EMP212-SMP
ISSUED
06/30/2005
9.5 12 GHz Power AMPLIFIER MMIC
Specifications are subject to change without notice.
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085
page 1 of 3
Phone: 408-737-1711 Fax: 408-737-1868 Web:
www.excelics.com
Revised July 2005
FEATURES
9.5 12GHz Operating Frequency Range
30dBm Output Power at 1dB Compression
16 dB Typical Small Signal Gain
-41dBc OIMD3 @Each Tone Pout 19dBm
Small Surface Mount Package
APPLICATIONS
Point-to-point and point-to-multipoint radio
Military Radar Systems
OUT
VD
IN
VG
1
2
3
5
6
7
8
4
ELECTRICAL CHARACTERISTICS (T
a
= 25
C, V
DD
=7V, Idsq=750mA)
SYMBOL PARAMETER/TEST
CONDITIONS MIN
TYP
MAX
UNITS
F
Operating Frequency Range
9.5
12
GHz
P
1dB
Output Power at 1dB Gain Compression
29
30
dBm
Gss
Small Signal Gain
13
16
dB
OIMD3
Output 3
rd
Order Intermodulation Distortion
@f=10MHz, Each Tone Pout 19dBm
V
DD
= 7.0V, Idsq=60%10%Idss
-41 -38 dBc
Input RL
Input Return Loss
-10
-8
dB
Output RL
Output Return Loss
-6
dB
Idss
Saturated Drain Current V
DS
= 3.0V, V
GS
= 0V
920
1150
1380
mA
V
DD
Drain Voltage
7
8
V
Rth
Thermal
Resistance
12.5
o
C/W
MAXIMUM RATINGS AT 25C
1,2
SYMBOL CHARACTERISTIC
ABSOLUTE
CONTINOUS
V
DS
Drain to Source Voltage
12V
8 V
V
GS
Gate to Source Voltage
-8V
-4 V
I
DD
Drain
Current
Idss
1300
I
GSF
Forward Gate Current
114mA
19mA
P
IN
Input Power
27dBm
@ 3dB compression
T
CH
Channel
Temperature
175C
150C
T
STG
Storage
Temperature
-65/175C
-65/150C
P
T
Total
Power
Dissipation
12.4W
10.4W
1. Operating the device beyond any of the above rating may result in permanent damage.
2. Bias conditions must also satisfy the following equation V
DS
*I
DS
< (T
CH
T
HS
)/R
TH
; where T
HS
= Base Plate Temperature
EMP212-SMP
ISSUED
06/30/2005
9.5 12 GHz Power AMPLIFIER MMIC
Specifications are subject to change without notice.
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085
page 2 of 3
Phone: 408-737-1711 Fax: 408-737-1868 Web:
www.excelics.com
Revised July 2005
Package Dimension and Pin Assignment
TOP SIDE VIEW
EXCELICS
EMP212
S
M
P
7
6
5
4
8
1
2
3
BOTTOM SIDE VIEW
Ground Plane
1
2
3
4
8
7
6
5
NOTES:
1. Material:
Plastic
2.
Plating: Gold over Nickel
3.
Ground Plane Must be Soldered to PCB RF Ground.
4.
Indicates PIN 1.
5.
All Dimensions are in Inches (Millimeters).
6.
All Tolerances are 0.003 (0.08).
PIN Assignment
1 N/C
2 N/C
3 VD
4 OUT
5 N/C
6 N/C
7 VG
8 IN
EMP212-SMP
ISSUED
06/30/2005
9.5 12 GHz Power AMPLIFIER MMIC
Specifications are subject to change without notice.
Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085
page 3 of 3
Phone: 408-737-1711 Fax: 408-737-1868 Web:
www.excelics.com
Revised July 2005
Evaluation Board
1
2
3
4
5
6
7
8
0.1uF
Cap
0.1uF
Cap
Suggested PCB Land Pattern
Suggested Ground Plane
Via Size 0.008[0.20]
Via Center to Center 0.018[0.45]
Notes:
1.
All Dimensions Are
In Inches
[Millimeters]
2.
All Tolerances Are
0.003[0.08]
3. Suggested
PCB
Material Is
Rogers4003 with
1/2oz Copper
4. Suggested
PCB
Thickness is 8mil
The grounded Co-Planar Wave
Guide (CPWG) PCB
input/output transitions allow
use of Ground_Signal_Ground
(GSG) probes for testing.
Suggested probe pitch is
500um. Alternatively, the
evaluation board can be
mounted in a metal housing
with SMA coaxial connectors.
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