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Электронный компонент: FLM6472-18F

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FEATURES
High Output Power: P1dB = 43.0dBm (Typ.)
High Gain: G1dB = 9.5dB (Typ.)
High PAE:
add = 37% (Typ.)
Low IM3 = -46dBc@Po = 32.0dBm
Broad Band: 6.4 ~ 7.2GHz
Impedance Matched Zin/Zout = 50
Hermetically Sealed Package
1
Edition 1.2
August 2004
FLM6472-18F
C-Band Internally Matched FET
Item
Drain-Source Voltage
Gate-Source Voltage
Total Power Dissipation
Storage Temperature
Channel Temperature
Symbol
VDS
VGS
15
-5
83.3
-65 to +175
175
Tc = 25C
V
V
W
C
C
PT
Tstg
Tch
Condition
Unit
Rating
ABSOLUTE MAXIMUM RATING (Ambient Temperature Ta=25
C)
Fujitsu recommends the following conditions for the reliable operation of GaAs FETs:
1. The drain-source operating voltage (VDS) should not exceed 10 volts.
2. The forward and reverse gate currents should not exceed 48.0 and -8.4 mA respectively with
gate resistance of 25
.
Item
Saturated Drain Current
Transconductance
Pinch-off Voltage
Gate Source Breakdown Voltage
Power-added Efficiency
3rd Order Intermodulation
Distortion
Output Power at 1dB G.C.P.
Power Gain at 1dB G.C.P.
Symbol
IDSS
-
7.5
11.25
-
7500
-
-0.5
-1.5
-3.0
-5.0
-
-
8.5
9.5
-
-
37
-
42.0
43.0
-
VDS = 5V, IDS = 250mA
VDS = 5V, IDS = 4875mA
VDS = 5V, VGS = 0V
IGS = -250A
VDS =10V,
IDS = 0.65 IDSS (Typ.),
f = 6.4 ~ 7.2 GHz,
ZS=ZL= 50 ohm
f = 7.2 GHz,
f = 10 MHz
2-Tone Test
Pout = 32.0dBm S.C.L.
A
mS
V
dB
%
-44
-46
-
dBc
dBm
V
gm
Vp
VGSO
P1dB
G1dB
Drain Current
-
4875
6000
mA
Idsr
IM3
add
Gain Flatness
-
-
0.6
dB
G
Test Conditions
Unit
Limit
Typ.
Max.
Min.
ELECTRICAL CHARACTERISTICS (Ambient Temperature Ta=25
C)
Channel to Case
Thermal Resistance
-
1.6
1.8
C/W
Rth
G.C.P.: Gain Compression Point, S.C.L.: Single Carrier Level
CASE STYLE: IK
10V x Idsr x Rth
Channel Temperature Rise
-
-
80
C
Tch
DESCRIPTION
The FLM6472-18F is a power GaAs FET that is internally matched for
standard communication bands to provide optimum power and gain in a
50 ohm system.
Eudyna's stringent Quality Assurance Program assures the highest
reliability and consistent performance.
