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Электронный компонент: U632H16SC25G1

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U632H16
1
March 31, 2006
STK Control #ML0046
Rev 1.0
PowerStore 2K x 8 nvSRAM
Pin Configuration
Pin Description
Top View
Signal Name
Signal Description
A0 - A10
Address Inputs
DQ0 - DQ7
Data In/Out
E
Chip Enable
G
Output Enable
W
Write Enable
VCCX
Power Supply Voltage
VSS
Ground
VCAP
Capacitor
HSB
Hardware Controlled Store/Busy
Package: SOP28 (300 mil)
Description
The U632H16 has two separate
modes of operation: SRAM mode
and nonvolatile mode. In SRAM
mode, the memory operates as an
ordinary static RAM. In nonvolatile
operation, data is transferred in
parallel from SRAM to EEPROM or
from EEPROM to SRAM. In this
mode SRAM functions are disab-
led.
The U632H16 is a fast static RAM
(25, 35, 45 ns), with a nonvolatile
electrically erasable PROM
(EEPROM) element incorporated
in each static memory cell. The
SRAM can be read and written an
unlimited number of times, while
independent nonvolatile data resi-
des in EEPROM. Data transfers
from the SRAM to the EEPROM
(the STORE operation) take place
automatically upon power down
using charge stored in an external
100 F capacitor. Transfers from
the EEPROM to the SRAM (the
RECALL operation) take place
automatically on power up. The
U632H16 combines the high per-
formance and ease of use of a fast
SRAM with nonvolatile data inte-
grity.
STORE cycles also may be initia-
ted under user control via a soft-
ware sequence or via a single pin
(HSB).
Once a STORE cycle is initiated,
further input or output are disabled
until the cycle is completed.
Because a sequence of addresses
is used for STORE initiation, it is
important that no other read or
write accesses intervene in the
sequence or the sequence will be
aborted.
RECALL cycles may also be initia-
ted by a software sequence.
Internally, RECALL is a two step
procedure. First, the SRAM data is
cleared and second, the nonvola-
tile information is transferred into
the SRAM cells.
The RECALL operation in no way
alters the data in the EEPROM
cells. The nonvolatile data can be
recalled an unlimited number of
times.
1
VCAP
VCCX
28
2
n.c.
W
27
4
A6
A8
25
5
A5
A9
24
3
A7
HSB
26
6
A4
n.c.
23
7
A3
G
22
8
A2
A10
21
12
DQ1
DQ5
17
9
A1
E
20
10
A0
DQ7
19
11
DQ0
DQ6
18
13
DQ2
DQ4
16
14
VSS
DQ3
15
SOP
Features
High-performance CMOS non-
volatile static RAM 2048 x 8 bits
25 ns Access Times
12 ns Output Enable Access
Times
I
CC
= 15 mA at 200 ns Cycle
Time
Automatic STORE to EEPROM
on Power Down using external
capacitor
Hardware or Software initiated
STORE
(STORE Cycle Time < 10 ms)
Automatic STORE Timing
10
6
STORE cycles to EEPROM
100 years data retention in
EEPROM
Automatic RECALL on Power
Up
Software RECALL Initiation
(RECALL Cycle Time < 20
s)
Unlimited RECALL cycles from
EEPROM
Single 5 V
10 % Operation
Operating temperature ranges:
0 to 70
C
-40 to 85
C
QS 9000 Quality Standard
ESD protection > 2000 V
(MIL STD 883C M3015.7-HBM)
RoHS compliance and Pb- free
U632H16
2
March 31, 2006
STK Control #ML0046
Rev 1.0
Operating Mode
E
HSB
W
G
DQ0 - DQ7
Standby/not selected
H
H
*
*
High-Z
Internal Read
L
H
H
H
High-Z
Read
L
H
H
L
Data Outputs Low-Z
Write
L
H
L
*
Data Inputs High-Z
Block Diagram
Truth Table for SRAM Operations
*
H or L
Characteristics
All voltages are referenced to V
SS
= 0 V (ground).
All characteristics are valid in the power supply voltage range and in the operating temperature range specified.
