PKF 2000 I
612 W DC/DC Power Modules
24 V Input Series
E
SMD and through-hole versions
with ultra low component height
8 mm (0.315 in)
84% efficiency (typ at 5 V)
1,500 V dc isolation voltage
Output current up to 2 A
Switching frequency syncronization
MTBF > 4.9 million hours at
+50 C pin temperature (+40 C
ambient)
Low EMI measured according to
CISPR 22 and FCC part 15J
The MacroDensTM PKF 2000 I series true component
level on-board DC/DC power modules are intended
as distributed power sources in decentralized +24V
DC power system.
Utilization of thick film technology and a high
degree of silicon integration has made it possible to
achieve a MTBF of more than 4.9 million hours.
The highly reliable and rugged over-moulded design
and the ultra low height makes them particularly
suited for cellular radio and other demanding
industrial applications, with board spacing down to
15 mm or 0.6 in.
These DC/DC power modules are optimized for free
convection cooling and have an operational ambient
temperature range in compliance with present and
future application needs, including non temperature
controlled environments.
The mechanical design offers the choice of surface
mount or through-hole versions, delivered in ready-
to-use tubes, trays or tape & reel package, and com-
patibility with semi and fully aqueous cleaning
processes.
The PKF series is manufactured using highly
automated manufacturing lines with a world-class
quality commitment and a five-year warranty.
Ericsson Microelectronics AB has been an ISO 9001
certified supplier since 1991. For a complete product
program please reference the back cover.
Patents
US: D357901 DE: M94022763
2
EN/LZT 146 31 R1A (Replaces EN/LZT 137 21 R6) Ericsson Microelectronics AB, June 2000
General
Absolute Maximum Ratings
Characteristics
Isolation voltage
(input to output test voltage)
V
ISO
Input T
C
< T
Cmax
unless otherwise specified
mW
mW
Input stand-by power
P
RC
min
max
Unit
T
C
Case temperature at full output power
45
+100
C
T
S
Storage temperature
55
+125
C
V
I
Continuous input voltage
0.5
+40
V dc
1,500
V dc
V
tr
Transient input energy
0.01
Ws
V
RC
Remote control voltage pin 10, 11 ref. to pin 18
5
V
I
V dc
V
adj
Output adjust voltage pin 8, 9 ref. to pin 18
5
+40
V dc
V
I
Input voltage range
1)
18
36
V
V
Ioff
Turn-off input voltage
16
18
V
16.8
See typical characteristics
V
Ion
Turn-on input voltage
19
V
18.3
See typical characteristics
C
I
Input capacitance
mF
2.4
P
Ii
Input idling power
I
O
= 0, T
C
= 30...+ 85 C
(V
I
= 24V)
(V
I
= 27V)
360
300
(V
I
= 24V)
(V
I
= 27V)
25
40
T
C
= 30...+ 85 C,
RC connected to pin 18
Characteristics
Conditions
min
typ
max
Unit
Stress in excess of Absolute Maximum
Ratings may cause permanent damage.
Absolute Maximum Ratings, sometimes
referred to as no destruction limits, are
normally tested with one parameter at a
time exceeding the limits of Output data
or Electrical Characteristics. If exposed to
stress above these limits, function and
performance may degrade in an unspeci-
fied manner.
NOTES:
1)
The power modules will operate down to
V
I
18 V, when V
I
decreases, but will turn on
at V
I
19 V, when V
I
increases (see also
Operating Information.
2)
The test is applicable for through-hole
versions.
Environmental Characteristics
Characteristics
Frequency
10...500 Hz
Amplitude
0.75 mm
Acceleration
10 g
Number of cycles
10 in each axis
Vibration
(Sinusoidal)
JESD 22-B103
(IEC 68-2-6 F
c
)
Test procedure & conditions
Frequency
10...500 Hz
Acceleration density
spectrum
0.5 g
2
/Hz
Duration
10 min in 3 directions
Reproducability
medium (IEC 62-2-36)
MIL-STD-883
Method 2026
(IEC 68-2-34 E
d
)
Random
vibration
Peak acceleration
200 g
Shock duration
3 ms
Shock
(Half sinus)
JESD 22-B104
(IEC 68-2-27 E
a
)
Temperature
85C
Humidity
85% RH
Duration
1000 hours
Temperature
40C...+125C
Number of cycles
500
Temperature, solder
260C
Duration
10...13 s
Temperature
change
Accelerated
damp heat
Solder
resistability
2)
JESD 22-A104
(IEC 68-2-14 N
a
)
JESD 22-A101
(IEC 68-2-3 C
a
with bias)
JESD 22-B106
(IEC 68-2-20 T
b
1A)
Duration
96 h
Temperature
35C
Concentration
5 %
IEC 68-2-11 K
a
Aggressive
environment
EN/LZT 146 31 R1A (Replaces EN/LZT 137 21 R6) Ericsson Microelectronics AB, June 2000
3
Mechanical Data
Through-hole version
Foot print Component side
Foot print Component side
Dimensions in mm (in)
3.6 [0.142]
5.0 [0.197]
24.0
[0.945]
29.6
[1.165]
2.8
[0.110]
1 2
3 4 5 6 7 8 9
10
11
12
13
14
15
16
17
18
40.0 [1.575]
Dimensions in mm (in)
Surface-mount version
40.0 [1.575]
Pin
Designation
Function
Connections
1
Out 1
Output 1. Positive voltage ref. to Rtn.