2
FLM6472-18F
C-Band Internally Matched FET
POWER DERATING CURVE
50
0
100
150
200
Case Temperature (
C)
100
80
60
40
20
Total Power Dissipation (W)
OUTPUT POWER & IM3 vs. INPUT POWER
VDS=10V
f1 = 7.2 GHz
f2 = 7.21 GHz
2-tone test
19
21
23
25
27
29
Input Power (S.C.L.) (dBm)
S.C.L.: Single Carrier Level
34
36
30
32
38
24
26
28
-55
-50
-45
-40
-35
-30
-25
-20
Output Power (S.C.L.) (dBm)
IM3
Pout
IM
3
(dBc)
OUTPUT POWER vs. FREQUENCY
Pin=34.5dBm
32.5dBm
30.5dBm
28.5dBm
6.6
6.4
6.8
7.2
7.0
Frequency (GHz)
38
39
40
41
42
43
44
45
Output Power (dBm)
VDS=10V
P1dB
OUTPUT POWER vs. INPUT POWER
VDS=10V
f = 6.8 GHz
25
23
27
29
31
33
35
Input Power (dBm)
39
41
43
45
37
35
30
45
15
0
Output Power (dBm)
add
Pout
add
(%)
3
FLM6472-18F
C-Band Internally Matched FET
S-PARAMETERS
VDS = 10V, IDS = 4875mA
FREQUENCY
S11
S21
S12
S22
(MHZ)
MAG
ANG
MAG
ANG
MAG
ANG
MAG
ANG
6200
.517
101.5
3.232
-103.7
.062
-144.7
.453
89.3
6300
.521
88.0
3.197
-118.5
.064
-159.2
.445
81.8
6400
.524
75.7
3.135
-130.9
.066
-170.7
.432
74.0
6500
.519
64.3
3.075
-144.6
.068
-176.9
.424
65.8
6600
.507
52.6
3.108
-158.3
.071
164.6
.410
55.5
6700
.490
40.7
3.111
-171.2
.074
152.8
.391
43.5
6800
.463
27.1
3.149
175.1
.079
139.3
.369
28.7
6900
.426
11.1
3.226
160.5
.086
125.2
.339
11.3
7000
.385
-9.3
3.308
145.2
.090
110.1
.301
-9.4
7100
.345
-33.6
3.366
129.9
.094
95.4
.259
-31.8
7200
.326
-66.5
3.378
112.2
.096
77.0
.202
-59.4
7300
.349
-102.2
3.287
93.9
.092
57.5
.141
-95.5
7400
.411
-134.0
3.133
75.3
.087
39.6
.098
-149.0
+j250
+j100
+j50
+j25
+j10
0
-j10
-j25
-j50
-j100
-j250
S11
S22
180
+90
0
-90
S21
S12
0.2
0.1
SCALE FOR |S
12
|
50
25
250
SCALE FOR |S21|
1
2
3
4
7.4
7.4
6.6
6.6
6.2 GHz
6.2 GHz
6.4
6.4
6.8
6.8
7.0
7.0
7.2
7.2
7.4
7.4
6.6
6.6
6.2 GHz
6.2 GHz
6.8
6.8
7.0
7.0
7.2
7.2
6.4
6.4
4
FLM6472-18F
C-Band Internally Matched FET
4-R 1.3
0.15
(0.051)
0.6
(0.024)
14.9
(0.587)
20.4
0.3
(0.803)
24
0.5
(0.945)
5.5 Max.
(0.217)
2.4
0.15
(0.094)
0.1
(0.004)
1.4
(0.055)
17.4
0.3
(0.685)
8.0
0.2
(0.315)
2.0 Min.
(0.079)
2.0 Min.
(0.079)
Case Style "IK"
Metal-Ceramic Hermetic Package
Unit: mm(inches)
1. Gate
2. Source (Flange)
3. Drain
1
3
2
Eudyna Devices Inc. products contain gallium arsenide
(GaAs)
which can be hazardous to the human body and the environment.
For safety, observe the following procedures:
CAUTION
Do not put this product into the mouth.
Do not alter the form of this product into a gas, powder, or liquid
through burning, crushing, or chemical processing as these by-products
are dangerous to the human body if inhaled, ingested, or swallowed.
Observe government laws and company regulations when discarding this
product. This product must be discarded in accordance with methods
specified by applicable hazardous waste procedures.
For further information please contact:
Eudyna Devices USA Inc.
2355 Zanker Rd.
San Jose, CA 95131-1138, U.S.A.
TEL: (408) 232-9500
FAX: (408) 428-9111
www.us.eudyna.com
Eudyna Devices Europe Ltd.
Network House
Norreys Drive
Maidenhead, Berkshire SL6 4FJ
United Kingdom
TEL: +44 (0) 1628 504800
FAX: +44 (0) 1628 504888
Eudyna Devices Asia Pte Ltd.
Hong Kong Branch
Rm. 1101, Ocean Centre, 5 Canton Rd.
Tsim Sha Tsui, Kowloon, Hong Kong
TEL: +852-2377-0227
FAX: +852-2377-3921
Eudyna Devices Inc.
Sales Division
1, Kanai-cho, Sakae-ku
Yokohama, 244-0845, Japan
TEL: +81-45-853-8156
FAX: +81-45-853-8170
Eudyna Devices Inc. reserves the right to change products and specifications
without notice. The information does not convey any license under rights of
Eudyna Devices Inc. or others.
2004 Eudyna Devices USA Inc.
Printed in U.S.A.