Dynamic measurements are based on a rise and fall time of
5 ns, measured between 10 % and 90 % of V
I
, as well as input levels of V
IL
= 0 V
and V
IH
= 3 V. The timing reference level of all input and outputsignals is 1.5 V, with the exception of the t
dis
-times and t
en
-times, in which cases
transition is measured
200 mV from steady-state voltage.
a: Stresses greater than those listed under ,,Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress
rating only, and functional operation of the device at condition above those indicated in the operational sections of this specification is
not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
Absolute Maximum Ratings
a
Symbol
Min.
Max.
Unit
Power Supply Voltage
V
CC
-0.5
7
V
Input Voltage
V
I
-0.3
V
CC
+0.5
V
Output Voltage
V
O
-0.3
V
CC
+0.5
V
Power Dissipation
P
D
1
W
Operating Temperature
C-Type
K-Type
T
a
0
-40
70
85
C
C
Storage Temperature
T
stg
-65
150
C
EEPROM Array
32 x (64 x 8)
STORE
RECALL
SRAM
Array
32 Rows x
64 x 8 Columns
A5
A6
A7
A8
A9
A0 - A10
Store/
Recall
Control
HSB
Row Dec
oder
V
CCX
V
SS
V
CAP
G
E
W
Software
Detect
Power
Control
V
CCX
V
CAP
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
Column I/O
Column Decoder
A0 A1
A2
A3
A4 A10
I
n
put
Buf
f
ers
U632H16
3
March 31, 2006
STK Control #ML0046
Rev 1.0
b: V
CC
reference levels throughout this datasheet refer to V
CCX
if that is where the power supply connection is made, or V
CAP
if V
CCX
is con-
nected to ground.
c: I
CC1
and I
CC3
are depedent on output loading and cycle rate. The specified values are obtained with outputs unloaded.
The current I
CC1
is measured for WRITE/READ - ratio of 1/2.
I
CC2
is the average current required for the duration of the STORE cycle (STORE Cycle Time).
d: Bringing E
V
IH
will not produce standby current levels until any nonvolatile cycle in progress has timed out. See MODE SELECTION
table.The current I
CC(SB)1
is measured for WRITE/READ - ratio of 1/2.
DC Characteristics
Symbol
Conditions
C-Type
K-Type
Unit
Min.
Max.
Min.
Max.
Operating Supply Current
c
I
CC1
V
CC
V
IL
V
IH
t
c
= 5.5 V
= 0.8 V
= 2.2 V
= 25 ns
90
95
mA
Average Supply Current during
STORE
c
I
CC2
V
CC
E
W
V
IL
V
IH
= 5.5 V
0.2 V
V
CC
-0.2 V
0.2 V
V
CC
-0.2 V
6
7
mA
Average Supply Current during
PowerStore
Cycle
I
CC4
V
CC
V
IL
V
IH
= 4.5 V
= 0.2 V
V
CC
-0.2 V
4
4
mA
Standby Supply Current
d
(Cycling TTL Input Levels)
I
CC(SB)1
V
CC
E
t
c
= 5.5 V
= V
IH
= 25 ns
30
34
mA
Operating Supply Current
at t
cR
= 200 ns
c
(Cycling CMOS Input Levels)
I
CC3
V
CC
W
V
IL
V
IH
= 5.5 V
V
CC
-0.2 V
0.2 V
V
CC
-0.2 V
15
15
mA
Standby Supply Current
d
(Stable CMOS Input Levels)
I
CC(SB)
V
CC
E
V
IL
V
IH
= 5.5 V
V
CC
-0.2 V
0.2 V
V
CC
-0.2 V
3
3
mA
Recommended
Operating Conditions
Symbol
Conditions
Min.
Max.
Unit
Power Supply Voltage
b
V
CC
4.5
5.5
V
Input Low Voltage
V
IL
-2 V at Pulse Width
10 ns permitted
-0.3
0.8
V
Input High Voltage
V
IH
2.2
V
CC
+0.3
V
U632H16
4
March 31, 2006
STK Control #ML0046
Rev 1.0
DC Characteristics
Symbol
Conditions
C-Type
K-Type
Unit
Min.
Max.
Min.
Max.
