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Электронный компонент: SG-3032JC

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30
Crystal oscillator
Specifications (characteristics)
Recommended soldering pattern
External dimensions
(Unit: mm)
(Unit: mm)
5.0
10.5 max.
#3
#4
#2
#1
2.7
max.
5.08
0.5
(1.0)
3.6
0.05
min.
(1.0)
5.8max.
1.3
3.8
1.3
2.1
2.5
2.1
NO. Pin terminal
1 NC
2 GND
3 OUT
4 V
DD
SG3032 B
E 9123A
32kHz CRYSTAL OSCILLATOR
SG-3032JC
No adjustment required with 32.768kHz crystal unit built-in.
Use of C-MOS IC enables reduction of current consumption.
Small suited to high-density mounting.
Item
Output frequency range
Power source voltage
Temperature range
Soldering condition
Frequency tolerance
Frequency temperature characteristics
Frequency voltage characteristics
Current consumption
Duty
Output voltage
Output load condition (fan out)
Output rise time
Output fall time
Oscillation start up time
Aging
Shock resistance
Max. supply voltage
Operating voltage
Unless otherwise stated, characteristics (specifications) shown in the above table are based on the rated operating temperature and voltage condition.
Storage temperature
Operating temperature
Symbol
f
0
V
DD
-GND
V
DD
T
STG
T
OPR
T
SOL
f/f
0
l
OP
t
W
/
t
V
OH
V
OL
C
L
t
TLH
t
THL
t
OSC
fa
S.R.
Specifications
32.768 kHz
-0.3V to +4.3V
1.8V to 3.6V
-55C to +125C
-20C to +70C
Twice at Under 260C within 10 sec.
B: 523ppm C: 550ppm D: 5100ppm
+10ppm / -120ppm
2ppm /V max.
5A max.
40% to 60%
V
DD
-0.4V min.
0.4V max.
15pF max.
100ns max.
100ns max.
3s max.
5ppm/year max.
5ppm max.
Remarks
V
DD
=3.3V Ta=25C
-20C to +70C, taking Ta=25C as the reference
Ta=25C
No load condition
1/2 V
DD
level
I
OH
= -50mA
I
OL
=+0.5mA
C-MOS load
Ta=25C, V
DD
=3.3V, first year
Three drops on a hard board from 75 cm or excitation
test with 3000G x 0.3ms x 1/ 2 sine wave in 3
directions
Actual size
C-MOS load:20%/80% V
DD
C-MOS load:80%/20% V
DD
For more than 1ms until V
DD
=0V
1.8V.
Time at 1.8V to be 0 sec.
THE CRYSTALMASTER
NOTICE
SEIKO EPSON CORP. QUARTZ DEVICE DIVISION acquired ISO9001 and ISO14001 certification
by B.V.Q. I. (Bureau Veritas Quality International) .
ISO9001 in October, 1992.
ISO14001 in November,1997.
No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko
Epson. Seiko Epson reserves the right to make changes to this material without notice. Seiko Epson does not assume any
liability of any kind arising out of any inaccuracies contained in this material or due to its application or use in any product or
circuit and, further, there is no representation that this material is applicable to products requiring high level reliability, such as,
medical products. Moreover, no license to any intellectual property rights is granted by implication or otherwise, and there is no
representation or warranty that anything made in accordance with this material will be free from any patent or copyright
infringement of a third party. This material of portions there may contain technology or the subject relating to strategic products
under the control of the Foreign Exchange and Foreign Trade Control Law of Japan and may require an export license from the
Ministry of International Trade and Industry or other approval from another government agency.
ENERGY SAVING EPSON
Our concept of Energy Saving technology conserves
resources by blending the essence of these three efficiency
technologies. The essence of these technologies is repre-
sented in each of the products that we provide to our cus-
tomers.
In the industrial sector, leading priorities include mea-
sures to counter the greenhouse effect by reducing CO2,
measures to preserve the global environ-
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efficient products. Environmental
problems are of global concern, and
although the contribution of energy-
saving technology developed by
EPSON may appear insignificant,
we seek to contribute to the develop-
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customers through the utilization of our electronic devices.
EPSON is committed to the conservation of energy, both
for the sake of people and of the planet on which we live.
EPSON offers effective savings to its customers through
a wide range of electronic devices, such as semiconductors,
liquid crystal display (LCD) modules, and crystal devices.
These savings are achieved through a sophisticated melding
of three different efficiency technologies.
Power saving technology
provides low power con-
sumption at low voltages.
Space saving technology
provides further reductions
in product size and weight
through super-precise pro-
cessing and high-density
assembly technology.
Time saving technology
shortens the time required
for design and development
on the customer side and
shortens delivery times.
Energy Saving
Power Saving
Space Saving
Time Saving
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