HWD2119
350mW Audio Power Amplifier with Shutdown Mode
General Description
The
HWD2119 is a mono bridged power amplifier that is ca-
pable of delivering 350mW
RMS
output power into a 16
load
or 300mW
RMS
output power into an 8
load with 10%
THD+N from a 5V power supply.
The
HWD2119 audio power amplifier is designed specifically
to provide high quality output power and mini
mize PCB
area with surface mount packaging and a minimal
amount
of external components. Since the
HWD2119 does not
require output coupling capacitors, bootstrap capacitors or
snubber networks, it is optimally suited for low-power por-
table applications.
The closed loop response of the unity-gain stable
HWD2119
can be configured using external gain-setting resistors. The
device is available in LLP, MSOP, and SO package types to
suit various applications.
Key Specifications
n
THD+N at 1kHz, 350mW continuous average output
power into 16
10% (max)
n
THD+N at 1kHz, 300mW continuous average output
power into 8
10% (max)
n
Shutdown Current
0.7A (typ)
Features
n
LLP, SOP, and MSOP surface mount packaging.
n
Switch on/off click suppression.
n
Unity-gain stable.
n
Minimum external components.
Applications
n
General purpose audio
n
Portable electronic devices
n
Information Appliances (IA)
Typical Application
FIGURE 1. Typical Audio Amplifier Application Circuit
Audio Power Amplifier
1
Absolute Maximum Ratings
(Notes 2, 3)
If Military/Aerospace specified devices are required,
please contact the
CSMSC Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage
6.0V
Storage Temperature
-65C to +150C
Input Voltage
-0.3V to V
DD
+0.3V
Power Dissipation (P
D
) (Note 4)
Internally Limited
ESD Susceptibility (Note 5)
3.5kV
ESD Susceptibility (Note 6)
250V
Junction Temperature (T
J
)
150C
Soldering Information (Note 1)
Small Outline Package
Vapor Phase (60 seconds)
215C
Infrared (15 seconds)
220C
Thermal Resistance
JC
(MSOP)
56C/W
JA
(MSOP)
210C/W
JC
(SOP)
35C/W
JA
(SOP)
170C/W
JA
(LLP)
117C/W (Note 10)
JA
(LLP)
150C/W (Note 11)
Operating Ratings
(Notes 2, 3)
Temperature Range
T
MIN
T
A
T
MAX
-40C
T
A
85C
Supply Voltage
2.0V
V
CC
5.5V
Electrical Characteristics V
DD
= 5V
(Notes 2, 3)
The following specifications apply for V
DD
= 5V, R
L
= 16
unless otherwise stated. Limits apply for T
A
= 25C.
Symbol
Parameter
Conditions
HWD2119
Units
(Limits)
Typical
Limit
(Note 7)
(Notes 8, 9)
I
DD
Quiescent Power Supply Current
V
IN
= 0V, I
o
= 0A
1.5
3.0
mA (max)
I
SD
Shutdown Current
V
PIN1
= V
DD
(Note 12)
1.0
5.0
A (max)
V
SDIH
Shutdown Voltage Input High
4.0
V (min)
V
SDIL
Shutdown Voltage Input Low
1.0
V (max)
V
OS
Output Offset Voltage
V
IN
= 0V
5
50
mV (max)
P
O
Output Power
THD = 10%, f
IN
= 1kHz
350
mW
THD = 10%, f
IN
= 1kHz, R
L
= 8
300
mW
THD+N
Total Harmonic Distortion + Noise
P
O
= 270mW
RMS
, A
VD
= 2, f
IN
=
1kHz
1
%
Electrical Characteristics V
DD
= 3V
(Notes 2, 3)
The following specifications apply for V
DD
= 3V and R
L
= 16
load unless otherwise stated. Limits apply to T
A
= 25C.