Output High Voltage
Output Low Voltage
V
OH
V
OL
V
CC
I
OH
I
OL
= 4.5 V
=-4 mA
= 8 mA
2.4
0.4
2.4
0.4
V
V
Output High Current
Output Low Current
I
OH
I
OL
V
CC
V
OH
V
OL
= 4.5 V
= 2.4 V
= 0.4 V
8
-4
8
-4
mA
mA
Input Leakage Current
High
Low
I
IH
I
IL
V
CC
V
IH
V
IL
= 5.5 V
= 5.5 V
= 0 V
-1
1
-1
1
A
A
Output Leakage Current
High at Three-State- Output
Low at Three-State- Output
I
OHZ
I
OLZ
V
CC
V
OH
V
OL
= 5.5 V
= 5.5 V
= 0 V
-1
1
-1
1
A
A
SRAM Memory Operations
No.
Switching Characteristics
Read Cycle
Symbol
Unit
Alt.
IEC
Min. Max.
1 Read Cycle Time
f
t
AVAV
t
cR
25
ns
2 Address Access Time to Data Valid
g
t
AVQV
t
a(A)
25
ns
3 Chip Enable Access Time to Data Valid
t
ELQV
t
a(E)
25
ns
4 Output Enable Access Time to Data Valid
t
GLQV
t
a(G)
12
ns
5 E HIGH to Output in High-Z
h
t
EHQZ
t
dis(E)
13
ns
6 G HIGH to Output in High-Z
h
t
GHQZ
t
dis(G)
13
ns
7 E LOW to Output in Low-Z
t
ELQX
t
en(E)
5
ns
8 G LOW to Output in Low-Z
t
GLQX
t
en(G)
0
ns
9 Output Hold Time after Address Change
t
AXQX
t
v(A)
3
ns
10 Chip Enable to Power Active
e
t
ELICCH
t
PU
0
ns
11 Chip Disable to Power Standby
d, e
t
EHICCL
t
PD
25
ns
e: Parameter guaranteed but not tested.
f:
Device is continuously selected with E and G both LOW.
g: Address valid prior to or coincident with E transition LOW.
h: Measured
200 mV from steady state output voltage.
U632H16
5
March 31, 2006
STK Control #ML0046
Rev 1.0
t
a(A)
Previos Data Valid
Read Cycle 1: Ai-controlled (during Read cycle: E = G = V
IL
, W = V
IH
)
f
Read Cycle 2: G-, E-controlled (during Read cycle: W = V
IH
)
g
No.
Switching Characteristics
Write Cycle
Symbol
25
Unit
Alt. #1 Alt. #2
IEC
Min. Max.
12 Write Cycle Time
t
AVAV
t
AVAV
t
cW
25
ns
13 Write Pulse Width
t
WLWH
t
w(W)
20
ns
14 Write Pulse Width Setup Time
t
WLEH
t
su(W)
20
ns
15 Address Setup Time
t
AVWL
t
AVEL
t
su(A)
0
ns
16 Address Valid to End of Write
t
AVWH
t
AVEH
t
su(A-WH)
20
ns
17 Chip Enable Setup Time
t
ELWH
t
su(E)
20
ns
18 Chip Enable to End of Write
t
ELEH
t
w(E)
20
ns
19 Data Setup Time to End of Write
t
DVWH
t
DVEH
t
su(D)
12
ns
20 Data Hold Time after End of Write
t
WHDX
t
EHDX
t
h(D)
0
ns
21 Address Hold after End of Write
t
WHAX
t
EHAX
t
h(A)
0
ns
22 W LOW to Output in High-Z
h, i
t
WLQZ
t
dis(W)
10
ns
23 W HIGH to Output in Low-Z
t
WHQX
t
en(W)
5
ns
t
a(A
)
t
cR
Address Valid
t
v(A)
Ai
DQi
Output
(1)
(2)
(9)
Ai
E
G
DQi
Output
t
dis(E)
t
cR
t
a(E)
t
en(E)
t
en(G)
t
a(G)
t
dis(G)
Address Valid
Output Data Valid
High Impedance
I
CC
ACTIVE
STANDBY
t
PD
t
PU
(1)
(3)
(4)
(5)
(7)
(6)
(8)
(10)
(11)
(2)
Output Data Valid