2
Rtn
Output return.
36
NC
Not connected.
7
Sync
Synchronization input.
8
V
adj
Output voltage adjust. To set typical output voltage (V
Oi
)
connect pin 8 to pin 9.
9
NOR
Connection of Nominal Output voltage Resistor. (See Operating
Information, Output Voltage Adjust).
10
TOA
Turn-on/off input voltage adjust (V
Ion
/V
Ioff
). Used to decrease the
turn-on/off input voltage threshold.
11
RC
Remote control and turn-on/off input voltage adjust. Used to turn-on
and turn-off output and to set the turn-on/off input voltage threshold.
12 16
NC
Not connected.
17
+In
Positive input.
18
In
Negative input.
Case
The case consists of semiconductor grade
epoxy with embedded pins.
Coefficient of thermal expansion (CTE) is
typ. 15 ppm/C.
Weight
Maximum 20 g (0.71 oz).
Connection Pins
Base material is copper (Cu), first plating
is nickel (Ni) and second (outer) plating is
palladium (Pd).
4
EN/LZT 146 31 R1A (Replaces EN/LZT 137 21 R6) Ericsson Microelectronics AB, June 2000
Thermal Data
Two-parameter model
This model provides a more precise description of the thermal
characteristics to be used for thermal calculations.
Thermally the power module can be considered as a component
and the case temperature can be used to characterize the
properties. The thermal data for a power module with the
substrate in contact with the case can be described with two
thermal resistances. One from the case to ambient air and one
from case to PB (Printed Board).
The thermal characteristics can be calculated from the following
formula:
T
PB
= (T
C
T
A
)(R
th CPB
+R
th CA
)/R
th CA
P
d
R
th CPB
+T
A
Where:
P
d
:
dissipated power, calculated as P
O
(l/h1)
T
C
:
max average case temperature
T
A
:
ambient air temperature at the lower side of the power
module
T
PB
:
temperature in the PB between the PKF connection pins
R
th C-PB
: thermal resistance from case to PB under the power
module
R
th C-A
: thermal resistance from case to ambient air
v:
velocity of ambient air.
R
th C-PB
is constant and R
th
C-A
is dependent on the air velocity.
Free convection is equal to an air velocity of approx.
0.2 0.3 m/s. See figure below.
Palladium plating is used on the terminal pins. A pin tem-perature
(T
p
) in excess of the solder fusing temperature (+183C for Sn/Pb
63/37) for more than 25 seconds and a peak temperature above
195C, is required to guarantee a reliable solder joint.
Both pin 1 and pin 9 must be monitored.
No responsibility is assumed if these recommendations are
not strictly followed.
Reflow Soldering Information
The PKF series of DC/DC power modules are manufactured in
surface mount technology. Extra precautions must therefore be
taken when reflow soldering the surface mount version. Neglec-
ting the soldering information given below may result in perma-
nent damage or significant degradation of power module per-
formance.
The PKF series can be reflow soldered using IR, Natural
Convection, Forced Convection or Combined IR/Convection
Technologies. The high thermal mass of the component and its
effect on
DT (C) requires that particular attention be paid to
other temperature sensitive components.
IR Reflow technology may require the overall profile time to be
extended to approximately 810 minutes to ensure an acceptable
DT. Higher activity flux may be more suitable to overcome the
increase in oxidation and to avoid flux burn-up.
The general profile parameters detailed in the diagram, with this
ex-tended time to reach peak temperatures, would then be
suitable.
Note! These are maximum parameters. Depending on process
variations, an appropriate margin must be added.
EN/LZT 146 31 R1A (Replaces EN/LZT 137 21 R6) Ericsson Microelectronics AB, June 2000
5
Electrical Data
Fundamental circuit diagram, Single output
Control
1
2
17
10
11
18
7
9
8
Safety
The PKF 2000 I series DC/DC power modules are designed in
accordance with EN 60 950, Safety of information technology
equipment including electrical business equipment. SEMKO certificate
no. 9738248.
The PKF power modules are recognized by UL and meet the
applicable requirements in UL 1950 Safety of information technology
equipment, the applicable Canadian safety requirements and UL
1012 Standard for power supplies.
The DC/DC power module shall be installed in an end-use
equipment and considerations should be given to measuring the
case temperature to comply with T
Cmax
when in operation.
Abnormal component tests are conducted with the input
protected by an external 3 A fuse. The need for repeating these
tests in the end-use appliance shall be considered if installed in a
circuit having higher rated devices.
The isolation is an operational insulation in accordance with
EN 60 950.
The DC/DC power module is intended to be supplied by isolated
secondary circuitry and shall be installed in compliance with the
requirements of the ultimate application. One pole of the input
and one pole of the output is to be grounded or both are to be
kept floating.
The terminal pins are only intended for connection to mating
connectors of internal wiring inside the end-use equipment.
These DC/DC power modules may be used in telephone
equipment in accordance with paragraph 34 A.1 of UL 1459
(Standard for Telephone Equipment, second edition).
The galvanic isolation is verified in an electric strength test. Test
voltage (V
ISO
) between input and output is 1,500 Vdc for
60 s. In production the test duration is decreased to 1 s.
The capacitor between input and output has a value of 1 nF and
the leakage current is less than 1A @ 26 Vdc.
The case is designed in non-conductive epoxy. Its flamma-bility
rating meets UL 94V-0. The oxygen index is 34%.
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