0603ESDA-TR, PolySURGTM
TR Series ESD Suppressor
Part Ratings and Characteristics:
Performance Characteristics
Units
Min
Typ
Max
Continuous operating voltage
VDC
-
-
24
Clamping voltage
2
V
-
35
60
Trigger voltage
3
V
-
125
-
ESD Threat voltage capability
4
kV
-
8
15
Capacitance (@ 1 KHz ~ 1.8GHz)
pF
-
-
0.15
Leakage current (@ 12 VDC)
nA
0.01
<0.1
-
Peak current
2
A
-
30
45
Operating temperature
C
-56
+25
+105
ESD pulse withstand
2
# pulses
20
>500
1
-
Notes:
1. Some shifting in characteristics may occur when tested over
several hundred ESD pulses at very rapid rate of 1 pulse per
second or faster.
2. Per IEC 61000-4-2, 30A @ 8kV, level 4, clamp measurement
made 30ns after initiation of pulse, all tests in contact discharge
mode.
3. Trigger measurement made using Transmission Line Pulse
(TLP) method
4. PolySURGTM devices are capable of withstanding up to a 15 kV,
45A ESD pulse. Device ratings are given at 8kV per Note 1,
unless otherwise specified.
Features:
0603/1608 foot print
Ideal ESD protection for high frequency, low voltage applications.
Exceeds testing requirements outlined in IEC 61000-4-2
Ultra low capacitance (0.15pF maximum)
Very low leakage current
Fast response time
Bi-directional
Surface mount
Computers & Peripherals
HDTV Equipment
DVD Players
A/V Equipment
Satellite Radio
Cell Phones
PDA's
Digital Still Cameras
Digital Camcorders
MP3 / Multimedia Players
Set Top Boxes
External Storage
DSL Modems
High Speed Data Ports
USB 2.0
IEEE 1394
HDMI
DVI
High Speed Ethernet
Infiniband
Applications
The PolySURGTM 0603ESDA-TR ESD Suppressors
protect valuable high-speed data circuits from ESD
damage without distorting data signals as a result of
its ultra-low (0.15pF maximum) capacitance.
Description
Ordering Information
Catalog Number
Packaging
0603ESDA-TR1
5,000 pieces in paper tape on
7" (178mm) reel
0603ESDA-TR, PolySURGTM
TR Series ESD Suppressor
W
L
H
T
R
1.0 max
(.039 max)
1.1 ref
(.043 ref)
0.60 min
(.023 min)
mm (inches)
Recommended Solder
Pad Outline
(per IPC-SM-782)
4.00.1
(.157.004)
4.00.1
(.157.004)
2.00.05
(.079.002)
8.00.30
(.315.012)
1.50.10
(.059.004)
1.750.1
(.069.004)
13.00.5
(.512.020)
9.01.5
(.354.059)
178.02.0
(7.008.080)
210.8
(.827.032)
2.00.5
(.080.020)
B
A
3.50.05
(.138.002)
60.01.5
(2.362.059)
2.00.75
(.079.030)
Dimension
A
B
0603
1.900.20
(.0750.008)
1.100.20
(.0430.008)
Product Dimension
Tape-and-Reel Specification
EIA Size
L
W
H
T
R
mm (in)
0603ESDA
1.60 0.10
0.80 0.10
0.50 0.10
0.30 0.20
0.70 0.10
(.063 .004) (.031 .004) (.020 .004) (.012 .008) (.028 .004)
Environmental Specifications:
Moisture Resistance per EIA/IS-722 Paragraph 4.4.2. This standard is based upon MIL-STD-202G Method 103B but with tem-
perature and relative humidity at +85C and 85% RH respectively. Test condition `A' (240Hr) per MIL-STD-202G
Thermal shock: MIL-STD-202, Method 107G, -55C to 125C, 30 min. cycle, 10 cycles
Vibration: MIL-STD-202F, Method 201A,(10 to 55 to 10 Hz, 1 min. cycle, 2 hrs each in X-Y-Z)
Chemical resistance: ASTM D-543, 4 hrs @ 40C, 3 solutions (H2O, detergent solution, defluxer)
Operating temperature characteristics, measurement at +25C, +105C and -56C
Full load voltage: 14.4VDC, 18VDC & 24VDC for 1000 hrs, 25C
Solder leach resistance and terminal adhesion: Per EIA-576
Solderability: MIL-STD-202, Method 208 (95% coverage)
0603ESDA-TR, PolySURGTM
TR Series ESD Suppressor
Device Marking
ESDA devices are marked on the tape and reel packages, not individually. Since the product is bi-directional and symmetrical, no
orientation marking is required.
Design Consideration
The location in the circuit for the TR series has to be carefully determined. For better performance, the device should be placed
as close to the signal input as possible and ahead of any other component. Due to the high current associated with an ESD
event, it is recommended to use a "0-stub" pad design (pad directly on the signal/data line and second pad directly on common
ground).
Processing Recommendations
The TR series currently has a convex profile on the top surface of the part. This profile is a result of the construction of the deice.
They can be processed using standard pick-and-place equipment. The placement and processing techniques for these devices are
similar to those used for chip resistors and chip capacitors.
Visit us on the Web at www.cooperbussmann.com sales@cooperbussmann.com
1225 Broken Sound Pkwy. NW, Suite F Boca Raton, Florida 33487
Tel: +1-561-998-4100 Toll Free: +1-888-414-2645 Fax: +1-561-241-6640
0603 7/05
Cooper Electronic
Technologies 2005
Soldering Recommendations
Compatible with lead and lead-free solder reflow processes
Peak reflow temperatures and durations:
IR Reflow = 260C max for 10 sec. max.
Wave Solder = 260C max. for 10 sec. max.
Recommended IR Reflow Profile:
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