mm
D = 1,7 mm
Recommended Reflow Soldering Temperature Profiles
The components should be soldered within 12 months after delivery from EPCOS. The parts
are to be left in the original packing in order to avoid any soldering problems caused by
oxidized terminals.
Storage temperature: -25 to 45C.
Relative humidity: <75% annual average, <95% on max. 30 days in a year.
The usage of mild, non activated fluxes for soldering is recommended, as well as proper
cleaning of the PCB.
A
A
D
C
B
B
max 2C/s
215 C
~ 40 s
~ 100 s
0
50
100
150
200
250
s
t
0
50
100
150
200
250
300
C
T
~ 245 C
180 C
Metal Oxide Varistors
CT0402S11AG
SMD Multilayer Varistor with Ni-Barrier Termination B72590T0110S160
Data Sheet
ISSUE DATE
13.02.03
ISSUE
c
PUBLISHER
KB VS PE
PAGE
5/6
Taping according to IEC 60286-3
Dimensions and tolerances
Tape material: cardboard
40 min.
empty cavities
25 min.
empty cavities
300 mm
cover tape
Leader
Tape end (trailer)
P1
0
A
G
F
E
W
P
D
P
0
2
0
T
2
B
0
T
T
1
1
T
Direction of unreeling
Definition Symbol
Dim.
Tolerance
Compartment width
A
0
0.6
0.2
Compartment length
B
0
1.15
0.2
Sprocket hole diameter
D
0
1.5
0.1
Sprocket hole pitch
P
0
4.0
0.1
1)
Distance center hole to
center compartment
P
2
2.0
0.05
Pitch of the component
compartments
P
1
2.0
0.1
Tape width
W
8.0
0.3
Distance edge to center of
hole
E 1.75
0.1
Distance center hole to
center compartment
F
3.5
0.05
Distance compartment to
edge
G 0.75
min
Thickness of cardboard tape
T
0.6
max.
Overall thickness
T
2
0.7
max.
1)
0.2 mm over any 10 pitches
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