Symbol
Parameter
Conditions
HWD2119
Units
(Limits)
Typical
Limit
(Note 7)
(Notes 8, 9)
I
DD
Quiescent Power Supply Current
V
IN
= 0V, I
o
= 0A
1.0
3.0
mA (max)
I
SD
Shutdown Current
V
PIN1
= V
DD
(Note 12)
0.7
5.0
A (max)
V
SDIH
Shutdown Voltage Input High
2.4
V (min)
V
SDIL
Shutdown Voltage Input Low
0.6
V (max)
V
OS
Output Offset Voltage
V
IN
= 0V
5
50
mV
P
O
Output Power
THD = 10%, f
IN
= 1kHz
110
mW
THD = 10%, f
IN
= 1kHz, R
L
= 8
90
mW
THD+N
Total Harmonic Distortion + Noise
P
O
= 80mW
RMS
, A
VD
= 2, f
IN
=
1kHz
1
%
2
Electrical Characteristics V
DD
= 3V
(Notes 2, 3)
The following specifications apply for V
DD
= 3V and R
L
= 16
load unless otherwise stated. Limits apply to T
A
=
25C. (Continued)
Note 1: See AN-450 'Surface Mounting and their Effects on Product Reliability' for other methods of soldering surface mount devices.
Note 2: All voltages are measured with respect to the ground pin, unless otherwise specified.
Note 3:
Absolute Maximum Ratings
indicate limits beyond which damage to the device may occur.
Operating Ratings
indicate conditions for which the device is
functional, but do not guarantee specific performance limits.
Electrical Characteristics
state DC and AC electrical specifications under particular test conditions which
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit
is given. However, the typical value is a good indication of device's performance.
Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by T
JMAX
,
JA
, and the ambient temperature T
A
. The maximum
allowable power dissipation is P
DMAX
= (T
JMAX
T
A
)/
JA
. For the
HWD2119, T
JMAX
= 150C and the typical junction-to-ambient thermal resistance (
JA
) when board
mounted is 210C/W for the MSOP package and 170C/W for the SOP package.
Note 5: Human body model, 100pF discharged through a 1.5 k
resistor.
Note 6: Machine Model, 220pF240pF capacitor is discharged through all pins.
Note 7: Typical specifications are specified at 25C and represent the parametric norm.
Note 8: Tested limits are guaranteed to National's AOQL (Average Outgoing Quality Level).
Note 9: Datasheet min/max specification limits are guaranteed by designs, test, or statistical analysis.
Note 10: The given
JA
is for an
HWD2119 package in an LDA08B with the Exposed-DAP soldered to a printed circuit board copper pad with an area equivalent to
that of the Exposed-DAP itself. The Exposed-DAP of the LDA08B package should be electrically connected to GND or an electrically isolated copper area.
Note 11: The given
JA
is for an
HWD2119 package in an LDA08B with the Exposed-DAP not soldered to any printed circuit board copper.
Note 12: The shutdown pin (pin1) should be driven as close as possible to V
DD
for minimum current in Shutdown Mode.
External Components Description
(
Figure 1)
Components
Functional Description
1.
R
i
Combined with R
f
, this inverting input resistor sets the closed-loop gain. R
i
also forms a high pass filter with
C
i
at f
c
= 1/(2
R
i
C
i
).
2.
C
i
This input coupling capacitor blocks DC voltage at the amplifier's terminals. Combined with R
i
, it creates a
high pass filter with R
i
at f
c
= 1/(2
R
i
C
i
). Refer to the section, Proper Selection of External Components
for an explanation of how to determine the value of C
i
.
3.
R
f
Combined with R
i
, this is the feedback resistor that sets the closed-loop gain: A
v
= 2(R
F
/R
i
).
4.
C
S
This is the power supply bypass capacitor that filters the voltage applied to the power supply pin. Refer to
the Application Information section for proper placement and selection of C
s
.
5.
C
B
This is the bypass pin capacitor that filters the voltage at the BYPASS pin. Refer to the section, Proper
Selection of External Components, for information concerning proper placement and selection of C
B
.
Typical Performance Characteristics
THD+N vs Frequency
THD+N vs Frequency
3
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