41
Crystal oscillator
Recommended soldering pattern
(Unit: mm)
1.3
3.0
5.8
3.0
1.3
3.8
1 Ts
2 GND
3 OUT
4 V
DD
NO.
#1
#2
#4
#3
8.65
0.25
9.8 max.
4.7 max.
4.06
0.25 min.
External dimensions
Specifications (characteristics)
(Unit: mm)
1.5000M
HG2012 AV
9357A
E
14.0 max.
5.08
7.62
0.51
Pin terminal
Do not connect T
S
-pin external device.
HIGH-STABILITY HIGH-FREQUENCY OSCILLATOR
HG-1000/2000 series
Cylindrical AT crystal unit built-in, thus assuring high reliability.
Excellent shock resistance and heat resistance.
Low current consumption.
Item
Output frequency range
Power source
voltage
Temperature
range
Soldering condition
Frequency stability
Current consumption
Duty
High output voltage
Low output voltage
Output load condition
Output rise time
Output fall time
Oscillation start up time
Aging
Shock resistance
Symbol
f
0
V
DD
-GND
V
DD
T
STG
T
OPR
T
SOL
f/f
0
lop
t
W
/
t
V
OH
V
OL
C
L
t
TLH
t
THL
t
OSC
fa
S.R.
HG-1012JA
HG-2012JA
Specifications
1.5000 MHz to 28.63636 MHz
-0.5V to +7.0V
5.0V 0.25V
-55C to +125C
-40C to + 85C
Under 260C within 10 sec. x 2 times
AV: 20ppm, BV: 25ppm
SV: 15ppm, AV: 20ppm
BX: 25ppm, CX: 30ppm BX: 25ppm
10mA max.
40% to 60%
V
DD
-0.4V min.
0.4V max.
15pF max.
8ns max.
4ms max.
5ppm/year max.
2ppm/year max.
10ppm max.
2ppm max.
Remarks
V
DD
=4.75V to 5.25V
Ta= -20C to +70C
Ta= -40C to +85C
No load condition
1/2 V
DD
level
I
OH
= -0.8mA
I
OL
=3.2mA
20%
80% V
DD
level
80%
20% V
DD
level
Time at 4.75V to be 0 sec.
Ta=25C
Three drops on a hard wooden board from
75 cm or excitation test with 3000G x 0.3ms
x 1/2sine wave in 3 directions
Max. supply voltage
Operating voltage
Storage temperature
Operable temperature
Actual size
THE CRYSTALMASTER
NOTICE
SEIKO EPSON CORP. QUARTZ DEVICE DIVISION acquired ISO9001 and ISO14001 certification
by B.V.Q. I. (Bureau Veritas Quality International) .
ISO9001 in October, 1992.
ISO14001 in November,1997.
No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko
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ENERGY SAVING EPSON
Our concept of Energy Saving technology conserves
resources by blending the essence of these three efficiency
technologies. The essence of these technologies is repre-
sented in each of the products that we provide to our cus-
tomers.
In the industrial sector, leading priorities include mea-
sures to counter the greenhouse effect by reducing CO2,
measures to preserve the global environ-
ment, and the development of energy-
efficient products. Environmental
problems are of global concern, and
although the contribution of energy-
saving technology developed by
EPSON may appear insignificant,
we seek to contribute to the develop-
ment of energy-saving products by our
customers through the utilization of our electronic devices.
EPSON is committed to the conservation of energy, both
for the sake of people and of the planet on which we live.
EPSON offers effective savings to its customers through
a wide range of electronic devices, such as semiconductors,
liquid crystal display (LCD) modules, and crystal devices.
These savings are achieved through a sophisticated melding
of three different efficiency technologies.
Power saving technology
provides low power con-
sumption at low voltages.
Space saving technology
provides further reductions
in product size and weight
through super-precise pro-
cessing and high-density
assembly technology.
Time saving technology
shortens the time required
for design and development
on the customer side and
shortens delivery times.
Energy Saving
Power Saving
Space Saving
Time Saving
Resource
Saving
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