Excelics
EMA303D-2
DATA SHEET
Release Date: March 7, 2003
19.5 - 24 GHz Medium Power MMIC
FEATURES
19.5 -24 GHz BANDWIDTH
+22 dBm OUTPUT POWER @1dB Gain Compression
22 dB TYPICAL SMALL SIGNAL GAIN
DUAL BIAS SUPPLY
0.3 MICRON RECESSED "MUSHROOM" GATE
Si
3
N
4
PASSIVATION
ADVANCED EPITAXIAL HETEROJUNCTION
PROFILE PROVIDES EXTRA HIGH POWER
EFFICIENCY, AND HIGH RELIABILITY
ELECTRICAL CHARACTERISTICS
1
(T
a
= 25
O
C)
SYMBOL
PARAMETERS/TEST CONDITIONS
MIN TYP MAX UNIT
F
Operating Frequency Range
19.5
24
GHz
P
1dB
Ouput Power at 1dB Gain Compression
@ Vdd=8V ; Id= 0.5 Idss
@ Vdd=6V ; Id= 0.5 Idss
21.5
19.5
23
21
dBm
Gss
Small Signal Gain @ Vdd=6V ; Id= 0.5 Idss
20
22
dB
Gss
Small Signal Gain Flatness
1.5
dB
NF
Noise Figure @ f=18GHz, Vdd=3.5V, Id=140mA
4
dB
Input RL
Input Return Loss
9
dB
Output RL Output Return Loss
8
dB
Idd
Power Supply Current
140
mA
Vdd
Power Supply Voltage
6
8
V
MAXIMUM RATINGS AT 25
O
C
SYMBOLS
PARAMETERS
ABSOLUTE
1
CONTINUOUS
2
Vds
Drain-Source Voltage
12V
8V
Vgs
Gate-Source Voltage
-8V
-3V
Ids
Drain Current
Idss
215mA
Igf
Forward Gate Current
50 mA
8.5mA
Pin
Input Power
15dBm
@3dB Compression
Tch
Channel Temperature
175
o
C
150
o
C
Tstg
Storage Temperature
-65/175
o
C
-65/150
o
C
Pt
Total Power Dissipation
1 W
0.85 W
Note: 1. Exceeding any of the above ratings may result in permanent damage.
2. Exceeding any of the above ratings may reduce MTTF below design goals.
Excelics Semiconductor, Inc., 2908 Scott Blvd., Santa Clara, CA 95054
Phone: (408) 970-8664 Fax: (408) 970-8998 Web Site: www.excelics.com
Chip Size 1060 x 2500 microns
Chip Thickness: 75
13 microns
All Dimensions In Microns
EMA303D-2
DATA SHEET
19.5 - 24 GHz Medium Power MMIC
ASSEMBLY DRAWING
50 ohm line on Alumina
RF INPUT
50pF
50pF
V
dd
50 ohm line on Alumina
V
GG
RF OUTPUT
0.1 uF
0.1 uF
The length of RF wires should be as short as possible. Use at least two wires between RF pad and 50 ohm line and
separate the wires to minimize the mutual inductance.
CHIP OUTLINE
Chip Size 1060 x 2500 microns
Chip Thickness: 75
13 microns
PAD Dimensions: 1. DC 100 x 100 microns
2. RF 80 x 68 microns
All Dimensions In Microns
0
0
1060
2500
2350
680
550
750
V
GG
1
V
D
1
V
D
3
RF IN
RF OUT
1150
2065
GND
GND
for DC check
1500
VD2
V
GG
1
V
GG
1
700